AAEON, a leading developer of edge computing solutions, introduces the latest from UP Board, the UP Xtreme Lite. UP Xtreme Lite brings the powerful 8th Generation Intel Core processors on a platform that's even easier for developers on a budget.

The UP Xtreme Lite is designed to provide developers with a platform that's flexible, powerful, and a great value while not sacrificing performance. Powered by the 8th Generation Intel Core i3/i5/i7 processors (formerly Whiskey Lake), the UP Xtreme Lite provides scalable performance with support for up to 16 GB SO-DIMM memory and SATA III (6.0 Gb/s) available with SATA port and M.2 2280 slot. Expandability for the UP Xtreme Lite includes M.2 2230 E-Key slot, M.2 2280 M/B-Key supporting two PCIe [x1] lanes and M.2 3042/3052 B-Key.

It was just over eleven years ago in spring 2009 that Shuttle launched its very first All-in-One PC in the form of the X50. A lot has happened since then. The model range has constantly evolved and has now become an established and important part of the Shuttle XPC product family we would not want to miss. Durability thanks to it being fanless, quiet running, low maintenance and flexible use - this sums up the X50 model range, which is now entering its seventh generation with the X50V7U3.

The machines in a 15.6-inch format (39.6 cm) are aimed less at customers from the B2C sector, but more at B2B target groups in different markets. The POS segment, in which the X50V7U3 may be used as a checkout system, for example, should be highlighted in particular. It benefits here from one particular feature: The whole front with the resistive touchscreen is protected in accordance with protection class IP54. This means the X50V7U3 is protected from dust and splashing of water, which confirms its robustness.

Microsoft today has released several microcode updates for Intel CPUs. The updates are meant to be applied in a case-by-case basis under their Windows 10 operating system, and these updates target several releases of that OS (ranging from version 1507 through version 1903/1909). These address several vulnerability exploits related to side-channel and speculative execution attacks on Intel CPUs.

The updates need to be installed specifically for the Windows OS version you're rocking, and on systems with CPUs affected by the vulnerabilities and covered by this microcode update release. These include Intel's Denverton (Atom C3000 series); Sandy Bridge, Sandy Bridge E and EP (2000 and 3000 series), Valleyview (Atom Z3000 series) and Whiskey Lake U CPUs (8000U series, 5000U series, and 4200U series). These updates must be installed manually by users.

Intel Wednesday rolled out its NUC 8 Pro "Provo Canyon" line of compact desktops targeted at businesses. These NUCs are fit for enterprise client desktop role as some of the models feature Intel vPro, and are powered by 8th generation Core "Whiskey Lake-U" processors. Leading the pack is the NUC8v7PN, powered by a Core i7-8665U processor, followed by the NUC8v5PN powered by Core i5-8365U, and the NUC8i3PN, powered by Core i3-8145U. The NUC8v7PN and NUC8v5PN offer Intel vPro support. All three come in two chassis types, H and K. The H chassis features a 2.5-inch drive bay with SATA 6 Gbps interface, and measures 117 mm x 112 mm x 53 mm, while the compact K chassis lacks the 2.5-inch drive bay, and is 37 mm tall. The three are also available in bare board form-factors, so you can use your own NUC-compatible cases.

Connectivity features common to all three are dual HDMI 2.0b (HDCP 2.2) ports with in-built CEC; two DDR4 SO-DIMM slots supporting up to 32 GB of dual-channel memory; one Thunderbolt 3 (40 Gbps) port at the rear panel that includes DisplayPort 1.3 and USB 3.1 gen 2 wiring; and four USB type-A ports, from which three are USB 3.1 gen 2, and one USB 2.0. Networking connectivity includes 802.11ac through an Intel Wireless AC-9560 vPro WLAN card (NUC8v7PN and NUC8v5PN only) or Wireless AC-9560 (NUC8i3PN), and one 1 GbE interface driven by Intel i219-LM controller. The audio is completely HDMI-based, there are no analog jacks. The three are certified for Windows 10 IoT Enterprise and Windows Server 2019.

The "Zen 2" based Ryzen 4000-series mobile processors and Threadripper 3990X HEDT chip dominated headlines throughout AMD's CES 2020 event, but an important product announcement slipped past us: the mobile Athlon 3000 Gold and 3000 Silver families of entry-level mobile SoCs. These are 15-Watt SoCs targeting low-cost ultraportables, convertibles, and straight up Windows x64 tablets, competing against Intel's Pentium Gold 5000U "Whiskey Lake" and Pentium Silver "Gemini Lake Refresh" series. The family currently only consists of two SKUs, the Athlon Gold 3150U and Athlon Silver 3050U.

The two chips are based on the "Dali" silicon, and feature "Zen" CPU cores. The Athlon Gold 3150U features a 2-core/4-thread "Zen" CPU clocked at 2.40 GHz with 3.30 GHz boost. The Athlon Silver 3050U, on the other hand, is configured with a 2-core/2-thread CPU clocked at 2.30 GHz with 3.20 GHz boost. The CPUs on both models is configured with 4 MB of L3 cache, which takes their "total cache" (L2 + L3) figure up to 5 MB. The iGPU on the 3150U is a Radeon Vega 3 with 192 stream processors, clocked at 1.00 GHz. The one on the 3050U, is AMD's smallest, with just 2 compute units, working up to 128 stream processors, but the engine clock is set at 1.10 GHz.

The XPC slim model series has a new member. With the DS10 range, Shuttle now presents four slender, fanless barebones with a robust steel chassis and a variety of connection options. The available processors can handle different requirements from the energy-saving dual-core Intel Celeron through to the powerful i7 quad-core model.

All DS10 models are completely fanless and operate without any noise. At the same time, they are very low-maintenance, because the passive cooling means that less dust gets inside them. This is why the DS10 range is also particularly suitable for constant 24/7 operation in adverse ambient conditions. The robust steel chassis measuring 20 × 16.5 × 3.95 cm (LWH) provides space for one 2.5-inch drive in the form of a hard disk or SSD as well as two SO-DIMM slots which can accommodate a total of up to 32 GB of DDR4 memory. An M.2-2280 slot is available for fast NVMe drives. The second M.2 slot is equipped with a WLAN/Bluetooth module which transmits and receives data using two external antennas.

Shuttle Inc., the global leader in small form factor computer technology, today announces its newest addition to the Nano PC solution: NC10U series. Powered by the new Intel Whiskey Lake ULV platform, the NC10U series is a palm-sized, 4K capable and low-power PC perfect for a variety of applications including home, office, and digital signage.

The NC10U series comes with a selection of Intel's 8th Generation ULV processors ranging from Celeron, Core i3, Core i5 to Core i7 and supports for dual-channel memory with up to 32 GB of DDR4. With an 8th Gen technology, the system reduces power consumption while delivering significant performance improvement. The NC10U series features HDMI 2.0a and DisplayPort connections to support dual-screen displays for increased productivity and efficiency. Plus with the availability with HDMI 2.0a, the NC10U series gives a smooth playback of 4K content and 4K HDR videos as well.

Shuttle is expanding its successful XPC all-in-one range, which now comprises four different platforms, to include a model based on Intel's Whiskey Lake processor generation. In addition to the 15.6" capacitive touchscreen, the P51U also features an IP54-certified front panel. The display has Full HD resolution, while an energy-saving Intel Celeron 4205U dual-core processor delivers the required computing power.

Alongside the X50, the P51U is the second Shuttle model in a 15.6" format. It is the first of its size with a capacitive IPS display that has a resolution of 1920×1080 pixels and allows easy, intuitive operation using more than one finger. Its compact dimensions of 39.3×27.3×4.0 cm (W×H×D) mean that it fits easily into a range of different environments. The P51U is less at home in the consumer segment than in the POS segment. The retail sector and restaurant trade are two primary target groups for this all-in-one PC.

Intel in addition to updating its 5G strategy, also announced availability of its 8th generation Core vPro "Whiskey Lake" mobile processor SoCs. Built as multi-chip modules with the CPU and PCH dies sitting on a single package, the new Core vPro i7-8665U has identical specifications to the original i7-8665U from Q3-2018, but with the addition of vPro, a set of additional features relevant to large organizations, such as AMT (active management technology), and TXT (trusted execution technology). OEM majors Dell, HP, Lenovo, and Panasonic are giving finishing touches to enterprise notebooks based on the new chip, which by itself could be priced around $500.

The specsheet of a Lenovo IdeaPad S530-13IWL has allowed us to know the existence of the new Intel 9000 series mobile CPUs. These are the Core i7-9550U, i5-9250U and i3-9130U. The laptop datasheet, spotted on Twitter by @momomo_us, confirms new members of that family , with "IWL" at the end of the model name meaning "Intel Whiskey Lake", a family launched last October with the Core i7-8565U, Core i5-8265U and Core i3-8145U. There is no confirmation from Intel on this rumor, and there aren't much details about the CPUs either: clock speeds and core counts are not specified, though should remain quite similar to the previous members of the 8000 series.

This information points to a light rebadge of Whiskey Lake CPUs according to NotebookCheck given that there is no mention of the 9th generation of processors. This is weird because the 8000 series is basically a synonym of the 8th Gen and the same happens with the 9000 series and the 9th generation. It seems the Core i7 will be a quad-core CPU with Hyper Threading support and 8 MB of L3 cache, while the Core i5, with the same core count, will have 6 MB of L3 cache. The Core i3 CPU would be a dual-core chip with 4 MB of L3 cache. We'll have to wait for an official confirmation to confirm the specs and advantages over the older models.

HP has been trying to differentiate from its competitors in the laptop market for some time now. Certain features and design decisions could be considered not that new (or good at all), but results speak for themselves with the new HP Spectre x360. This year's 2 in 1 laptop features a new angular design that affects the borders of the laptop, but also two of its corners which are now chamfered. The effect is not only intriguing but has also a practical side: that chamfered corners have been used to put there the power button and a USB-C (Thunderbolt 3) connector.

Inside we can find the new Intel Whiskey Lake processors (Core i5-8265U and Core i7-8565U), up to 16 GB of RAM and up to 512 GB of storage on a M.2 NVMe SSD. Those CPUs allow to get more performance than previous models, but they also help on the battery life side: HP claims the 13.3-inch model can get up to 22.5 hours, a quite optimistic promise that we are anxious to prove right. The 15.6-inch model has the option to get a GeForce GTX 1050 Ti Max Q and there is also a LTE enabled variant of this laptop, but the interesting part comes on the privacy and security features.

Intel is debuting its first wave of 9th generation Core desktop processors with three models later this year - the 6-core/6-thread Core i5-9600K, the 8-core/8-thread Core i7-9700K, and the 8-core/16-thread Core i9-9900K. We've been very curious about how the entry of the Core i9 extension to the mainstream-desktop LGA1151 platform would affect pricing of the Core i5 and Core i7 K-series SKUs, especially given that the i7-9700K is the first Core i7 SKU in a decade to lack HyperThreading. An updated catalog by a major Singapore-based PC components distributor adds more clarity.

Singapore-based PC component distributor BizGram, in its latest catalog, disclosed the all-inclusive retail prices of the three new processors. As Redditor Dylan522p suggests, if you do the SGD-USD conversion and subtract all taxes, you get ominous-looking SEP prices for the three. Intel could price the Core i5-9600K at USD $249.99. The Core i7-9700K could be priced at $349.99. The flagship Core i9-9900K could go for $449.99. These seem like highly plausible pre-tax launch prices for the three chips, and fit into the competitive landscape.

The Core i7-9700K will be Intel's second fastest 9th generation Core LGA1151 processor. The 8-core/8-thread chip is equipped with 12 MB of shared L3 cache, and clocked at 3.60 GHz, with 4.90 GHz maximum Turbo Boost. It's no secret that these chips will be supported on just about any Intel 300-series chipset motherboard provided you have a BIOS update; although Intel prefers you use one of its upcoming Z390 chipset boards for overclocking its 8-core chips. That said, there are plenty of Z370 chipset boards with fairly strong CPU VRM setups. Someone with access to the i7-9700K paired it with an Aorus Z370 Ultra Gaming 2.0 motherboard, and put it through Geekbench.

The Core i7-9700K yielded a single-core score of 6,297 points, which is marginally higher than that of a stock Core i7-8700K (3.70 GHz to 4.70 GHz), owing to a higher boost frequency. The i7-8700K averages 6,000 ±100 points in this test. Multi-threaded performance is where the i7-9700K comes alive, scoring 30,152 points, which is about 12 percent higher than the 27,000 ±500 points the i7-8700K scores; and about 4-5% higher than the 28,000 ±1,000 points the AMD Ryzen 7 2700X manages in this test. The lack of HyperThreading seems to be more than compensated by the two extra cores the i7-9700K has over its predecessor. The i9-9900K maxes out the silicon with HyperThreading and 16 MB L3 cache, which could enable Intel to target a higher price-point.

With its 9th generation Core processors, Intel is re-introducing soldered IHS (integrated heatspreaders), at least in its top two premium models, the Core i9-9900K, and the Core i7-9700K. Intel refers to this feature as STIM (soldered thermal interface material). AMD implements soldered IHS across its Ryzen "Summit Ridge," "Pinnacle Ridge," and Threadripper families. XFastest took apart an i9-9900K to confirm that Intel is indeed using solder. Soldered IHS is generally preferred for better heat-transfer characteristics, compared to fluid TIMs. The use of fluid TIMs prompts some serious enthusiasts to even "de-lid" (run their processors without the IHS).

The 8-core "Whiskey Lake-S" die could be around 178 mm² in area, with the addition of two more cores, and 4.5 MB more cache (L2 + L3), over its predecessor. You'll recall that the 6-core "Coffee Lake" die measures 150 mm², a 25 mm² gain over the 4-core "Kaby Lake" die. We aren't expecting Intel to change the iGPU or uncore components. Intel is building these dies on the same 14 nm++ silicon fabrication node as "Coffee Lake," with the only architectural difference being silicon-level hardening against certain security vulnerabilities.

Intel "Whiskey Lake" CPU microarchitecture recently made its debut with "Whiskey Lake-U," an SoC designed for Ultrabooks and 2-in-1 laptops. Since it's the 4th refinement of Intel's 2015 "Skylake" architecture, we wondered what set a "Whiskey Lake" core apart from "Coffee Lake." Silicon fabrication node seemed like the first place to start, with rumors of a "14 nm+++" node for this architecture, which should help it feed up to 8 cores better in a compact LGA115x MSDT environment. Turns out, the process hasn't changed, and that "Whiskey Lake" is being built on the same 14 nm++ node as "Coffee Lake."

In a statement to AnandTech, Intel explained that the key difference between "Whiskey Lake" and "Coffee Lake" is silicon-level hardening against "Meltdown" variants 3 and 5. This isn't just a software-level mitigation part of the microcode, but a hardware fix that reduces the performance impact of the mitigation, compared to a software fix implemented via patched microcode. "Cascade Lake" will pack the most important hardware-level fixes, including "Spectre" variant 2 (aka branch target injection). Software-level fixes reduce performance by 3-10 percent, but a hardware-level fix is expected to impact performance "a lot less."

Intel today announced additions to the 8th Gen Intel Core processor family: The U-series (formerly code-named Whiskey Lake) and Y-series (formerly code-named Amber Lake) are optimized for connectivity in thin, light laptops and 2 in 1s for the first time, while also providing ultimate mobile performance and long battery life.

"The new 8th Gen Intel Core processors extend once again our leadership in delivering exceptional performance. Now with Gigabit Wi-Fi, we've enabled faster PC connectivity, added more intuitive voice experiences and enabled longer battery life needed for the next wave of mobile computing," said Chris Walker, vice president of the Client Computing Group and general manager of Intel Mobile Client Platform.

A number of retailers across Europe are coming up with early pricing of Intel's 9th generation Core-K processors, codenamed "Whiskey Lake" or "Coffee Lake Refresh." One such set of pricing, compiled by Czech publication Alza.cz confirms that our suspicions that Intel will establish a new $500-ish price-point in its MSDT (mainstream desktop) segment. We are not counting the anomalous / limited-edition Core i7-8086K in our assertion. The current Core i5-8600K is a $250-ish product, while the current platform flagship Core i7-8700K remains around $350. The upcoming Core i5-9600K (6-core/6-thread) and Core i7-9700K (8-core/8-thread) will succeed the two at nearly identical price-points. We expect Core i9-9900K to have a premium price around the $500-mark.

Intel arrested the growing popularity of AMD's Ryzen 5 1600 earlier this year, with its 8th generation Core i5 processors. The 2nd generation Ryzen 5 series only trade blows with Intel's competing offerings, with the Ryzen 5 2600X at best edging past the i5-8600K with a wafer-thin margin, in price-performance and absolute-performance. The Ryzen 7 2700X has more merits over the 6-core/12-thread i7-8700K, besides a slightly lower price, creating a competitive uncertainty that works to AMD's advantage; and which Intel hopes to plug with the 8-core/8-thread i7-9700K. The 8-core/16-thread i9-9900K could be double-digit percentage faster owing to HyperThreading and larger cache, and Intel could look to monetize that with a premium price.

Intel is giving final touches to its 9th generation Core "Whiskey Lake-U" processors for Ultrabooks and other ULV platforms. Successors to 8th Gen "Kaby Lake Refresh" chips, these 15-Watt SoCs may not pack a newer microarchitecture in terms of IPC increases, but Intel is building them on the latest iteration of its 14 nm node, along with tweaks made to their Turbo Boost algorithm, which combined with higher boost clocks, should offer better performance than the previous generation.

The lineup begins with the Core i3-8145U, successor to the i3-8130U. This 2-core/4-thread chip is has a lower nominal clock at 2.10 GHz (vs. 2.20 GHz of its predecessor), but significantly higher boost clocks of 3.90 GHz (vs. 3.40 GHz of the i3-8130U). The Core i5-8265U and top-end i7-8565U are both 4-core/8-thread chips with a nominal clocks of 1.60 GHz and 1.80 GHz, respectively. The i5-8265U has a boost clock of 4.10 GHz and 6 MB of L3 cache; while the i7-8565U tops that with 4.70 GHz boost clocks, and 8 MB of L3 cache. All three chips have 15W TDP, configurable to 25W by applying the "high performance" power scheme.

With no end to its 10 nm transition woes in sight (at least not until late-2019), Intel is left with refinement of its existing CPU micro-architectures on the 14 nanometer node. The client-desktop segment sees the introduction of the "Whiskey Lake" (aka Coffee Lake Refresh) later this year; while the enterprise segment gets the 14 nm "Cascade Lake." To its credit, Cascade Lake introduces a few major platform innovations, such as support for Optane Persistent Memory, silicon-level hardening against recent security vulnerabilities, and Deep Learning Boost, which is hardware-accelerated neural net building/training, and the introduction of VNNI (Variable Length Neural Network Instructions). "Cascade Lake" makes its debut towards the end of 2018. It will be succeeded in 2019 by Ice Lake the new "Cooper Lake" architecture.

"Cooper Lake" is a refresh of "Cascade Lake," and a stopgap in Intel's saga of getting 10 nm right, so it could build "Ice Lake" on it. It will be built on the final (hopefully) iteration of the 14 nm node. It will share its platform with "Cascade Lake," and so Optane Persistent Memory support carriers over. What's changed is the Deep Learning Boost feature-set, which will be augmented with a few new instructions, including BFLOAT16 (a possible half-precision floating point instruction). Intel could also be presented with the opportunity to crank up clock speeds across the board.

ASUS announced that it is releasing motherboard BIOS updates that add 9th generation Core "Whiskey Lake" processor compatibility for almost its entire Intel 300-series chipset motherboard family. This includes models based on H310, B360, Q370, and H370 chipsets, and not just the top Z370. Intel is expected to debut its 9th generation Core processor family with three SKUs later this year: the Core i9-9900K, the Core i7-9700K, and the Core i5-9600K. The tables below list motherboard models alongside the minimum BIOS version you'll need for "Whiskey Lake" compatibility. You'll find your BIOS in the "support" tab of the product page of your motherboard on ASUS website.

Intel's client desktop processor lineup is under tremendous pressure owing to competition from AMD, with the company having to roll out entire processor generations over mere 2-3 quarters. You'll recount that Intel was merrily trotting around with its barely-innovative 7th Gen "Kaby Lake" family in early 2017, when AMD stunned the industry with an outperforming product lineup. The 7th generation barely lasted its planned product cycle, before Intel rushed in a pathetic sub-$500 Core X lineup, and the 8th generation "Coffee Lake" with 50-100% core-count increases. Even that is proving insufficient in the wake of 2nd generation AMD Ryzen "Pinnacle Ridge," and Intel is cutting short its product cycle with the 9th generation Core "Whiskey Lake" (or "Coffee Lake" Refresh) series, that further increase core-counts.

"Whiskey Lake" was originally planned for Q1-2019 alongside the 14 nm original Z390 chipset. Intel wasn't expecting AMD to rebound with Ryzen 2000 series (particularly the tangible IPC increases and improved multi-core boosting). And so, it decided to rush through with a new product generation yet again. The Z370 is being re-branded to Z390 (with an improved CPU VRM reference design), and what was originally meant to come out in Q1-2019, could come out by Q4-2018, at the very earliest by October. Intel reportedly planned availability sooner, but realized that distributors have heaps of unsold 8th generation Core inventory, and motherboard vendors aren't fully ready for the chip. Since getting a 9th gen Core chip doesn't warrant a new motherboard, customers would be inclined to pick up 9th generation chip with their existing boards, or any new 300-series board. This would kill the prospects of selling 8th generation Core CPUs.

ASUS is ready with a staggering 19 motherboard models based on Intel's upcoming Z390 Express chipset. This chipset, as you'd recall, is a re-branding of the Z370 Express with a stronger reference CPU VRM design, to cope with overclocking Intel's upcoming 8-core "Whiskey Lake" processors better. This time around, ASUS lineup is more exhaustive than its Z370-based lineup, with its top-tier ROG Maximus XI series including nearly all extensions including the Maximus XI Hero (and its WiFi sub-variant), Maximus XI Code, Maximus XI Apex, Maximus XI Formula, and Maximus XI Extreme (no Gene, though). The upper-mid tier ROG Strix series includes three ATX models: Strix-E, Strix-F, Strix-H, and the mini-ITX Strix-I, but again curiously, no micro-ATX Strix-G.

The company's mainline Prime series is relegated to just three models: Prime Z390-A, Prime Z390M-Plus, and Prime Z390-P. The cheap entry-level TUF Gaming lineup swelled to five modes: TUF Z390M-Pro Gaming, TUF Z390M-Pro Gaming WiFi, TUF Z390-Plus Gaming, TUF Z390-Plus Gaming WiFi, and TUF Z390-Pro Gaming. There's also the Z390 Dragon, designed for gaming i-cafes. Intel is reportedly launching its first 9th generation Core "Whiskey Lake" processors as early as 1st August, 2018.

Wrap your head around this: at some point in 2019, AMD will be selling 7 nm processors while Intel sells 14 nm processors. That how grim Intel's 10 nanometer silicon fabrication process development is looking. In the Q&A session of its Q2-2018 Earnings Call, Intel stated that the first products based on its 10 nm process will arrive only by Holiday 2019, making 14 nm micro-architectures hold the fort for not just the rest of 2018, but also most of 2019. In the client-segment, Intel is on the verge of launching its 9th generation Core "Whiskey Lake" processor family, its 5th micro-architecture on the 14 nm node after "Broadwell," "Skylake," "Kaby Lake," and "Coffee Lake."

It's likely that "Whiskey Lake" will take Intel into 2019 after the company establishes performance leadership over 12 nm AMD "Pinnacle Ridge" with a new round of core-count increases. Intel is also squeezing out competitiveness in its HEDT segment by launching new 20-core and 22-core LGA2066 processors; and a new platform with up to 28 cores and broader memory interface. AMD, meanwhile, hopes to have the first 7 nm EPYC processors out by late-2018. Client-segment products based on its architecture, however, will follow the roll-out of these enterprise parts. We could see a point in 2019 when AMD launches its 7 nm 3rd generation Ryzen processors in the absence of competing 10 nm Core processors from Intel. Posted below is an Intel slide from 2013, when the company was expecting 10 nm rollout by 2015. That's how much its plans have derailed.

The fluid thermal interface material between the processor die and the IHS (integrated heatspreader) has been a particularly big complaint of PC enthusiasts in recent times, especially given that AMD has soldered IHS (believed to be more effective in heat-transfer), across its Ryzen processor line. We're getting reports of Intel planning to give at least its top-dog Core i9 "Whiskey Lake" 8-core socket LGA1151 processor a soldered IHS. The top three parts of this family have been detailed in our older article.

The first Core i9 "Whiskey Lake" SKU is the i9-9900K, an 8-core/16-thread chip clocked between 3.60~5.00 GHz, armed with 16 MB of L3 cache. The introduction of the Core i9 extension to the mainstream desktop segment could mean Intel is carving out a new price point for this platform that could be above the $300-350 price traditionally held by top Core i7 "K" SKUs from the previous generations. In related news, we are also hearing that the i9-9900K could be launched as early as 1st August, 2018. This explains why motherboard manufacturers are in such hurry to release BIOS updates for their current 300-series chipset motherboards.

HWiNFO v. 5.7 has brought with it a smattering of improvements and additions, as is usually the case. These are worthier of a news piece than most, however, since we're looking at quite a number of interesting developments. For one, preliminary support has been added for Intel's Whiskey Lake, an upcoming mobile design that succeed's Intel's Kaby Lake products, and should bring the fight to AMD's Ryzen Mobile offerings. Furthermore, and still on the Intel camp, support for the upcoming 10 nm Ice Lake has also been added. Íf you'll remember, Ice Lake is expected to be Intel's first foray into the 10 nm+ process in the mobile camp (given away by the U/Y product codes), after numerous delays that made the company stick with its 14 nm process through three iterations and in-process improvements. These are not the only Intel developments, however; the team behind HWiNFO has also added a new feature that reveals your Intel CPU's Turbo Boost multipliers, which the company has since removed form their ARK pages and processor specifications - an issue that generated rivers of ink.

Stepping away from the blue giant's camp, there's added support for AMD's next revision of their Ryzen processors (Pinnacle Ridge, on a 12 nm process). There's also mention of upcoming support for AMD's 400-series chipsets, which should improve platform features of the AM4 socket. This addition comes after we've seen its first appearance in the PCI-SIG Integrators List.