ASRock Industrial releases the 4X4 BOX 7040 Series Mini PCs powered by AMD Ryzen 7040U Series APUs, featuring up to 8 "Zen 4" cores and 16 threads. With the new AMD Ryzen AI, the first AI engine for an x86 platform, and support of dual-channel DDR5 5600 MHz memory up to 64 GB, the new Series sprint ahead in speed, performance, and AI capability, while guaranteeing extended runtime. The 4X4 BOX 7040 Series comes with enriched I/O connectivity in a compact appearance, enabling 4K quad-display outputs, five USB ports with two USB4, dual storage, and dual LAN up to 2.5G, Wi-Fi 6E. The faster performance with AI engine and longer runtime bring about productivity boost and next-level experience in content creation, gaming, entertainment, commerce, and many other AIoT applications.

Powered by AMD Ryzen 7040U Series APU (Ryzen 7 7840U/Ryzen 5 7640U), ASRock Industrial's 4X4 BOX 7040 Series contain selections: 4X4 BOX-7840U and 4X4 BOX-7640U. Featuring 4 nm "Zen 4" architecture with up to 8 cores and 16 threads, and enhanced dual-channel DDR5 5600 MHz SO-DIMM memory up to 64 GB, the Series guarantee faster productivity, content creation, and gaming with extended runtime. Moreover, with built-in AMD Ryzen AI - the pioneer of dedicated AI hardware in an X86 processor, the 4X4 BOX 7040 Series usher in advanced potentials in power, efficiency, and intuition for the future AI working world. This integration transforms the 4X4 BOX 7040 Series into a reliable personal virtual assistant, propelling dynamic AI applications, enhancing video conferencing, and delivering AI-inspired visuals.

OpenHW Group today announced that the industry's most comprehensive Development Kit for an open-source RISC-V MCU is now available to be ordered. The OpenHW CORE-V MCU DevKit includes an open-source printed circuit board (PCB) which integrates OpenHW's CORE-V MCU and various peripherals, a software development kit (SDK) with a full-featured Eclipse-based integrated development environment (IDE), as well as connectivity to Amazon Web Services (AWS) via AWS IoT ExpressLink for secure and reliable connectivity between IoT devices and AWS cloud services.

The comprehensive open-source CORE-V MCU DevKit enables software development for embedded, internet-of-things (IoT), and artificial intelligence (AI)-driven applications. The CORE-V MCU is based on the open-source CV32E40P embedded-class processor, a small, efficient, 32-bit, in-order open-source RISC-V core with a four-stage pipeline that implements the RV32IM[F]C RISC-V instruction extensions.

MaxLinear, Inc., a leader in data storage accelerator solutions, today announced the production-release of the OCP 3.0 storage accelerator adapter card for Panther III. The ultra-low latency accelerator is designed to quicken key storage workloads, including database acceleration, storage offload, encryption, compression, and deduplication enablement for maximum data reduction. The Panther III OCP card is ideal for use in modern data centers, including public to edge clouds, enterprise data centers, and telecommunications infrastructure, allowing users to access, process, and transfer data up to 12 times faster than without a storage accelerator. The OCP version of the card is available immediately with a PCIe version available in Q3 2023.

"In an era where the amount of data generated exceeds new storage installations by multiple fold, Panther III helps reduce the massive storage gap while improving TCO per bit stored," said Dylan Patel, Chief Analyst at SemiAnalysis.

ASUS IoT, the leading global AIoT solution provider, today announced Tinker Board 3N series, a versatile, Arm -based single-board computer (SBC) that empowers easy system integration, broad adaptability and superb expandability - elevating it to the perfect choice for the emerging Industrial Internet of Things (IIoT) era.

The NUC-sized SBC series is equipped with rich I/O and supports Linux Debian, Yocto, and Android operating systems, presenting an all-new premium option for developers and system integrators' diverse IIoT projects. Its optimized thermal design simplifies deployment of embedded applications, ensuring efficient operation in demanding environments. With its durable and reliable design, Tinker Board 3N offers enhanced computing performance, low power consumption and a wide range of interfaces, so it's primed and ready for smart manufacturing applications powering the IoT revolution.

Semiconductor industry players Robert Bosch GmbH, Infineon Technologies AG, Nordic Semiconductor, NXP Semiconductors, and Qualcomm Technologies, Inc., have come together to jointly invest in a company aimed at advancing the adoption of RISC-V globally by enabling next-generation hardware development.

Formed in Germany, this company will aim to accelerate the commercialization of future products based on the open-source RISC-V architecture. The company will be a single source to enable compatible RISC-V based products, provide reference architectures, and help establish solutions widely used in the industry. Initial application focus will be automotive, but with an eventual expansion to include mobile and IoT.

ASRock Industrial, the leading provider of global industrial motherboards and systems, has released new Mini PCs and motherboards powered by Intel Processor N97 (Alder Lake-N). The available selections include NUC BOX-N97, iBOX-N97, and Motherboard Series consisting of NUC-N97, Pico-ITX (SOM-P104), SBC 3.5" (SBC-260, SBC-261), and Mini-ITX (IMB-1005, IMB-1006, IMB-1007) form factors. Compared to the previous Intel Celeron Processor J6412 (Elkhart Lake), the Intel Processor N97 (Alder Lake-N) showcases remarkable CPU performance increase of up to 37% and graphics performance up to 154%. The new NUC BOX-N97, iBOX-N97, and NUC-N97 Motherboard Series provide rich I/O and expansion options, including triple displays up to 4K at 60 Hz, dual 2.5G LAN, and dual storage option with SATA 3.0 and M.2 Key M, catering to diverse application needs, such as entertainment, office, business, retail, transportation, embedded, industrial, and beyond.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, today announced its latest line-up of industrial motherboards and application systems. BIOSTAR's latest BIQ67-AHP, the BIW68-AHP, and the BIELK-PAT motherboards, with MT-J6412, and MT PRO-J6412 application systems are built to address various system integration and industrial needs, offering innovative features that ensure high performance, reliability, and longevity.

The BIQ67-AHP and BIW68-AHP motherboards are excellent for system integration, general industrial systems and GPU AI workstation. These allow businesses to have reliable computers that help stay up-to-date on customers' contact details, transaction history, accounts, communication, and business management on a reliable and efficient platform. Featuring Intel Q670 chipset and Intel W680 chipset respectively, the BIQ67-AHP and BIW68-AHP motherboards carry additional features and functionality such as DDR4 support up to 128 GB, dual Intel LAN, multiple PCI/PCIe slots, M.2 slots, USB 3.2, COM ports, and more. The BIELK-PAT motherboard, with its wide range temperature -40 °C ~ 85 °C and voltage support, is built to withstand and function optimally in diverse environments and outdoor applications. It is ideal for uses such as EV charging stations, kiosks, refrigerated factories, and is great for HMI applications for businesses of all sizes.

Earlier today Logitech International was invited and honored to participate in the US National Label for Consumer IoT Security launch at the White House in Washington DC. The event, sponsored by the National Security Council, was led by chairwoman of the FCC, Jessica Rosenworcel, and included members of both organizations, as well as other leading tech companies focused on and making strides in product security for consumers.

Logitech is an active contributor in industry efforts to integrate security into the core standards that its products use. Through its participation in the Product Security Working Group (PSWG) and Matter Working Group within the Connectivity Standards Alliance (CSA), the company continues to work with others in the industry to write and certify the standards by which next generation products will operate.

Today, Intel announced it has agreed to a term sheet with ASUS, a global technology solution provider, for an agreement to manufacture, sell and support Intel Next Unit of Compute (NUC) 10th to 13th generations systems product line, and develop future NUC systems designs. "Our NUC systems product team delivered unique products that spurred innovation in the ultra-small form factor market. As we pivot our strategy to enable ecosystem partners to continue NUC systems product innovation and growth, our priority is to ensure a smooth transition for our customers and partners. I am looking forward to ASUS continuing to deliver exceptional products and supporting our NUC systems customers," said Sam Gao, Intel vice president and general manager of Intel Client Platform Solutions.

Intel is pivoting its strategy to enable ecosystem partners to continue NUC systems product line innovation and growth. ASUS's expertise and track record delivering industry-leading mini PCs to customers make it ideally suited to continue driving innovation and growth in NUC systems products. "Thank you, Intel, for your confidence in us to take the NUC systems product line forward. I am confident that this collaboration will enhance and accelerate our vision for the mini PC - greatly expanding our footprint in areas such as AI and AIoT," said Joe Hsieh, ASUS chief operating officer. "We are committed to ensuring the excellent support and service that NUC systems customers expect."

Today, U.S. Deputy National Security Advisor Anne Neuberger, Chairwoman of the Federal Communications Commission (FCC) Jessica Rosenworcel, and Laurie Locascio, Director of the National Institute of Standards and Technology (NIST) unveiled the U.S. national IoT security label at the White House.

Infineon Technologies AG supports this action to address the growing need for IoT security. The new label supports the IoT security requirements under NISTIR 8425, which resulted from an Executive Order to improve the nation's cybersecurity. This label will recognize products that meet these requirements by permitting them to display a U.S. government label and be listed in a registry indicating that these products meet U.S. cybersecurity standards.

BeagleBoard.org, a leading developer of open-source hardware platforms, is thrilled to announce the highly anticipated launch of BeagleV-Ahead, an innovative single board computer (SBC) based on TH1520, a quad core 64-bit RISC-V SoC from T-Head. This groundbreaking open-source SBC brings a new level of accessibility, performance, and flexibility to the rapidly growing RISC-V ecosystem.

BeagleV-Ahead is set to revolutionize the world of embedded systems and empower developers and enthusiasts worldwide. It represents a significant milestone in the democratization of computer architecture and open-source hardware development. Built around the powerful and energy-efficient RISC-V instruction set architecture (ISA), the BeagleV-Ahead SBC offers unparalleled opportunities for developers, hobbyists, and researchers to explore and experiment with RISC-V technology.

ASUS IoT, the global AIoT solution provider, today announced PE1100N, a unmatched, ultra-compact computer for AI inferencing at the edge, and based on the next-generation and world-leading NVIDIA Jetson Orin series. It features a fanless design for quiet operation, rich industrial connectivity for serious flexibility and supports a wide range of power inputs and operating temperatures for maximum versatility and durability.

With the powerful Jetson platform, featuring an efficient Arm processor and embedded NVIDIA GPU, PE1100N delivers energy-efficient computing with powerful AI-inferencing capabilities, making it ideal for diverse, scalable edge AI applications in smart city, transportation, manufacturing and more - including traffic analysis, people-tracking, counting and surveillance. Also, PE1100N's compact size and anti-vibration design make it especially ideal for smart manufacturing solutions, such as automated guided vehicle (AGVs), autonomous mobile robots (AMRs), AI-powered automated optical inspection (AOI) and robotics applications - accelerating time to market for AI applications.

ASRock Industrial is introducing new choices in industrial motherboards powered by 13th Gen Intel Core Processors (Raptor Lake-S) with up to 24 cores and 32 threads that boost computer-intensive edge performance. They come equipped with Intel W680, Q670, and H610 chipsets, and offer support for up to DDR5-5600 memory modules and PCIe Gen 5, allowing expanded possibilities and seamless integration within industry-specific applications.

By harnessing the power of the 13th Gen Intel Core Processors, they leap up to 1.04x/1.34x/1.25x faster in single-thread, multi-thread, and CPU image classification inference performance, respectively, compared to the preceding 12th Gen Intel Core processors. The new 13th Gen Intel CPU motherboards with DDR5 support, available in Mini-ITX, Micro-ATX, and ATX form factors, have been specifically designed to cater to the unique requirements of the Edge AIoT applications in commerce, automation, robot, entertainment, and security industries.

Metalenz, the world leader in metasurface optics, today announced it has partnered with leading semiconductor foundry United Microelectronics Corporation ("UMC") to release its direct supply chain to mass production and bring the unrivaled scale and precision of semiconductor manufacturing to the optics industry. The announcement marks the launch of metasurface optics on the open market for the first time and follows multiple design wins for Metalenz with leading OEMs in Asia.

"After initially designing meta-optics in partnership with one of the leading suppliers of 3D sensing solutions, we are now engaged with OEMs directly to bring the benefits of metasurface optics to their 3D sensing applications. By partnering with a world-class foundry like UMC, we gain the manufacturing capabilities, expertise, and global reach to serve customers interested in adopting our meta-optics technology," said Rob Devlin, Co-founder and CEO of Metalenz. "This will further accelerate our growth as we are becoming the leading provider of precision optics for 3D sensing solutions."

Broadcom Inc. today announced sample availability of its second generation of wireless connectivity chipset solutions for the Wi-Fi 7 ecosystem, spanning Wi-Fi routers, residential gateways, enterprise access points, and client devices. The new chips build on the ecosystem of products with Broadcom's first-generation Wi-Fi 7 chips while delivering additional functionality to a wider market.

The first chip, the BCM6765, is a highly-optimized residential access point chip that supports 320 MHz 2-stream Wi-Fi operation. This new platform system-on-chip (SoC) allows the productization of Wi-Fi 7 mass-market access points and smart repeater solutions which span the spectrum of cost, form factor, and performance. The second chip, the BCM47722, is an enterprise access point chip that also supports 320 MHz 2-stream operation along with dual IoT radios that support simultaneous operation for Bluetooth Low Energy (BLE), Zigbee, Thread, and Matter protocols. This SoC addresses the growing needs of Internet of things (IoT) applications in the enterprise Wi-Fi market. The third chip, the BCM4390, is a low-power Wi-Fi, Bluetooth, and 802.15.4 combo chip designed for use in mobile devices such as handsets and tablets. It supports 160 MHz 2-stream Wi-Fi operation, dual Bluetooth, and Zigbee, Thread, and Matter protocols to service a broad set of mobile markets.

TrendForce reports that inventory reduction in Q1 fell short of expectations and coincided with the industry's traditional off-season, leading to overall subdued demand. However, due to new product release and a surge in urgent orders for specialized specifications, Q1 revenue of the global top ten IC design houses remained on par with 4Q22, with a modest QoQ increase of 0.1% for a total revenue of US$33.86 billion. Changes in ranking included Cirrus Logic slipping from the top ten as well as the ninth and tenth positions being replaced by WillSemi and MPS, respectively. The rest of the rankings remained unchanged.

The smartphone supply continues to grapple with overstock, but AI applications are entering a period of rapid growth
Qualcomm witnessed an uptick in its revenue, largely attributed to the launch and subsequent shipments of its latest flagship chip, the Snapdragon 8Gen2. The company saw 6.1% in QoQ growth in its smartphone business, which effectively offset the downturn from its automotive and IoT sectors. As a result, Qualcomm's Q1 revenue increased marginally by 0.6%, cementing its position at the top of the pack with a market share of 23.5%.

To help bridge the growing gap between modern systems and the legacy technology still in use around the world, global industrial computing specialists, OnLogic (www.onlogic.com), have released the Helix 511 Edge Computer. Designed for use in manufacturing, automation, energy management, and other edge and IoT applications, the Helix 511 easily interfaces with on-site systems thanks to a broad selection of modern and legacy connectivity options.

"We frequently have conversations with customers who are struggling to update their technology infrastructure simply because they can't connect existing systems to newer, more powerful and more capable devices," says OnLogic Product Manager, Hunter Golden. "The embedded computing space has traditionally lagged behind when it comes to adopting new technologies. We want to shift that paradigm while still allowing innovators to access and exchange data with their existing equipment. In many cases, you don't need to rip and replace everything, you just need a Helix 511."

GlobalFoundries Inc., a global leader in feature-rich semiconductor manufacturing, and STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced today the conclusion of the agreement to create a new, jointly-operated, high-volume semiconductor manufacturing facility in Crolles (France), which was announced on 11 July 2022.

"I would like to thank Minister Le Maire, the French Minister of the Economy and Finance, and his team for their support and the dedication for the last 12+ months that have made celebrating today's milestone possible," said Dr. Thomas Caulfield, President and CEO of GlobalFoundries. "In partnership with ST in Crolles, we are further expanding GF's presence within Europe's dynamic technology ecosystem while benefiting from economies of scale to deliver additional capacity in a highly capital efficient manner. Together we will deliver GF's market leading FDX technology and ST's comprehensive technology roadmap, in alignment with customer demand which is expected to remain high for Automotive, IoT, and Mobile applications over the next decades."

ASUS today announced the availability of the ExpertWiFi EBM68 and EBR63, two routers designed to serve commercial needs ranging from small cafes to medium-sized businesses. The ASUS ExpertWiFi EBM68 is a tri-band AX7800 mesh system suited to mid-size businesses or spaces with multiple-stories such as a hotel or a retail store, and the ASUS ExpertWiFi EBR63 is a dual band AX3000 business router suited to cafes, small offices or home offices (SOHOs).

With the ExpertWiFi series, ASUS uniquely delivers Self-Defined Network (SDN) and a variety of other innovative features to the business router ecosystem, including customizable guest portals with user-friendly interface and guidance for simple and accessible settings. They also bring VLAN and VPN support for advanced protection of business information and data, streamlined network expansion options, space-saving designs and easy device management with the new ASUS ExpertWiFi app.

Samsung Electronics today announced the global launch of its full 2023 Smart Monitor lineup. The new M8, M7 and M5 Smart Monitors (Model Name: M80C, M70C, M50C) from Samsung enable users to tailor their monitors to their unique styles and needs, as they watch, play and work.

"We are raising the bar for Smart Monitors globally with our new lineup and especially our enhanced M8 model," said Hoon Chung, Executive Vice President of Visual Display Business at Samsung Electronics. "Within a single monitor, users can enjoy the best of entertainment and gaming, productivity, design and personalized convenience and comfort."

Global memory leader, Team Group, continues to develop and manufacture innovative, high-performance, and reliable industrial memory storage products, providing customers with convenient and flexible solutions. Today, it is releasing the brand new P845-M30 SSD, designed for the M.2 2230 form factor and PCIe Gen 4 interface. This compact, high-performance SSD is suitable for mini industrial PCs, handheld embedded applications, and AIoT-related tasks.

The P845-M30 comes with 112 layers of high-quality 3D NAND flash memory and uses page mapping technology to reduce its block P/E cycling frequency, extending its lifespan, and increasing its random access speeds. It is available in capacities ranging from 256 GB to 1 TB and measures only 30 mm in length. In addition, its support of the PCIe Gen 4 interface allows it to provide high-speed transfers with low power consumption. The P845-M30 can upgrade your device's performance without taking up space, making it the ideal SSD solution for mini industrial computers, which require a small form factor and large capacities.

Hackboard today announced the launch of Hackboard 2, an affordable single-board computer (SBC) about the size of a smartphone but with the power of a desktop computer and one of the lowest-priced Intel-powered and Windows-based single-board computers ever made. It's ideal for Makers and Hobbyists, IoT, Edge Computing, and Embedded Solutions with customizable Hackboards, contact Support@Hackboard.com for more info. Soon, Hackboard will ship Personal Computer Kits, ideal for work-from-home users, remote learners and the classroom.

The Hackboard 2 allows users to create their ideal computing environment at an affordable price, while taking advantage of the benefits of industry standard technology. With optional 4G or 5G modules, users can connect to the internet from almost anywhere. Users can plug the system into nearly any monitor with an HDMI input, including their TV.

Goldkey and IIoT technology manufacture company SECO have announced a strategic collaboration for the Asia-Pacific (APAC) region. The collaboration involves mutual specification of both companies' products, joint customer approach, and promotion of CLEA, the IoT-AI platform developed by SECO, towards existing and potential opportunities with Goldkey DRAM solutions under the auspices of SECO Microelectronics and Goldkey Technology Corporation. The Memorandum of Understanding (MoU) was signed at NürnbergMesse on 14th March 2023.

Complementing the company's expansion of DRAM development in the Industrials sector Vicky Tseng, CEO of Goldkey Technology Corporation states: "The collaboration underlines the symbiosis between both companies. SECO's innovations in IoT hardware which include cyber-security firmware and the AI software-platform address the need for all-encompassing least-complicated answers to modern IoT requirements," adding "SECO is indeed an industry forerunner in highly advanced IIoT technology, and together with Goldkey's industrial-DRAM portfolio, we are confident to providing comprehensive solutions to meeting unique requirements of customers in the region."

LattePanda launched the powerful and hackable single board server, the LattePanda Sigma. With its super computing power, this device opens up endless possibilities for tech enthusiasts, developers, small businesses & enterprises. With its innovative design and unique features, the LattePanda Sigma is poised to redefine the world of single board servers and drive innovation to new heights.

The LattePanda Sigma is powered by the 13th-generation Intel Core i5-1340P Rapter Lake (12-Core, 16-Thread) processor and features Intel Iris Xe Graphics, providing optimal graphics performance. Its optimized power consumption minimizes power usage by almost 50%, making it an eco-friendly choice. With 16 GB of high-speed Dual-Channel LPDDR5-6400 MHz RAM, the LattePanda Sigma can handle even the most demanding tasks with ease, making it perfect for graphic design, gaming, and video editing.

The global economy has faced increased inflation risks and downstream inventory corrections in 2H22, which have affected IC design houses faster than wafer foundries, as they are far more sensitive and responsive to market reversals. TrendForce reports that adverse factors such as weak overall consumption, restrictions from China, and the slowdown of corporate IT spending and CSP demand have impacted the revenue performance of the world's top 10 IC design houses in 4Q22, leading to a QoQ decline of 9.2%, or approximately US$33.96 billion.

TrendForce predicts that the revenue of these top 10 companies keep declining—though with a slight convergence—into 1Q23, owing to ongoing inventory corrections across the entire supply chain as well as Q1 being the traditional off-season for consumer demand. Demand will continue to be weak despite new product launches and inventory replenishment in the supply chain.