There is now an Amazon Basics CPU air cooler that works with Intel Socket LGA1700 and AMD Socket AM5. Called simply the CPU Air Cooler (model: RR-H410-20PC-AS), it features a conventional aluminium fin-stack tower-type design, and uses four copper heatpipes that make direct contact with the CPU at the base. A 92 mm fan ventilates the cooler. This fan is RGB illuminated and includes a controller. The fan turns at speeds ranging between 600 to 2,000 RPM, pushing up to 34.73 CFM of airflow, and features a conventional rifle bearing.

The cooler itself measures 102 mm x 83.4 mm x 136 mm (WxDxH), and Amazon Basics claims that it can handle thermal loads of up to 200 W. Amazon Basics usually brings otherwise obscure white-box brands into the market under its marquee so customers with confidence in the Amazon brand can buy them. In this case, the retail giant roped in no less than Cooler Master as the OEM for this cooler. The cooler itself appears to be a rebadged version of the Hyper H410R RGB, but with updated retention modules to support the latest CPU socket types. Amazon Basics is pricing this at $28.47. You can catch a review at the source link.

Thermaltake today launched the ToughAir 710, a premium dual aluminium fin-stack CPU cooler. Measuring 148.6 mm x 146.6 mm x 165 mm (LxWxH), the TA710 is a massive, heavyweight category cooler (with its weight expected to be around the 1 kg-mark). The cooler features a U-type dual fin-stack design. Seven 6 mm-thick nickel-plated copper heatpipes make indirect contact with the CPU over a base of the same material, with their ends passing through the two fin-stacks. These are ventilated by a pair of 140 mm fans in push-pull configuration, with the second fan nested between the two stacks.

Each of the two included ToughFan 14 spinners turns at speeds of up to 1,400 RPM, pushing up to 81.96 CFM of airflow at 1.81 mm H₂O static pressure, and 23.9 dBA noise output. The fans are rated for 40,000 hours of use. Thermaltake rates the ToughAir 710 as being capable of handling thermal loads of 250 W. Among the CPU socket types supported are LGA1700, LGA2066, LGA1200, LGA115x, AM5, and AM4. The company didn't reveal pricing.

ASRock today introduced the Blazing M.2 Gen 5 Fan-Heatsink, an active cooling solution for M.2 Gen 5 SSDs, and meant to be paired with the company's Socket AM5 and LGA1700 motherboards that have Gen 5 M.2 slots. The cooler is a 5 cm-tall hunk of extruded aluminium with a 30 mm fan ventilating it at roughly 5 CFM. There are five types of these coolers, each suitable for a particular type of ASRock motherboards. These coolers have been out since December 2022 as inclusions in motherboards, however, ASRock released the types 3, 4, and 5 (from the table below) today. The cooler is said to significantly lower temperatures of SSD controllers, minimizing performance losses to thermal throttling. These coolers are expected to be priced around $30 a pop.

Motherboard major MSI has reportedly began scaling down production of its Socket LGA1700 motherboards with DDR4 memory slots, in favor of those with the newer DDR5 slots. The move is aimed at gradually weaning the market off DDR4. The company has issued product discontinuance notices for several of its Intel 600-series and 700-series chipset motherboards that have DDR4 slots. Among the rather recently-announced products on the chopping block are the MPG Z790 Edge WiFi DDR4, Pro Z790-A WiFi DDR4, Pro Z790-P DDR4, and the DDR4 version of the MAG B760M Mortar. Meanwhile, DDR5 memory prices are on the chill, with the cheapest 16 GB (2x 8 GB) kit being priced at $60, and the cheapest 32 GB (2x 16 GB) one at $97.

Server and workstation cooling solutions provider Dynatron unveiled the L35, a unique all-in-one liquid CPU cooler meant for 2U rackmount cases. The cooler features a 240 mm x 80 mm radiator, which relies on three 80 mm fans in a row for ventilation. The radiator itself is a chunky 44 mm-thick. The cooler uses a pump located at the radiator, while the thin water-block doesn't have any cables going to it, just the coolant tubes. Each of the three included 80 mm fans are data-center grade, turn at speeds of up to 8,000 RPM, pushing up to 115.61 CFM of airflow, at 64.4 dBA of noise output. Among the CPU socket types supported are Intel LGA2066, LGA1700, AMD AM5, and AM4. Dynatron claims that the cooler is capable of handling thermal loads of up to 250 W.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is thrilled to showcase the latest B760MZ-E PRO motherboard. The BIOSTAR B760MZ-E PRO motherboard is a versatile solution that meets diverse pro-user demands. Whether you are a professional creator seeking the hottest mid-range hardware on the market, a business professional requiring reliable and efficient computing power, or a casual user needing a seamless computing experience, the B760MZ-E PRO has you covered. Its cutting-edge technology, advanced DDR5 memory support, lightning-fast transfer speeds, and connectivity options make it the ultimate choice for those seeking a high-performance motherboard that can handle anything thrown its way.

Built on Intel's B760 single-chip architecture, The BIOSTAR B760MZ-E PRO motherboard supports the latest 12th/ 13th Generation Intel Core Processors, providing robust and stable performance for demanding applications. Its 4-DIMM DDR5 memory support and PCIe M.2 4.0 (64 Gb/s) lightning-fast transfer speeds offer unrivaled computing and file transfer efficiency. Ideal for content designers, business professionals, and casual users seeking the best-performance motherboard of this range.

The leading global motherboard, graphics card, and small form factor PC manufacturer, ASRock, proudly announces its new Mini PC Jupiter 600 series including Jupiter H610 and B660 two models. Jupiter 600 series features the flexibility and expandability in a compact size suited to a wide range of applications such as office, retail, healthcare, transportation and industry.

With support for the latest 13th and 12th Gen Intel Core processors (LGA1700) up to 65 watts, DDR4 3200 MHz memory, the Jupiter 600 series delivers desktop-grade performance for commercial usage. Support up to three-storage design including one M.2 PCIe Gen 4x4 SSD, one M.2 PCIe Gen 3x4 SSD, and one 2.5-inch HDD to provide fast data transfer speed and high capacity storage.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is proud to announce the launch of four brand new motherboards - B760MZ-E PRO, B760MX2-E D4, B760MX2-E, and B760MX-E D4. These motherboards are tailored to meet the needs of a variety of target audiences, from content creators to home entertainment enthusiasts.

The B760MZ-E PRO motherboard is specifically designed for content creators who require a powerful and efficient system for photo and footage editing. This motherboard features the latest Intel B760 chipset and supports 12th/ 13th Generation Intel Core Processors. It supports DDR5 memory and PCIe 4.0, making it one of the advanced motherboards on the market. It also features 2.5 GbE LAN, Wi-Fi 6E module support for faster data transfer and connectivity. The B760MZ-E PRO also has a sleek design with LED ROCK ZONE and VIVID LED DJ RGB lighting, making it a stylish addition to any setup.

Jonsbo today released the HX5230, a mid-range tower-type CPU cooler. The cooler features an all-black tower-type design, Five 6 mm-thick nickel-plated copper heatpipes make indirect contact with the processor over a mirror-finish copper base, conveying heat through the anodized aluminium fin-stack, which is ventilated by a 120 mm fan. The fin-stack is capped by a die-cast aluminium top-plate that has a premium brushed-metal appearance. The included fan features a fluid-dynamic bearing, takes in 4-pin PWM input, and turns at speeds ranging between 700 to 1,800 RPM, pushing up to 83.04 CFM of airflow, at up to 2.68 mm H₂O static pressure, and up to 37.6 dBA noise output. Jonsbo claims that the HX5230 can handle thermal loads of up to 230 W. With its fan in place, the cooler measures 128 mm x 75 mm x 158 mm (WxDxH), weighing 704 g. Among the socket types supported are LGA1700, AM5, AM4, and LGA1200. The company didn't reveal pricing.

Jonsbo today unveiled the HP400S-New, a top-flow, low-profile CPU cooler with a claimed thermal capacity of 140 W, and with a height of just 40 mm. A major revision of the HP400S from February 2022, the "-New" revision uses a thicker fin-stack and a faster fan. The cooler uses a dense aluminium fin-stack heatsink with a C-type design. Four 6 mm-thick nickel-plated copper heatpipes make direct contact with the CPU at the base, conveying heat to an aluminium fin-stack arranged along the plane of the motherboard. This is then ventilated by a 15 mm-thick 90 mm fan that turns between 900—3,000 RPM, with 12.59—38.18 CFM of airflow, and 20.2—34 dBA noise output. With the fan in place, the cooler measures all of 103 mm x 92 mm x 40 mm, weighing 350 g. Among the CPU socket types supported are LGA1700, AM5, AM4, LGA1200, and LGA115x.

Colorful Technology Company Limited, a world-renowned manufacturer of desktop components, laptops, desktops, AIO PCs, and storage, launches the B760 Series motherboards for the 13th Gen and 12th Gen Intel Core processors. The Intel B760 Series motherboards are ideal gaming and content creation with DDR5 and DDR4 memory support depending on model.

COLORFUL introduces the CVN B760M FROZEN WIFI D5 and CVN B760I FROZEN WIFI motherboards for gamers and enthusiasts. Coming in a compact micro-ATX and Mini-ITX form factors, both motherboards feature PCIe 5.0 x16 slot to support the latest high-end graphics cards. The CVN B760 motherboards also come with Wi-Fi 6, three PCIe 4.0 M.2 slots for the CVN B760M FROZEN WIFI D5 and two PCIe 4.0 M.2 slots for the CVN B760I FROZEN WIFI Mini-ITX motherboard. COLORFUL also presents the BATTLE-AX B760M-F PRO motherboard with DDR4 memory support and two PCIe 4.0 M.2 slots.

The Intel Ethernet i226-V onboard 2.5 GbE controller appears to have a design flaw that causes the Ethernet connection to drop at random times for a few seconds. The I226-V is the latest version of Intel's cost-effective 2.5 Gbps Ethernet networking chips meant for PC motherboards with chipsets that have integrated MACs (i.e. Intel chipsets). It succeeds the I225-V, which was Intel's first consumer 2.5 GbE PHY. The I225-V was plagued by various issues that caused it to be unstable at 2.5 Gbps (but could be worked around by forcing 1 GbE mode). Many premium Intel 700-series chipset Socket LGA1700 motherboards integrate the new I226-V, which is the I225's successor, as their default onboard 2.5 GbE controller. Some enthusiast-segment motherboards have a second Ethernet controller that's either of a different brand (such as Realtek or Marvell), or a different kind of wired Ethernet (such as 10 GbE).

Since mid-December, users of Intel 700-series chipset motherboards (which debut the I226-V), have been reporting random connections drops to Intel's Support Community, Microsoft, ASUS and Reddit 1, 2, 3, 4, 5. These drops are momentary, last a few seconds, and you'll mostly not notice it; however for applications that need an uninterrupted connection (such as online gaming, video conferencing, VPN, Remote Desktop etc.), such a link drop will be noticeable. You can check if you are affected by opening Windows Event Viewer, navigate to "Windows Logs," "System" and search for "e2fnexpress," in particular Event 27 "Intel Ethernet Controller I226-V, Network link is disconnected." and Event 32 "Intel Ethernet Controller I226-V. Network link has been established at 1 Gbps full duplex." We've experienced the issue in our labs. We tried updating to the latest 27.8 drivers from Intel, and used the latest motherboard BIOS, at 1 Gbps speed, but the issue couldn't be fixed reliably. In the end, we just switched over to the motherboard's second network interface, which is not an Intel NIC, and the issue went away. Another option could be to buy a cheap PCI-Express network card or use the board's integrated Wi-Fi. Still, such issues aren't acceptable, especially not from a world-leading manufacturer like Intel, who once was reputed for the quality of its networking equipment. Intel and its motherboard partners need to get on top of this issue.Update Mar 1st: Intel has issued a Windows workaround and patch for these issues. Let us know if this fixes it for you.

Update Mar 4th: User @lovingbenji reports that on his system this new driver version does not fix the disconnect issue.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is delighted to announce the brand new B760M-SILVER motherboard. Constructed around the INTEL LGA1700 socket, which supports 12th / 13th Generation Intel Core processors, the B760M-SILVER carries BIOSTAR's RACING pedigree, with visual flair and innovative features strategically picked to enhance the user's overall experience.

The B760M-SILVER features the MicroATX form factor, which makes it ideal for space and cost-conscious applications, coupled with the BIOSTAR-certified 10+1+1 Phase / 70 A power delivery solution great for gaming and entertainment builds. It comes further equipped with BIOSTAR's DIGITAL PWM technology, which provides exceptionally precise power delivery across all its components.

EK, the premium liquid cooling gear manufacturer, is releasing the EK-Quantum Velocity² ILM Replacement - 1700, a product that replaces the motherboard's Integrated Loading Mechanism (ILM) with a frame that bolsters the structural rigidity of the socket, motherboard, and even the CPU. It is used for cooling 12th and 13th generation Intel Core CPUs with regular EK-Quantum Vector² CPU water blocks, not Direct Die models.

Due to the rectangular and elongated design of these CPUs and the way the stock ILM holds the CPU down, the Intel 12th and 13th-gen CPUs are prone to warping caused by uneven pressure. The new contact frame from EK mitigates this issue as it prevents any warping or bending of the CPU and its surrounding area. This improves the cooling efficiency due to more even pressure applied on the CPU. As a result, the bending is removed and the CPU's center that contains the heat source is no longer concave, enabling improved contact with the cooler.

At the 2023 International CES, Cooler Master showed off a unique all-in-one liquid closed-loop CPU cooler that features user-replaceable pump-block covers, the MasterLiquid Atmos. The top cover of the pump-block comes off, so you can replace it with something with a different shape or color. Examples of these covers include a frosty-white cover made of recycled plastic resin, or a tinted acrylic diffuser. Underneath is a white silicone diffuser for an ARGB lighting element. The lighting extends to the included Cooler Master Sickleflow ARGB fans.

The MasterLiquid Atmos model shown at CES was the ML360 Atmos, featuring a 360 mm x 120 mm radiator with a trio of Sickleflow ARGB fans. These fans come pre-installed on the radiator, to minimize packaging waste. The ML360 Atmos uses a dual-chamber pump-block, which features CM's Gen 2 ARGB lighting. The company didn't go into the technical details of the fan, but mentioned its top speed to be 2,400 RPM. The MasterLiquid Atmos series comes in two variants, 240 mm and 360 mm. Among the CPU socket types supported are LGA1700, LGA1200, AM5, and AM4.

The Cooler Master Hyper 212 series over the years has become synonymous with aftermarket CPU cooling, as possibly the most popular custom CPU cooler. The company modernized it over the years with new heatsink and fan technologies, and it's has undergone a major design- and tech overhaul with the new Hyper 212 Halo. It retains the conventional aluminium fin-stack (type-U) design, with four 6 mm-thick copper heatpipes making direct contact with the CPU at the base, conveying heat to an aluminium fin-stack heatsink that's been capped off with a die-cast aluminium top-plate. The included 120 mm Halo fan features rifle-bearings rated for over 160,000 hours, and features two sets of addressable-RGB LEDs—along the bore of the fan-frame, and the impeller hub. The fan turns at speeds ranging between 650 to 2,050 RPM, pushing up to 51.88 CFM of airflow at 2.89 mm H₂O static-pressure, and 27 dBA maximum noise output. As part of its design modernization, the Hyper 212 Halo gets support for the latest Sockets LGA1700 and AM5.

EK, the premium liquid cooling hardware manufacturer, is launching the Direct Die product series aimed at delidding and achieving the ultimate cooling of the LGA 1700 socket-based Intel CPUs from the 12th generation Alder Lake and 13th gen Raptor Lake families. Kitguru teamed up with EK to investigate the potential benefits of direct die cooling for Intel's Alder Lake CPUs to achieve the best possible thermal performance on a daily basis. After publishing the first video announcing this collaboration, EK was overwhelmed by the response from Kitguru's audience. In order to bring these products to market, EK reached out to Der8auer, a renowned expert in delidding and direct die applications.

EK has prepared a total of four products to start this Direct Die series: two CPU water blocks (one Limited Edition), a delidding tool, and an upgrade kit for existing EK-Quantum Vector² LGA1700 water blocks. So far, these products are aimed at Intel's LGA1700 socket and 12th and 13th-generation Intel Core CPUs. Delidding is the process of removing the integrated heatspreader (IHS) to reduce the distance between the CPU core die and the coldplate of the CPU cooler. Another benefit involves the removal of an entire layer of thermal transfer from the CPU die to the IHS. The delidding process enables a direct heat transfer from the CPU core to the water block. All this results in a significant reduction in overall thermals and less thermal difference between CPU cores. The procedure is typically performed by experienced enthusiasts because it involves a physical modification of the product that voids the CPU warranty. For a more in-depth explanation, please refer to this EK's blog post on delidding.

At the 2023 International CES, Cooler Master showed off two of its latest premium dual fin-stack (type-D) air CPU coolers, the MasterAir MA826 Stealth, and the Hyper 662 Halo. The MA826 Stealth is, unsurprisingly, the more upmarket of the two, and measures 162.2 mm x 150.6 mm x 165.6 mm (LxWxH). A nickel-plated copper base makes contact with the processor. From here eight 6 mm-thick composite-material "superconductive" heatpipes make their way to two aluminium fin-stacks, which are then ventilated by two Mobius series fans—a 120 mm "push" fan, and a 135 mm conveyor fan located between the two fin-stacks. The two stacks are capped off by a die-cast aluminium top-plate. Both fans feature loop dynamic bearings that are rated for over 200,000 hours operation.

The Hyper 662 Halo leads the company's immensely popular Hyper series that's synonymous with aftermarket CPU cooling. This cooler comes in all-white and all-black trims, and is visibly smaller than the MA826 Stealth. It features the same nickel-plated copper base, but with six heatpipes making their way to the two fin-stacks, and a pair of 120 mm fans handling the ventilation. The fans feature two ARGB LED zones (along the bore of the frame and inside the impeller hub), which is where the Holo name derives from. Both coolers support the latest CPU socket types, including LGA1700 and AM5.

Cooler Master is working with Intel to bring TEC cooling back to the PC mainstream under an Intel-designed standard. Back in the 2010s, the professional overclocking scene was pervaded with various sub-zero cooling methods including liquid-nitrogen or dry-ice evaporators, refrigerated cooling solutions, and an exotic technology called TEC (thermoelectric couple). A TEC based cooler relies on the Peltier Effect, where high-voltage is passed through a TEC plate that has a cool side, and a hot side. The cool side makes contact with the processor/GPU through a base-plate, whereas the hot side is cooled by a liquid-cooling loop. The net result would be that the cool side ends up considerably bringing down temperatures, sometimes even below 0°C. The only drawback for TEC solutions were the need for liquid cooling (for the hot side), and that the TEC mechanism itself is very power-hungry.

The new MasterLiquid ML360 Sub-Zero Evo AIO implements the Intel Cryo Cooling Technology specification that blends TEC technology with a user-friendly all-in-one, closed loop liquid cooling solution. The TEC contributes to the cooling by bringing down CPU temperatures to low-double digits, while the AIO CLC handles the hot-side of the TEC. This part of the cooler uses Cooler Master's most advanced pump-block, and a 360 mm x 120 mm radiator with a trio of the company's high static-pressure Mobius series fans. The cooler is designed for Intel Socket LGA1700. In the pictures below, you see the ML360 Sub-Zero Evo, with its four key components as per the Intel specification: the radiator, the condensation controller, the block (with the TEC), and the pump.

Wizmax by Micronics introduced a handful new CPU coolers and purpose-build heatsinks at the 2023 International CES. The CPU cooler lineup is led by the MA Frigate series. The MA4 Frigate, a thick single aluminium fin-stack tower-type cooler. Five 6 mm-thick copper heatpipes make direct contact with the CPU at the base, conveying heat through a thick aluminium fin-stack, which is ventilated by a custom-design 130 mm fan. With this fan in place, the cooler measures 132 mm x 95 mm x 156.4 mm (WxDxH), weighing 990 g. The fan turns at speeds of up to 1,500 RPM, pushing up to 71.7 CFM of airflow at 1.9 mm H₂O static-pressure. The MA4 Frigate is rated for handling thermal loads of up to 210 W.

The Wizmax MA6 Frigate is the larger sibling, with a type-D dual fin-stack design. Six 6 mm-thick nickel-plated copper heatpipes make indirect contact with the CPU through a copper base, conveying heat to two fin-stacks, which are ventilated by a pair of 140 mm fans in push-pull arrangement. One-third of the fins in the two fin-stacks are made of copper, and the rest aluminium. Each of the two 140 mm fans turns at speeds of up to 1,500 RPM, pushing up to 83 CFM of airflow at 2.2 mm H₂O. With the fans in place, the cooler measures 146 mm x 165 mm x 165 mm (WxDxH), weighing 1.6 kg. The MA6 Frigate is rated for 250 W thermal loads. Both coolers support the latest CPU socket types, including AM5 and LGA1700.

GIGABYTE displayed their latest motherboards and graphics cards at the 2023 International CES, covering their Socket LGA1700 Intel 700-series chipset; and Socket AM5 AMD 600-series chipset. The Z790 AORUS Tachyon is the company's top-grade LGA1700 motherboard targeting the professional overclocking crowd. The board is designed to chase down CPU and memory overclocking world records, featuring the company's most powerful CPU VRM solution, and a 1 DIMM-per-channel DDR5 memory setup that preferred by overclockers for supporting the highest memory overclocks with the tightest timings. There are several overclocker-friendly features besides the onboard buttons—dual-BIOS ROMs, angled connectors for bench cases, consolidated voltage measurement points, and a feature-packed BIOS setup program.

Over in the AMD side, GIGABYTE's top Socket AM5 motherboard is the X670E AORUS Xtreme, which is a feature-packed motherboard with possibly the strongest CPU VRM solutions in the market for Ryzen 7000 processors, and with the best VRM cooling. In addition to the PCIe Gen 5 M.2 slot wired to the AM5 SoC, you get additional Gen 5 slots that subtract from the x16 PEG slot. The AORUS Xtreme also has the most feature-rich BIOS available among GIGABYTE's AM5 lineup. The B650I AORUS Ultra is a premium Mini-ITX Socket AM5 motherboard based on the AMD B650 chipset. Despite its compact size, it gives you a PCI-Express 4.0 x16 PEG slot, a Gen 5 M.2 slot, and two additional Gen 4 M.2 slots, besides the latest wired- and wireless connectivity. We also snapped the B650 AERO G motherboard targeting creators, and the mainstream B650 AORUS Elite AX.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is excited to announce the brand new B760A-SILVER motherboard. Constructed around the Intel LGA1700 Socket, which supports both 12th and 13th-generation Intel processors, the B760A-SILVER motherboard is a jack of all trades, highly suitable for gamers and content creators who look for the most advanced features with a tolerable price tag.

Based on BIOSTAR's globally acclaimed RACING DNA, it offers efficient, reliable functionality typically found only on top-shelf motherboard offerings from market competitors. Signature RGB features, including the RGB ROCK ZONE, give any build a new level of depth and futuristic appeal that complements any color, style, or theme. The B760A-SILVER motherboard supports dual-channel DDR5 memory powered by advanced features like support for both AMD and Intel XMP RAM modules designed to facilitate unparalleled hardware acceleration and performance.

Leading global motherboard manufacturer, ASRock, proudly announces its new series of Intel B760 motherboards, including B760M Steel Legend WiFi, B760M Pro RS, and special edition B760M PG SONIC WiFi. These feature-filled motherboards are designed to bring supreme performance and the latest technologies - including up to PCI-Express 5.0 & overclocked DDR5 - to benefit more PC enthusiasts, gamers, and office/workstation builds than ever before. The B760 chipset is designed for the latest 13th Generation Intel Core 'K' or 'non-K' series processors (socket LGA1700), while also supporting the previous 12th generation.

Followed by the success and critical acclaim of the ASRock Z790 PG SONIC, the company has released another officially licensed motherboard featuring SEGA's Sonic the Hedgehog: the B760M PG SONIC WiFi. Based on the mainstream Intel B760 chipset, this micro ATX motherboard features all the exciting SONIC elements in a small form factor and budget friendly design.

Intel today expanded its 13th Gen Core "Raptor Lake" Socket LGA1700 desktop processor family with several new 65 W mainstream models. These include all the SKUs that lack an unlocked multiplier, aren't meant for CPU overclocking, and come with slightly lower frequencies and tighter power-management than the unlocked K-series SKUs the company debuted the series with in 2022. The retail packages of these processors include stock Intel fan-heatsinks similar to those the company includes with its 12th Gen "Alder Lake" 65 W processors.

The series is led by the Core i9-13900, an 8P+16E core processor with P-core base frequency of 2.00 GHz, P-core maximum boost frequency of 5.60 GHz, E-core base frequency of 1.50 GHz and 4.20 GHz; and the full 36 MB of L3 cache available on the silicon. The processor base power value is 65 W, and the maximum turbo power is 219 W. Intel lists the MSRP of these processors at $550, a variant without integrated graphics, the i9-13900F, can be had for $524. The Core i7-13700 positioned a notch below, is an 8P+8E processor, with a P-core boost frequency of up to 5.20 GHz, a slightly better 2.10 GHz E-core boost, 30 MB of L3 cache, and the same 219 W MTP value. The i7-13700 is priced at $384, and the iGPU-disabled.

Intel's 2023 roadmap for the desktop processor segment sees the company flesh out its 13th Gen Core "Raptor Lake" desktop family with 65 W (locked) SKUs, and the new i9-13900KS flagship; followed by a new lineup of processors under the "Raptor Lake Refresh" family, due for Q3-2023, with no mentions of a desktop "Meteor Lake" processor in the year. It turns out that "Raptor Lake Refresh" is being designed to fill in for these (i.e. there won't be any "Meteor Lake" desktop chips). This, according to OneRaichu, a reliable source with Intel leaks.

"Meteor Lake" is Intel's first client processor to fully incorporate the company's IDM 2.0 product development strategy of disintegrating the processor into multiple chiplets built on various foundry nodes based on design needs; and combining them onto a single package with a high-performance interconnect. "Meteor Lake" has just one problem and that is CPU core-counts, with rumors pointing to 6P+16E (6 performance cores + 16 efficiency cores) being the maximum core-count possible, something Intel probably feels won't be competitive in the desktop segment against AMD, which will probably have a lineup of "Zen 4" X3D processors out by Q3-2023, with up to 16 P-cores. The company will, however, give "Meteor Lake" a sizable launch in the various mobile segments.