Capacity: | 7.5 TB (7680 GB) |
---|---|
Overprovisioning: | 1039.4 GB / 14.5 % |
Production: | Active |
Released: | Jul 21st, 2021 |
Part Number: | SEDC1500M/7680G |
Market: | Enterprise |
Form Factor: | U.2 |
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Interface: | PCIe 3.0 x4 |
Protocol: | NVMe 1.3 |
Power Draw: |
7.0 W (Idle) 8.2 W (Avg) 20.9 W (Max) |
Manufacturer: | Silicon Motion |
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Name: | SM2270 |
Architecture: | ARM 32-bit Cortex-R5 |
Core Count: | 6-Core |
Flash Channels: | 16 |
Chip Enables: | 8 |
Controller Features: | DRAM |
Manufacturer: | Toshiba |
---|---|
Name: | BiCS4 |
Type: | TLC |
Technology: | 96-layer |
Speed: | 800 MT/s |
Capacity: | Unknown |
ONFI: | 4.0 |
Toggle: | 3.0 |
Topology: | Charge Trap |
Process: | 19 nm |
Die Size: | 86 mm² (6.0 Gbit/mm²) |
Planes per Die: | 2 |
Decks per Die: | 2 |
Word Lines: |
109 per NAND String
88.1% Vertical Efficiency |
Read Time (tR): | 58 µs |
Program Time (tProg): | 561 µs |
Die Read Speed: | 551 MB/s |
Die Write Speed: | 57 MB/s |
Endurance: (up to) |
3000 P/E Cycles
(30000 in SLC Mode) |
Page Size: | 16 KB |
Block Size: | 1152 Pages |
Plane Size: | 1822 Blocks |
Type: | Unknown |
---|---|
Capacity: | 8192 MB |
Sequential Read: | 3,100 MB/s |
---|---|
Sequential Write: | 2,700 MB/s |
Random Read: | 420,000 IOPS |
Random Write: | 200,000 IOPS |
Endurance: | 13450 TBW |
Warranty: | 5 Years |
MTBF: | 2.0 Million Hours |
Drive Writes Per Day (DWPD): | 1.0 |
SLC Write Cache: | Yes |
TRIM: | Yes |
---|---|
SMART: | Yes |
Power Loss Protection: | Yes |
Encryption: |
|
RGB Lighting: | No |
PS5 Compatible: | No |
Controller:The SM2270 uses three separate dual-core ARM Cortex R5 CPUs. To do this, Silicon Motion "essentially removed the front-end from the SM2262 8-channel controller design and put two of those on one die, behind a new wider front end with support for PCIe x8.". NAND Die:Read latency tR: 58 µs (ABL) |