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MSI Spatium M370 1 TB

1 TB
Capacity
Phison E15
Controller
TLC
Flash
PCIe 3.0 x4
Interface
M.2 2280
Form Factor
Back
Back
PCB Front
PCB Front
SSD Controller
Controller
NAND Die
NAND Die
The MSI Spatium M370 is a solid-state drive in the M.2 2280 form factor, launched on July 5th, 2021. It is available in capacities ranging from 1 TB to 2 TB. This page reports specifications for the 1 TB variant. With the rest of the system, the MSI Spatium M370 interfaces using a PCI-Express 3.0 x4 connection. The SSD controller is the PS5015-E15-35 from Phison, a DRAM cache is not available. MSI has installed 96-layer TLC NAND flash on the Spatium M370, the flash chips are made by Toshiba. To improve write speeds, a pseudo-SLC cache is used, so bursts of incoming writes are absorbed more quickly. The cache is sized at 23 GB, once it is full, writes complete at 500 MB/s. The Spatium M370 is rated for sequential read speeds of up to 2,400 MB/s and 1,850 MB/s write; random IO reaches 220K IOPS for read and 330K for writes.
At its launch, the SSD was priced at 129 USD. The warranty length is set to five years, which is an excellent warranty period. MSI guarantees an endurance rating of 800 TBW, a typical value for consumer SSDs.

Solid-State-Drive

Capacity: 1 TB (1024 GB)
Variants: 1 TB 2 TB
Overprovisioning: 70.3 GB / 7.4 %
Production: Active
Released: Jul 5th, 2021
Price at Launch: 129 USD
Part Number: Unknown
Market: Consumer

Physical

Form Factor: M.2 2280 (Double-Sided)
Interface: PCIe 3.0 x4
Protocol: NVMe 1.3
Power Draw: Unknown (Idle)
Unknown (Avg)
3.6 W (Max)

Controller

Manufacturer: Phison
Name: PS5015-E15-35
Architecture: ARM 32-bit Cortex-R5
Core Count: Triple-Core
Frequency: 667 MHz
Foundry: TSMC
Process: 28 nm
Flash Channels: 4 @ 1,200 MT/s
Chip Enables: 4
Controller Features: HMB (enabled)

NAND Flash

Manufacturer: Toshiba
Name: BiCS4
Part Number: DA7BG65AWV
Type: TLC
Technology: 96-layer
Speed: 800 MT/s
Capacity: 4 chips @ 2 Tbit
ONFI: 4.0
Toggle: 3.0
Topology: Charge Trap
Process: 19 nm
Die Size: 86 mm²
(6.0 Gbit/mm²)
Dies per Chip: 4 dies @ 512 Gbit
Planes per Die: 2
Decks per Die: 2
Word Lines: 109 per NAND String
88.1% Vertical Efficiency
Read Time (tR): 58 µs
Program Time (tProg): 561 µs
Die Read Speed: 551 MB/s
Die Write Speed: 57 MB/s
Endurance:
(up to)
3000 P/E Cycles
(30000 in SLC Mode)
Page Size: 16 KB
Block Size: 1152 Pages
Plane Size: 1822 Blocks

DRAM Cache

Type: None
Host-Memory-Buffer (HMB): 64 MB

Performance

Sequential Read: 2,400 MB/s
Sequential Write: 1,850 MB/s
Random Read: 220,000 IOPS
Random Write: 330,000 IOPS
Endurance: 800 TBW
Warranty: 5 Years
MTBF: 1.5 Million Hours
Drive Writes Per Day (DWPD): 0.4
SLC Write Cache: approx. 23 GB
(dynamic only)
Speed when Cache Exhausted: approx. 500 MB/s

Features

TRIM: Yes
SMART: Yes
Power Loss Protection: No
Encryption:
  • AES-256
  • TCG Opal
  • TCG Pyrite
RGB Lighting: No
PS5 Compatible: No

Notes

Controller:

1 main core using Cortex-R5 with CoXProcessor technology (one additional dual-core) Cortex-R5 clocked at a lower clock for better efficience.

NAND Die:

Read latency tR: 58 µs (ABL)
tPROG with ~ 25% Overhead: ~ 750 µs (Avg - 42.7 MB/s per each die)

Nov 12th, 2024 18:15 EST change timezone

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