Friday, October 14th 2011
AMD to Turn to TSMC for ''Bulldozer'' Manufacturing
AMD is rumored to be seeking ties with TSMC, Taiwan's premier semiconductor manufacturing foundry, for future manufacturing of its "Bulldozer" architecture processors, according to a report by DonanimHaber. This has two very distinct implications: first, AMD could be facing issues with GlobalFoundries 32 nm HKMG node, its de facto foundry for CPU manufacturing, and second, this could just be an obvious development of future low-power APUs based on the new x86 architecture being manufactured at TSMC, much like how current E-series and C-series APUs are.
Then again, AMD doesn't exactly have any APUs in works that use "Bulldozer" architecture for the x86 cores, rather, its successor codenamed "Piledriver". Another couple of important things to note here are that TSMC does not have a 32 nm bulk node (it was scrapped with the transition to 28 nm bulk), and its HKMG (high-K metal gate transistor) manufacturing technology is deployed rather recently. It would be interesting to follow this development.
Source:
DonanimHaber
Then again, AMD doesn't exactly have any APUs in works that use "Bulldozer" architecture for the x86 cores, rather, its successor codenamed "Piledriver". Another couple of important things to note here are that TSMC does not have a 32 nm bulk node (it was scrapped with the transition to 28 nm bulk), and its HKMG (high-K metal gate transistor) manufacturing technology is deployed rather recently. It would be interesting to follow this development.
28 Comments on AMD to Turn to TSMC for ''Bulldozer'' Manufacturing
That donanim hebel knows a lot of AMD rumors...
GF has to be able to survive on their own and maybe they see the best chance of doing this is inconsistent with chasing the bleeding edge in fabrication.
It's the right and only defensive move they can take right now.
Good luck to 'em :pimp:
It's also very clear that AMD wanted higher clockspeeds out of Bulldozer at launch (4.2 - 4.6) to actually be more competitive in the market, but I guess GloFo messed up again, and we can all see the sky-rocketing power consumption of a Bulldozer FX chip when overclocked around 4.6 GHz.
So AMD promisses that soon-ish they will improve Bulldozer's performace numbers by up to 50%, and I really think this claim has EVERYTHING to do with migrating production to TSMC.
AMD retire this BD batch to APU's or midrange cpu's, adjust their power and speeds to match midrange cpu specs then cook a new batch for performance cpu's and name then BD2 / BD Gen2 for Feb/March 2012.
IE: BD goes to best power / performance capable and labeled as hard core mid / APU then do BD gen2 with fixes for desktop performance.
Same as Half baked Sandy-e's and full baked Sandy-e's for next year, we can forgive you AMD, just recover like this.
AMD we are still rooting for you, just hope you can quickly recover from your BDangover "hangover" .
LOL AMD likely did not catch the old saying, do not keep all your eggs in 1 basket or AMD translation, do not keep all your CPU's in HKMG.
Time to do your own foundry's in Canada, Brazil, Australia or EU.
Is this poor HKMG performance or is it another insider sabotage in HKMG ?
LOL who am I kidding it is not like AMD/Intel spends time reading decent website like this one.
This really just appears to be FUD, why does it seem when this donanim... "herbal" speaks it's like some enlightened maharishi.
Move along nothing to see here!
AMD looks like they are actually trying to hit rock bottom.
As far as I know, TSMC does not even have a 28nm SOI of which AMD currently designed BD on and is using GF 32nm SOI. TSMC only produces on Bulk which AMD uses for their GPUs and Bobcat APUs.
This would be like moving a Chevy Corvette from it manufacturing plant to the Ford Taurus plant. It just is not going to work without a lot of reworking of the car or assembly line.
This is one of the reasons AMD didn't move their GPU production to GF this last time because they were designed for Bulk. GF did not offer Bulk, so AMD would have had to redesign the chip to accommodate SOI production. No worth the time since it would take about a year just to get something down the line and back to find out if the initial silicone (A0) worked or not and get it out for production (given that there were no major bugs). By that time AMD will have moved on to 28nm and it would have been a waste of money and human resources that could have been better used for something else.
Sure outsourcing to these other companies might be cheaper, but with as often as they are in the news for mistakes and screw ups, think they'd be better off doing it all themselves.
As of now, AMD could not possibly afford to build a next-gen fab or buy a current-gen one. They need market share for that, and to get that, they need a good product. Chicken and egg. I don't know what they did during the Athlon/Athlon 64 days but it seems they missed out on doing the right things back then and today they are paying for it.
though i'm sure many people will disagree, but I still thinks that purchasing ATI was a big mistake, at $6.4B (if memory serves correct) it was a huge risk, and it eventually caused the spin-off, and less investment in R&D further down the road.
yes Llano is nice, but is it all AMD is out there for ?