Introducing the EVGA Z690 CLASSIFIED - The latest addition to EVGA's most-respected line of motherboards. This motherboard fully supports the latest 12th Gen Intel Core Series Processors and takes full advantage of PCIe Gen5 and PCIe Gen4 M.2 NVMe SSDs. The EVGA Z690 CLASSIFIED provides unbeatable power, performance and stability via a 19-phase VRM and 10-layer PCB. Moreover, this board supports up to 128 GB of DDR5 memory, 2x 2.5 Gbps NIC + Wi-Fi 6E / BT 5.2, 7.1 HD audio, and multiple USB options. The EVGA Z690 CLASSIFIED is designed for nothing less than the ultimate gaming experience.

From its inception, Lenovo Legion wanted to make the modern gaming experience immersive, as well as more inclusive. At CES 2022, Lenovo Legion once again delivers on its pursuit of unyielding play and productivity to gamers of every generation and content creators, who can now all universally enjoy premium entertainment and play from home battle stations, dorms, esports arenas - or practically anywhere, and look good doing it too.

Lenovo's first batch of 2022 battle-ready PCs, monitors, accessories and gamer-focused software and services unveiled today, which include the powerful 16-inch Lenovo Legion 5i Pro and Lenovo Legion 5 Pro laptops and the polished 15-inch Lenovo Legion 5i and Lenovo Legion 5 laptops. The new gaming laptops come available with Windows 11 gaming performance, next-gen AMD Ryzen processors, or latest 12th Gen Intel Core processors and up to latest fully powered NVIDIA GeForce RTX Laptop GPUs. Inspired by gamer research, these new devices celebrate 'magical minimalism' design and denote a leap towards a contemporary aesthetic with purposeful detailing like an uncluttered wordmark, expressive venting, and immersive lighting. A top-placed camera bump with eShutter kill switch and rear port protection convey a sleek look of power and performance that helps to create a more inclusive experience focused on player enjoyment and winning, not labels. Paired with exclusives beloved by Legion fans such as the advanced thermals of next-level Legion Coldfront 4.0, the hair-trigger speeds and improved ergonomics of Legion TrueStrike keyboard, and optimized tuning via Lenovo Vantage for gaming.

With adoption of Wi-Fi CERTIFIED 6 growing steadily, Wi-Fi Alliance is evolving Wi-Fi 6 certification to meet increasing demands from today's Wi-Fi use cases. Wi-Fi CERTIFIED 6 Release 2 is now available, bringing new features that support increasing device and traffic density to deliver greater performance and power management with Wi-Fi devices and applications. Wi-Fi CERTIFIED 6 Release 2 adds support for uplink multi-user multiple input, multiple output (multi-user MIMO) to deliver smoother streaming services and video conferencing, faster uploads, and more reliable gaming. Additionally, three power management features improve Wi-Fi CERTIFIED 6 power efficiency, benefitting enterprise, industrial, and Internet of Things (IoT) applications. New features apply across all bands supported by Wi-Fi 6 - 2.4 GHz, 5 GHz and 6 GHz - bringing capacity, efficiency, coverage and performance benefits to residential, enterprise, and large public networks. Wi-Fi CERTIFIED 6 delivers the best experience with advanced applications, while providing strong WPA3 security and promoting interoperability between Wi-Fi CERTIFIED devices.

"Wi-Fi delivers advanced capabilities that have driven tremendous global innovation, paving the way for massive growth in Wi-Fi applications that users rely on every day," said Edgar Figueroa, president and CEO, Wi-Fi Alliance. "Wi-Fi CERTIFIED 6 Release 2 furthers Wi-Fi's evolution to address today's market needs, and supports more high-performance Wi-Fi scenarios with greater capacity, efficiency, and reliability."

The leading global motherboard manufacturer, ASRock, reveals Z690 Taichi Razer Edition, a Razer Chroma RGB integrated motherboard paired with innovation and craftsmanship, poised to perfect Chroma RGB ecosystem on the latest 12th Gen Intel Core desktop processors, and illuminate the strong relationship between ASRock and Razer.

Razer Chroma RGB is the world's largest lighting ecosystem for gaming devices which supports over 500 devices, 150 natively integrated games and over 15 million users worldwide. The integration with ASROCK enables universal compatibility with thousands of addressable RGB (ARGB) components directly into the ecosystem.

Wonderful news can't come sooner at the beginning of the new year. MSI launched the latest mainstream H670, B660 and H610 Series motherboards that everyone has been looking forward to ever since Intel released the 12th Gen Core processors. After MSI received high praises for the new Z690 motherboards last year, it's the B660 Series motherboards' turn to come under the spotlight. Some benefits of the B660 Series motherboards include affordable prices and remarkable performance. What else do MSI B660 motherboards use to draw our attention?

As promised to all of our fans and users, MSI is dedicated to offering a huge selection of choices. For the latest platform, MSI launched MAG and PRO segments and most of them are available in both DDR4 and DDR5 versions. The overclocking memory frequency of MSI B660 DDR5 motherboards can achieve 6200 MHz as a result of MSI OC LAB's tuning and MSI Memory Boost. All MSI B660 Series motherboards support PCIe 4.0, which provides 64 GB/s of transfer bandwidth. Equipped with up to 12 DrMOS with Duet Rail Power System, MSI MAG B660 motherboards have 6 layers PCB with 2-oz copper to guarantee stable current delivered to the core processors.

GIGABYTE TECHNOLOGY Co. Ltd, the global leading brand of PC, is adding more members to the AORUS professional gaming laptops, including the new AORUS 17, AORUS 15, and AORUS 5 featuring the 12th Generation Intel Core Processors, and leading the concept of "Reshape the Game" with this launch on January 5th, 2022.

AORUS 17 is the first in the series to adopt a gaming display with a four-sided bezel-less design, reaching a 90% screen-to-body ratio and a 30% reduction in the lower edge of the screen. The impeccable visual extension shall enhance the visual experience to a level that would only find in a movie theater. With the max refresh rate of 360 Hz, the display shall never tear or blur as the extremely fast reaction time of 3 milliseconds gives the players unparalleled advantages on the battlefield. With the use of the bent-type panel, AORUS 17 has a big 17" screen but in a typical 15" laptop. The AORUS 17's slim body greatly increases portability. The ultra-high screen-to-body ratio gives this thin laptop a 17" screen, punching way above its weight class. Slide the laptop effortlessly into your backpack and immerse in an expansive e-sports gaming experience, any time any place.

AMD is planning to crash Intel's big 12th Gen Core "Alder Lake-P" mobile processor launch with its own next-gen launch, the Ryzen 6000 mobile processor series. These chips are the company's first built on the TSMC N6 (6 nm) silicon fabrication process, and combine up to 8 "Zen 3+" CPU cores, with a next-generation iGPU based on the RDNA2 graphics architecture. The company has given the Media CoreNext and Video CoreNext engines incremental updates, according to a leaked slide scored by VideoCardz.

Ryzen 6000 "Rembrandt" processors come with hardware-accelerated decode of the AV1 video format. The Display CoreNext (display I/O engine) now supports DisplayPort 2.0, complete with DSC, UHBR10, HDR10+, and variable refresh-rate. The HDR pipeline has awareness for the various display panel types, including OLED and mini-LED. The iGPU on "Rembrandt" features up to 12 compute units (768 stream processors). It remains to be seen if Ray Accelerators are featured, as that would make this the first iGPU (on the PC platform) with DirectX 12 Ultimate support.

Qualcomm Technologies, Inc. announces the Snapdragon G3x Gen 1 Gaming Platform, a purpose-built platform that allows gamers the best place to play their favorite games. The platform delivers cutting-edge performance to run all Android games, play content from cloud gaming libraries, stream games from your home console or PC, and enjoy entertainment from your favorite Android apps. Amassing the entire arsenal of Snapdragon Elite Gaming technologies together to create a premium category of dedicated consumer gaming products, the platform is designed to power incredible experiences for gamers on-the-go.

To showcase the platform, Qualcomm Technologies partnered with Razer to build the first Snapdragon G3x Handheld Gaming Developer Kit, which is available exclusively for developers starting today. Razer is a global leader in gaming hardware and has already constructed one of the world's largest gamer-focused ecosystems of hardware, software, and services.

MediaTek and AMD announced a collaboration to co-engineer industry leading Wi-Fi solutions, starting with the AMD RZ600 Series Wi-Fi 6E modules containing MediaTek's new Filogic 330P chipset. The Filogic 330P chipset will power next-generation AMD Ryzen-series laptop and desktop PCs in 2022 and beyond, delivering fast Wi-Fi speeds with low latency and less interference from other signals.

To optimize the AMD RZ600 Series Wi-Fi 6E modules with a focus on delivering seamless connectivity experiences for customers, AMD and MediaTek developed and certified PCIe and USB interfaces for modern sleep states and power management, which are vital elements of modern customer experiences. Further, the optimization process included stress testing and ensuring compatibility standards, which may ultimately reduce development time for OEM customers.

The latest 12th Gen Core processor is the first to incorporate Intel 7 process technology and Hybrid Architecture. To match the performance of the 12th Gen Core processors, all MSI Z690 Series motherboards are upgraded. The highlight of the new platform is the latest PCIe 5.0 and DDR5. All MSI Z690 motherboards support PCIe 5.0 solution which provides 128 GB/s of transfer bandwidth. MSI has Z690 DDR5 and DDR4 motherboards to meet different needs. Excitingly, MSI OC LAB tuning boosts the memory frequency performance by over 30% based on MSI's exclusive Memory Boost technology. With the optimized layout, MSI uses the SMT process for both PCIe 5.0 and DDR5 to maintain the stability of high-speed transfer.

The newest core processors need mighty power phases. The MSI Z690 Gaming Series motherboards have at least 16 DrMOS with Duet Rail Power System and dual 8-pin CPU connectors, which guarantee stable and strong current delivered to the core processor. Moreover, the MSI Z690 Series motherboards have Server Grade PCB with 2oz thickened copper, which allows for higher transfer speed. (*1) The upgraded power phases typically have higher temperatures. However, heat dissipation isn't an issue for us. Our Z690 motherboards feature an Extended Heatsink, 7 W/mK thermal pad, and M.2 Shield Frozr. The MEG and MPG Series motherboards, which are popular among gamers all over the world, have Heat-pipe Design and double-side M.2 thermal that can drive maximum performance.

EK, the premium liquid cooling gear manufacturer, and MSI, a world-leading gaming brand, have partnered up once again to launch the next-gen MSI CARBON motherboard and EK-Quantum monoblock combo. The brand new EK-Quantum MSI MPG Z690 CARBON EK X D-RGB is based on the latest Z690 chipset and supports Intel 12th gen Alder Lake CPUs, this motherboard offers unparalleled cooling for the CPU, VRM section, and the first slot m.2 SSD thanks to the purpose-designed monoblock.

MSI's world-class engineering team and EK's industry-leading thermal engineers worked together to improve the previous-gen solution and bring even more benefits to the newest Intel Alder Lake platform. The MPG Z690 Carbon EK X allows maximum performance without the noisy environment, providing you with countless hours of uninterrupted gameplay while monitoring the flow in your loop via the integrated flow indicator. And to make sure your first assembly goes without a hitch, an EK-Leak Tester was included in the package.

GIGABYTE's AERO line of motherboards and notebooks target creators who like to game. The company is ready with a premium motherboard based on the Intel Z690 chipset, the Z690 AERO D. This has to be the prettiest looking motherboard we've come across in a long time, and it appears to have the chops to match this beauty. The Socket LGA1700 motherboard uses large ridged-aluminium heatsinks over the chipset, M.2 NVMe slots, and a portion of the rear I/O shroud. Aluminium fin-stack heatsinks fed by heat-pipes, cool the CPU VRM. You get two PCI-Express 5.0 x16 slots (x8/x8 with both populated). As an AERO series product, the board is expected to be loaded with connectivity relevant to content creators, although the box is missing a Thunderbolt logo. We expect at least 20 Gbps USB 3.2x2 ports, and 10 GbE networking, Wi-Fi 6E.

Acer launched a lineup of green PCs with its Vero series, including the Acer Aspire Vero laptop for consumers and the Acer TravelMate Vero laptop for commercial use. From PCs to peripherals, Vero devices share certain green guidelines, such as utilizing post-consumer recycled (PCR) plastic and shipping in recyclable packaging. As sustainability concerns not only how a product is made but what becomes of it, Acer's Vero devices have also been designed to be easy to disassemble, simplifying the process of repairs or upgrades and ultimately increasing the devices' lifespans.

More than just a stylish computer, the Acer Aspire Vero (AV15-51) is a tangible manifestation of Acer's commitment to more sustainable operations. Its chassis is composed of 30% PCR plastic, cutting CO2 emissions by 21% for the production of that part. The keycaps also contain 50% PCR plastic, and the Aspire Vero's award-winning 100% recyclable packaging can be repurposed as a DIY laptop stand. From there, a thoughtful design helps to eliminate needless waste by making it easy to disassemble, repair, upgrade and recycle the computer or its components. Running the newly-released Windows 11 operating system, it's incredibly easy to use, too.

NETGEAR, Inc., the leading provider of award-winning connected products designed to simplify and improve people's lives, today introduced the next generation in smart home WiFi mesh systems. The Orbi Quad-band Mesh WiFi 6E System (RBKE960 Series) adds the newly available 6 GHz WiFi band to deliver quad-band technology with faster Internet speeds to more devices simultaneously with less interference and wait time. The most powerful Orbi to date supports multi-Gigabit Internet throughout the home, improving WiFi performance for the growing number of devices in today's homes while paving the way for new devices and experiences to come.

This past year pushed home networks to their limits. Average US household Internet speeds rose 30 percent and peak Internet traffic increased 38 percent over pre-pandemic levels. Activities necessitated by the pandemic such as remote work from home, virtual Zoom meets with friends and relatives, first-run movie streaming, online shopping, exercise, gaming, and ordering food are becoming the norm now and going forward. At the same time, Internet service providers are providing Gigabit plus Internet connections at scale, ranging from 1.2 to 2 Gigabits and even 10 Gigabits to homes. High-performance WiFi based on the latest 6E standard in the clear 6 GHz band is the only means to harness such Internet speed at home to handle all these applications unimpeded.

Qualcomm Technologies, Inc., together with ecosystem leaders spanning key platforms and OEMs, is set to redefine wireless expectations for latency-sensitive gaming, productivity and learning applications on Window's 11 PCs with Qualcomm FastConnect systems. Wi-Fi Dual Station designed using Qualcomm 4-Stream Dual Band Simultaneous, harnesses multiple Wi-Fi bands and antennas concurrently, to outperform traditional single band connections. By simultaneously utilizing the 2.4 GHz and 5 GHz band (or 6 GHz where available), latency issues in one band can be easily resolved at a system-level both quickly and transparently to the end user.

"Microsoft is pleased to bring 'Wi-Fi Dual Station' to the Windows 11 ecosystem, enabling our Windows OEMs and ecosystem leaders to deliver low-latency performance on the latest Wi-Fi hardware. Games and other latency-sensitive applications can now leverage two concurrent Wi-Fi connections providing best-in-class user experiences," said Ian LeGrow, vice president, program management for windows platforms and services, Microsoft.

MediaTek today unveiled its new Filogic connectivity family with the introduction of the Filogic 830 Wi-Fi 6/6E system-on-chip (SoC) and Filogic 630 Wi-Fi 6E network interface card (NIC) solutions. MediaTek's new Filogic series of high-performance Wi-Fi 6/6E chipsets provide reliable connectivity, high computation capabilities and a rich set of features in highly integrated, power-efficient designs.

"The MediaTek Filogic series ushers in a new era of smart Wi-Fi solutions with extreme speeds, low latency and superb power efficiency for seamless, always connected experiences," said Alan Hsu, Corporate Vice President & General Manager, Intelligent Connectivity at MediaTek. "These new chipsets provide best-in-class features with highly integrated designs for the next generation of premium broadband, enterprise and retail Wi-Fi solutions."

In view of the ongoing production capacity shortage in the semiconductor industry and the resultant price hike of chips, revenue of the top 10 IC design companies for 2Q21 reached US$29.8 billion, a 60.8% YoY increase, according to TrendForce's latest investigations. In particular, Taiwanese companies put up remarkable performances during this period, with both MediaTek and Novatek posting YoY growths of more than 95%. AMD, on the other hand, experienced a nearly 100% YoY revenue growth, the highest among the top 10.

TrendForce indicates that the ranking of the top five companies for 2Q21 remained unchanged from the previous quarter, although there were major changes in the 6th to 10th spots. More specifically, after finalizing its acquisition of Inphi, Marvell experienced a major revenue growth and leapfrogged Xilinx and Realtek in the rankings from 9th place in 1Q21 to 7th place in 2Q21.

To all those who missed the 6 GHz 802.11ax (Wi-Fi 6E) bus, ASUS rolled out the PCE-AX58BT, a desktop PCI-Express network adapter that provides Wi-Fi 6E and Bluetooth 5.2 connectivity. The adapter provides a theoretical maximum bandwidth of 2402 Mbps Wi-Fi 6E (6 GHz) and Wi-Fi 6 (5 GHz), along with Wi-Fi 6 (2.4 GHz) bandwidth of up to 574 Mbps. Older 802.11ac is supported at speeds of up to 1733 Mbps, and 802.11n at up to 300 Mbps. The network controller also supports the latest WPA3 security standards.

The PCE-AX58BT connects to your desktop PC over a PCI-Express x1 slot, and an included USB 2.0 header cable (needed for the Bluetooth component). A pair of external antennae are fixed to a magnetized base that can be placed either on your desk, or on top of your PC case. While ASUS does not mention the controller, it is very likely the Intel AX210 Gig+ looking at the feature-set. It sits underneath an aluminium heatsink on an M.2-2230 card on top of the add-on card's main PCB. The company didn't reveal pricing or availability information. ASUS is readying a portfolio of Wi-Fi 6E consumer networking hardware, including the upcoming ZenWiFi PRO router.

ASUS earlier today teased its upcoming premium home networking product, the ZenWiFi PRO router. Designed in a vertical, cuboidal body with an acrylic top that shows off its MU-MIMO antennas, the ZenWiFi PRO is designed to be space-saving on your desk, while not compromising on range or bandwidth. As an ASUS Zen product, it's likely to be high on the aesthetics, with its matte black body that resembles a skyscraper. The "penthouse" (if you can call it that), features the antennas resembling pillars, as well as an RGB-illuminated ASUS logo that probably serves other functions. The teaser already reveals that the router is designed for 6 GHz Wi-Fi 6E. It's also possible that ASUS throws in goodies such as 2.5 GbE wired LAN and WAN ports, USB 3.x type-C and type-A ports to plug in the next crop of 5G dongles, DAS, and much more. It also wouldn't surprise us if ASUS designs mesh repeaters with the same design scheme as optional accessories, or part of whole-home mesh kits.

Here's the first picture of a production EVGA X570 DARK motherboard, the company's flagship Socket AM4 motherboard targeting overclocking features on the latest "Zen 3" processors. The board prioritizes CPU and memory overclocking headroom above all else. The orientation of the Socket AM4 is rotated 240°, such that the memory slots are located on top of the socket. There's only 1 DIMM per memory channel, which is the most optimal topology for memory overclocking. The angled power inputs, along with onboard buttons, switches, POST code display, and voltage measurement points, are conveniently located in the top-right corner of the PCB, with the power inputs being angled to reduce cable clutter.

The CPU socket is wired to two PCI-Express 4.0 x16 slots (x8/x8 with both populated), and an M.2 NVMe slot with PCI-Express 4.0 x4 wiring. The X570 chipset (not specified whether it's an X570S), is cooled passively, by a large heatsink that extends into heatsink over the board's two M.2 slots. Connectivity likely includes two wired networking interfaces, a Wi-Fi 6E wireless interface, and EVGA's highest-grade onboard audio solution. The board's BIOS is optimized for record-breaking CPU and memory overclocking, using sub-zero cooling solutions. The company didn't reveal availability or pricing.

With AMD launching the latest Ryzen 5000 Series processors, MSI X570S motherboards will also hit the market in the coming days. The new series of MSI X570S motherboards have not only upgraded specifications but also included brand-new designs. The following are detailed introductions that you must not miss. The whole series of MSI X570S motherboards all support AMD's latest Ryzen 5000 Series processors. To unleash the impressive performance, MSI offers a comprehensive upgrade for the power phase. MEG X570S motherboards have direct 16+2 phases with 90 A SPS and MPG X570S motherboards have at least 12+2 Duet Rail Power System with 75 A SPS. Both the MAG X570S TORPEDO MAX and the MAG X570S TOMAHAWK MAX WIFI have Mirrored Power Arrangement 12+2 phases with 60 A SPS as well.

s for heatsink design, the major change is to remove fans on the chipsets, which helps reduce dust and noise. In order to dissipate heat effectively without fans, the area of the heatsink that covers the chipset is enlarged considerably. Also, all MSI X570S Series motherboards feature at least 1 M.2 Shield Frozr which prevents throttling by offering the best thermal protection to help maintain SSD maximum performance. For hard-core users, we have the MEG X570S ACE MAX with 4 Gen 4 M.2 slots covered with M.2 Shield Frozr and Double Side M.2 Thermal.

Today, Intel announced the Intel NUC 11 Extreme Kit (code-named "Beast Canyon"), a highly modular desktop PC engineered to provide a phenomenal experience for gaming, streaming and recording. With the latest 11th Gen Intel Core processors, support for full-size discrete graphics cards and a full range of I/O ports, the Intel NUC 11 Extreme Kit delivers high performance gameplay and smooth, immersive visuals.

Compact Intel NUC 11 Extreme Kits are designed to provide powerful, immersive gaming experiences. For performance, connectivity, and modularity, the Intel NUC 11 Extreme kit delivers massive performance with a small footprint.

The highest-performing Intel NUC yet delivers a premium and size-optimized PC package for creating innovative desktops suited to gamers' unique performance needs. Packing the latest hardware components into a tiny 8-liter case, the Intel NUC 11 Extreme Kit is loaded with features typically found in much larger gaming rigs and offers customizable design options.

GIGABYTE is giving finishing touches to its new motherboard targeted at creators who like to game, and premium desktop builders, the X570S AERO G. This marks the debut of the company's AERO brand, associated with notebooks, over to the desktop PC components segment. The board's aesthetics appear more in line with the company's VISION line of products. The Socket AM4 motherboard is based on the new AMD X570S chipset, a low-power version of the X570 that can make do with fanless cooling.

What sets the X570S AERO G apart is its five M.2 NVMe Gen 4 slots, leveraging the PCIe Gen 4 downstream connectivity of the X570S. You also get two PCI-Express 4.0 x16 slots (x8/x8 with both populated), and creator-relevant connectivity that includes 2.5 GbE wired LAN, Wi-Fi 6E, and GIGABYTE's highest onboard audio grade. Thunderbolt connectivity is unlikely to be found. The board will come with out-of-the-box support not just for Ryzen 5000 "Vermeer" processors, but also Ryzen 5000G "Cezanne" APUs, which it wires out through DisplayPort and HDMI ports.

Update Jul 5th: GIGABYTE formally launched the X570S AERO G. It lacks 10 GbE, unlike previously reported, offers 2.5 GbE, and comes with USB 3.2x2 (20 Gbps) ports.

At the beginning of June, MSI presented the brand-new X570S Series motherboards during MSI's online product launch event. The unique designs and remarkable features sparked widespread discussions. Here are more in-depth concrete details regarding the MSI MAG X570S Series. In 2019, AMD's X570 platform came out and became the first chipset that supports PCIe 4.0 solution. Even now, MSI X570 Series motherboards are undoubtedly a great lineup with high specifications and aggressive designs. However, MSI can't just stop there. Our mission is to deliver the best computing experience for every gamer and creator. The new X570S Series motherboards achieved exactly that.

MSI is dedicated to product optimization so the new motherboards are made with prominent features. The MAG X570S Series is at the forefront of this launch. Inspired by military design, the MAG X570S TOMAHAWK MAX WIFI and MAG X570S TORPEDO MAX share identical looks. More excitingly, the MAG X570S TORPEDO MAX now comes in the Pacific Blue colorway, which is all the rage for our fans. Apart from the attractive designs, the imperative modification is the fanless chipset heatsink. We removed the fan to reduce dust and noise, while the ranges of the heatsink are expanded. Also, both MAG X570S TOMAHAWK MAX WIFI and MAG X570S TORPEDO MAX have M.2 Shield Frozr. The former has an All aluminium Design while the latter has an Extended Heatsink Design.

Today, Lenovo announced the latest additions to its ThinkPad and ThinkVision portfolios. The redesigned and re-engineered ThinkPad X1 Extreme Gen 4 delivers more power, better connectivity and rich configuration options in response to customer demand. Powered by up to the latest 11th Gen Intel Core i9 H-Series vPro processors and available with the latest NVIDIA GeForce RTX Laptop GPUs, up to 64 GB DDR4 memory and dual Solid-State Drive (SSD) support, the X1 Extreme Gen 4 is also offered with optional 5G Wireless WAN for high-speed access to cloud data.

With 74 percent of companies planning to permanently shift to more remote working, users need an exceptional collaboration experience. X1 Extreme Gen 4 delivers in spades, thanks to edge-to-edge 16-inch display options up to 4K along with Dolby Vision support, a new FHD webcam, dual noise-cancelling microphones and a user-facing Dolby Atmos Speaker System that is 20 percent larger than previous generation. All this performance wrapped in a legendary ThinkPad durable package that weighs less the 1.81 kg (four pounds).