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Coreboot Code Hints at Intel "Alder Lake" Core Configurations

Intel's 12th Gen Core EVO "Alder Lake" processors in the LGA1700 package could introduce the company's hybrid core technology to the desktop platform. Coreboot code leaked to the web by Coelacanth's Dream sheds fascinating insights to the way Intel is segmenting these chips. The 10 nm chip will see Intel combine high-performance "Golden Cove" CPU cores with energy-efficient "Gracemont" CPU cores, and up to three tiers of the company's Gen12 Xe integrated graphics. The "Alder Lake" desktop processor has up to eight big cores, up to eight small ones, and up to three tiers of the iGPU (GT0 being disabled iGPU, GT1 being the lower tier, and GT2 being the higher tier).

Segmentation between the various brand extensions appears to be primarily determined by the number of big cores. The topmost SKU has all 8 big and 8 small cores enabled, along with GT1 (lower) tier of the iGPU (possibly to free up power headroom for those many cores). The slightly lower SKU has 8 big cores, 6 small cores, and GT1 graphics. Next up, is 8 big cores, 4 small cores, and GT1 graphics. Then 8+2+GT1, and lastly, 8+0+GT1. The next brand extension is based around 6 big cores, being led by 6+8+GT2, and progressively lower number of small cores and their various iGPU tiers. The lower brand extension is based around 4 big cores with similar segmentation of small cores, and the entry-level parts have 2 big cores, and up to 8 small cores.

Intel "Alder Lake" CPU Core Segmentation Sketched

Intel's 12th Gen Core "Alder Lake-S" desktop processors in the LGA1700 package could see the desktop debut of Intel's Hybrid Technology that it introduced with the mobile segment "Lakefield" processor. Analogous to Arm big.LITTLE, Intel Hybrid Technology is a multi-core processor topology that sees the combination of high-performance CPU cores with smaller high-efficiency cores that keep the PC ticking through the vast majority of the time/tasks when the high-performance cores aren't needed and hence power-gated. The high-performance cores are woken up only as needed. "Lakefield" combines one "Sunny Cove" high-performance core with four "Tremont" low-power cores. "Alder Lake-S" will take this concept further.

According to Intel slides leaked to the web by HXL (aka @9550pro), the 10 nm-class "Alder Lake-S" silicon will physically feature 8 "Golden Cove" high-performance cores, and 8 "Gracemont" low-power cores, along with a Gen12 iGPU that comes in three tiers - GT0 (iGPU disabled), GT1 (some execution units disabled), and GT2 (all execution units enabled). In its top trim with 125 W TDP, "Alder Lake-S" will be a "16-core" processor with 8 each of "Golden Cove" and "Gracemont" cores enabled. There will be 80 W TDP models with the same 8+8 core configuration, which are probably "locked" parts. Lastly, there the lower wrungs of the product stack will completely lack "small" cores, and be 6+0, with only high-performance cores. A recurring theme with all parts is the GT1 trim of the Gen12 iGPU.

Intel "Alder Lake-S" Confirmed to Introduce LGA1700 Socket, Technical Docs Out for Partners

Intel's Core "Alder Lake-S" desktop processor, which succeeds the 11th generation "Rocket Lake-S," is confirmed to introduce a new CPU socket, LGA1700. This new socket has been churning in the rumor mill since 2019. The LGA1700 socket is Intel's biggest mainstream desktop processor package change since LGA1156, in that the package is now physically larger, and may be cooler-incompatible with LGA115x sockets (Intel H# sockets). The enlargement in package size is seen as an attempt by Intel to give itself real-estate to build future multi-chip modules; while the increased pin-count points to the likelihood of more I/O centralization to the processor package.

The "Alder Lake-S" silicon is rumored to be Intel's first 10 nm-class mainstream desktop processor, combining a hybrid core setup of a number of "Golden Cove" high-performance CPU cores, and a number of "Gracemont" low-power cores. The processor's I/O feature-set is expected to include dual-channel DDR5 memory, PCI-Express gen 4.0, and possibly preparation for gen 5.0 on the motherboard-side. In related news, Intel put out technical documentation for the "Alder Lake-S" microarchitecture and LGA1700 socket. Access however, is restricted to Intel's industrial partners. The company also put out documentation for "Rocket Lake-S."
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May 21st, 2024 09:17 EDT change timezone

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