Wednesday, July 25th 2018
Intel Core i9 8-core LGA1151 Processor Could Get Soldered IHS, Launch Date Revealed
The fluid thermal interface material between the processor die and the IHS (integrated heatspreader) has been a particularly big complaint of PC enthusiasts in recent times, especially given that AMD has soldered IHS (believed to be more effective in heat-transfer), across its Ryzen processor line. We're getting reports of Intel planning to give at least its top-dog Core i9 "Whiskey Lake" 8-core socket LGA1151 processor a soldered IHS. The top three parts of this family have been detailed in our older article.
The first Core i9 "Whiskey Lake" SKU is the i9-9900K, an 8-core/16-thread chip clocked between 3.60~5.00 GHz, armed with 16 MB of L3 cache. The introduction of the Core i9 extension to the mainstream desktop segment could mean Intel is carving out a new price point for this platform that could be above the $300-350 price traditionally held by top Core i7 "K" SKUs from the previous generations. In related news, we are also hearing that the i9-9900K could be launched as early as 1st August, 2018. This explains why motherboard manufacturers are in such hurry to release BIOS updates for their current 300-series chipset motherboards.
Source:
Coolaler
The first Core i9 "Whiskey Lake" SKU is the i9-9900K, an 8-core/16-thread chip clocked between 3.60~5.00 GHz, armed with 16 MB of L3 cache. The introduction of the Core i9 extension to the mainstream desktop segment could mean Intel is carving out a new price point for this platform that could be above the $300-350 price traditionally held by top Core i7 "K" SKUs from the previous generations. In related news, we are also hearing that the i9-9900K could be launched as early as 1st August, 2018. This explains why motherboard manufacturers are in such hurry to release BIOS updates for their current 300-series chipset motherboards.
79 Comments on Intel Core i9 8-core LGA1151 Processor Could Get Soldered IHS, Launch Date Revealed
And so i hope imtel will do that with there hedt platform as well. So that i dont have to delid a 1000 dollar+ cpu.
I'm guessing they had to solder the 9900K simply because of high stock clock speed and extra 2 cores over the previous flagship (8700K).
*wink*
X299 definitely needs more cpus - it was targeted against X399 - they'd better not pull the same chipset refreshing move on HEDT or they can gtfo - that tr4 32 core is insane.
That said, without having seen this post yet, I literally just said a few minutes ago in another thread that I wouldn't be surprised if Intel started using solder again (among some other things). The Ryzen effect is real. Still, it's not good enough. Just because one top end chip gets soldered doesn't excuse the rest. These chips are often paired with that dinky little coaster heatsink in stuffy cases with poor airflow. I don't care for prebuilt machines, but nobody who buys one should have to suffer impacted performance because of some poor cost cutting design choices. Nobody should be using a computer plagued with thermal throttling issues because Intel wanted to save a few cents on that CPU by using paste and maybe a buck or two on some dinky cooler, while such a configuration only "guarantees" some shitty base frequency when in reality it should "turbo" much higher.
Come to think of it, back in the day there did exist some lower end Intel chips, such as the C2D e4400, that weren't soldered. For some reason, nobody really complained about that... but those chips also didn't run stupid hot, either.
Nah.
They stopped soldering any CPU a year ago and have no reason to switch back as long as people keep buying.
In any case, I'm starting to enjoy decapitating Intel's latest CPU's : )
Some Intel fans on the other hand danced around with this idea that Intel couldn't do it because ~
- it'd cost way too much? nope
- the solder would not be effective long term? Xeons say hello
- worst of all you couldn't solder them all because the chip was tiny!
AMD doesn't solder RR, they solder everything else AFAIK, unlike Intel.9900k