New product alert! In January last year, we launched the $4 Raspberry Pi Pico, our first product built on silicon designed here at Raspberry Pi. At its heart is the RP2040 microcontroller, built on TSMC's 40 nm low-power process, and incorporating two 133 MHz Arm Cortex-M0+ cores, 264kB of on-chip SRAM, and our unique programmable I/O subsystem. Since launch, we've sold nearly two million Pico boards, and RP2040 has found its way into a huge number of third-party products. We always believed that RP2040 was a great fit for commercial and industrial applications, but the global semiconductor shortage has vastly accelerated adoption. With millions of units on hand today, and pipeline in place for tens of millions more, design engineers who have been let down by their current suppliers have a perfect excuse to experiment.

Fast cores, large memory, and flexible interfacing make RP2040 a natural building block for Internet of Things (IoT) applications. But Pico itself has one obvious missing feature for IoT: a method for connecting to the network. Now, this is about to change. Today, we're launching three new members of the Pico family. Raspberry Pi Pico W is priced at $6, and brings 802.11n wireless networking to the Pico platform, while retaining complete pin compatibility with its older sibling. Pico H ($5) and Pico WH ($7) add pre-populated headers, and our new 3-pin debug connector, to Pico and Pico W respectively. Pico H and Pico W are available today; Pico WH will follow in August.

As global adoption of Edge AI continues to rise through smart transitions, ASRock Industrial is excited to release the new iEPF-9010S/iEP-9010E Series Robust Edge AIoT Platform, enabled by 12th Gen Intel Core Processors (Alder Lake S) with R680E/H610 chipsets to bring breakthrough performance at the Edge. Featuring excellent computing power with energized Edge AI acceleration, the iEPF-9010S/iEP-9010E Series provide high memory capacity, rich I/Os and expandability, wide RF connectivity- 4G LTE, 5G, Wi-Fi 6E, BT 5.2 with real-time TSN/TCC, plus ruggedness for industrial environments. The Series is an effective all-in-one consolidation for high-demanding workloads, tailor-made for mission-critical industrial applications such as factory automation, machine automation, robotic control, AI AOI, autonomous vehicles, smart cities, and much more.

AMD today announced the Ryzen Embedded R2000 Series, second-generation mid-range system-on-chip (SoC) processors optimized for a wide range of industrial and robotics systems, machine vision, IoT and thin-client equipment. Ryzen Embedded R2000 Series doubles the core count and delivers a significant performance uplift compared to the prior generation, with the new R2514 model exhibiting up to 81 percent higher CPU and graphics performance than the comparable R1000 series processor. Performance-per-watt efficiency is also optimized using "Zen+" core architecture with AMD Radeon graphics for rich and versatile multimedia capabilities. Ryzen Embedded R2000 processors can power up to four independent displays in brilliant 4K resolution.

Embedded R2000 Series processors are scalable up to four "Zen+" CPU cores with eight threads, 2 MB of L2 cache and 4 MB of shared L3 cache. This gives embedded system designers great flexibility to scale performance and power efficiencies with a single processing platform. With support for up to 3200 MT/s DDR4 dual-channel memory and expanded I/O connectivity, the Ryzen Embedded R2000 Series processors deliver 33 percent higher memory bandwidth and up to 2X greater I/O connectivity compared to R1000 series processors.

MediaTek today unveiled its new Genio platform for AIoT devices and introduced the first chip in the Genio family, the Genio 1200 designed for premium AIoT products. MediaTek Genio is a complete platform stack for the AIoT with powerful and ultra- efficient chipsets, open platform software development kits (SDKs) and a developer portal with comprehensive resources and tools. This all-in-one platform makes it easy for brands to develop innovative consumer, enterprise and industrial smart applications at the premium, mid-range and entry levels, and bring these devices to market faster. With MediaTek Genio, customers have access to all the hardware, software and resources needed to go from concept to design and manufacturing.

Customers can choose from a range of Genio chips to suit their product needs, and then use MediaTek's developer resources and the Yocto Linux open platform SDK to customize their designs. MediaTek also makes it easy for customers to access its partners' system hardware and software, and leverage partners' networks and sales channels. By offering an integrated, easy-to-use platform, MediaTek Genio reduces development costs and speeds up time to market, while providing long-term support for operating system updates and security patches that extend the product lifecycle. "Today MediaTek powers the most popular AIoT devices on the market. As the industry enters the next era of innovation, MediaTek's Genio platform delivers flexibility, scalability and development support brands need to cater to the latest market demands," said Jerry Yu, MediaTek Corporate Senior Vice President and General Manager of MediaTek's Computing, Connectivity and Metaverse Business Group. "We look forward to seeing the new user experiences brands bring to life with the Genio 1200 and its powerful AI capability, support for 4K displays and advanced imaging features."

Today MaxLinear announced the immediate availability of two 1000BASE-T Ethernet Switches (GSW125, GSW145) and a quad-port 2.5GBASE-T PHY (GPY245), expanding its Ethernet product portfolio to better serve the industrial, telecommunications, and networking outdoor markets, where products must perform efficiently in harsh temperature environments. With the increase of outdoor Wi-Fi access points, Industrial IoT and Industrial PCs used to collect, monitor and control equipment, products must operate in either high heat or frigid cold environments. Extreme temperatures can impact network operation, data transmission, and system reliability, causing interruptions and downtime, leading to security risks and costly emergency repairs.

"MaxLinear has a 40-year history of being a leading supplier in industrial interface devices, having shipped over 1B serial transceivers over the past five years," said James Lougheed, Vice President of Marketing, High Performance Analog. "As the requirements for industrial-grade Ethernet products continue to grow, we continue to invest to remain in a strong position to support these fast-growing markets."

As industries compete to capitalize on the abundance of data generated by intelligent, connected devices, implementation of an intelligent data strategy has become even more critical. Edge computing has played an instrumental role to address this demand, but the edge itself has continued to evolve with the ever-growing need for even more demanding, real-time computing. Rugged edge computing enables applications that require real-time, low latency data processing and storage to function reliably in volatile environments that are not friendly to regular systems.

Trends and technologies such as Industry 4.0, AIoT, and 5G are driving the need for improved intelligence at the rugged edge. Businesses and organizations want more computing power at the edge because of the benefits it provides to their operations. NVM Express (NVMe) is an essential enabling technology for rugged edge computing, reducing latency and accelerating data processing to the point where connected devices can operate anywhere to perform machine learning, artificial intelligence, and inference computing. Real-time data access and analytics are turning rugged edge computing into a competitive necessity across all sectors and industries.

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories has today launched new industrial-grade Registered DIMM (R-DIMM) DDR5 memory modules. This completes a full suite of industrial-grade DDR5 including U-DIMM, SO-DIMM and now R-DIMM modules designed for the latest Intel 12th Generation processors, and future DDR5 platforms.

ADATA industrial-grade R-DIMM DDR5 memory modules are suitable for a wide range of applications, including 5G backhaul equipment, AIoT, High-Performance Computing, Server, Data Center, Edge Computing, Networking, Surveillance and more. DDR5 is expected to account for 90% of the global memory market by 2026, and ADATA's DDR5 memory is ready to support the growing demand for reliable, high bandwidth memory.

ADATA Technology (Taiwan Stock Exchange: 3260.TWO), a global leading brand of industrial-grade memory, including flash storage products and DRAM modules, today announces that its in-house developed firmware for 112-Layer (BiCS5) 3D NAND PCIe solid state drives has become University of New Hampshire InterOperability Laboratory (UNH-IOL) NVMe 1.4 certified. The certification reaffirms ADATA's core competencies in R&D and commitment to offering high performance SSDs. UNH-IOL is an independent test facility that provides interoperability and standards conformance testing for networking, telecommunications, data storage, and consumer technology products.

The IM2P32A8 M.2 2280 and IM2P32A4 M.2 2242 industrial-grade solid state drives will benefit from the newly certified firmware. What's more, both SSDs feature 112-layer 3D TLC Flash memory developed by WD and KIOXIA, supports the PCIe Gen3x4 interface, and provides large capacities of up to 2 TB. With ADATA's firmware, they provide improved performance and interoperability. In addition to processing large volumes of data, the SSDs can also serve as storage devices or a boot disk, which can fulfill the needs of applications such as 5G, Industrial Internet of Things (IIoT), smart cities, and telemedicine.

Apacer has taken 3D NAND Flash optimization to new heights. Today, it announces the release of SLC-liteX industrial SSDs that can provide an incredible 100,000 P/E cycles. That's 3 to 33 times higher than competing 2D MLC or 3D TLC products can offer. 5G and AIoT manufacturers who are invested in large-scale data collection and analysis, including those demanding higher capacities, higher performance and higher endurance, will quickly see the advantages of this development. According to Allied Market Research, "the global 3D NAND flash memory market size was valued at $12.38 billion in 2020, and is projected to reach $78.42 billion by 2030, registering a CAGR of 20.3% from 2021 to 2030."

The endurance of any NAND Flash product can be measured in P/E cycles. Every time a write or erase action is performed, the Flash cell will suffer irreparable damage. In the industrial world, 3,000 P/E cycles was considered quite a competitive number. But with increasing demands for greater endurance thresholds in applications such as 5G O-RAN and edge computing switches, the market was hungry for more - while still recognizing the paramount importance of cost-effectiveness. Apacer's crack team of firmware experts tackled the problem and were able to tweak the technology to deliver 100,000 P/E cycles. Careful cell distribution management of the 3D TLC structure was necessary in order to correctly adjust the voltage delta and charge sensing. Furthermore, powered by carefully selected industrial grade NAND components, the firmware structure is specifically optimized to enhance NAND flash stability during daily operations, and the error handling algorithm is significantly improved to avoid any unexpected ECC errors.

In celebration of Pi Day, OnLogic, a global industrial computing manufacturer and solution provider known for their reliable, orange industrial PCs, has announced that their new Factor 201 Raspberry Pi-powered device is available for pre-order. In addition, they've released more details about the next model in the Factor 200 Series, the Factor 202. Both devices are powered by the Raspberry Pi Compute Module 4, which was developed specifically for industrial products.

"We're delighted that OnLogic has chosen to develop the Factor 201 around Raspberry Pi. Using Raspberry Pi Compute Module 4 with their custom-designed carrier boards and industrial enclosure has allowed OnLogic to offer their customers flexible and reliable solutions, and we see Raspberry Pi hardware being increasingly widely adopted in industry with products like this one," said Gordon Hollingworth, Chief Product Officer at Raspberry Pi Ltd.

UP! Bridge the Gap, a brand belonging to a leading manufacturer of AI Edge hardware solutions, AAEON, has unveiled the UP Squared 6000 Edge Computing Kit - a compact, industrial turnkey solution featuring an innovative software package to ease and simplify the development process for system integrators, independent software vendors (ISVs), and IoT developers.

Based on the latest Intel Atom x6000E series processors (formerly Elkhart Lake), the UP Squared 6000 Edge Computing Kit delivers upgraded single-thread, multi-thread, and graphical performances to accelerate computer vision and deep learning applications and enables the features of the Intel Programmable Services Engine (Intel PSE).

Since OpenVINO launched in 2018, Intel has enabled hundreds of thousands of developers to dramatically accelerate AI inferencing performance, starting at the edge and extending to the enterprise and the client. Today, ahead of MWC Barcelona 2022, the company launched a new version of the Intel Distribution of OpenVINO Toolkit. New features are built upon three-and-a-half years of developer feedback and include a greater selection of deep learning models, more device portability choices and higher inferencing performance with fewer code changes.

"The latest release of OpenVINO 2022.1 builds on more than three years of learnings from hundreds of thousands of developers to simplify and automate optimizations. The latest upgrade adds hardware auto-discovery and automatic optimization, so software developers can achieve optimal performance on every platform. This software plus Intel silicon enables a significant AI ROI advantage and is deployed easily into the Intel-based solutions in your network," said Adam Burns, vice president, OpenVINO Developer Tools in the Network and Edge Group.

The number of devices connected to WiFi has skyrocketed by 12X since 2018 as Xfinity households connected nearly 1 billion devices in 2021. In fact, reliable WiFi has become so critical that nearly half of the country (45 percent) believe it is more important than reliable transportation*. These findings and more highlight Comcast's 2021 WiFi Trends Report, providing insights into how WiFi enabled Americans to pursue what mattered to them most in 2021 based on network trends and consumer insights.

"The ecosystem of connected devices in the home and the applications running on them has exploded over the last few years, driving a shift in consumers perceptions on what truly is important to their connectivity experience," said Sophie Ahmad, Chief Marketing Officer of Xfinity Consumer Service, Comcast Cable. "Unbeatable Internet that provides the best connection, complete security, faster speeds and the best tech is now integral to how Americans work, exercise, parent, and entertain."

GIGABYTE Technology, an industry leader in high-performance servers and workstations, today announced a partnership with Canonical to certify servers for the Ubuntu Server operating system so systems can be quickly and confidently deployed. As part of GIGABYTE's commitment to certifying enterprise solutions and to help customers with rapid deployment, GIGABYTE routinely works with partners to get server qualifications that ensure the software will be compatible with the hardware and the systems will be able to get up and running in no time. Partnering with Canonical further extends the depth of certification that GIGABYTE provides to better support end users with their flavor of OS.

Among the choices of Linux operating systems, Ubuntu has emerged as the most popular choice as users enjoy the long-term support and reliability that come from Canonical. When it comes to the public cloud, Linux desktop or IoT, Ubuntu has a dominant presence. Additionally, developers appreciate the ability to work across platforms (desktop, public/private cloud, edge, IoT) consistently and efficiently particularly on AI, machine learning, and deep learning projects.

Exponential demand growth for remote and unmanned terminals in smart home, logistics, manufacturing and other end-user applications has driven iterative updates in Wi-Fi technology. Among the current generations of technologies, Wi-Fi 5 (802.11ac) is mainstream while Wi-Fi 6 and 6E (802.11ax) are at promotional stages, according to TrendForce's investigations. In order to meet the connection requirements of industry concepts such as the Metaverse, many major manufacturers have trained their focus on the faster and more stable next generation 802.11be Wi-Fi standard amendment, commonly known as Wi-Fi 7. Considering technical characteristics, maturity, and product certification status, Wi-Fi 6 and 6E are expected to surpass Wi-Fi 5 to become mainstream technology in 2022, with global market share expected to reach 58%.

To expand vertical markets and accelerate AIoT deployments for clients, AAEON announced its introduction of UP Squared 6000, a high-performance industrial computing maker board at small form factor (101.6 mm x 101.6 mm) powered by Intel Atom x6000E/RE, Pentium or Celeron N/J series SoC (formerly Elkhart Lake) to its expanding UP Family. With the next-generation IoT-enhanced processors, UP Squared 6000 delivers upgraded single-thread, multi-thread and graphical performances, and features Intel Programmable Service Engine (PSE) and onboard TPM to accelerate and optimize AIoT vertical applications.

To drive optimal performances required for today's vertical markets, such as robotics, smart agriculture, retail, and vision-intensive applications, UP Squared 6000, powered by Intel Atom x6000E/RE, Pentium or Celeron N/J series SoC (formerly Elkhart Lake), delivers up to 1.7x single-thread performance, 1.5x multi-thread performance, and 2x graphical processing performance enabled by Intel UHD Graphics (11th Generation GPU). By adopting the next-generation IoT-enhanced processors, UP Squared 6000 brings improved performance and efficiency in artificial intelligence deployments.

Following the announcement of new 12th Generation Intel Core processors at CES 2022, global industrial computer hardware manufacturer and IoT solution provider, OnLogic, has revealed their upcoming Karbon 800 Series of rugged computers, designed to leverage the advanced features and capabilities of Intel's latest CPUs. The OnLogic Karbon 800 Series has been engineered for machine learning, artificial intelligence (AI), advanced manufacturing, automation, and other Industry 4.0 and Industrial IoT applications, that require powerful computing in commercial and industrial environments.

The Karbon 800 will be available in four models at launch, allowing users to select and customize the system that best fits their particular needs. Each model can be configured with up to a 16-core, Intel Core i9 processor and 64 GB of DDR4 ECC or non-ECC memory. Depending on the model, a wide range of storage and expansion options are available, including optional hot-swap bays as well as single and dual PCIe Gen 4 slots. OnLogic's unique ModBay expansion technology can also be used to add a variety of additional connectivity and storage options, including up to 14x LAN ports and a 6x 2.5" SSD RAID array.

IBM today announced that LG Electronics has joined the IBM Quantum Network to advance the industry applications of quantum computing. By joining the IBM Quantum Network, IBM will provide LG Electronics access to IBM's quantum computing systems, as well as to IBM's quantum expertise and Qiskit, IBM's open-source quantum information software development kit.

LG Electronics aims to explore applications of quantum computing in industry to support big data, artificial intelligence, connected cars, digital transformation, IoT, and robotics applications - all of which require processing a large amount of data. With IBM Quantum, LG can leverage quantum computing hardware and software advances and applications as they emerge, in accordance with IBM's quantum roadmap. By leveraging IBM Quantum technology, LG will provide workforce training to its employees, permitting LG to investigate how potential breakthroughs can be applied to its industry.

congatec - a leading vendor of embedded and edge computing technology - introduces the 12th Generation Intel Core mobile and desktop processors (formerly code named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules. Featuring the latest high performance cores from Intel, the new modules in COM-HPC Size A and C as well as COM Express Type 6 form factors offer major performance gains and improvements for the world of embedded and edge computing systems. Most impressive is the fact that engineers can now leverage Intel's innovative performance hybrid architecture. Offering of up to 14 cores/20 threads on BGA and 16 cores/24 threads on desktop variants (LGA mounted), 12th Gen Intel Core processors provide a quantum leap [1] in multitasking and scalability levels. Next-gen IoT and edge applications benefit from up to 6 or 8 (BGA/LGA) optimized Performance-cores (P-cores) plus up to 8 low power Efficient-cores (E-cores) and DDR5 memory support to accelerate multithreaded applications and execute background tasks more efficiently.

Leopard Imaging Inc. a global leader in high-definition embedded camera design and manufacturing, and an Elite Partner of Nvidia Jetson Platform, is announcing its plans for the Consumer Electronics Show (CES) 2022 from January 5th to 8th showcasing advanced imaging solutions and AI edge computing solutions. The company will exhibit demos of 3D Depth Camera Hawk on the Jetson Edge AI and Isaac Robotics Platforms. As an imaging solution development veteran, Leopard Imaging will exhibit customized cameras for autonomous driving, drones, IoT, robotics, and AI edge computing devices at CES 2022. The company will exchange ideas with its partners, industry experts, and customers to develop more advanced imaging solutions.

In November, Leopard Imaging collaborated with NVIDIA launching Hawk 3D Depth stereo camera LI-AR0234CS-STEREO-GMSL2, supporting NVIDIA Isaac Robotics platform and NVIDIA Jetson platform, and taking camera solutions to the next level. Leopard Imaging empowers the imaging quality with Active Alignment (AA) technology through its powerful manufacturing capabilities. Its full integration services will help customers incorporate this camera with different robotic projects.

UP Bridge the Gap, a brand belonging to AAEON, a leading manufacturer of AI Edge hardware solutions, is excited to announce the new UP Squared 6000 is available for pre-order and will start shipping in February 2022. UP Squared 6000 is the newest addition to the extensive UP Squared lineup. It brings greater expandability and performance over previous generations and is available as both a board and compact edge system.

Based on the latest Intel Atom x6000E Series and Intel Pentium and Intel Celeron N and J Series processors (formerly Elkhart Lake), UP Squared 6000 offers up to 1.7x better compute performance and twice the performance for 3D graphics compared with the previous generation. With a flexible I/O loadout and powerful computing capabilities, the UP Squared 6000 is an astonishingly power-efficient platform.

Rugged embedded computer brand Cincoze announces the launch of three new 16:9 widescreen sunlight-readable display modules in 15", 21", and 24" to extend the CRYSTAL product line of industrial PCs and monitors. The 16:9 widescreen sunlight-readable display modules boast vivid colors, high brightness, responsive touch, and industrial-grade rugged design. The modules are ideal for IoT and smart cities, and they are the first choice for HMI applications such as vehicle charging piles, outdoor kiosks, and self-service platforms.

The Cincoze sunlight-readable display module lineup currently includes 8" to 19" 4:3 modules, and the newly added 15", 21", and 24" 16:9 modules provide a more comprehensive range of size options. The new modules inherit the design concepts of the CRYSTAL series, including the patented convertible display system (CDS) modular system. CDS enables the addition of a P2000/P1000 series embedded system module to create a sunlight-readable panel PC or the addition of the M1000 series display module to create a sunlight-readable industrial monitor. Multiple and flexible solutions to facilitate future upgrades and maintenance.

Normally we wouldn't really cover kitchen gadgets, but Asus has just launched its PureGo PD100 in the US market and it's the company's first entry in this market space. However, it's also an "IoT" gadget, as it features Bluetooth connectivity and an app, as well as wireless charging.

At this point, you're probably wondering what the heck it is though, well, ASUS calls it a "Fruit and Vegetable Cleanliness Detector". In reality, it appears to be a sensor that detects pesticides and other "harmful" pollutants in water. In other words, you have to fill up your sink, wash your fruit or vegetables, then plop the PD100 in the water to tell you how dirty the water is. The idea is that you replace the dirty water with clean water until the device tells you that there's no more pollutants in the water. At $199.99 it's hard to see how this is going to be a big seller for ASUS, but maybe it'll be this year's gift from tech people to their loved ones.

As the global vaccination rate rose, and border restrictions in Europe and North America eased, social activities also began to enter a period of recovery, with the consumer electronics market seemingly ready for the arrival of the traditional peak season in 2H21, according to TrendForce's latest investigations. At the same time, however, the global supply chain was affected by delays in maritime transport, skyrocketing shipping costs, and component shortages, in addition to already-prohibitive price hikes for certain components in 1H21. Given the parallel rise in both material and manufacturing costs, the market for end products has not undergone the expected cyclical upturn in 2H21. Even so, the overall demand for and shipment of smartphones, notebook computers, and monitors experienced QoQ increases in 3Q21, thereby driving up businesses for major OSAT (outsourced semiconductor assembly and test) companies. For 3Q21, the revenues of the top 10 OSAT companies reached US$8.89 billion, a 31.6% YoY increase.

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today announces the new upgraded ADATA IM2P33E8 PLP PCIe Gen3x4 M.2 2280 solid state drive (SSD) with Power Loss Protection (PLP) technology. Since its launch in 2019, the IM2P33E8 has been recognized by industry insiders and customers involved in 5G, IoT, cloud, AI and other industrial applications for its excellent performance, high capacities, and comprehensive data security mechanism.

In order to meet the requirements of industrial applications in the era of 5G, IoT, Cloud, AI, and big data analytics, ADATA is offering an SSD that is able to operate for longer after power outages and reduce the misidentification of bad blocks. This was achieved by the inclusion of tantalum polymer capacitors to the IM2P33E8 PLP. Tantalum polymer capacitors have the ability to reduce the detriment caused by power outages, most notably data loss.