Tuesday, March 23rd 2021
ASML Finishes Development of EUV Pellicles for Greater Sub-7nm Yields
ASML has finally finished development of EUV (Extreme Ultra Violet) pellicles to be employed in manufacturing processes that use the most energetic frequency of visible light to etch semiconductors onto wafers. Pellicles have been used for decades in the industry, and they are basically ultra-thin membranes that protect photomasks during the etching process - impeding particles from depositing in the substrate, which could lead to defects at the wafer level for every subsequent patterning that is laid on top of the impurity. Manufacturers such as TSMC have deployed EUV-powered manufacturing processes, but they have had to toil with potentially lower yields and increased costs with wafer analysis so as to reduce chances of defects appearing.
It's been a long time coming for EUV-capable pellicles, because these have different requirements compared to their traditional, non-EUV counterparts. However, once they are available on the market, it's expected that all semiconductor manufacturers with bleeding-edge manufacturing processes integrate them into their production flows. These will allow for better yields, which in turn should reduce overall pricing for the manufacturing processes. As an example, these EUV masks could be deployed on TSMC's 7 nm, 6 nm, 5 nm, and so on and so on. Other players other than ASML are also finishing their pellicle design, so the industry will have multiple options to integrate into their processes.
Sources:
SemiEngineering, if you caught the "and so on and so on" reference, you're my new best friend
It's been a long time coming for EUV-capable pellicles, because these have different requirements compared to their traditional, non-EUV counterparts. However, once they are available on the market, it's expected that all semiconductor manufacturers with bleeding-edge manufacturing processes integrate them into their production flows. These will allow for better yields, which in turn should reduce overall pricing for the manufacturing processes. As an example, these EUV masks could be deployed on TSMC's 7 nm, 6 nm, 5 nm, and so on and so on. Other players other than ASML are also finishing their pellicle design, so the industry will have multiple options to integrate into their processes.
20 Comments on ASML Finishes Development of EUV Pellicles for Greater Sub-7nm Yields
By every foundrie doing cutting edge nodes too.
As wafers get thinner, there will be bigger need for these kinds of developments just to keep moving forward. Still waiting on the nanotube tech to mature.
And they are not cheap so continued replacement (If used)hit chip costs.
Now less particulate damage, higher yields, more chips.
But 9/12 months until that kicks in on shop shelf's.
That's down to 1Nm(manufacturers speak 3Nm real) fully sorted on traditional lytho afaik.
New tech would obviously be beneficial like GAO or nano ribbons.
ASML announced months ago that this new type would be available at the end of 2020, and now it's finally here.
They are as you should imagine some of the most highly developed, qualified and tuned light sources about , taking quite some effort to make on their own.
Why do you think other foundries and machine tool maker's are not about.
The cost of development to be competitive.
As the node scales and yields improve price naturally decreases, Unless the supply is still constrained.
Why don't you start your own fab if you can make chips on the cheap?
Its really very simple, the smallest nodes are the cutting edge, and you can't 'just do that', its similar to projects in space. Everything is new and if its not, its not worth doing, while the margins for error are tiny or non existant altogether.