DeepCool, a global brand and manufacturer of computer hardware and peripherals for enthusiasts, today announced that it will provide free-of-charge mountings kits for Intel's upcoming LGA1700 platform, enabling customers to continue using their existing DeepCool CPU coolers on the new 12th generation Intel Core CPUs (Alder Lake S). Additionally, current and future DeepCool coolers will also include the new mounting hardware.

Intel's new CPU will follow a new hybrid architecture that will be more powerful than previous generations through the use of high-performing, efficient cores. This new architecture will have a direct impact on the appearance of the CPU, as Alder Lake features an additional 500 contacts compared to its predecessors (i.e., 1200 to 1700); as a result, the socket had to be greatly enlarged.

GIGABYTE's AERO line of motherboards and notebooks target creators who like to game. The company is ready with a premium motherboard based on the Intel Z690 chipset, the Z690 AERO D. This has to be the prettiest looking motherboard we've come across in a long time, and it appears to have the chops to match this beauty. The Socket LGA1700 motherboard uses large ridged-aluminium heatsinks over the chipset, M.2 NVMe slots, and a portion of the rear I/O shroud. Aluminium fin-stack heatsinks fed by heat-pipes, cool the CPU VRM. You get two PCI-Express 5.0 x16 slots (x8/x8 with both populated). As an AERO series product, the board is expected to be loaded with connectivity relevant to content creators, although the box is missing a Thunderbolt logo. We expect at least 20 Gbps USB 3.2x2 ports, and 10 GbE networking, Wi-Fi 6E.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced a new PRO generation of performance custom cooling CPU water blocks in the award-winning Hydro X Series: the XC5 RGB PRO and XC7 RGB PRO. Equipped with more than 110 high-efficiency micro-cooling fins and an innovative quad-split flow design, these new water blocks deliver extraordinary cooling paired with vibrant RGB lighting at the heart of your loop. With compatibility across the entire range of modern CPUs from Intel and AMD, including the upcoming Intel LGA 1700 socket, the Hydro X Series delivers the cooling you need to help your next stunning PC build run at its full potential.

Thanks to new precision-machined copper cold plates and a quad-split flow design with multiple inlet channels, the XC5 RGB PRO and XC7 RGB PRO achieve fantastic cooling performance, up to 4°C lower than their previous generation counterparts. Their durable construction with reinforced standard G1/4" threads will keep your CPU running at its best for years to come.

ARCTIC, one of the leading manufacturers of low-noise PC coolers and components, has added the powerful Liquid Freezer II 280 and Liquid Freezer 420 RGB and A-RGB models to its award-winning AIO range. The multi-compatible water coolers are also equipped for Intel's new Alder Lake CPUs with LGA1700 sockets. With the efficient PWM-controlled pump, featuring a VRM fan for additional cooling in the socket area, as well as the proven 140 mm P-fans, achieving high static pressure with very low noise, the ARCTIC Liquid Freezer II series clearly sets itself apart from other AIOs and offers plenty of overclocking flexibility.

A maintenance-free water circuit and the integrated cable management, which hides the PWM and RGB cables in the hose sleeves, plus a six-year manufacturer's warranty underline the high quality and complete the attractive price-performance ratio of the Liquid Freezer II range. The color-capable, effective LED lighting of the fans makes these high-performance coolers the ideal choice for gaming PCs. Optionally, the Liquid Freezer II 280 RGB and Liquid Freezer 420 RGB are also available in a bundle with Arctic's software-controlled RGB controller.

Corsair on Wednesday tweeted the first picture of its production Vengeance DDR5 memory modules. The picture reveals a simple, minimalist design, with a sheet-metal heatspreader design with some printed graphic, and the new Vengeance logo. Unlike the Vengeance DDR4 generation, there don't appear to be false "finnage" toward the top of the module. Since DDR5 will be coexisting with DDR4 to at least the next couple of years as Intel is getting its motherboard partners to come out with a substantive lineup of LGA1700 motherboards with DDR4 memory slots, Corsair made sure to mention "DDR5" right on the module. Corsair also revealed that it is developing the first Dominator-branded DDR5 memory, which will possibly come out with the first Intel 12th Gen Core processors.

BIOSTAR over the weekend teased two of its top Socket LGA1700 motherboards based on the Intel Z690 chipset, under the Valkyrie and Racing brands. The outline drawing does precious more than to highlight the combination of the VRM heatsink and rear I/O shroud for both models. Outlines in the background clearly highlight the lengthy LGA1700 socket, an elaborate CPU VRM setup that pulls power from two 8-pin EPS connectors, an unremarkable chipset heatsink that extends into a combi-heatsink covering the M.2 slots. BIOSTAR is expected to launch these two alongside the first wave of 12th Gen Core processors.

Phanteks today announced that it will be offering free mounting kits for Intel LGA1700 platform to existing Glacier One All-In-One Liquid CPU coolers' customers free of charge, allowing customers to use their current CPU/AIO coolers with the new 12th generation Intel Core CPUs.

The new LGA1700 mounting kit will be available free-of-charge via Phanteks' Customer Support once LGA 1700 motherboards are sold. Customers will need to send proof of purchase of Phanteks' Glacier One AIO Liquid Coolers and either an LGA1700 CPU or an LGA1700 motherboards will be required.

be quiet!, the German manufacturer for premium PC components, ensures that its CPU coolers remain compatible with the latest CPU sockets. Therefore, the company will be offering a free upgrade kit for the upcoming Intel LGA1700 socket. In the course of 2022, all compatible coolers will include the new mounting material by default.

By showing a proof of purchase of an Alder-Lake-S CPU or an LGA1700 mainboard as well as a compatible be quiet! cooler, customers will receive the conversion kit free of charge from be quiet!. An order form will be available on the be quiet! website at the launch of the new processor generation. In addition, there is the possibility to purchase the assembly kits for a small nominal fee.

The market launch of the Intel Alder Lake series is expected soon. Along with the new CPUs, Intel is also introducing the new LGA1700- socket with changed hole spacing on the motherboard as well as changes in CPU cooler mounting height. Starting in mid-October, ARCTIC will provide mounting kits for all Freezer 34 models, the entire Liquid Freezer II series, the Freezer 50 as well as Freezer i13 X and Freezer i13 X CO. Replacing the mounting parts will enable our customers to use their ARCTIC coolers with the new Intel processors. In the future, most of the current CPU coolers will be delivered with the mounting set for the Intel 1700 socket.

The mounting sets will be available in the ARCTIC web shop for a service fee of 5,99€, and customers will receive the set completely free of charge upon presentation of a corresponding processor purchase receipt. ARCTIC will soon launch a new CPU air cooler with Alder Lake compatibility from the factory - the i35 A-RGB. The launch of the new Intel cooler with addressable RGB is expected at the end of October.

Here's the first picture of Intel's upcoming mainstream desktop processor socket, the LGA1700, which was until now only seen in renders or technical drawings. The socket is characterized by a more rectangular contact pad than previous Intel sockets. The Socket H family (LGA115x and LGA1200) that ruled Intel MSDT sockets for over a decade, has a largely square pad. Intel's HEDT sockets such as the LGA1366, LGA2011 and LGA2066, on the other hand, had a rectangular pad, though not as pronounced (slender) as the LGA1700.

From the looks of it, the retention mechanism of the LGA1700 appears similar to that of Socket H and most other Intel LGA sockets (though dissimilar from the LGA2011/LGA2066). In its client desktop avatar, the LGA1700 has 100 unused pins. This is because the socket is physically identical to the LGA1800, which is speculated to be left for future generations of Intel processors with additional power or I/O pins. The Z-height of LGA1700 is lower than that of Socket H, which entails a major change in the retention module design of most aftermarket CPU cooling solutions.

With its new Socket LGA1700 heralding the first change in the physical dimensions of the processor's integrated heatspreader (IHS), Intel will introduce the first major redesign of its boxed retail stock cooling solution in over a decade. The Socket H-series (LGA115x/LGA1200) stock fan-heatsink has undergone several minor redesigns over the years, with regards to heatsink mass, the presence or absence of a copper core, the spiral or radial orientation of the aluminium heatsink forks (which affect surface-area and mass); although with what we're seeing in leaked Intel slides, the company's next stock coolers could look significantly different.

The Intel Laminar L-series fan-heatsinks come in three distinct variants based on the TDP of the processor they're bundled with. The Laminar RH1 (H equals "high") could be bundled exclusively with Core i9 SKUs that have 65 W TDP on the box, but have PL2 values well above 200 W. The Laminar RM1 (M equals "mainstream" or "medium"), will be bundled with Core i7, Core i5, and Core i3 SKUs that have the same 65 W TDP, but slightly lower PL2 (or at least a trade-off for higher noise). The Laminar RS1 (S equals "small"), targets entry-level Pentium and Celeron chips.

The Gigabyte Z690 AORUS MASTER and Gigabyte Z690 AORUS ELITE AX motherboards have recently been listed for sale at an Australian retailer. The LGA1700 motherboards will support Intel's upcoming Alder Lake 12th Generation Core series processors which are expected to launch in November. The motherboards were listed for 768.90 AUD and 438.90 AUD which equates to 572 USD and 327 USD respectively. These prices are approximately 10% more than their equivalent Z590 versions which should provide a good indication of general pricing for all upcoming Z690 motherboards.

The listings state that the Gigabyte Z690 AORUS MASTER will feature DDR4 memory compatibility which may be a mistake as manufacturers have announced that some high-end boards will be offered with DDR5 support. The motherboards will likely be some of the first consumer boards to support PCIe 5.0 which will enable faster storage with supported drives. These motherboards should be available to purchase in the coming months when Intel officially launches their 12th Gen Core series processors and Z690 chipset.

The top Intel 12th Gen Core "Alder Lake-S" 8+8 (P+E) cores processor will cost 741€ including taxes, according to a leaked document revealing retail channel prices of various upcoming 12th Gen Core desktop processors. It also speaks of the i9-12900KF, the "almost-flagship" part that comes with a disabled iGPU, going for up to 708€ (incl taxes).

The Core i7-12700K, the 8+4 (P+E) cores part that lacks Thermal Velocity Boost, will go for up to 524€ (incl taxes). Its "KF" twin will be about 20€ cheaper. The mid-tier Core i5-12600K processor (6 P-cores and 4 E-cores), is going for up to 365€. Not long ago, this was the roughly the price of Intel's top mainstream-desktop processors (such as the i7-7700K). The iGPU-devoid i5-12600KF will go for 333€. Intel is expected to debut its 12th Gen Core desktop processors and compatible Socket LGA1700 motherboards in Q4-2021, along the sidelines of the Windows 11 launch. The first wave of processors are expected to only be unlocked K or KF parts, with locked ones only arriving in early Q1-2022.

Noctua today announced that it will provide free-of-charge mounting upgrade kits for Intel's upcoming LGA1700 platform, enabling customers to keep using existing CPU coolers on the new 12th generation Intel Core CPUs (Alder Lake-S). Additionally, most of Noctua's current multi-socket cooler models will soon include LGA1700 mounting hardware and the popular NH-L9i low-profile coolers will come in new, dedicated LGA1700-revisions.

"We have offered free-of-charge mounting upgrade kits to our customers ever since AMD introduced AM2 in 2006, and we're proudly continuing this tradition with Intel's upcoming Amber Lake-S processors and the LGA1700 socket", says Roland Mossig (Noctua CEO). "Customers will be able to upgrade most Noctua CPU coolers since 2005 at no additional cost, so even 15-year-old coolers can be used on the latest processors!"

Intel's 12th Generation Core "Alder Lake-S" desktop processor will see a limited launch in 2021, according to an Igor's Lab report. This will be restricted to PC enthusiast-relevant SKUs bearing the -K and -KF brand extensions, and compatible Socket LGA1700 motherboards based only on the top Z690 (Z590-successor) chipset. The series will ramp up to other (locked) models, along with more affordable chipset models (B560-successor), only by Q1-2022, on the sidelines of the 2022 International CES. Sources tell Igor's Lab that these select few models could be launched between October 25 and November 19.

Intel is expected to make several technological leaps over AMD with "Alder Lake-S." To begin with, it has the first hybrid core technology that combines high-performance "Golden Cove" cores with high-efficiency "Gracemont" cores, in a heterogenous multi-core setup comparable to Arm big.LITTLE. Next up, it is expected to debut the PCI-Express Gen 5 I/O, and DDR5 memory support. While PCIe 5.0 GPUs remain under development, the first devices to take advantage of it are expected to be NVMe SSDs, benefiting from 128 Gbps bandwidth (Gen 5 x4). It is also learned that the next-gen motherboards will retain the current ATX 24-pin + EPS power interface, and Intel won't force adoption of ATX12VO. The new ATX12VO standard increases motherboard costs as it essentially transfers DC-to-DC switching components from the PSU to the motherboard (12 V to 5 V; 12 V to 3.3 V, etc), and adds output connectors.

With qualification samples of the upcoming Intel Core i9-12900K "Alder Lake-S" processors and companion Socket LGA1700 motherboards hitting the black-market, expect a deluge of benchmarks on social media. One such that stands out makes a fascinating claim that the i9-12900K beats AMD's current flagship Ryzen 9 5950X processor at Cinebench R20, which has been AMD's favorite multi-threaded benchmark. At stock speeds, with liquid cooling, the i9-12900K allegedly scores 810 points in the single-threaded test, and 11600 points in multi-threaded.

To put these numbers into perspective, a retail Ryzen 9 5950X scores 641 points in the single-threaded test, and 10234 points in multi-threaded, in our own testing. The i9-12900K is technically a 16-core processor, just like the 5950X, but half its cores are low-power "Gracemont." The "Alder Lake-S" chip appears to be making up ground on the single-threaded performance of the "Golden Cove" P-core, that's a whopping 25% higher than the "Zen 3" core on the 5950X. This is aided not just by higher IPC, but also the max boost frequency of 5.30 GHz for 1~2 cores, and 5.00 GHz "all-core" boost (for the P-cores).

Qualification samples (QS) of Intel's upcoming Core i9-12900K "Alder Lake-S" desktop processors just hit the black market for the equivalent of roughly USD $1,064 to $1,157 (6,500 to 7,500 RMB), in China. The processor maxes out the 10 nm silicon, offering 8 "Golden Cove" P-cores, and 8 "Gracemont" E-cores, along with 30 MB of L3 cache, a dual-channel DDR5 memory interface, in a hybrid processor setup. You can bag yourself this QS, but you'll need to find a compatible motherboard. "Alder Lake-S" debuts the new LGA1700 socket, Intel's first major change in the physical dimensions of its mainstream-desktop CPU socket since 2009, mandating a cooler update.

Bold and eye-catching, the MAG CORELIQUID C Series and MAG CORELIQUID P Series are MSI's latest all-in-one liquid coolers. Both liquid cooler series comes in 3 different sizes of radiators in 240 mm, 280 mm, and 360 mm. What draws them apart is their looks, with the MAG CORELIQUID C Series looking vibrant thanks to the ARGB lighting on the water block and fans. On the other hand, the MAG CORELIQUID P Series looks modest and understated with a blacked-out design throughout its water block and fans.

One key aspect of these two liquid cooler series is the socket support. Due to the new LGA1700 socket, many have questioned whether existing or planned CPU coolers will be compatible with Intel's impending Alder Lake processors. The MAG CORELIQUID C Series and the MAG CORELIQUID P Series are MSI's latest CPU coolers coming to the market with socket LGA1700 support. The LGA1700 is Intel's next-generation CPU socket, which will debut with the company's Alder Lake processors later this year. What makes this news even more exciting is that, unlike other brands that provide LGA1700 support through future customer support, the MAG CORELIQUID C Series and MAG CORELIQUID P Series will support the LGA1700 straight out of the box.

The Intel LGA1700/LGA1718 sockets have featured prominently in recent leaks for the upcoming 12th Generation Core Series Alder Lake processors and their Raptor Lake successors we have seen very little mention of the LGA18XX socket. The socket cover for LGA17XX has recently been pictured and it lists also being compatible with LGA18XX which would suggest the two sockets will be somewhat similar. We don't know what products may feature the LGA18XX socket but the most likely option would be the 7 nm Meteor Lake architecture. Intel has developed a new mounting solution for the two sockets with updated hole patterns indicating they are similar.

AMD Socket AM5 motherboards are set to arrive in Q2-2022, according to PJ, the editor of Uniko's Hardware. This would mean that the Zen 3 + 3D Vertical Cache chiplet AMD CEO Dr Lisa Su showed off in her Computex keynote, could very well be built in the Socket AM4 package, compatible with existing motherboards. The prototype Dr Su showed off appeared Socket AM4, too. AMD claims that the 3D Vertical Cache feature, when paired with a "Zen 3" chiplet, improves gaming performance by a significant 15 percent, helping AMD catch up with Intel's "Rocket Lake-S" processor at gaming. Elsewhere across the landscape, PJ predicts that the Z690 chipset, which goes with "Alder Lake-S" processors in the LGA1700 package, will arrive by Q4 2021, with cost-effective chipsets such as the B660 and H610 in Q1-2022.

Intel's 11th Gen Core "Rocket Lake-S" could have a brief stint as the tip of Intel's desktop spear. Wccftech reports that its successor, the 12th Gen Core "Alder Lake-S," could launch by November 2021. The processor debuts on the new LGA1700 socket, and will introduce many firsts to the platform. The biggest change will be the heterogenous CPU core architecture. The top-spec "Alder Lake-S" is believed to be a 16-core/24-thread processor. From these, 8 will be larger high-performance cores, featuring HyperThreading, while the other 8 will be smaller high-efficiency cores. The chip is expected to be built on the 10 nm SuperFin process, and hence Intel is expected to significantly lower power draw of desktops when the machine is idling or handling lighter desktop loads.

Besides the major update to the CPU cores, "Alder Lake-S" is expected to continue featuring a Xe LP based integrated graphics solution. Significant changes with the I/O are expected, including DDR5 memory support with backwards compatibility for DDR4, and PCI-Express Gen 5.0. The LGA1700 socket is significantly different from the various LGA115x/LGA1200 sockets Intel has been pulling for its mainstream desktop platforms since 2009. It could trigger the need for new CPU coolers that support the socket.

Intel only just announced their 11th generation Rocket Lake-S desktop processors last week but we are already receiving information about the next generation Alder Lake-S platform which will finally make the jump to 10 nm. Intel slides for the upcoming family of processors have been leaked and they reveal some interesting information including a claimed 20% single-threaded performance increases from the new Golden Cove core design and 10 nm SuperFin node. The processors will feature Intel Hybrid Technology with a mix of small low-performance cores and large high-performance cores with a maximum of eight each for sixteen total cores. The processors will also include the latest connectivity with both PCIe 4.0 and PCIe 5.0 support along with DDR4 and DDR5 4800 MHz compatibility.

Intel will also be launching a new socket type called LGA1700 with a new package size which will render existing cooling solutions for LGA115X and LGA1200 sockets incompatible. The processors will also come with the launch of a new 600 Series chipset with PCIe 3.0 and PCIe 4.0 support along with the usual complement of USB, SATA, and networking. The entry-level 600-series motherboards will only support DDR4 memory at up to 3200 MHz while high-end Z690 motherboards will include DDR5 support. Intel has confirmed that they intend to launch Alder Lake later this year but it is yet to be known if they are referring to the desktop or mobile series.

Intel "Alder Lake" is the first processor generation coming from the company to feature the hybrid big.LITTLE type core arrangement and we are wondering how the configurations look like and just how powerful the next-generation processors are going to be. Today, a Geekbench submission has appeared that gave us a little more information about one out of twelve Alder Lake-S configurations. This time, we are getting an 8-core, 16-threaded design with all big cores and no smaller cores present. Such design with no little cores in place is exclusive to the Alder Lake-S desktop platform, and will not come to the Alder Lake-P processors designed for mobile platforms.

Based on the socket LGA1700, the processor was spotted running all of its eight cores at 2.99 GHz frequency. Please note that this is only an engineering sample and the clock speeds of the final product should be higher. It was paired with the latest DDR5 memory and NVIDIA GeForce RTX 2080 GPU. The OpenCL score this CPU ran has shown that it has provided the GPU with more than enough performance. Typically, the RTX 2080 GPU scores about 106101 points in Geekbench OpenCL tests. Paired with the Alder Lake-S CPU, the GPU has managed to score as much as 108068 points, showing the power of the new generation of cores. While there is still a lot of mystery surrounding the Alder Lake-S series, we have come to know that the big cores used are supposed to be very powerful.

Intel has just recently announced its next-generation Rocket Lake-S processor specifications designed to bring improved performance and newer platform technologies like PCIe 4.0. However, we are yet to see the first 10 nm CPU for desktop users. Today, thanks to the sources over at VideoCardz, we have the first look at Intel's next-next-generation processor called Alder Lake. The Alder Lake-S is a platform that brings many of the "firsts" for Intel. It will be the first architecture being built on the company's 10 nm SuperFin architecture. Alongside the new node, the platform will transition to the next-generation of technologies. Rumored are the transitions to PCIe 5.0 and perhaps, most importantly - DDR5.

Another new approach will be Intel's adaptation of Arm's big.LITTLE heterogeneous core structure. The processor will feature a few of the "little" cores for light tasks, and fire up the "big" cores for heavy computing. All of that will require a new socket to house the processor, which is the LGA1700. You can see the new processor below, compared to LGA1200 CPU from the previous generation.

Intel has been preparing the launch of its 10 nm processors for desktop users for some time now, and today we are getting the first pictures of the Alder Lake-S CPU backside. Featuring a package with a size of 37.5×45 mm, the Alder Lake CPU uses more of its area for a pin count increase. Going up from 1200 pins in the LGA1200 socket, the new Alder Lake-S CPU uses 1700 CPU pins, which slots in the LGA1700 socket. In the picture below, there is an engineering sample of the Alder Lake-S CPU, which we see for the first time. While there is no much information about the processor, we know that it will use Intel's 10 nm SuperFin design, paired with hybrid core technology. That means that there will be big (Golden Cove) and little (Gracemont) cores in the design. Other features such as PCIe 5.0 and DDR5 should be present as well. The new CPU generation and LGA1700 motherboards are scheduled to arrive in second half of 2021.