Arm today announced the appointment of new Board members Dr. Paul E. Jacobs, chairman and CEO of XCOM Labs and former CEO and executive chairman of Qualcomm Inc., and Rosemary Schooler, former corporate vice president and general manager of Data Center and AI Sales for Intel. Both bring significant public company experience spanning technology development, business strategy and corporate governance to Arm as it continues to prepare for a public listing.

"The unique insights and depth of experience that Paul and Rosemary bring will help us expand and diversify our Board while providing enormous value to Arm at such a pivotal moment in our journey," said Rene Haas, CEO, Arm.

TP-Link, a leading global provider of consumer and business networking products, today held an epochal WiFi 7 product launch to announce its WiFi 7 networking solution.

As the world's first vendor to release a full home and enterprise WiFi 7 product line, TP-Link launched new WiFi 7 routers, Deco products, Omada EAPs, and Aginet products for ISP markets to cover all usage scenarios. Additionally, TP-Link's new HomeShield 3.0 provides more reliable and smarter network solutions.

Axiomtek - a world-renowned leader relentlessly devoted to the research, development, and manufacture of series of innovative and reliable industrial computer products of high efficiency - is pleased to announce the iNA200, a DIN-rail cybersecurity gateway for operational technology (OT) network security. The iNA200 is powered by the Intel Atom x6212RE or x6414RE processor (Elkhart Lake) and has one DDR4-3200 SO-DIMM for up to 32 GB of system memory. For demanding rugged environments, this fanless IIoT edge gateway comes with a wide operating temperature range of -40°C to 70°C and supports wide power input of 9 to 36 VDC with dual power input. The iNA200 also has two 2.5G LAN ports, sufficient storage, and high expandability for various industrial application needs.

"OT cybersecurity is essential for Industry 4.0. Axiomtek's iNA200 is designed to safeguard your OT assets and avoid network threats for critical infrastructure," said Kevin Hsiao, a product manager of Network Computing Platform Division at Axiomtek. "Additionally, our iNA200 features an M.2 Key B slot to enable 5G connectivity for next-generation industrial use cases. With the Trusted Platform Module 2.0 (TPM 2.0) support, this cybersecurity gateway increases security offering hardware-level protection against malware and sophisticated cyber-attacks."

ASUS today announced the opening of its first AI-enabled smart factory. The facility is powered by a variety of AIoT technologies, including a 3D Digital Twin system, an augmented reality (AR) platform, autonomous mobile robots (AMR) for in-factory logistics, as well as an AI-driven defect inspection system. All of this will help achieve ASUS Industry 4.0 goals, increasing manufacturing efficiency and improving ESG outcomes.

Albert Chang, ASUS Corporate Vice President and Co-Head of the AIoT Business Group, explained the importance of the new factory:
"In 2018, our Chairman Jonney Shih started ASUS on a new journey to become a company that transforms and evolves, trusts in radical truth and transparency, embraces idea meritocracy, and fosters collective wisdom. The opening of our first AI-enabled smart factory is a significant milestone in our company transformation and showcases our solid integrated capabilities, from software to hardware, that we offer to our clients and suppliers."

TCL, a pioneer in display technology and affordable, powerful connected experiences, unveils a new range of CPE devices at Broadband World Forum, including three latest generation 5G routers. TCL will also deliver the keynote address on the exhibition's final day on October 20th. TCL is committed to providing users with safe, high-speed, reliable, and seamless mobile broadband connection services. As a leading global broadband provider, TCL works with more than 150 carriers worldwide to meet network connection demands for home, business, mobile and machine-to-machine (M2M).

"Our vision is to create seamless connections for everyone", commented Sharon Xiao, GM of the Smart Connected Device Business at TCL Communication. "By 2027[1], 5G subscriptions are forecast to reach 4.4 billion. TCL's long-term partnership with top-tier operators means we can offer high-quality 5G Mobile Broadband (MBB) and Fixed Wireless Access (FWA) products to clients and consumers and make our vision a reality."

NETGEAR, Inc., the leading provider of award-winning connected products designed to simplify and improve people's lives, today launched a new addition to its Orbi line. The Orbi 860 Series builds on the award-winning Orbi 850 Series by future-proofing the best seller with a 10Gb Ethernet port, supporting multi-gig internet connections; upgraded antenna design for greater WiFi performance and a bundled year of NETGEAR Armor, providing homes with an automatic shield of security against internet threats across every connected device.

Following on the tremendous success of the Orbi 850 Series (WiFi 6 AX6000 Mesh System RBK853), the Orbi 860 Series joins NETGEAR's industry-leading WiFi 6 Whole Home Mesh WiFi portfolio. The past few years have seen huge changes to internet usage spurred by the pandemic, including a dramatic increase in just about everything from home-- working, shopping, learning, and socializing. As Internet Service Providers enable faster multi-gig internet speeds, up to 10 Gigabits per second, and hackers create new sophisticated cyber-attacks, high-performance and secure WiFi become imperative.

The Connectivity Standards Alliance, the international community of more than 550 technology companies committed to open standards for the Internet of Things, announced today the release of the Matter 1.0 specification and the opening of the Matter certification program. Member companies who make up all facets of the IoT now have a complete program for bringing the next generation of interoperable products that work across brands and platforms to market with greater privacy, security, and simplicity for consumers.

As part of the Matter 1.0 release, authorized test labs are open for product certification, the test harnesses and tools are available, and the open-source reference design software development kit (SDK) is complete - all to bring new, innovative products to market. Further, Alliance members with devices already deployed and with plans to update their products to support Matter can now do so, once their products are certified.

Samsung Electronics, a world leader in advanced semiconductor technology, announced today a strengthened business strategy for its Foundry Business with the introduction of cutting-edge technologies at its annual Samsung Foundry Forum event. With significant market growth in high-performance computing (HPC), artificial intelligence (AI), 5/6G connectivity and automotive applications, demand for advanced semiconductors has increased dramatically, making innovation in semiconductor process technology critical to the business success of foundry customers. To that end, Samsung highlighted its commitment to bringing its most advanced process technology, 1.4-nanometer (nm), for mass production in 2027.

During the event, Samsung also outlined steps its Foundry Business is taking in order to meet customers' needs, including: foundry process technology innovation, process technology optimization for each specific applications, stable production capabilities, and customized services for customers. "The technology development goal down to 1.4 nm and foundry platforms specialized for each application, together with stable supply through consistent investment are all part of Samsung's strategies to secure customers' trust and support their success," said Dr. Si-young Choi, president and head of Foundry Business at Samsung Electronics. "Realizing every customer's innovations with our partners has been at the core of our foundry service."

DFI, the world's leading brand in embedded motherboards and industrial computers, was invited to participate in "AMD Datacenter Solutions Day" in September, based on the theme of high-performance computing (HPC). As the first in the world to launch the smallest industrial motherboard equipped with AMD products, DFI partnered with its subsidiary, AEWIN, to present their star products and share how ultra-small products can help the trend of software virtualization technologies in the forum. We hope to optimize the development of diverse services in IoT applications.

AMD invited industry giants to the event to discuss the future of high-performance computing and conduct in-depth discussions with their partners related to high-performance computing, cloud computing, and AI. DFI was a speaker in the digital learning AI session during the event. DFI shared their views on software-defined IoT and explained the role of ultra-small products in the application environment.

According to TrendForce research, due to steady weakening of overall demand for consumer electronics, inventory pressure has increased among downstream distributors and brands. Although there are still sporadic shortages of specific components, the curtain has officially fallen on a two-year wave of shortages in general, and brands have gradually suspended stocking in response to changes in market conditions. However, stable demand for automotive and industrial equipment is key to supporting the ongoing growth of foundry output value. At the same time, since the creation of a marginal amount of new capacity in 2Q22 led to growth in wafer shipments and a price hike for certain wafers, this drove output value among top ten foundries to reach US$33.20 billion in 2Q22. Quarterly growth fell to 3.9% on a weakening consumer market.

A prelude to inventory correction was officially revealed in 3Q22. In addition to intensifying severity in the initial wave of order slashing for LDDI/TDDI, and TV SoC, diminishing order volume also extended to non-Apple smartphone APs and peripheral IC PMIC, CIS, and consumer electronics PMICs, and mid-to-low-end MCUs, posing a challenge for foundry capacity utilization. However, the launch of the new iPhone in 3Q22 is expected to prop up a certain amount of stocking momentum for the sluggish market. Therefore, top ten foundry revenue in 3Q22 is expected to maintain a growth trend driven by high-priced processes and quarterly growth rate is expected to be slightly higher than in 2Q22.

NVIDIA today introduced the NVIDIA IGX platform for high-precision edge AI, bringing advanced security and proactive safety to sensitive industries such as manufacturing, logistics and healthcare. In the past, such industries required costly solutions custom built for specific use cases, but the IGX platform is easily programmable and configurable to suit different needs.

As the platform for safe, secure autonomous systems, IGX improves human-machine collaboration. For manufacturing and logistics, IGX provides an additional layer of safety in highly regulated physical-world factories and warehouses. For medical edge AI use cases, IGX delivers secure, low-latency AI inference to address the clinical demand for instantaneous insights from a range of instruments and sensors for medical procedures, such as robotic-assisted surgery and patient monitoring.

NVIDIA today expanded the NVIDIA Jetson lineup with the launch of new Jetson Orin Nano system-on-modules that deliver up to 80x the performance over the prior generation, setting a new standard for entry-level edge AI and robotics. For the first time, the NVIDIA Jetson family spans six Orin-based production modules to support a full range of edge AI and robotics applications. This includes the Orin Nano—which delivers up to 40 trillion operations per second (TOPS) of AI performance in the smallest Jetson form factor—up to the AGX Orin, delivering 275 TOPS for advanced autonomous machines.

Jetson Orin features an NVIDIA Ampere architecture GPU, Arm-based CPUs, next-generation deep learning and vision accelerators, high-speed interfaces, fast memory bandwidth and multimodal sensor support. This performance and versatility empower more customers to commercialize products that once seemed impossible, from engineers deploying edge AI applications to Robotics Operating System (ROS) developers building next-generation intelligent machines.

ASUS IoT, a global AIoT solution provider, today announced a partnership agreement with Canonical to provide pre-installed and certified versions of the Ubuntu Linux operating system for embedded boards and systems in diverse edge computing applications. New ASUS IoT devices such as the PE100A will be guaranteed by Canonical for optimized performance with Ubuntu Linux, in the interest of improving development time, configuration and installation.

This collaboration between ASUS IoT and Canonical ensures that individual hardware I/O functions conform to industrial-grade standards and to the version of Ubuntu running on the device. Moreover, it provides up to 10 years of Linux security (with five years of bundled ESM service) along with updated capabilities for users in industrial manufacturing, smart retail, smart transportation, surveillance and many other application sectors.

According to the latest TrendForce statistics, revenue of the top ten global IC design houses reached US$39.56 billion in 2Q22, growing 32% YoY. Growth was primarily driven by demand for data centers, networking, IoT, and high-end product portfolios. AMD achieved synergy through mergers and acquisitions. In addition to climbing to third place, the company also posted the highest annual revenue growth rate in 2Q22 at 70%.

Qualcomm continues in the No. 1 position worldwide, exhibiting growth in the mobile phone, RF front-end, automotive, and IoT sectors. Sales of mid/low-end mobile phone APs were weak but demand for high-end mobile phone APs was relatively stable. Company revenue reached US$9.38 billion, or 45% growth YoY. NVIDIA benefitted from expanded application of GPUs in data centers to expand this product category's revenue share past the 50% mark to 53.5%, making up for the 13% YoY slump in its game application business, bringing total revenue to US$7.09 billion, though annual growth rate slowed to 21%. AMD reorganized its business after the addition of Xilinx and Pensando. The company's embedded division revenue increased by 2,228% YoY. In addition, its data center department also made a considerable contribution. AMD posted revenue of US$6.55 billion, achieving 70% growth YoY, highest amongst the top ten. Broadcom's sales performance in semiconductor solutions remained solid and demand for cloud services, data centers, and networking is quite strong. The company's purchase order backlog is still increasing with 2Q22 revenue reaching US$6.49 billion, an annual growth rate of 31%.

Robustel strengthen their industry leading portfolio of Industrial IoT routers and gateways with a brand-new series of cost competitive, fully integrated EDGE Computing gateways. With a deep, well-established product range specialising in industrial IoT/M2M solutions, Robustel are always looking for new and innovative ways to service customers in key industrial verticals. Since the company's founding in 2010 the key directive has been to listen and engage with the market to provide solutions that meet real world requirements and a competitive price point allowing for the scale and potential of massive IoT.

With the release of Robustel's first generation 5G Industrial Gateway the R5020 in 2020, the company has seen a massive global trend in customers relying on Cloud IoT infrastructure to deliver a variety of IoT solutions across all verticals; However, there is a growing subsector of customers with demand for more processing being performed at the network edge, to avoid unnecessary network noise and congestion from high volumes of data being streamed over the cellular network.

Intel has announced the availability of its 12th Gen Intel Core SoC processors for IoT Edge. Representing a new lineup of purpose-built edge products optimized for Internet of Things (IoT) applications, this first-of-its-kind socketed system-on-chip (SoC) delivers high performance integrated graphics and media processing for visual compute workloads, a compact footprint to enable smaller innovative form factor designs, and a wide operating thermal design power (TDP) that enables fanless designs and helps customers achieve product sustainability goals.

"As the digitization of business processes continues to accelerate—fueled by workforce demand, supply chain constraints and changing consumer behavior—the amount of data created at the edge and the need for it to be processed and analyzed locally continues to explode. Intel understands the challenges that businesses face—across a wide range of vertical industries—and is committed to help them continue to deliver innovative use cases," said Jeni Panhorst, Intel vice president and general manager of the Network and Edge Compute Division.

Dedicated to innovation in embedded board computing, AAEON are delighted to announce an impressive breakthrough in its ATX motherboard range with the release of the new ATX-Q670A, AAEON's first ATX board with DDR5 support. With this innovation, the ATX-Q670A can provide customers with an unprecedented 50% increase in bandwidth and also a decrease in power consumption compared to prior generations. Particularly suited to IoT applications, the ATX-Q670A also combines the greatest maximum SATA performance with the very fastest SSD to give customer applications access to higher I/O speeds.

The ATX-Q670A is not just faster, but also far more expansive and accommodating to higher-performance modules, offering two PCIe [x16] slots alongside both a PCIe [x4] and PCIe [x1] slot, in addition to a further three PCI slots. Such specifications, alongside the ATX-Q670A's dual graphic card support mean that it can facilitate everything from video capture to AI calculation for vision-based applications, with four independent 4K@60 Hz resolution display capabilities to complete the package.

KIOXIA America, Inc. today announced that it has begun sampling the latest generation of its JEDEC e-MMC Ver. 5.1-compliant embedded flash memory products for consumer applications. The new products are available in capacities of 64 and 128 gigabytes (GB) and integrate the company's BiCS FLASH 3D flash memory and a controller in a single package.

Demand for mid-range capacities in consumer products such as tablets and IoT devices continues to grow, and though the market continues to shift to UFS, there are cases where e-MMC may still be used. The new KIOXIA e-MMC devices expand the available options. A leading provider of flash memory and storage for consumer applications and mobile devices, KIOXIA has been supporting e-MMC since 2007 and was the first supplier to introduce the higher performance follow-on solution to e-MMC, UFS, in early 2013. Today, the broad KIOXIA lineup of e-MMC and UFS solutions provides support across a wide range of densities (4 GB-1 TB).

Network security is of paramount importance in the energy, oil and gas industries, which is why AAEON, a leading manufacturer of industrial IoT and AI Edge solutions, has introduced the ICS-6280, its latest Industrial-Grade Network Appliance. Powered by the Intel Atom x6000E series processors (formerly Elkhart Lake), the ICS-6280 is specially designed for optimal performance in rugged industrial environments, with features such as redundant power supply capabilities supporting wide voltage inputs from 9Vdc to 48Vdc. This is bolstered by its wide operating temperature of -40°C ~ 75°C, which ensures continuity of operation in industrial settings.

While durable and rugged, the ICS-6280 maintains excellent connectivity via its sophisticated and purpose-built I/O, with LAN Bypass and wireless network support, including expansion options to facilitate Wi-Fi and cellular network connections for excellent networking even in remote deployment scenarios. The most important element to be considered when building an industrial IoT network is security, particularly in the energy, oil and gas sectors. Therefore, the ICS-6280 insures against threats by incorporating physical security features such as an isolated COM port, alongside NGFW, redundant power supply, and UTM support to its mechanism.

The UEFI Forum today announced the release of the Unified Extensible Firmware Interface (UEFI) 2.10 specification and Advanced Configuration and Power Interface (ACPI) 6.5 specification. The new specification versions expand support for new processor types, memory interfaces and platform types, while allowing for crypto agility in post-quantum system security.

"We are excited to share the new Conformance Profiles feature, responsive to community pull for a way to make the UEFI Forum's work useful," said Mark Doran, UEFI Forum President. "The Conformance Profiles feature will expand the platform types UEFI can support to an ever wider range of platform types like IoT, embedded and automotive spaces - beyond general purpose computers."

Seeed Studio, a provider of AIoT Hardware Service Platform, today announced it has joined NVIDIA Metropolis, a partner program focused on bringing to market a new generation of vision AI applications. NVIDIA Metropolis nurtures a rich ecosystem and offers powerful developer tools to supercharge vision AI applications that are designed to make the world's most important spaces and operations safer and more efficient.

Seeed is a reseller of NVIDIA embedded systems and a member of the NVIDIA Jetson ecosystem for edge AI. The company offers NVIDIA Jetson module powered full system and carrier boards, integrating software into AI solutions spanning many industries. Offering a one-stop product experience, Seeed speeds time to market for customers by handling all licensing, integration, manufacturing, fulfillment, and distribution.

The LattePanda Team launched the world's thinnest pocket-sized hackable computer - LattePanda 3 Delta with global electronic components distributors. The collaboration will ensure that the product choice for LattePanda 3 Delta is passed on to customers through quick, easy online selection via the website of global electronic components distributors and LattePanda.

"LattePanda Team is so proud to cooperate with the global electronic components distributors for this joint launch. It delivers an exciting message to our customers that they can gain fast, easy access to our high-performance and hackable LattePanda 3 Delta anywhere in the world. Our collaboration will assure even higher levels of customer service," said Sandy Zhang, CMO of LattePanda Team.

Bringing new AI and robotics applications and products to market, or supporting existing ones, can be challenging for developers and enterprises. The NVIDIA Jetson AGX Orin 32 GB production module—available now—is here to help. Nearly three dozen technology providers in the NVIDIA Partner Network worldwide are offering commercially available products powered by the new module, which provides up to a 6x performance leap over the previous generation.

With a wide range of offerings from Jetson partners, developers can build and deploy feature-packed Orin-powered systems sporting cameras, sensors, software and connectivity suited for edge AI, robotics, AIoT and embedded applications. Production-ready systems with options for peripherals enable customers to tackle challenges in industries from manufacturing, retail and construction to agriculture, logistics, healthcare, smart cities, last-mile delivery and more.

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that its new package 100BGA LPDDR4/4X had achieved the JEDEC JED209-4 standard to ensure energy conservation and carbon reduction. The LPDDR4/4X is now available in a space-saving 100BGA package measuring only 7.5X10mm2. The device is ideal for IoT applications requiring higher throughput in a small package to allow designers to reduce the PCB size for more compact IoT designs.

Winbond's LPDDR4/4X memory is available in density of 1Gb and 2Gb, supporting speeds of up to 4267 Mbps. It is available in both Single-Die-Package (SDP) with a 2Gb density and Dual-Die-Package (DDP) with a 4Gb density. The higher speed of LPDDR4 1CH x16 4267 Mbps offers improved performance over previous DDR4 x16 3200 Mbps devices, which is especially useful for consumer applications.

Axiomtek - a world-renowned leader relentlessly devoted in the research, development and manufacture of series of innovative and reliable industrial computer products of high efficiency - is pleased to announce the IMB760, a server-grade extended ATX motherboard (330 mm x 305 mm) powered by the dual LGA4189 socket 3rd Gen Intel Xeon scalable processors (code name: Ice Lake-SP) with the Intel C627A chipset. It comes with an effective load balancing between two CPUs and multiple accelerator cards to stabilize computation loads and maximize computing power. Featuring optimized performance, more PCI Express Card slots, and high-density memory expansion, this EATX server motherboard enables high level computing, AI workload and deep learning for the data-fueled future.

"Performance, security, and flexibility are indispensable for AI in next-gen computing. As the first and flagship EATX motherboard of Axiomtek, the IMB760 features built-in AI and crypto acceleration functions as well as advanced security capabilities to meet the specific needs of automated manufacturing, robotics, image or video analytics, and other AIoT applications. This server-grade motherboard has sixteen DDR4-3200 RDIMM sockets with a memory capacity of up to 1 TB. Ready for the demands of massive data storage and high-speed data transmission, the industrial motherboard supports two NVMe SSD, one IPMI LAN, and two 10GbE LAN ports. Rich expansions with enough PCIe x16 slots and PCIe x8 slots for GPU acceleration, making IM760 a perfect solution for computationally intensive imaging, intelligent video analytics, and heavy workload processing," said Wayne Chung, the product manager of AIoT Team at Axiomtek.