MediaTek today unveiled its new Filogic connectivity family with the introduction of the Filogic 830 Wi-Fi 6/6E system-on-chip (SoC) and Filogic 630 Wi-Fi 6E network interface card (NIC) solutions. MediaTek's new Filogic series of high-performance Wi-Fi 6/6E chipsets provide reliable connectivity, high computation capabilities and a rich set of features in highly integrated, power-efficient designs.

"The MediaTek Filogic series ushers in a new era of smart Wi-Fi solutions with extreme speeds, low latency and superb power efficiency for seamless, always connected experiences," said Alan Hsu, Corporate Vice President & General Manager, Intelligent Connectivity at MediaTek. "These new chipsets provide best-in-class features with highly integrated designs for the next generation of premium broadband, enterprise and retail Wi-Fi solutions."

In view of the ongoing production capacity shortage in the semiconductor industry and the resultant price hike of chips, revenue of the top 10 IC design companies for 2Q21 reached US$29.8 billion, a 60.8% YoY increase, according to TrendForce's latest investigations. In particular, Taiwanese companies put up remarkable performances during this period, with both MediaTek and Novatek posting YoY growths of more than 95%. AMD, on the other hand, experienced a nearly 100% YoY revenue growth, the highest among the top 10.

TrendForce indicates that the ranking of the top five companies for 2Q21 remained unchanged from the previous quarter, although there were major changes in the 6th to 10th spots. More specifically, after finalizing its acquisition of Inphi, Marvell experienced a major revenue growth and leapfrogged Xilinx and Realtek in the rankings from 9th place in 1Q21 to 7th place in 2Q21.

To all those who missed the 6 GHz 802.11ax (Wi-Fi 6E) bus, ASUS rolled out the PCE-AX58BT, a desktop PCI-Express network adapter that provides Wi-Fi 6E and Bluetooth 5.2 connectivity. The adapter provides a theoretical maximum bandwidth of 2402 Mbps Wi-Fi 6E (6 GHz) and Wi-Fi 6 (5 GHz), along with Wi-Fi 6 (2.4 GHz) bandwidth of up to 574 Mbps. Older 802.11ac is supported at speeds of up to 1733 Mbps, and 802.11n at up to 300 Mbps. The network controller also supports the latest WPA3 security standards.

The PCE-AX58BT connects to your desktop PC over a PCI-Express x1 slot, and an included USB 2.0 header cable (needed for the Bluetooth component). A pair of external antennae are fixed to a magnetized base that can be placed either on your desk, or on top of your PC case. While ASUS does not mention the controller, it is very likely the Intel AX210 Gig+ looking at the feature-set. It sits underneath an aluminium heatsink on an M.2-2230 card on top of the add-on card's main PCB. The company didn't reveal pricing or availability information. ASUS is readying a portfolio of Wi-Fi 6E consumer networking hardware, including the upcoming ZenWiFi PRO router.

ASUS earlier today teased its upcoming premium home networking product, the ZenWiFi PRO router. Designed in a vertical, cuboidal body with an acrylic top that shows off its MU-MIMO antennas, the ZenWiFi PRO is designed to be space-saving on your desk, while not compromising on range or bandwidth. As an ASUS Zen product, it's likely to be high on the aesthetics, with its matte black body that resembles a skyscraper. The "penthouse" (if you can call it that), features the antennas resembling pillars, as well as an RGB-illuminated ASUS logo that probably serves other functions. The teaser already reveals that the router is designed for 6 GHz Wi-Fi 6E. It's also possible that ASUS throws in goodies such as 2.5 GbE wired LAN and WAN ports, USB 3.x type-C and type-A ports to plug in the next crop of 5G dongles, DAS, and much more. It also wouldn't surprise us if ASUS designs mesh repeaters with the same design scheme as optional accessories, or part of whole-home mesh kits.

Here's the first picture of a production EVGA X570 DARK motherboard, the company's flagship Socket AM4 motherboard targeting overclocking features on the latest "Zen 3" processors. The board prioritizes CPU and memory overclocking headroom above all else. The orientation of the Socket AM4 is rotated 240°, such that the memory slots are located on top of the socket. There's only 1 DIMM per memory channel, which is the most optimal topology for memory overclocking. The angled power inputs, along with onboard buttons, switches, POST code display, and voltage measurement points, are conveniently located in the top-right corner of the PCB, with the power inputs being angled to reduce cable clutter.

The CPU socket is wired to two PCI-Express 4.0 x16 slots (x8/x8 with both populated), and an M.2 NVMe slot with PCI-Express 4.0 x4 wiring. The X570 chipset (not specified whether it's an X570S), is cooled passively, by a large heatsink that extends into heatsink over the board's two M.2 slots. Connectivity likely includes two wired networking interfaces, a Wi-Fi 6E wireless interface, and EVGA's highest-grade onboard audio solution. The board's BIOS is optimized for record-breaking CPU and memory overclocking, using sub-zero cooling solutions. The company didn't reveal availability or pricing.

With AMD launching the latest Ryzen 5000 Series processors, MSI X570S motherboards will also hit the market in the coming days. The new series of MSI X570S motherboards have not only upgraded specifications but also included brand-new designs. The following are detailed introductions that you must not miss. The whole series of MSI X570S motherboards all support AMD's latest Ryzen 5000 Series processors. To unleash the impressive performance, MSI offers a comprehensive upgrade for the power phase. MEG X570S motherboards have direct 16+2 phases with 90 A SPS and MPG X570S motherboards have at least 12+2 Duet Rail Power System with 75 A SPS. Both the MAG X570S TORPEDO MAX and the MAG X570S TOMAHAWK MAX WIFI have Mirrored Power Arrangement 12+2 phases with 60 A SPS as well.

s for heatsink design, the major change is to remove fans on the chipsets, which helps reduce dust and noise. In order to dissipate heat effectively without fans, the area of the heatsink that covers the chipset is enlarged considerably. Also, all MSI X570S Series motherboards feature at least 1 M.2 Shield Frozr which prevents throttling by offering the best thermal protection to help maintain SSD maximum performance. For hard-core users, we have the MEG X570S ACE MAX with 4 Gen 4 M.2 slots covered with M.2 Shield Frozr and Double Side M.2 Thermal.

Today, Intel announced the Intel NUC 11 Extreme Kit (code-named "Beast Canyon"), a highly modular desktop PC engineered to provide a phenomenal experience for gaming, streaming and recording. With the latest 11th Gen Intel Core processors, support for full-size discrete graphics cards and a full range of I/O ports, the Intel NUC 11 Extreme Kit delivers high performance gameplay and smooth, immersive visuals.

Compact Intel NUC 11 Extreme Kits are designed to provide powerful, immersive gaming experiences. For performance, connectivity, and modularity, the Intel NUC 11 Extreme kit delivers massive performance with a small footprint.

The highest-performing Intel NUC yet delivers a premium and size-optimized PC package for creating innovative desktops suited to gamers' unique performance needs. Packing the latest hardware components into a tiny 8-liter case, the Intel NUC 11 Extreme Kit is loaded with features typically found in much larger gaming rigs and offers customizable design options.

GIGABYTE is giving finishing touches to its new motherboard targeted at creators who like to game, and premium desktop builders, the X570S AERO G. This marks the debut of the company's AERO brand, associated with notebooks, over to the desktop PC components segment. The board's aesthetics appear more in line with the company's VISION line of products. The Socket AM4 motherboard is based on the new AMD X570S chipset, a low-power version of the X570 that can make do with fanless cooling.

What sets the X570S AERO G apart is its five M.2 NVMe Gen 4 slots, leveraging the PCIe Gen 4 downstream connectivity of the X570S. You also get two PCI-Express 4.0 x16 slots (x8/x8 with both populated), and creator-relevant connectivity that includes 2.5 GbE wired LAN, Wi-Fi 6E, and GIGABYTE's highest onboard audio grade. Thunderbolt connectivity is unlikely to be found. The board will come with out-of-the-box support not just for Ryzen 5000 "Vermeer" processors, but also Ryzen 5000G "Cezanne" APUs, which it wires out through DisplayPort and HDMI ports.

Update Jul 5th: GIGABYTE formally launched the X570S AERO G. It lacks 10 GbE, unlike previously reported, offers 2.5 GbE, and comes with USB 3.2x2 (20 Gbps) ports.

At the beginning of June, MSI presented the brand-new X570S Series motherboards during MSI's online product launch event. The unique designs and remarkable features sparked widespread discussions. Here are more in-depth concrete details regarding the MSI MAG X570S Series. In 2019, AMD's X570 platform came out and became the first chipset that supports PCIe 4.0 solution. Even now, MSI X570 Series motherboards are undoubtedly a great lineup with high specifications and aggressive designs. However, MSI can't just stop there. Our mission is to deliver the best computing experience for every gamer and creator. The new X570S Series motherboards achieved exactly that.

MSI is dedicated to product optimization so the new motherboards are made with prominent features. The MAG X570S Series is at the forefront of this launch. Inspired by military design, the MAG X570S TOMAHAWK MAX WIFI and MAG X570S TORPEDO MAX share identical looks. More excitingly, the MAG X570S TORPEDO MAX now comes in the Pacific Blue colorway, which is all the rage for our fans. Apart from the attractive designs, the imperative modification is the fanless chipset heatsink. We removed the fan to reduce dust and noise, while the ranges of the heatsink are expanded. Also, both MAG X570S TOMAHAWK MAX WIFI and MAG X570S TORPEDO MAX have M.2 Shield Frozr. The former has an All aluminium Design while the latter has an Extended Heatsink Design.

Today, Lenovo announced the latest additions to its ThinkPad and ThinkVision portfolios. The redesigned and re-engineered ThinkPad X1 Extreme Gen 4 delivers more power, better connectivity and rich configuration options in response to customer demand. Powered by up to the latest 11th Gen Intel Core i9 H-Series vPro processors and available with the latest NVIDIA GeForce RTX Laptop GPUs, up to 64 GB DDR4 memory and dual Solid-State Drive (SSD) support, the X1 Extreme Gen 4 is also offered with optional 5G Wireless WAN for high-speed access to cloud data.

With 74 percent of companies planning to permanently shift to more remote working, users need an exceptional collaboration experience. X1 Extreme Gen 4 delivers in spades, thanks to edge-to-edge 16-inch display options up to 4K along with Dolby Vision support, a new FHD webcam, dual noise-cancelling microphones and a user-facing Dolby Atmos Speaker System that is 20 percent larger than previous generation. All this performance wrapped in a legendary ThinkPad durable package that weighs less the 1.81 kg (four pounds).

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions announced the launch of the newest X570S AORUS series motherboards primed to unleash the potential of the recently released AMD Ryzen 5000 series desktop processors with enhanced DrMOS direct power design and 6 layers and above ultra cool PCB for higher stability. The whole series equip with a brand new passive chipset thermal design and up to four sets of high thermal efficiency armored PCIe 4.0 M.2 slots with M.2 Thermal Guard III, which ensures effective heat dissipation of full operation on chipsets and 7000 MB/s high speed operating on NVMe SSDs without throttling by overheating. The brand new X570S series motherboards kick off the PCIe 4.0 era with extensive feature sets.

The flagship X570S AORUS MASTER motherboard is fitted with a 16-phase direct digital power design for the more solid power management and optimized overclocking performance. With advanced heat dissipation technology of Fins-Array II Stacked Fins Heatsink, Direct Touch Heatpipe II and Smart Fan 6, GIGIABYTE X570S motherboards can maintain cool and high performance under high loading operation. Furthermore, GIGABYTE Active OC Tuner technology integrated in select motherboards to provide a more flexible performance improvement.

MSI, a world leader in computer hardware and solutions, has announced the availability of its revamped lineup of mobile workstations.The new WS76and WS66 have been verified by NVIDIA Studio to ensure the hardware and software drivers are made for highly demanding creative workflows. MSI has also announced the brand-new design of WE76, WF76 and WF66 for professionals. MSI recently released its newest NVIDIA Studio-verified content creation lineup for creators on-the-go, the Creator Z16 and Creator 17 but the new workstations provide options for professionals who need additional power to run the most complex programs.

Driven by the latest NVIDIA RTX graphics and 11th gen Intel Core processors, MSI's workstations are now capable of delivering 2x performance compared to previous models. The lineup speed sup rendering with greater visual accuracy and computing power. Whether users are working with large, complex CAD models in the office, or need to take their work to go, MSI Workstations can easily take on even the heaviest workloads. The lineup is recognized and certified by the most trusted ISV software including Vectorworks, Enscape, Autodesk, Ansys, and Solidworks to provide an exceptional, seamless user experience.

Today at Computex 2021, Intel announced two new additions to the lineup of 11th Gen Intel Core processors. These new processors, combined with Intel's co-engineering work with independent software vendors (ISVs) and original equipment manufacturers (OEMs), continue Intel's leadership in mobile compute—delivering the world's best processors for thin-and-light Windows-based laptops. Intel also introduced its first 5G product for the next generation of PC experiences, Intel 5G Solution 5000, following the previously announced collaboration with MediaTek and Fibocom.

"We've taken the world's best processor for thin-and-light Windows laptops and made the experience even better with the addition of our two new 11th Gen Intel Core processors with Intel Iris Xe graphics. In addition, we know real-world performance and connectivity are vital to our partners and the people who rely on PCs every day, so we're continuing that momentum with more platform capabilities and choice in the market with the launch of our first 5G product for PCs: the Intel 5G Solution 5000," said Chris Walker, Intel corporate vice president and general manager of Mobility Client Platforms.

HP introduced its latest gaming hardware and software designed for today's gamers with the powerful OMEN 16 and OMEN 17, bright and customizable OMEN 25i Gaming Monitor, and community gaming with OMEN OASIS Beta feature in OMEN Gaming Hub. The company also debuted Victus by HP, its next-generation mainstream-level gaming PC portfolio, with a 16-inch laptop.

Gaming continues to be an outlet for entertainment and connecting with friends. Two out of three people are spending more time watching videos and gaming than they did prior to the pandemic, with one in four gaming three to four hours more and almost one in five gaming six to ten hours more a week6. HP's next-generation gaming portfolio is designed for both veteran gamers and enthusiast explorers to be entertained, connected, and empowered to progress in their favorite games.

MSI, a leading manufacturer of business, design and gaming technology, is proud to announce its new lineup of laptops powered by the latest 11th Gen Intel Core H series processors and NVIDIA GeForce RTX 3080 Laptop GPU. Having expanded to creators' terrain in recent years, MSI has perked up to materialize the concept where design is the bond between dreaming it and doing it through their upcoming virtual event "Tech Meets Aesthetic". The new laptops continue MSI's trend of producing top-tier, powerful machines with aesthetic touches that enhance user experience and unleash the inner gamer and creator spirits.

With a 30% performance upgrade over previous models, the high-speed combo of PCIe Gen4, Thunderbolt 4, and Wi-Fi 6E heighten increased enhancements. For the gaming lineup, MSI-exclusive features like "Discrete Graphics Mode" improve graphics performance, while MSI Center allows users to overclock the GPU with ease.

Acer today announced updates to its popular Predator Triton 300, Predator Helios 300 and Nitro 5 series of gaming notebooks, all of which have been refreshed to take advantage of the latest 11th Gen Intel Core H-series processors and NVIDIA GeForce RTX 30 Series Laptop GPUs - including the new GeForce RTX 3050 and GeForce RTX 3050 Ti. On top of a number of other updates, improvements to the devices' displays ensure that players will appreciate as much of this power boost as possible.

"The new silicon announced today are as exciting for us at it is for users, as more powerful processors let us push the thermal management capabilities of our devices further than ever," said James Lin, General Manager, Notebooks, IT Products Business, Acer Inc. "There is a lot of exciting technology coming to the surface right now, and we're able to offer an excellently tuned package for players of all skill levels. Whether you're a seasoned pro or investing in your first gaming notebook, this is the time."

The new Razer Blade 15 Advanced Model lineup continues to present the best gaming laptops on the market. Armed with the new 11th Gen Intel Core H-Series Processor up to an Intel Core i9, NVIDIA GeForce RTX 30-Series Laptop GPU, and the fastest available displays with up to 360Hz, the new Razer Blade 15 Advanced Model delivers ultimate power in a premium compact form factor. The RTX 3060 version stands at an impressive height of only 15.8 mm, making it the thinnest gaming laptop in the world with a GeForce RTX 3060 Laptop GPU.

To ensure a smooth experience, the new Razer Blade 15 Advanced Model utilizes the latest PCIe Gen 4 configuration and is powered by DDR4 3200 MHz memory. The innovative M.2 design returns, with dual slots available on RTX 3070 versions and above, allowing users to easily expand the SSD according to their storage needs. Be it hardcore gaming or content creation, the Razer Blade 15 Advanced Model laptops are built to handle intensive usage and multitasking.

Intel today announced the 11th generation Core "Tiger Lake-H" mobile processors for notebooks of conventional thickness, gaming notebooks, and mobile workstations. This is the first scale-up of the "Tiger Lake" microarchitecture, with the introduction of a brand new die that has up to 8 "Willow Cove" CPU cores. These processors typically come with TDP of 35-45 W, but the flagship part ships with TDP as high as 65 W. Unlike "Rocket Lake," this chip is built on Intel's latest 10 nm SuperFin silicon fabrication process. With it, Intel is announcing ten processor SKUs—five each for the consumer and commercial notebook market segments. These span across the Core i9, Core i7, and Core i5 brand extensions.

The 10 nm "Tiger Lake-H" silicon measures roughly 190 mm², and has several changes compared to the 4-core "Tiger Lake-U" silicon the company debuted the 11th Gen with. The biggest change is the CPU core count of 8. This lets it not only achieve parity with AMD in mobile CPU core counts, but also purportedly beat it on the back of a higher IPC. Each of these 8 "Willow Cove" cores has 1.25 MB of dedicated L2 cache, and share 24 MB of L3 cache. You get the same "Willow Cove" ISA as the "Tiger Lake-U," including AVX-512 and DLBoost. Next up, the chip features an integrated graphics based on the Gen12 Xe LP graphics architecture, only that the execution units have reduced to just 32 on this silicon, compared to 96 on the 4-core Tiger Lake-U. The new chip enjoys a bigger power budget to run the iGPU at higher clock speeds. There is also a 20-lane PCI-Express Gen 4.0 interface, and a dual-channel DDR4 memory controller.

AMD in 2020 set out on an ambitious project to develop Wi-Fi modules under its own marquee. This was catalyzed in part by the company's Ryzen PRO line of mobile processors, to better compete with Intel's Core vPro processors, which included Intel's own vPro-ready WLAN modules as part of a package to notebook OEMs. Come 2021, and AMD's module is ready, and is debuting with a handheld game console.

The new AMD RZ608 WLAN module is cutting-edge, in supporting Wi-Fi 6E (802.11ax over 6 GHz) in addition to a plethora of older Wi-Fi standards; and Bluetooth 5.2. 6 months seem like an awfully short amount of time for AMD to whip up a WLAN product portfolio from scratch, especially with the IP tangles involved. The company instead chose to partner with MediaTek, which has access to all the IP needed to develop such a product. The WLAN PHY appears to be a MediaTek design, specifically based on the MT7921K chip. We'll hear a lot more about the RZ608, as it might start showing up in notebooks powered by Ryzen 5000 "Cezanne" processors. It remains to be seen if the chip makes it to desktop platforms, too.

Intel's fabled 8-core "Tiger Lake-H" silicon built on the 10 nm SuperFin process, is close to reality. The company's upcoming 11th Gen Core "Tiger Lake-H" processors for performance- and gaming notebooks, leverages this die. An HD Tecnologia report leaks alleged company slides from Intel that detail the processor line up and feature-set. To begin with, the 11th Gen Core-H series processors come in core-counts ranging from 4-core/8-thread, to 6-core/12-thread, and 8-core/16-thread. Look at the embargo date on the leaked slides, one could expect a formal launch as close as May 11, 2021.

The 10 nm SuperFin "Tiger Lake-H" silicon features 8 "Willow Cove" CPU cores, and an updated iGPU based on the company's latest Gen12 Xe LP graphics architecture. Each of the eight CPU cores has 1.25 MB of L2 cache, and they share a massive 24 MB of L3 cache. The Gen12 Xe LP iGPU only has 32 execution units (EUs), according to the slides, 1/3rd those of the 96 EUs on the "Tiger Lake-U." The uncore component is also updated, now featuring dual-channel DDR4-3200 native support, and a 28-lane PCI-Express 4.0 root-complex. 16 of these lanes are wired out as PEG (PCI-Express Graphics), four as a CPU-attached NVMe slot, and eight toward the 8-lane DMI 3.0 chipset bus.

MSI, the world's leading gaming motherboard brand, proudly announces the new flagship Intel Z590 MEG Series motherboards - the MEG Z590 ACE GOLD EDITION, MEG Z590 UNIFY, and MEG Z590 UNIFY-X. They're not only tailored for enthusiast gamers but also offered more possibilities to satisfy various desires - the luster of gold against endless darkness.

Gold symbolizes a unique attribute of pride and elites. The pure luster of gold, 24K presents utmost in color and luminosity. With craftsmanship and hours of dedication, the 24K gold and state-of-the-art technology have been harmonized into one. The MEG Z590 ACE GOLD EDITION boasts premium aesthetics with a brand new color scheme - the platinum color finish and genuine 24K-gold foil heatsink perfectly show off the concept of beauty.

Linksys, a global leader in home and business Wi-Fi solutions, today announces the availability of the market's first Wi-Fi 6E certified systems, the Linksys Hydra Pro 6E and award-winning Linksys Atlas Max 6E. Built with Velop Intelligent Mesh and utilizing the newly opened 6GHz band, the Linksys Hydra Pro and Linksys Atlas Max expand the user's network for the fastest speeds possible to every corner of the home. Wi-Fi 6E offers the 6GHz band connection that is needed for device-heavy homes and ensures optimal performance for video conferencing, working and learning from home, as well as the latest AR and VR devices.

"Wi-Fi 6E is driving a surge in technology innovation and we're proud to deliver next-level solutions that harness 6E speeds and efficiency, coupled with built-in Velop Intelligent Mesh," says Harry Dewhirst, vice president of business development, Linksys. "As the market's first Wi-Fi 6E system certified by the Wi-Fi Alliance we remain steadfast in our commitment to provide our customers reliable, innovative and secure Wi-Fi solutions."

Samsung Electronics today unveiled the Galaxy Book Pro and Galaxy Book Pro 360, the new generation of mobile computing devices that bring together powerful performance with the mobile DNA of a Samsung Galaxy smartphone. Based on the enhanced Galaxy ecosystem, Galaxy Book Pro and Book Pro 360 work seamlessly with your other Galaxy and IoT devices, making workflow and entertainment across devices smoother—and making life easier. As a staple for the Galaxy Book Pro series, Samsung embraced open collaboration, working with industry-leading partners Intel and Microsoft, to build a new approach to mobile computing, where smartphones and PCs work together flawlessly across operating systems and never sacrifice performance for portability.

MSI first Summit laptops have been well-acclaimed by business users. Now the new members are introduced! Surrounded by the captivating golden ratio spiral special effect, MSI grandly unveiled the "MSIology: Determined to Succeed 2021" virtual event. Exemplifying the perfection of the golden ratio, MSI launched the Summit series, including the honorees of "CES Innovation Awards" MSI Summit E16 Flip and MSI Pen, "Best of the CES 2021" winner Summit E13 Flip Evo, and the MSI USB-C Docking Station Gen 2. During the virtual event, MSI showcased the versatile work styles and displayed how the MSI Summit series can unleash users' potential to boost business and productivity.

"As the famous author Arthur C. Clarke once said, any sufficiently advanced technology is equivalent to magic. Today, we are here to witness the magic of the new MSI Summit.", Iris Chuang, Product Management Director of MSI Notebook, proudly announced in the opening of the new product launch. A symbol of aesthetics, a giant golden ratio spiral outlined the spirit of MSIology, which is to design impeccable laptops for perfectionists who are determined to succeed.

Qualcomm Technologies, Inc. announced the latest addition to its 7-series portfolio, the Qualcomm Snapdragon 780G 5G Mobile Platform. Snapdragon 780G is designed to deliver powerful AI performance and brilliant camera capture backed by the Qualcomm Spectra 570 triple ISP and 6th generation Qualcomm AI Engine, allowing users to capture, enhance, and share their favorite moments seamlessly. This platform enables a selection of premium-tier features for the first time in the 7-series, making next generation experiences more broadly accessible.

"Since introducing the Snapdragon 7-series three years ago, more than 350 devices have launched based on 7-series mobile platforms. Today, we are continuing this momentum by introducing the Snapdragon 780G 5G Mobile Platform," said Kedar Kondap, vice president, product management, Qualcomm Technologies, Inc. "Snapdragon 780G was designed to bring in-demand, premium experiences to more users around the world."