Component Analysis

Before reading this page, we strongly suggest a look at this article, which will help you better understand the insides of a PSU.



Despite the high capacity and small PCB, there is still plenty of available space because FSP used two large daughter boards to mount the DC-DC converters and transient/EMI filter. Moreover, instead of a single large bulk cap, FSP used three smaller ones. Finally, all heatsinks are small, especially those on the primary side. Good parts are used, but the build quality is not topnotch.


The transient/EMI filter stages have all the necessary parts, offering top EMI suppression on incoming and outgoing emissions.


A Metal Oxide Varistor (MOV) covered in heat shrink handles voltage surges, while an NTC thermistor and relay combination suppresses large inrush currents.


The bridge rectifiers are not bolted onto a heatsink, so they rely entirely on the cooling fan to remove their heat.


The APFC converter uses two Vishay FETs and the same number of STMicroelectronics boost diodes. The bulk caps are by Chemi-Con, and their combined total capacity is 420 uF.


The APFC controller is a FSP MIA IC 6600. The same controller also handles the main FETs and the standby circuit which generates the 5VSB rail.


The main FETs are two Infineon IPA80R310CEs, and the reset switch is an Infineon IPD80R1K4CE.


The unit's main transformer is quite small.


The FETs regulating the +12 V rail are installed on the solder side of the main PCB.


Two DC-DC converters generate the minor rails. They use four Infineon FETs, and their joint PWM controller is an Anpec APW7159C.


There aren't many electrolytic caps, but those installed are of high quality. Lots of Teapo polymer caps are also used.


The 5VSB circuit uses a CET FET on its primary side and a PFC SBR on its secondary side.


The supervisor IC is a Weltrend WT7502R, which only provides the essential protection features. The FSP MIA IC 6601 provides OCP. The same IC also controls the +12 V and 3.3 V FETs.


Several polymer caps are installed on the face of the modular PCB. The supervisor IC along with a TPS54231 buck-converter IC are also installed here.


Soldering quality is mediocre. I expected better soldering from FSP.


The cooling fan is by Power Logic and of high quality. It uses double ball-bearings and will, as such, last for a while even under high operating temperatures.