Following its successful demonstration of a MIPI camera solution using the UP Squared Pro 7000 at Embedded World, AAEON have announced a MIPI Expansion Kit for the newly released third generation board. Equipped with the Intel Atom Processors x7000E Series, Intel Core i3-N305 Processor and Intel Processor N Series (formerly Alder Lake-N) and an FPC port supporting MIPI-CSI interface, the UP Squared Pro 7000 emphasizes AAEON's continued dedication to bringing the latest Intel technologies to a wider variety of platforms. One such platform is the LI-ADL-ADP-IMX415-MIPI-081H, a 4K MIPI Camera Module from leading intelligent embedded camera creator, Leopard Imaging Inc.

The company recently announced that the camera has been designed with full-function drivers to support the Intel Atom Processors x7000E Series, Intel Core i3-N305 Processor, and Intel Processor N Series (formerly Alder Lake-N), allowing users to take advantage of the peripheral Intel technologies that come with the processor platform, such as Intel UHD Graphics on a Windows 10 IoT Enterprise OS.

Samsung Electronics, a world leader in advanced semiconductor technology, today announced its first ultra-wideband (UWB) chipset, the Exynos Connect U100. With single-digit centimeter accuracy, the new UWB solution is optimized for use in mobile, automotive and Internet of Things (IoT) devices, offering precise distance and location information. Samsung also unveiled 'Exynos Connect', a new brand that consolidates its short-range wireless communication solutions, such as UWB, Bluetooth and Wi-Fi that are essential in facilitating an increasingly hyper-connected world.

"Our Exynos Connect U100 combines sophisticated ranging and positioning capabilities with strong security to enable hyper-connectivity between people and everyday objects, fueling a range of new applications in positioning and location tracking," said Joonsuk Kim, Executive Vice President of the Connectivity Development Team at Samsung Electronics. "Building on our technology leadership in communications technologies, we are committed to driving innovation in short-range communication solutions to transform the way we connect and relate to the world around us."

Intel has quietly canceled its Thunder Bay hybrid system-on-chip (SoC) that combines standard general-purpose CPU Cores and Movidius Vision Processing Unit (VPU) cores. Such chips were aimed at commercial and Internet-of-Things (IoT) applications that relied on computer vision acceleration and edge-computing applications. According to the latest report, it appears that Thunder Bay is canceled as Intel has released a set of patches that removed the Thunder Bay code from the Linux kernel.

Intel kept Thunder bay details well hidden and while earlier rumors pointed to a combination of Intel Xeon x86 CPU cores and Movidius VPU cores, the only Thunder Bay support in Linux patches where showing a combination of ARM Cortex-A53 low-power cores with the Movidius VPU. Intel acquired Movidius back in 2016 and while it is not something that Intel talks about often, there are several products based on Movidius VPUs, including Neural Compute Stick, Intel drones, the Intel RealSense Tracking Camera, and most recently, the Intel Movidius 3700VC VPU, formerly Keem Bay. In any case, it appears that Intel is abandoning an idea of combining general purpose x86 CPU cores and Movidius VPU cores.

Qualcomm Technologies, Inc. today announced the world's first integrated 5G IoT processors that are designed to support four major operating systems, in addition to two new robotics platforms, and an accelerator program for IoT ecosystem partners. These new innovations will empower manufacturers participating in the rapidly expanding world of devices at the connected intelligent edge.

The need for connected, intelligent, and autonomous devices is growing rapidly, and it is expected to hit $116 billion by 2030 according to Precedence Research. Businesses attempting to compete in this fast-moving economy need a reliable source of control and connectivity technology for their IoT and robotic devices. Qualcomm Technologies, which has shipped over 350 million dedicated IoT chipsets, is uniquely capable of providing manufacturers with the platforms needed to address this expanding segment.

DFI, the global provider of industrial computers, has introduced its ECX700-AL ruggedized x86 PC for outdoor edge computing applications. Its impeccable performance capabilities, compact size, and high durability make it the ideal solution for outdoor operations. The ECX700-AL is a rugged computer with a waterproof and dust-proof design to withstand harsh environments and any type of climate. Stable performance is ensured with its wide operating temperature of -40 to 70 degrees Celsius. It is also equipped with a smart vent that drains water automatically, preventing typical problems such as condensation within the system or excessive heat.

An external SIM slot provides convenience for users when changing SIM cards, and the high-gain antenna delivers a high-quality signal. Versatile I/O settings including a combo port that supports 2 CANs and 2 COMs as well as selective display ports (HDMI/VGA) help integrators meet demands for various applications.

MediaTek, a fabless semiconductor company powering two billion devices a year, and Kontron, a leading global provider of IoT and Embedded Computer Technology (ECT), today announced that Kontron is integrating MediaTek's Genio 1200 and Genio 700 chipsets into its new modules for IoT applications.

MediaTek Genio is a complete platform stack for IoT, offering brands powerful and efficient chipsets, open platform software development kits (SDK), and a developer portal with comprehensive resources and tools. Genio chipsets are ideal for a wide variety of commercial, industrial, and retail applications that require highly responsive processing, advanced multimedia support, and multi-tasking.

Kontron, a leading global provider of IoT/Embedded Computer Technology (ECT), will present an Mini-ITX motherboard based on Intel Core i3 processors as well as Intel N-series processors with latest UHD Gen12 graphics at embedded world 2023, thus expanding its product family of compact, power-saving motherboards "Designed and Made in Germany." The K3931-N Mini-ITX is available in four variants with different CPUs and is particularly suitable for use in the areas of casino gaming, digital signage, kiosk, POS/POI, ticketing as well as for applications in industrial and medical technology.

The Intel Core i3 and Intel N series processors set new standards for x86 processors in the power range from 6 W to 15 W. They use the same Efficient-cores and Intel UHD graphics as the 12th Gen Intel Core processors based on the Xe architecture. This makes it easier to port applications and solutions across Intel CPU performance and power ranges. Support for Intel AVX2 and Intel Deep Learning Boost - combined with up to 32 execution units - provides accelerated deep learning inference and media processing for diverse edge applications.

Phison Electronics, a global leader in NAND flash and storage solutions, announced today the launch of IMAGIN+, an upgraded platform offering R&D resource sharing and ASIC (Application-Specific Integrated Circuit) design services for NAND flash controllers, storage solutions, PMIC, and Redrivers/Retimers. The introduction of IMAGIN+ comes during the Embedded World Exhibition & Conference (March 14-16) in Nuremberg, a premier global event for the embedded community.

Phison's rejuvenated platform, bolstered by more than two decades of research and development expertise, empowers global partners and customers to create not just ASIC chips and NAND flash storage solutions but also to participate in the growth of a thriving ecosystem of emerging technologies. Phison understands that success in today's fast-paced market requires more than just providing NAND storage solutions; it requires the ability to influence and shape the industry through signal integrity and power management ICs, Compute Express Link and other value-added offerings.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is showcasing its latest lineup of Intel 12th / Elkhart Lake motherboards and Barebone systems at the Embedded World 2023 exhibition, currently underway from March 14th to 16th in Nuremberg, Germany. As the largest international trade fair for embedded systems, the exhibition attracts professionals and enthusiasts from various industries worldwide. BIOSTAR's product lineup includes six industrial motherboards - BIH11-AHB, EIB7B-AXI, BIH61-IHP, BIH60-IHP, BICMA-IHP, and BIELK-IHT - equipped with advanced features such as high-performance processing, support for multiple displays, and various connectivity options. These motherboards are ideal for applications in digital signage, medical, transportation, and other industries.

In addition to the motherboards, BIOSTAR is also showcasing six barebone systems, including the MP-J4125, MP-J6412, MT-J6412, MT-J6412 PRO, MS-J6412, and MS-N3160. These systems offer powerful performance, efficient energy consumption, and compact design, making them suitable for home entertainment, office productivity, AI, edge computing, and many more versatile applications.

ASUS IoT, the global AIoT solution provider, today announced PE6000G - the industry's first edge AI system that supports up to a 450 W GPU for high-throughput, demanding GPU-computing applications. Powered by a 12th Gen Intel Core processor and paired with the Intel R680E chipset, PE6000G supports up to 450 W graphics card power and is ready for the latest PCI Express (PCIe ) 5.0 standard, meeting requirements for enabling real-time AI inference at the edge.

Demand for high-performance GPU-accelerated solutions at the edge is increasing to satisfy mission-critical AI applications. Users who require rugged and durable systems to withstand shocks and vibration, plus wide-range operating temperatures to accommodate high GPU computing power, face the dilemma of finding solutions that provide the necessary specifications to meet physical space constraints, along with heat dissipation and power consumption within a rugged mechanical design. The all-new PE6000G series strikes a balance between all these needs for deployment in a variety of challenging environments.

NFC-based sensing controllers with energy-harvesting capabilities are critical for the development of passive smart devices that can operate with high accuracy, efficiency, and design convenience in a wide range of IoT applications. With the NGC1081, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its product portfolio of NFC tag-side controllers. The new IC is a single-chip solution that enables the IoT industry to develop low-cost, miniaturized, smart edge computing/sensing devices, maximizing the benefits for both end-users and manufacturers. Such devices can be controlled and powered by mobile phones, with potential applications ranging from medical patches and disposable point-of-case testers to data loggers, smart thermostats, and sensor inlays.

The tag-side controller supports a dual power supply function, allowing it to operate in a passive mode (battery-free) based on energy harvesting, or in a battery-powered mode, operating as a self-contained sensing node via a 3 to 3.3 V external power supply. In passive mode, the entire sensing system, including the IC and its connected sensors, can draw power via energy harvesting from the NFC field of a mobile phone. Together with its naturally galvanically isolated sensing interface, these features open up countless possibilities for creating many innovative sensing use cases that require no batteries and minimal maintenance. This is particularly useful for applications where the power supply needs to be galvanically isolated to meet the safety requirement.

DFI, the global leader in embedded solutions, today announced their latest PCSF51 next-generation 1.8" Single Board Computer at Embedded World 2023. The 1.8" SBC powered by the revolutionary AMD Ryzen Embedded R2000 Processor, the PCSF51 features advanced graphics processing and computing capabilities in a miniature form factor. Equipped with flexible expandability and I/O versatility, this energy-efficient SBC is tailored for use in industrial applications, robotics, edge computing, AI vision systems, and more.

"By leveraging the latest AMD Ryzen Embedded R2000 Processor, we have achieved many advantages for the tiny yet powerful PCSF51," said DFI President Alexander Su. "We have a positive outlook for future Industrial Pi innovations." Compared to its previous generation GHF51 with the AMD Ryzen R1000 Processor, the latest R2000 processor built into the PCSF51 delivers upgraded performance with double the max CPU core count, scalability up to four CPU cores and eight threads, and a 50% increase in CPU power. Graphics performance is boosted by 15% with up to eight graphic compute units. The design of the PCSF51 has also been enhanced from the previous GHF51, with an easier-to-use on board power/reset and HDMI, in addition to a thinner thermal module. With rich multimedia capabilities, it can support ultra-high-resolution displays in 4K resolution.

MSI is a top player in the ICT industry. With over 35 years of experience in R&D. By introducing AI systems, IoT, automation, and remote operations. Leveraging its many years of experience in ODM/OEM and its production capabilities, MSI delivers products that apply to smart transportation, smart cities, innovative automation, digital signage and intelligent retailing, offering top-quality, integrated solutions that best suit client needs. MSI commercial monitors offer crisp visuals and a range of features to enhance the computing experience.

MS-98M3 is the embedded 3.5" SBC that supports multiplexing with 11th generation Intel IOTG Core processor, codenamed Tiger Lake-UP3 series of ultra-low power and high-performance, providing reliability and high durability with lower power consumption, and actively deploy in multiple applications such as AMR-AI-PJ-UVGI Robot, which was verified by Texcell/France to effectively inactivate the new SARS-COV2 virus within seconds.

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced that it will present the first live demonstrations of artificial intelligence (AI) and machine learning (ML) implementations on an MCU based on the Arm Cortex -M85 processor. The demos will show the performance uplift in AI/ML applications made possible by the new Cortex-M85 core and Arm's Helium technology. They will take place in the Renesas stand - Hall 1, Stand 234 (1-234) at the embedded world 2023 Exhibition and Conference in Nuremburg, Germany from March 14-16.

At embedded world in 2022, Renesas became the first company to demonstrate working silicon based on the Arm Cortex-M85 processor. This year, Renesas is extending its leadership by showcasing the features of the new processor in demanding AI use cases. The first demonstration showcases a people detection application developed in collaboration with Plumerai, a leader in Vision AI, that identifies and tracks persons in the camera frame in varying lighting and environmental conditions. The compact and efficient TinyML models used in this application lead to low-cost and lower power AI solutions for a wide range of IoT implementations. The second demo showcases a motor control predictive maintenance use case with an AI-based unbalanced load detection application using Tensorflow Lite for Microcontrollers with CMSIS-NN.

Think Silicon, the leading provider of ultra-low-power GPU IP for embedded systems, will showcase its latest graphics and AI solutions for edge computing devices in Hall 4, Booth 476 at Embedded World 2023 taking place in Nuremberg, Germany from March 14-16. The solutions demonstrate how Think Silicon is meeting the complex needs of ultra-low-power graphics and AI applications in the wearables, smart home, industrial and automotive markets.

Think Silicon's booth will feature the industry's first RISC-V-based GPU - the NEOX IP Series. NEOX represents a new era of smart GPU architectures with programmable compute shaders, running on a real-time operating system (RTOS) and supported by lightweight graphics and machine learning programming frameworks. NEOX serves as a GPU platform addressing a wide variety of vertical markets, including next-generation ultra-low-power smartwatches, augmented reality (AR) eyewear, surveillance and entertainment video, and smart displays for point-of-sale/point-of-interaction terminals.

According to TrendForce's latest survey of the server market, many cloud service providers (CSPs) have begun large-scale investments in the kinds of equipment that support artificial intelligence (AI) technologies. This development is in response to the emergence of new applications such as self-driving cars, artificial intelligence of things (AIoT), and edge computing since 2018. TrendForce estimates that in 2022, AI servers that are equipped with general-purpose GPUs (GPGPUs) accounted for almost 1% of annual global server shipments. Moving into 2023, shipments of AI servers are projected to grow by 8% YoY thanks to ChatBot and similar applications generating demand across AI-related fields. Furthermore, shipments of AI servers are forecasted to increase at a CAGR of 10.8% from 2022 to 2026.

Simply NUC, Inc, a leading mini computer solutions company, today announced a new Simply NUC branded mini PC product family called Chapel Rock. The ultracompact long life mini PC is built for several use cases, from embedded units like kiosks and vending machines, to edge devices like security systems and sensor arrays. Chapel Rock brings the same reliability and customizability as its predecessor, Chimney Rock, with upgrades like dual 2.5Gb Ethernet and the all-new 12th Gen Intel Architecture. Simply NUC is currently taking orders on Chapel Rock with units expected to ship by the end of March.

"Since launching our long life NUC product line, our customers have successfully leveraged these mini PCs for an array of applications where longer development cycles are required for validation and certifications," said Aaron Rowsell, Simply NUC CEO, "and we're thrilled to extend our long life NUC offering with Chapel Rock."

Qualcomm Technologies' 6th generation modem-to-antenna solution is the first ready to support 5G Advanced, the next phase of 5G. It introduces a new architecture, a new software suite and includes numerous world's first features to push the boundaries of connectivity including coverage, latency, power efficiency and mobility. Snapdragon X75 technologies and innovations empower OEMs to create next generation experiences across segments including smartphones, mobile broadband, automotive, compute, industrial IoT, fixed wireless access and 5G private networks.

Snapdragon X75 is the first Modem-RF System with a dedicated hardware tensor accelerator, Qualcomm 5G AI Processor Gen 2, enabling over 2.5 times better AI performance compared to Gen 1 and introduces Qualcomm 5G AI Suite Gen 2 with new AI-powered optimizations to achieve better speeds, coverage, mobility, link robustness and location accuracy. The Qualcomm 5G AI Suite features advanced AI-based capabilities including world's first sensor-assisted mmWave beam management and AI-enhanced GNSS Location Gen 2, which uniquely optimize Snapdragon X75 for superior 5G performance.

Qualcomm Technologies, Inc. today announced Snapdragon X35 5G Modem-RF System, the world's first 5G NR-Light modem-RF system. NR-Light, a new class of 5G, fills the gap in between high-speed mobile broadband devices and extremely low-bandwidth NB-IoT devices. NR-Light devices, powered by Snapdragon X35, can be smaller, more cost-efficient, and provide longer battery life than traditional mobile broadband devices.

With its optimized design and breakthrough performance, Snapdragon X35 offers a device platform that bridges the complexity and capability gap between the extremes in 5G today and addresses the need for mid-tier use cases. This lower cost option provides device makers with a long-term migration path to replace LTE CAT4+ devices, ultimately increasing 5G adoption and allowing for faster transition to a unified 5G network.

Samsung Electronics today reported financial results for the fourth quarter and the fiscal year 2022. The Company posted KRW 70.46 trillion in consolidated revenue and KRW 4.31 trillion in operating profit in the quarter ended December 31, 2022. For the full year, it reported 302.23 trillion in annual revenue, a record high and KRW 43.38 trillion in operating profit.

The business environment deteriorated significantly in the fourth quarter due to weak demand amid a global economic slowdown. Earnings at the Memory Business decreased sharply as prices fell and customers continued to adjust inventory. The System LSI Business also saw a decline in earnings as sales of key products were weighed down by inventory adjustments in the industry. The Foundry Business posted a new record for quarterly revenue while profit increased year-on-year on the back of advanced node capacity expansion as well as customer base and application area diversification.

SUS IoT, the global AIoT solution provider, today announced PE3000G—the industry's first edge AI system to support Mobile PCI Express Module (MXM) GPUs from both NVIDIA and Intel. Specifically, the all-new industrial PC works seamlessly with NVIDIA Ampere/Turing or Intel Arc A-series MXM GPUs. Powered by a 12th Gen Intel Core processor and up to 64 GB of DDR5 4800 MHz memory, and combining a proven power design, guaranteed and fanless thermal performance, and superior physical and mechanical ruggedness, PE3000G brings unprecedented longevity, computing power, flexibility and reliability to AI computing at the edge—making it an ideal option for scenarios where resilience, longevity and both CPU and GPU scalability are paramount.

"PE3000G is ASUS IoT's response to the burgeoning demand for accelerating AI inference and extreme deployment in industrial settings," commented KuoWei Chao, General Manager of the ASUS IoT business unit. "With robust power, thermal and mechanical design, it pushes versatile edge-AI-inference applications to business-critical applications. PE3000G is an ideal fit to accelerate edge AI inference in SWaP-constrained applications, such as machine vision in factory automation, outdoor surveillance system and AI-inference systems for autonomous vehicles."

Powercast Corporation, the leader in radio-frequency (RF)-based over-the-air wireless power technology, has unveiled its Ubiquity transmitter, an ultra-low-cost RF power transmitter which was selected as a CES 2023 Innovation Award Honoree in three categories: Smart Home, Embedded Technologies and Sustainability, Eco-Design & Smart Energy.

Designed to be the industry's most economical RF wireless transmitter, Powercast has lowered the barrier to entry where RF wireless power can actually become ubiquitous with multiple RF transmitters covering every home. Ubiquity will be on display in Powercast's booth #52311 at the Venetian Expo in the Smart Home Marketplace during CES 2023 in Las Vegas, January 5 - 8, 2023.

Ahead of CES 2023, MediaTek today announced the latest chipset in the Genio platform for IoT devices, the octa-core Genio 700 designed for smart home, smart retail, and industrial IoT products. The new chipset will be featured as part of a demo at MediaTek's booth at CES 2023. With a focus on power efficiency, the MediaTek Genio 700 is a N6 (6 nm) IoT chipset that boasts two ARM A78 cores running at 2.2 GHz and six ARM A55 cores at 2.0 GHz while providing 4.0 TOPs AI accelerator. It comes with support for FHD 60p + 4K 60p display, as well as an ISP for better images.

"When we launched the Genio family of IoT products last year, we designed the platform with the scalability and development support that brands need, paving the way for opportunities to continue expanding," said Richard Lu, Vice President of MediaTek IoT Business Unit. "With a focus on industrial and smart home products, the Genio 700 is a perfect natural addition to the lineup to ensure we can provide the widest range of support possible to our customers."

Global market intelligence firm TrendForce reports that the revenue generation momentum of the global IC design industry slowed down in 3Q22. The main factors behind this development were the Russia-Ukraine military conflict, the recent COVID-19 lockdowns in China, the ongoing inflation, and clients undergoing inventory corrections. The total revenue of the global top 10 IC design houses came to US$37.38 billion for 3Q22, showing a QoQ decline of 5.3%. Qualcomm remained first place in the ranking of the global top 10 IC design houses by revenue for 3Q22. Broadcom returned to second place by overtaking NVIDIA and AMD, who slipped to third and fourth respectively due to weakening demand for PCs and cryptocurrency mining machines.

Regarding US-based IC design houses that were in the top 10 group for 3Q22, Qualcomm recorded a QoQ increase for the sales of smartphone SoCs and 5G modem chips. It also made gains in the automotive electronics market by expanding its collaborations with partners in the automotive industry. As a result, Qualcomm's 3Q22 revenue figures for mobile and automotive offerings reflected QoQ increases of 6.8% and 22.0% respectively. The revenue growth of these two major product categories offset the marginal decline in the revenue for RF front-end chips. Qualcomm's IC design revenue as a whole climbed up by 5.6% QoQ to US$9.90 billion for 3Q22. The company sat firmly at the top of the ranking.

Aetina, an edge AI solution provider that offers edge computing hardware and software for use in AI and IoT, has launched the first-ever MXM module that is powered by Hailo-8 AI inference processors. The ASIC-based MXM 3.1 module—AI-MXM-H84A—is designed for different AI applications, to boost their performance; the applications include automatic guided vehicles (AGVs) in logistics, virtual fence systems in manufacturing, as well as other kinds of autonomous machines and computer vision systems.

Aetina AI-MXM-H84A modules feature four Hailo-8 AI processors, providing up to 104 Tera-Operations Per Second (TOPS) AI performance with best-in-class power efficiency to speed up deployment of neural network (NN) and deep learning (DL) processes on edge devices by AI developers. The Hailo-8 AI accelerator allows edge devices to run DL applications at full scale with superb efficiency, effectiveness, and sustainability. Due to its small-sized form factor, the high-performance MXM 3.1 type B module can be easily integrated into a variety of embedded systems by developers and system integrators to handle heavy inference workloads with low latency.