Taiwanese company Thermalright has recently launched the LGA1700-BCF (Bending Corrector Frame) to mitigate the risk of bending and warping with 12th Generation Intel Alder Lake processors. Intel has previously disclosed that their Alder Lake processors could exhibit mild warping as a result of changes to the integrated heatspreader (IHS) design but that the processors still performed within specification. This new product from Thermalright aims to prevent this warping despite Intel advising that any 3rd party modifications could void the warranty for Alder Lake processors. The Thermalright LGA1700-BCF is now available to purchase for 39 RMB (6 USD) in red and silver color options with support for H610, B660, and Z690 motherboards.

AMD's first desktop processor with DDR5 memory support, the Ryzen 7000 series "Raphael," based on the "Zen 4" microarchitecture, will come with a design focus on DDR5 memory overclocking capabilities, with the company claiming that the processors will be capable of handling DDR5 memory clock speeds "you maybe thought couldn't be possible," according to Joseph Tao who is a Memory Enabling Manager at AMD.

Tao stated: "Our first DDR5 platform for gaming is our Raphael platform and one of the awesome things about Raphael is that we are really gonna try to make a big splash with overclocking and I'll just kinda leave it there but speeds that you maybe thought couldn't be possible, may be possible with this overclocking spec." We are hearing reports of AMD innovating a new overclocking standard for DDR5 memory, which it calls RAMP (Ryzen Accelerated Memory Profile), which it is positioning as a competing standard to Intel's XMP 3.0 spec.

ID-COOLING today announced IS-47S 47 mm height low profile CPU air cooler. At a total height including the fan of 47 mm, this cooler would be a good choice for your A4 cases. Designed with an overall dimension of 100x93x47mm, it has no conflict of the RAM or PCI-E slots. The heatsink is solid built with a pure copper base and 4 heatpipes and massive aluminium fins. The heatsink itself is measured at 35 mm height. Adding a powerful 12 mm PWM fan, this cooler is capable of handling processors with a maximum TDP of 95 W. In terms of mounting kit, two separate backplates are provided in the box for Intel and AMD respectively. The sockets list includes Intel LGA1700/1200/1151/1150/1155/1156 and AMD AM4.

The bundled thermal grease is named FROST X25, which has a thermal conductivity of 10.5 W/m-K.

Alphacool's CPU All-in-One solutions Eisbaer Aurora and Eisbaer LT Aurora are now available with the new NexXxoS HPE (High Performance Edition) 360mm radiator. What does HPE mean? The NexXxos HPE-30 radiator uses the same materials as the previous NexXxos models, but technically goes a step further. Due to the condensed internal construction, the number of water channels and copper fins could be increased. This means that a larger volume of water is in direct contact with the cooling fins and the heat transfer is enormously improved.

Due to the higher number of fin rows and their shortening, the cooling surface is also used much more efficiently. Comparison tests (test setup: ASUS Prime X299/Intel i9-10900X with 350 W waste heat) with the conventional NexXxos radiator have shown that a significant performance increase of 4.5K is possible when using the HPE radiator. At higher ambient temperatures and higher fan speeds, the performance gap to the normal NexXxoS radiators even increases progressively and reaches a possible performance increase of up to 6K. There has never been such a leap in performance in the past!

EK, the Europe-based premium water cooling gear manufacturer, is proud to present its flagship CPU water block - EK-Quantum Magnitude, designed specifically for the LGA 1700 socket. It uses specific flow distribution, cold plate geometry, and mounting pressure tailored to the IHS of LGA 1700 Intel processors. Its unrivaled internal geometry creates a far greater heat transfer area with less restriction that leaves no stress on the rest of the custom loop liquid cooling system.

This block is specifically engineered for LGA1700 socket-based Intel Core CPUs of 12th generation Core architecture. EK-Quantum Magnitude is bearing the prestigious iF Design award for the bold and different approach to the CPU water block mounting mechanism. Differentiated from any mounting structure of a water block that is usually a black and mundane plate, the design accentuates an integrated X-shaped three-dimensional frame with premium finishes that firmly cradles the main body in place, while the screws are morphed into sophisticated design details.

Noctua today presented the all-new NH-D12L low-height dual tower CPU cooler and the corresponding NF-A12x25r round-frame 120 mm fan. At a height of only 145 mm (13 mm lower than Noctua's regular 120 mm models), it fits many 4U enclosures as well as narrower tower cases that have been previously limited to solutions with 92 mm fans. At the same time, its five heatpipe dual-tower design and state-of-the-art NF-A12x25r 120 mm fan allow it to achieve a level of efficiency that surpasses many full-height 120 mm models.

"So far, all our 120 mm class coolers were 158 mm high, but as of recent, more and more PC cases only support up to 150 or even 145 mm - this is where the NH-D12L steps in", explains Roland Mossig (Noctua CEO). "Simply lowering one of our existing models wasn't an option because a standard square 120 mm fan would cause lots of issues with motherboard heatsinks or shrouds. That's why we came up with this novel dual tower design and a round-frame version of the NF-A12x25 fan that can be installed at a very low position between the two towers - a winning combination that provides impressive results for this height class."

SilentiumPC, the European manufacturer of CPU coolers, power supplies, and PC cases, announces the newest version of its Spartan line of CPU coolers. This includes the Spartan 5 standard, the Spartan 5 MAX, and the Spartan 5 ARGB and MAX ARGB. This new lineup of CPU cooling systems was developed in cooperation with Synergy Cooling, and directly competes with more expensive mid-range coolers. The streamlined heatsink design and base, which consists of heatpipes in direct contact with the processor, is able to effectively cool even the latest processors, while maintaining low noise levels and an affordable price.

The Spartan 5 family uses a specially designed, heatsink-integrated version of the award-winning 120 mm Fluctus fan, ensuring both quiet operation and psychoacoustic optimization throughout the entire setup. It was designed primarily for system integrators and users looking for efficient and inexpensive cooling. Thanks to its uniform structure, it is not only extremely easy to install, but also much more resistant to mechanical damage that may occur during transport.

ARCTIC, a leading manufacturer of low-noise PC coolers and components, introduces today the Alpine 17 and Alpine 17 CO, a pair of compact air coolers designed exclusively for the Intel LGA1700 socket. With the release of its newest Alpine coolers, ARCTIC presents an affordable option for users looking to cool their Alder Lake processors. The successors to the Alpine 12 series retain its classic radial heatsink design but are specifically built for the LGA1700 socket.

The cooler's Y-shaped fin ensures optimal heat distribution in the heatsink, while heat dissipation is significantly enhanced by the Alpine 17's large surface area and high airflow rate. With a low installation height of only 68.2 mm, the Alpine 17 and Alpine 17 CO are ideal choices for most all-in-one systems as well as small cases (Mini-ITX, µATX etc.).

Scythe releases today a revised version of the premium High-End CPU Cooler Fuma 2. Based on the classic Fuma 2 asymmetrical heatsink design, the award-winning twin tower cooler is now upgraded with two new Kaze Flex II fans. The new fans increase the airflow by speeding up to 1500 RPM and the rubber frame design guarantees grand noise reduction. For many Intel 12th Gen CPU users, the concern about the additional purchase of the LGA 1700 mounting kit can now rest assured. The Scythe H.P.M.S. IV mounting System now offers full Intel LGA 1700 support. The Scythe Fuma 2 Rev.B CPU cooler is now available in the US, Japan, Taiwan markets.

Chinese motherboard maker ONDA released the first Intel Socket LGA1700 motherboard that features both DDR4 and DDR5 memory support—something we learned quite early on that Intel either isn't allowing or is "discouraging" motherboard vendors to do. The ONDA H610M+ is based on the entry-level Intel H610 chipset, and is an otherwise basic-looking motherboard. The memory sub-system is interesting.

While the board supports both DDR5 and DDR4, there's only one of each slots, so you're limited to single-channel, and like every motherboard from the past that supported multiple memory types; you can't use the DDR5 and DDR4 slots at the same time. The board runs DDR4 at a maximum frequency of DDR4-3200, and the DDR5 slot at DDR5-4800 (max). That's not all, the board is quite possibly the only H610 chipset-based motherboard with a Gen 5 PCI-Express x16 slot (every other H610 board we've come across has Gen 4, to keep costs low). PCIe Gen 5 is allowed for the H610 platform. Another interesting bit is the M.2 E-key slot, so you can drop in a WLAN module. It's likely that this board will only be available in the Chinese market.

Intel debuted its Socket LGA1700 motherboard lineup with Z690, and later B660 and H610 chipset options, but the H670 seemed elusive. Motherboard vendors are slowly launching their H670-based offerings, and MSI joined the party with the MAG H670 Tomahawk WiFi DDR4. The board is very similar in design to the company's MAG B660 Tomahawk-series motherboards, but with a little more I/O, and a broader chipset bus. The key feature that sets the H670 apart from the B660 is the 8-lane DMI 4.0 chipset bus, compared to 4-lane DMI 4.0 on the B660.

Another key difference between the H670 Tomahawk and B660 Tomahawk is that the PCI-Express x16 slot is Gen 5 capable on the H670 board, but this is due to MSI's design choices. On paper, B660 platforms can have Gen 5 PEG slots. Yet another key differentiator between the H670 and B660 chipsets, is that the H670 puts out 12 PCIe Gen 4 downstream lanes, and MSI leveraged this to put out two chipset-attached M.2 NVMe slots with Gen 4 x4 wiring. Connectivity includes a 2.5 GbE wired networking interface driven by an Intel i225-V controller, an Intel AX200 WiFi 6 + Bluetooth 5.2 module; and 8-channel HD audio driven by the 12-year old Realtek ALC897 CODEC. The company didn't reveal pricing.

Jonsbo today unveiled the HX4170D, a low-profile, top-flow CPU cooler with a Z-height (including fan) of 45.3 mm. Four 6 mm-thick copper heat pipes pass through an indirect-copper base, conveying heat through an aluminium fin-stack that's ventilated by a compact 12.5 mm-thick 92 mm fan. The fan spins between 600 to 3,300 RPM, pushing up to 38.85 CFM of air-flow, at up to 28.4 dBA noise level. The fan features a hydraulic bearing.

There are two variants of the HX4170D. The standard White variant has an all-white heatsink, and its fan features addressable-RGB illumination. The All-Black variant has an opaque fan impeller, and lacks illumination. The cooler measures 95 mm x 95 mm x 45.3 mm (WxDxH), weighing 290 g. Among the CPU socket types supported are LGA1700, LGA1200, LGA115x, and AM4. The company didn't reveal pricing.

JONSBO today unveiled the HP400S, an ultra-low-profile, top-flow CPU cooler. With its fan in place, the cooler has a height of just 36 mm. Despite its compact dimensions, its designers claim that it is capable of handling thermal loads of up to 140 W. Its design involves four 6 mm-thick copper heat pipes making direct contact with the CPU at the base, twisting into a dense aluminium fin-stack with 40 fins, which are ventilated by a 90 mm fan. This 15 mm-tall 90 mm fan can turn at speeds of up to 3,000 RPM, pushing up to 48.3 CFM of airflow, and 3.24 mm H₂O static pressure, with a maximum noise output of 33 dBA. The cooler measures 103 mm x 92 mm x 36 mm, with a weight of 380 g. Among the CPU socket types supported are LGA1700, AM4, LGA1200, and LGA115x. The company didn't reveal pricing.

Bitspower is known almost entirely for its DIY liquid-cooling products, but is looking to expand into the air-based cooling space. The company is ready with the Bitsport Phantom, a tower-type CPU air cooler. The cooler features a conventional tower-type design, in which four 6 mm-thick copper heat-pipes make direct contact with the CPU at the base, conveying heat through the fin-stack. The heat-pipes are capped at the ends, and the top-plate has a slick looking insert with the Bitspower logo in the center. The fin-stack is ventilated by a 120 mm addressable-RGB illuminated fan. The cooler supports the latest LGA1700 socket. Specs related to the fan and heatsink, as well as pricing and availability information, remains unknown.

Intel is allegedly advancing the launch of its 13th Gen Core "Raptor Lake-S" desktop processors to some time in Q3-2022, according to a report by Moore's Law is Dead. It was earlier believed to be a Q4 launch, much like "Alder Lake" was, in 2021. The report predicts the debut of "Raptor Lake" in the desktop segment in Q3-2022 (between July and September), with certain mobile SKUs expected toward the end of the year, in Q4. The Core "Raptor Lake-S" processor is built in the existing Socket LGA1700 package, and is being designed for compatibility with existing Intel 600-series chipset motherboards with a firmware update.

The "Raptor Lake-S" silicon is built on the existing Intel 7 (10 nm Enhanced SuperFin) node, and physically features eight "Raptor Cove" P-cores, along with sixteen "Gracemont" E-cores that are spread across four clusters. The chip has additional cache memory, too. Moore's Law is Dead predicts that the "Raptor Cove" P-core could introduce an IPC uplift in the region of 8 to 15 percent over the "Golden Cove" core, while the chip's overall multi-threaded performance could be anywhere between 30 to 40 percent over "Alder Lake-S," on account of not just increased IPC of the P-cores, but also eight additional E-cores.

Introducing the EVGA Z690 DARK K|NGP|N - The Motherboard Designed by and Used by Professional Overclockers. EVGA DARK motherboards blaze the trail for other boards to follow, and the Z690 DARK K|NGP|N is no exception. The ability to destroy world records is insignificant next to the power of a 21-phase VRM and a 10-layer PCB - capable of driving the most powerful 12th Gen Intel Core processors. With support for 64 GB of DDR5 memory at up to 6600 MHz+(OC), PCIe Gen5, and PCIe Gen4 M.2 NVMe SSDs, a new DARK age of overclocking will rise as quickly as new hardware becomes available. The Z690 DARK K|NGP|N is today's choice for the future of overclocking and gaming.

The new Jonsbo HX6240 joins a breed of thick aluminium fin-stack tower-type coolers, which rely on a thicker aluminium fin-stack, over a split dual fin-stack design. With its single 120 mm fan in place, the cooler measures 105 mm x 120 mm x 162 mm (DxWxH), weighing 1.035 kg. Its design involves a nickel-plated copper base that has a mirror-finish, from which six 6 mm-thick copper heat pipes emerge, transferring heat to the aluminium fin-stack, which is ventilated by a 120 mm fan.

The surface-area for heat-dissipation mentioned by Jonsbo, is 8,900 cm². The fan included with the Jonsbo HX6240 turns at speeds of up to 1,800 RPM, pushing up to 83.04 CFM of airflow, at up to 45.56 dBA noise output. It features a fluid-dynamic bearing. An interesting design element of this cooler is its detachable top-plate, which uses magnets to stay in place, and is hence tool-free. Removing the top-plate, and slighly pushing down the fan, lets you reduce the height of the cooler by 5 mm. The HX6240 comes in two trims—black and white. Among the CPU socket types supported are LGA1700, LGA1200, and AM4. The company didn't reveal pricing.

Akasa, a leading provider of cooling and thermal solutions for the global electronics industry, has released new variants of their classic CPU coolers, updated for the Alder Lake processors (LGA 1700 mounting system). The three coolers are designed for unlocked desktop CPUs (AK-CC6606BP01), F-Series desktop CPUs (AK-CC6603EP01), and T-Series desktop CPUs (AK-CC6601EP01). These coolers will work at the TDP set by Intel, and will follow the official thermal and mechanical design guide, improving heat dissipation from the Alder Lake processors.

The 12th generation of Intel Core processors will be using the LGA1700 mounting system, launching with a host of technological advances. Intel's new hybrid core design allows for efficient data processing, with the introduction of Performance and Efficiency cores (P-cores and E-cores respectively). P-cores are dedicated to the faster processing tasks, whilst E-cores have been built to work through background processes, therefore increasing the multitasking capabilities of the CPU. Due to the new sizes of these cores, the shape of the CPU's integrated heatspreader (IHS) has changed to accommodate this, with its rectangular dimensions of 37.5 mm x 45 mm.

MSI is updating its MAG CoreLiquid-R line of all-in-one liquid CPU coolers from 2020 with the new V2 series. Available in its standard black, and now, the new all-white color trim. These coolers are every bit identical to the original CoreLiquid-R series from 2020, except out-of-the-box support for Intel Socket LGA1700. The White trim covers the water-block, the Nylon sleeves of the tubing, the fan-frames, and the radiator. A characteristic feature of the CoreLiquid-R is the integration of pump with the radiator instead of the water-block; leaving it relatively lightweight. The ARGB-illuminated top of the water-block rotates, letting you reorient the MSI Gaming logo.

Thermalright today introduced the AXP120-X67, a premium low-profile, top-flow CPU cooler, with a height of 67 mm with the fan in place. The cooler features a "C-type" aluminium fin-stack heatsink, in which heat is drawn from the C1100-grade nickel-plated copper base, and conveyed to the fin-stack via six 6 mm-thick heat-pipes of the same material. The fin-stack is arranged along the plane of the motherboard, and is ventilated by a 15 mm-thick 120 mm fan in a top-flow fashion.

The included 120 mm Thermalright TL-C12015 fan comes with 15 mm thickness, features a fluid-dynamic bearing, turns at speeds of up to 1,800 RPM, pushing up to 59 CFM of airflow, at a static pressure of 1.36 mm H₂O, and 26.1 dBA maximum noise output. The cooler measures 120 mm x 123.5 mm x 67 mm (WxDxH), weighing 490 g. Among the CPU socket types supported are LGA1700, LGA1200, and AM4. The company didn't reveal pricing.

Cougar today introduced the Forza 50, a slim yet premium tower-type CPU cooler. Designed with a height of 155 mm, the cooler features a dense aluminium fin-stack to which heat is fed by four 6 mm-thick copper heat pipes that make direct contact with the CPU at the base. This is ventilated by a high-speed Cougar MHP-120 fan which features hydro-dynamic bearing, turns at speeds of up to 2,000 RPM, pushing up to 82.48 CFM of air-flow, at up to 31.68 dBA of noise output, and 4.24 mm H₂O static pressure. With its fan in place, the Cougar Forza 50 measures about 135 mm x 155 mm x 75 mm (WxHxD), weighing 792 g. Among the CPU socket types supported are LGA1700, LGA1200, and AM4. The company didn't reveal pricing.

Thermalright today introduced the Macho MAXX, its latest single-tower type CPU coolers. The Macho line of tower-type coolers see Thermalright's designers choose a single large aluminium fin-stack over a "D-type" dual fin-stack approach. With its fan in place, the cooler measures 140 mm x 124 mm x 158 mm (WxDxH), weighing 780 g.

The design of the Macho MAXX involves a nickel-plated C1100-grade copper base, from which six 6 mm-thick copper heat pipes emerge, conveying heat across the large stack of 31 fins, which is ventilated by a 140 mm TL-D14 fan. This fan turns at speeds of up to 1,500 RPM, pushing up to 77.8 CFM of airflow, at up to 2.09 mm H₂O static pressure, and up to 25.6 dBA noise output. It features a fluid-dynamic bearing. Among the CPU socket types supported are LGA1700, LGA1200, and AM4. The company didn't reveal pricing.

ZALMAN today launched the Alpha line of all-in-one liquid CPU coolers. Available in three variants based on radiator size—Alpha 36 (360 mm x 120 mm), Alpha 28 (280 mm x 140 mm), and Alpha 24 (240 mm x 120 mm), each with sub-variants based on color—white and black; the main sell with the Alpha series is an innovation with the pump-block design.

ZALMAN designed the pump to feature three independent coolant flow paths for the inflow and outflow, which works to prevent pump overload. Its designers claim this also improves cooling performance by reducing residual fluid in the pump-chamber. The heat-dissipation base is made of copper, with a large micro-fin lattice, with 0.15 mm fins. The pump-block features an in-built fan-controller that manages the radiator fans based on cooling needs. The pump-block also features a dome-shaped ARGB-illuminated top that freely moves around, so you can orient the ZALMAN logo whichever way you want.

Akasa, has announced they will be releasing an updated set of CPU coolers compatible with Intel's newest mounting system, LGA1700. The new line of coolers will follow Intel's official thermal and mechanical design guide and improves heat dissipation from the Alder Lake processors.

The 12th generation of Intel Core processors will be using this LGA1700 mounting system, launching with a host of technological advances. Intel's new hybrid core design allows for efficient data processing, with the introduction of Performance and Efficiency cores (P-cores and E-cores respectively). P-cores are dedicated to the faster processing tasks, whilst Ecores have been built to work through background processes, therefore increasing the multitasking capabilities of the CPU. Due to the new sizes of these cores, the shape of the CPU's integrated heatspreader (IHS) has changed to accommodate this, with its rectangular dimensions of 37.5 mm x 45 mm.

Thermalright today introduced the TA120 EX Mini White, one of the company's more compact tower-type CPU coolers. The cooler is designed with a height of 135 mm, even though it uses a 120 mm fan for ventilation. It features a conventional tower type design, in which five 6 mm-thick copper heat pipes make indirect contact with the CPU at the base (nickel-plated C1100-grade copper with mirror finish), pushing heat through the fin-stack, which is ventilated by a TL-D12 PRO-W fan. It features a fluid-dynamic bearing, and turns at speeds of up to 1,850 RPM, pushing up to 82 CFM of airflow, with 2.1 mm H₂O static pressure, and 29.6 dBA noise output. Among the CPU socket types supported include LGA1700, AM4, and LGA1200. The company didn't reveal pricing.