A Look Inside & Component Analysis

Before reading this page, we strongly suggest a look at this article, which will help you understand the internal components of a PSU much better. Our main tool for the disassembly of the PSU is a Thermaltronics TMT-9000S soldering and rework station. It is of extreme quality and is equipped with a matching de-soldering gun. For the identification of tiny parts, we use an Andonstar HDMI Digital Microscope.


This is Andyson's Titanium platform, which has been downgraded a bit in terms of efficiency since it would have been pretty hard to keep the same efficiency levels without giving up the fully modular cable design or the top-notch ripple suppression and tight load regulation. Over temperature protection along with other modifications (different FETs, caps, etc.) have also been included for the best-possible performance in this wattage range and price category. On the primary side are a half-bridge topology and an LLC resonant converter; the secondary side uses a synchronous design with a pair of DC-DC converters for the generation of the minor rails.


The main transformer uses a special design which restricts its footprint. It is also covered by a metallic shield on three sides.


The first part of the EMI filtering stage is on the PCB that holds the AC receptacle. It includes an X and two Y caps. The same filter continues on the main PCB with two more Y caps, two X caps, a pair of CM chokes, and an MOV. There is also an NTC thermistor for protection against large inrush currents. A bypass relay helps the thermistor cool down faster and also offers a small efficiency boost.


Two bridge rectifiers (GBU1006) are used. They are strong enough to meet the needs of the ACP-650FP7.


The APFC converter utilizes two Infineon IPP50R140CP FETs and a single CREE C3D10060A boost diode. The two bulk caps are by Nichicon (420V, 330uF each or 660uF combined, 2000h @ 105°C, GG), and their capacity is adequate for the needs of this unit. Here, we insisted on large enough bulk caps capable of delivering a hold-up time below 17 ms and an accurate power ok signal.


The PFC controller is a Champion CM6502S, and it has been installed on a small vertical daughterboard right next to the primary heatsink.


The primary switching FETs, two Infineon IPP50R190CEs, are configured in a half-bridge topology. An LLC resonant converter is also used for increased efficiency.



Eight Infineon BSC014N04LS FETs regulate the +12V rail. These FETs are installed to the solder side of the main PCB and are cooled by the chassis. There is a thermal pad (nost shown in the photos above) to allow for the chassis to connect with the +12V FETs.


Both electrolytic and polymer caps are used for the filtering of the rails. Nippon Chemi-Con (KZE, KY) and Nichicon provide the electrolytic caps, and the polymers are by Chemi-Con and FPCAP.


The VRMs that generate the minor rails use two CSD86350Q5D power blocks, and there are two PWM controllers (Anpec APW7073) for those circuits.


The LLC resonant controller is a Champion CM6901, and it has been installed to the solder side of the main PCB. Next to it, we find the supervisor IC, a SITI PS223, and the driver IC of the primary FETs.


The fan controller uses a Unisonic LM324G IC.


Two Chemi-Con electrolytic caps and a number of polymer FPCAPs on the modular board's primary side provide an extra ripple-filtering layer.


The 5VSB rail is regulated by a PFR10V45CT diode, while its PWM controller is a Sanken STR-A6069H IC.


The soldering quality is very good. Andyson performed incredibly well in this area.


The fan uses an FDB bearing, and its maximum speed is restricted to make sure it isn't loud. In addition, it is controlled by a very relaxed fan profile.