VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the new VIA EPIA-M830 Mini-ITX board. Designed specifically to meet the needs of next generation kiosk, POI and POS applications, the VIA EPIA-M830 places the latest 64-bit, high performance VIA Nano E-Series processor in a streamlined, application specific Mini-ITX form factor board.

Kiosk and POS systems will soon support an incredible array of increasingly complex human-machine interactions that reach beyond traditional ticketing or retail scenarios. The VIA EPIA-M830 is designed to take the kiosk to this next phase, providing the backbone of devices that offer cashless purchasing and self service infrastructures in supermarkets and gas stations as well as more secure and interactive, multimedia-rich POI, lotto and gaming machines.

The Intel juggernaut rolls on in Q1 2010, according the latest IDC report covering PC processor sales. Similar to the GPU market, processor sales grew by 39% compared to this time last year (Q1 2009), but declined by 5.6% compared to Q4 2009. Revenues went up 40.4% year-on-year and down just 2% sequentially. Intel's market share grew by 0.5%, slightly at the expense of AMD, which went down 0.6%.

Intel holds 81% of the processor market, while 'rival' AMD holds 18.8%. VIA holds a tiny 0.2% of the market. In the x86 server market, Intel holds 90.2%, with AMD and others at 9.8%. With the notebook and desktop segments it reached 87.8% and 71.7%, respectively. For 2010 IDC is predicting a CPU unit growth of 15.1%. Q1 2010 saw Intel propagating processors based on its new architecture to the crucial value and mainstream market segments, with the Core i3, Core i5, and Pentium dual-core processors in the LGA-1156 package.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the latest additions to its VIA VIPRO range of fanless touch screen panel PCs with the 6.5 inch VIA VIPRO VP7806 and 15 inch VIA VIPRO VP7815. Created using the flexible and modular Em-ITX form factor, these new VIA VIPRO panel PCs offer the perfect solution for the latest HMI applications.

Both VIA VIPRO devices are fanless and durable with IP65 compliant LED backlit panels that can withstand temperatures of -200C to 600C. Industry-leading device interactivity is assured with touch panel navigation, an integrated two megapixel autofocus IP camera, microphone and speakers. These features make the VIA VIPRO series perfectly placed for next generation panel applications that include hospital patient terminals, home and building automation and advanced multimedia-rich security ecosystems.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA Nano E-Series processor, bringing native 64-bit software support, virtualization capabilities and extended longevity support to embedded markets.

The move to 64-bit software architecture is an essential transition for the future of the embedded industry. Forthcoming operating systems such as Windows Embedded Standard 7 will be able to leverage a 64-bit software eco system that provides up to double the amount of data a CPU can process per clock cycle. This translates in to greater ease in manipulating large data sets and an overall performance boost compared to non-native 64-bit architectures.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the launch of its latest DIY PC kit, the VIA ARTiGO A1100, a sub-liter DIY PC kit for enthusiasts who want to taste the most extreme, ultra-compact desktop computing experience.

The VIA ARTiGO A1100 takes inspiration from Pico-ITX, cramming a range of features that include a 64-bit processor, HD video support, HDMI and VGA display connectivity, Gigabit networking, Wi-Fi Support and five USB ports, all into a PC chassis that fits snuggly into the palm of your hand.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the new VIA VX900 media system processor, a full featured single chip solution that will be coupled with the latest VIA Nano-3000 Series processors to bring truly stunning video playback to the latest HD online video services.

"VIA's trail-blazing VX900 will bring welcome relief to those pining for the best view of HD video online," said Richard Brown, Vice President of Marketing, VIA Technologies, Inc. "The VIA VX900 represents the most complete solution for HD digital content consumption on the market today."

Do you desire for a free CPU upgrade? Of course, you do! ASRock Inc. today launched the UCC [Unlock CPU Core] Series motherboard that delivers added core processing power by enabling the ASRock exclusive UCC function of the AMD CPUs. Unprecedentedly integrated with ASRock exclusive UCC Chip, ASRock UCC function is well-designed to provide extra performance boost on ASRock UCC Series motherboards. In conjunction with AMD's 8XX Series chipsets, ASRock 890GX Extreme3 motherboard, the first UCC series motherboard, comes with unique UCC feature and supports both advanced rendering from HD 4290, DX10.1 graphics technology and ATI Quad CrossFireX, 3-Way CrossFireX technologies.

Equipped with an exclusive ASRock UCC Chip, ASRock 890GX Extreme3 is able to support the excellent UCC function. ASRock UCC feature allows users to enjoy an instant performance boost by simply tuning on the UCC switch on BIOS. ASRock 890GX Extreme3 is the ASRock True 333 series motherboards. The board offers the latest SATA3 6.0Gb/s and USB 3.0 5.0Gb/s technologies from the industry-leading NEC support. The real I/O includes 1 x external SATA3 connector through the Bundled eSATA3 Bracket and 2 x USB 3.0 ports for 10X faster data transfer speed. For memory part, it supports 4 X DDR3 1800(OC), Hyper Transport Bus 5200 MT/s, ATI Quad CrossFireX and 3-Way CrossFireX. For audio aspect, it features 7.1 CH, VIA 2020 audio codec with Premium Blu-ray audio support. Combined with advanced rendering from AMD Radeon HD 4290, DX10.1 graphics, ASRock 890GX Extreme3 offers the spectacular visual output (output options include: D-Sub, DVI-D, HDMI) as well.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA ART-3000, a complete, fanless and ruggedized embedded box system based on the unique I/O-rich Em-ITX form factor, offering the ideal solution for a variety of industrial applications.

Available as a complete system including drives and memory, the fanless VIA ART-3000 combines a number of unique features including diskless booting, excellent vibration and shock resistance, dual Gigabit networking and dual LVDS video support. Ruthlessly low power consumption means the VIA ART-3000 can also support fanless configurations with no moving parts making it ideal for ultra stable, mission critical implementations.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced its participation at Digital Signage Expo 2010, Feb. 24 - 25, Las Vegas. Join VIA at the Las Vegas Convention Center, Hall C1-2, Booth 1240 and experience the latest technologies for next-generation signage systems, including a demonstration of the forthcoming S3 Graphics Chrome 5400E x2; a dual GPU add-in-board aimed at advanced, multi-display digital signage applications.

The S3 Graphics 5400E x2 is a highly integrated and flexible video card that features dual graphics and multimedia processors. Boasting extreme hardware acceleration of the latest HD video codecs, the S3 Graphics 5400E x2 uses S3 Graphics' PanoChrome technology to provide up to four independent HD video streams at resolutions of 1080p on up to eight displays, employing a variety of display modes and configurations.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced its latest technology platform for fleet management device designs. The VIA EPIA-P710-D is a Pico-ITXe expansion module that allows system integrators to easily create cutting-edge fleet management devices that incorporate a range of the latest communication and intelligent management technologies.

Designed for easy integration into the dashboard of any vehicle, this new fleet management hardware platform provides the advanced x86 backbone necessary for today's advanced fleet and logistics management applications including fuel management, active scheduling, advanced routing, asset monitoring and the latest emergency, safety and rescue features.

Worldwide PC microprocessor shipments in the fourth calendar quarter of 2009 (4Q09) rose modestly, compared to 3Q09, but still achieved all-time record levels for a single quarter, according to IDC's latest PC processor study. Notably, when compared to 4Q08, shipments in 4Q09 rose 31.3%. For the full year 2009, total PC processor unit shipments grew 2.5%, while revenue declined 7.1% to $28.6 billion.

"Compared to 3Q09, the modest rise in shipments in 4Q09 indicates that the market is returning to normal seasonal patterns," said Shane Rau, director of Semiconductors: Personal Computing research at IDC. "Compared to 4Q08, the huge rise in shipments indicates that the market has put the recession behind it. Both comparisons indicate that the PC industry anticipates improvement in PC end demand in 2010."

VIA Technologies, Inc., a leading provider of PC and prosumer audio silicon, today unveiled the VIA Vinyl Envy VT1730 USB 2.0 Audio Controller, the industry's first highly-integrated single chip solution that leverages the broad USB 2.0 bandwidth (480 Mb/s) to deliver uncompromised audio quality.

The VIA Envy VT1730 is an 8-channel, 24-bit/192kHz audio controller specifically designed to achieve cinema-quality audio recording and playback in high fidelity USB and MIDI system applications. Whether it's using the bandwidth capacity of USB 2.0 to simultaneously support audio streams from a guitar, bass, keyboard and microphone, or delivering true-to-life sound to multiple speakers in a home theatre set-up, the VIA Envy VT1730 offers outstanding audio performance and impressive application flexibility.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA M'SERV S2100: a compact and versatile server system suitable for a range of applications for SOHO and SMB customers. Available to OEM customers, the VIA M'SERV S2100 is a mere 10.2" long by 4.7" high and provides up to four terabytes of storage in a stylish, compact, low power and low noise system.

The VIA M'SERV S2100 is the first product of its kind to offer the unique advantages of the high-performance, 64-bit VIA Nano processor. This makes the VIA M'SERV S2100 capable of addressing many traditional and next-generation server applications including sophisticated backup, cloud-intermediary service roles along with other storage oriented server applications such as NVR (Network Video Recorder) systems and Log servers.

VIA Technologies, Inc., a leading innovator of power efficient x86 processor platforms, today launched the VIA VL700 USB 3.0-SATA Controller, a highly integrated single chip solution that allows users to connect SATA hard disk drive (HDD), solid state drive (SSD), and optical disc drive (ODD) devices to their PC via new USB 3.0 specification ports.

With data transfer rates of up to 5Gbps, USB 3.0 (also known as SuperSpeed USB) offers ten times the throughput available to USB 2.0 based devices, meaning large amounts of information stored on a SATA device can be effortlessly transferred to a PC in a fraction of the time it would usually take.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA EPIA-P820, the first Pico-ITX form factor board to feature the high performance, 64-bit VIA Nano processor, bringing industry-leading digital multimedia performance and virtualization capabilities to the smallest of spaces with the VIA AMOS-3001 chassis system.

The choice of VIA Nano processor means that the VIA EPIA-P820 offers a range of advantages over competitor offerings, including full 64-bit software support, a high-performance superscalar architecture and full support of the latest virtualization technologies for next generation server and virtual machine applications. Paired with the VIA VX855 media system processor, the VIA EPIA-P820 is well equipped to handle smooth playback of the most demanding codecs at resolutions up to 1080p.

VIA Technologies, Inc., a leading innovator of power efficient x86 processor platforms, today unveiled the VIA VL810 SuperSpeed Hub Controller, the industry's first integrated single chip solution that supports the higher transfer rates of the new USB 3.0 specification.

USB 3.0 (also known as SuperSpeed USB) allows for a maximum data transfer rate of up to 5Gbps, or ten times the throughput available to USB 2.0 based devices. Other enhancements provide for improved interaction between device and host controller, including important advancements in power management.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the latest VIA EPIA-M800 Mini-ITX and VIA EPIA-N800 Nano-ITX boards. Featuring the 64-bit, high-performance VIA Nano processor, these new embedded boards bring advanced digital multimedia performance to the next wave of embedded devices on forthcoming Windows 7-based technologies.

Devices based on the VIA EPIA-M800 and VIA EPIA-N800 leverage the performance enhancements of the VIA Nano processor, offering an improved user experience with advanced human to machine interaction and a visually stunning multimedia experience through the latest HD codecs and media streaming technologies. Specific applications include the latest media-centric designs in digital signage and advanced information, ticket and kiosk machines.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA VN1000 digital media chipset for next generation desktop and all-in-one PCs, offering a world-class HD multimedia entertainment platform compatible with the advanced desktop features of Microsoft Windows 7.

The VIA VN1000 is the most power efficient DX10.1 digital media chipset available today, making it the perfect solution for next generation small form factor and all-in-one Windows 7 PCs that focus on entertainment, multimedia and touch screen capabilities. The DirectX 10.1 hardware environment provided by the VIA Chrome 520 IGP means Windows 7 users can enjoy a more fluid and visually enhanced desktop experience as well as the latest gaming titles.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced Mobile-ITX, the latest VIA-developed open form factor specification for the creation of ultra-compact and portable embedded devices. Mobile-ITX defines a uniquely compact 6cm x 6cm computer-on-module specification designed to enable an easier and less resource intensive development cycle for a range of ultra-compact, portable embedded systems.

Vertical market segments including medical, transportation and military embedded markets have evolved to demand greater miniaturization and portability from today's x86 platforms. Mobile-ITX addresses the need for a simple, modular approach to portable IPC design, making it easier than ever to bring to market ultra-compact and lightweight devices that offer comprehensive connectivity options and a rich, flexible feature set.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA AMOS-5000, a specially designed chassis kit for Em-ITX form factor boards such as the VIA EITX-3000, offering fast and easy assembly of a variety of fanless, robust IPC designs.

Built using only five sections the VIA AMOS-5000 has the VIA-developed Em-ITX at its heart, offering developers a wealth of advantages including rich and versatile I/O configurations through expansive dual I/O coastlines, coupled with a variety of expansion modules for wide variety of application specific I/O configurations and a flexible EMIO bus supporting a wide range of modern and legacy bus technologies. Systems build using the VIA AMOS-5000 are shock resistant and can withstand a wide range of temperatures.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms,　today introduced its new VIA Nano 3000 Series processors, bringing enhanced digital media performance and lower power consumption to Windows 7 thin and light notebook and all-in-one desktop PC markets.

Based on the 64-bit superscalar 'Isaiah' architecture, VIA Nano 3000 Series processors deliver the most compelling thin and light notebook computing experience with their rich HD entertainment capabilities, including support for flawless playback of high bit-rate 1080p HD video, as well as low power consumption resulting in longer battery life.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms,　today announced the VIA EPIA-P720 Pico-ITX board, which takes advantage of the latest VIA VX855 media system processor to deliver stunningly smooth playback of the latest HD video formats for next-generation digital interactive devices.

"VIA continually strives to offer customers compelling product designs that open up new worlds of possibility," said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies, Inc.　"The VIA EPIA-P720 enables a new class of extremely compact embedded devices that can comfortably handle the most demanding video playback whilst remaining entirely fanless. No other compact platform currently offers these features in tandem."

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms,　today announced the VIA ACE-CNX security service, helping customers harness the power of the Advanced Cryptographic Engine (ACE) embedded at the core of all VIA processors.

The customer-centered VIA ACE-CNX service allows VIA's team of security experts to work closely with the customer, implementing data encryption standards that meet with widely accepted international standards. The advantage of data encryption through the hardware, as opposed to software, is that the encryption is seamless, fast and entirely unobtrusive to the end user.

The flexible VIA ACE-CNX service can be employed in a wide variety of scenarios where seamless data encryption is required. Data encryption can be used to protect valuable proprietary content in digital signage infrastructures; it can also be used to protect data in remote access or VPN scenarios while application and database repositories can be encrypted, making the threat of data theft redundant.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced its latest additions to the VIA AMOS series of universal chassis products; the VIA AMOS-1000 and VIA AMOS-2000 chassis are specially designed to work with VIA EPIA Mini-ITX and Nano-ITX boards and feature unique multi-story stackability.

VIA developed the VIA AMOS-1000 and VIA AMOS-2000 chassis to make complete system design as straightforward and expedient as possible. The guiding principle behind the VIA AMOS-1000 and VIA AMOS-2000 is the ability to add additional layers to the chassis, facilitating simple system expansion for optical drives, system storage and PCI or PCI Express AIBs.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA EPIA N700-10EW Nano-ITX board, designed for industrial and embedded applications in environments with extreme temperatures. Guaranteed to maintain absolute stability at temperatures ranging from -20 degrees C to 70 degrees C, the fanless VIA EPIA N700-10EW can be employed in environments that traditionally inhibit x86 computing. These include specialized industrial applications where machinery can create intense operating temperatures, as well as extreme climate scenarios like desert, mountain and high altitude environments.

"By expanding our range of EPIA products to include extended temperature products, VIA is addressing the broader needs of our extensive customer base," said Daniel Wu, Vice President of VIA Embedded, VIA Technologies, Inc. "Extreme thermal competency usually comes at a premium, the VIA EPIA N700-10EW will help to significantly lower that barrier."