Cooler Master, a leading provider of PC components, gaming peripherals, and tech lifestyle solutions, has today announced the NR200P V2 - a redesigned new take on the classic high performance NR200P case. The V2 keeps things compact and frees up desk space without sacrificing any of the performance benefits users expect from an NR200P case, such as versatile cooling support and maximized airflow.

At CES 2024 in Las Vegas, case maker InWin displayed several innovative new models for custom PC builds. The company continues its reputation for eye-catching designs with the debut of the adjustable flatpack POC One case and highly modular Mini Mod-II and Mod-III chassis. The POC One features interlocking panels for easy snap-together assembly, an advancement over the original April-launched POC line. It includes repositionable top or side handles for portable or horizontal setups. Using a mix of aluminium, other metals, and acrylic, the POC One initially comes in black/orange or blue/silver styles. Despite its minimalist flatpack form, it fits full-size components like 335 mm long triple-slot GPUs, 140 mm tall CPU coolers, and standard ATX power supplies. Three PCIe slots and an included riser allow vertical graphics card mounting.

During the CES 2024, Thermaltake announced the CTE E600 MX series of cases, in addition to the Tower 300 micro-ATX design shown at the company booth. Firstly, The Thermaltake CTE E600 MX mid-tower chassis focuses on exceptional cooling, customization, and tidy cable management. Its dual-chamber layout separates hot components from cables, with 12 potential fan mounts and 420 mm radiator support. Interchangeable front panels allow configuring for either maximum airflow or sleek tempered glass viewing. A bundled 400 mm PCIe 4.0 riser cable uniquely enables three GPU orientation options - standard, vertical, or a "floating" centered mount showcasing your graphics card. Anchor points and included ties facilitate organizing wiring neatly out of sight in the partitioned cable chamber. With outstanding flexibility tailoring both form and function, the CTE E600 MX empowers users to build their perfect customized system matching individual style and cooling demands. The CTE E600 comes with an MSRP of $179.99.

Thermaltake, a leading PC DIY brand for premium hardware solutions, is thrilled to announce the CTE E600 MX E-ATX Mid-tower PC Chassis today, and now showcased at the CES 2024 in Las Vegas. This cutting-edge Mid-tower chassis marks a significant addition to the award-winning CTE series. The CTE E600 MX inherits Thermaltake's innovative CTE (Centralized Thermal Efficiency) Form Factor as a dual-chamber mid-tower case. This design concept strongly emphasizes delivering high-level thermal performance to critical chassis components. The CTE E600 MX has a revolutionary 3-way GPU installation option and an interchangeable dual-front panel design for optimal flexibility and PC gaming build customization. It is now available in black, snow, and hydrangea blue editions.

"The CTE series PC case represents a significant leap in innovation, having been prominently featured at the last CES. Our latest addition, the CTE E600 MX, is remarkable. Our product design team closely studied feedback from gaming communities, particularly from hardcore gamers. They strongly preferred a PC case offering extensive installation options for critical gaming components, such as graphic cards. By balancing functionality with aesthetics, we ensured that the CTE E600 MX didn't compromise chassis ventilation while maintaining a sleek and appealing look," stated Michael Guo, the vice president of Thermaltake USA.

In Win launches its Foldable POC Mini-ITX Tower - the latest iBuildiShare series case you can shape yourself! In Win Development Inc. (In Win), a leading innovator in PC enthusiast gaming hardware, has introduced its POC Mini-ITX tower PC chassis. POC is the latest addition to In Win's iBuildiShare series. Encouraging the development of dexterity skills both inside and out of a PC.

DIY PC builders of all ages can assemble a Mini-ITX enclosure from this vibrant modular kit by actually bending and shaping each panel. Similar to the art of origami, but using 0.8 mm foldable SECC steel panels instead of paper. This durable, lightweight material can withstand multiple bends. Delivered flat-packed, POC minimizes packaging materials and weight, reducing environmental impact.