MSI has been in close contact with the AMD and has referred to their official technical guidance to provide users with a safer and more optimized hardware environment. To achieve this goal, MSI will release a new list of BIOS updates specifically for the AMD Ryzen 7000 series CPU.

According to AMD's design specifications, the Ryzen 7000X3D series CPU does not fully support overclocking or overvoltage adjustments, including CPU ratio and CPU Vcore voltage. However, AMD EXPO technology can be used to optimize memory performance by appropriately increasing the CPU SoC voltage to ensure system stability when operating at higher memory frequencies.

Yesterday SK Hynix reported its Q1 2023 results and to say that they were abysmal is being kind, as the company reported a 3.4 trillion won operating loss, or just over US$2.5 billion. That's no small hit to take for any company, especially when it's only the performance for a single quarter. However, SK Hynix is apparently trying to see its situation from a positive perspective and believes that the memory chip market will rebound in the second half of this year. The positive outlook isn't just based on what SK Hynix believes though, as various analysts and securities companies believe in an upswing in the second half of the year.

That said, Micron, one of SK Hynix main competitors, has a more drab outlook for the remainder of 2023 and is expecting a tough year ahead. SK Hynix is expecting production cuts by itself, Micron and Samsung to start to take effect sometime in the second quarter this year, which should see inventory drop to more normal levels for all three companies. SK Hynix is also expecting to see a higher demand for DDR5 DRAM later this year, especially in the mobile and server market space. Finally, SK Hynix is hoping that its customers will buy higher density memory products this year, replacing older, lower density solutions, be that DRAM or NAND flash related. SK Hynix is expecting to launch its Gen 5 10 nm DRAM and 238-layer NAND sometime next year, which the company is also hoping will bring more income to its coffers, but the company still has to make it through the rest of 2023 first.

Samsung Electronics today reported financial results for the first quarter ended March 31, 2023. The Company posted KRW 63.75 trillion in consolidated revenue, a 10% decline from the previous quarter, as overall consumer spending slowed amid the uncertain global macroeconomic environment. Operating profit was KRW 0.64 trillion as the DS (Device Solutions) Division faced decreased demand, while profit in the DX (Device eXperience) Division increased.

The DS Division's profit declined from the previous quarter due to weak demand in the Memory Business, a decline in utilization rates in the Foundry Business and continued weak demand and inventory adjustments from customers. Samsung Display Corporation (SDC) saw earnings in the mobile panel business decline quarter-on-quarter amid a market contraction, while the large panel business slightly narrowed its losses. The DX Division's results improved on the back of strong sales of the premium Galaxy S23 series as well as an enhanced sales mix focusing on premium TVs.

KLEVV, an emerging memory brand introduced by Essencore, is excited to unveil two new high performance DDR5 overclocking memory, the CRAS V RGB and the BOLT V. Designed to cater to a wide range of users, the CRAS V RGB and BOLT V DDR5 memory empower all aspects of computational requirements. They deliver outstanding performance on the latest AMD and Intel platforms, from gaming to content creation, with Intel XMP 3.0 and AMD EXPO overclocking features. Furthermore, the CRAS V RGB and BOLT V DDR5 memory are fully battle-hardened, passing the QVL tests required by major motherboard manufacturers. With strictly selected memory chips and meticulous manufacturing processes, they ensure the highest level of reliability, tailored to perform multitasking operation effortlessly.

Released under KLEVV's flagship memory range, the CRAS V RGB memory features modern design refined with exquisite attention to detail. Precision crafted aluminium heatsink highlighted by signature RGB lights visible on both top and fine gaps on the sides make for a sight to behold. The RGB lights are fully customizable and controllable with third-party software provided by world-renown motherboard manufacturers like ASUS, ASROCK, Gigabyte, and MSI with corresponding hardware, serving as the centerpiece of any build. The 32 GB (16 GB x2) 288 Pin DDR5 unbuffered DIMM kits are available in four base clock options starting at 6000MT/s, 6400MT/s, 7200MT/s, 7600MT/s, and extending up to blazing-fast 8000 MT/s.

It seems like the long boot times that have plagued MSI's X670 and B650 motherboards might soon be nothing but a bad memory, as the company has issued UEFI updates for its motherboards that are said to cut the boot times in half. The company has added what it calls "Memory Context Restore" in the new UEFI releases, which speeds up the boot times significantly. MSI didn't provide any details as to what the feature does, but according to a post on MSI's forum, it is meant to avoid retraining of the RAM and is a feature that MSI had offered on past AMD platforms.

The chart below shows the boot times using two 16 GB DDR5-6000 modules from Kingston with EXPO and with Memory Context Restore enabled, the boot time goes from 43 to 22 seconds. The specific test system was using MSI's own MAG X670E Tomahawk WiFi motherboard, paired with an AMD Ryzen 7 7800X3D CPU.If you have an MSI X670 or B650 motherboard and want to take advantage of the new improved boot times, head over to MSI's website and downloaded the latest UEFI version for your motherboard.

According to the South China Morning Post (SCMP) sources, Yangtze Memory Technologies Corp (YMTC) has been plotting to manufacture its advanced 3D NAND flash using locally sourced equipment. As the source notes, YMTC has placed big orders from local equipment makers in a secret project codenamed Wudangshan, named after the Taoist mountain in the company's home province of Hubei. Last year, YTMC announced significant progress towards creating 200+ layer 3D NAND flash before other 3D NAND makers like Micron and SK Hynix. Called X3-9070, the chip is a 232-layer 3D NAND based on the company's advanced Xtacking 3.0 architecture.

As the SCMP finds, YTMC has placed big orders at Beijing-based Naura Technology Group, maker of etching tools and competitor to Lam Research, to manufacture its advanced flash memory. Additionally, YTMC has reportedly asked all its tool suppliers to remove all logos and other marks from equipment to avoid additional US sanctions holding the development back. This significant order block comes after the state invested 7 billion US Dollars into YTMC to boost its production capacity, and we see the company utilizing those resources right away. However, few industry analysts have identified a few "choke points" in YTMC's path to independent manufacturing, as there are still no viable domestic alternatives to US-based tool makers in areas such as metrology tools, where KLA is the dominant player, and lithography tools, where ASML, Nikon, and Canon, are noteworthy. The Wuhan-based Wudangshan project remains secret about dealing with those choke points in the future.

Netlist Inc. an enterprise solid state storage drive specialist has been awarded over $303 million in damages by a federal jury in Texas on April 21, over apparent patent infringement on Samsung's part. Netlist has alleged that the South Korean multinational electronics corporation had knowingly infringed on five patents, all relating to improvements in data processing within the design makeup of memory modules intended for high performance computing (HPC) purposes. The Irvine, CA-based computer-memory specialist has sued Samsung in the past - with a legal suit filed at the Federal District Court for the Central District of California.

Netlist was seemingly pleased by the verdict reached at the time (2021) when the court: "granted summary judgements in favor of Netlist and against Samsung for material breach of various obligations under the Joint Development and License Agreement (JDLA), which the parties executed in November 2015. A summary judgment is a final determination rendered by the judge and has the same force and effect as a final ruling after a jury trial in litigation."

SK hynix announced today it has become the industry's first to develop 12-layer HBM3 product with a 24 gigabyte (GB) memory capacity, currently the largest in the industry, and said customers' performance evaluation of samples is underway. HBM (High Bandwidth Memory): A high-value, high-performance memory that vertically interconnects multiple DRAM chips and dramatically increases data processing speed in comparison to traditional DRAM products. HBM3 is the 4th generation product, succeeding the previous generations HBM, HBM2 and HBM2E

"The company succeeded in developing the 24 GB package product that increased the memory capacity by 50% from the previous product, following the mass production of the world's first HBM3 in June last year," SK hynix said. "We will be able to supply the new products to the market from the second half of the year, in line with growing demand for premium memory products driven by the AI-powered chatbot industry." SK hynix engineers improved process efficiency and performance stability by applying Advanced Mass Reflow Molded Underfill (MR-MUF)# technology to the latest product, while Through Silicon Via (TSV)## technology reduced the thickness of a single DRAM chip by 40%, achieving the same stack height level as the 16 GB product.

Kingston FURY, the high-performance division of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced it has shipped more than 100 million overclockable modules. In 2002, Kingston entered the enthusiast market with a line of high-performance memory modules under the Kingston HyperX name. Over the next 19 years Kingston grew the HyperX name within the enthusiast and gaming space until its sale of the peripheral line to HP in 2021. Continuing the incredible success of the HyperX memory products, Kingston rebranded its high-performance component lines into Kingston FURY, investing resources and knowledge from its core business to create the next generation of enthusiast products. Today, the engineering expertise behind the numerous overclocking records and awards continues into a new era of leading-edge, high-performance, enthusiast and gaming solutions.

Since its inception, Kingston has taken pride in its testing innovations and industry-leading product reliability. Back in 2005, Kingston was granted a U.S patent on a proprietary, first of its kind, dynamic burn-in tester. This ensured the utmost reliability in server memory modules used in the world's largest data centres. Earlier this year, Kingston broadened its portfolio by adding the Kingston FURY Renegade Pro DDR5 RDIMM which provides overclockable server-class DDR5 memory for creators, engineers, and data science professionals to meet the requirements of the latest applications. Its award-winning line of Kingston FURY Beast DDR5 and Renegade DDR5 memory modules also received a makeover with the introduction of white heat spreaders to empower users to choose the colour that best fits their individual style.

Demonstrating continued innovation, Kioxia Corporation and Western Digital Corp. today announced details of their newest 3D flash memory technology. Applying advanced scaling and wafer bonding technologies, the 3D flash memory delivers exceptional capacity, performance and reliability at a compelling cost, which makes it ideal for meeting the needs of exponential data growth across a broad range of market segments.

"The new 3D flash memory demonstrates the benefits of our strong partnership with Kioxia and our combined innovation leadership," said Alper Ilkbahar, Senior Vice President of Technology & Strategy at Western Digital. "By working with one common R&D roadmap and continued investment in R&D, we have been able to productize this fundamental technology ahead of schedule and deliver high-performance, capital-efficient solutions."

It looks like 12 GB will be the standard memory size for the NVIDIA GeForce RTX 4070 graphics card the company plans to launch in mid-April 2023. It is very likely that the card has 12 GB of memory across the 192-bit memory bus width of the "AD104" silicon the SKU is based on. The RTX 4070 is already heavily cut down from the RTX 4070 Ti that maxes out the "AD104," with the upcoming SKU featuring just 5,888 CUDA cores, compared to the 7,680 of the RTX 4070 Ti. The memory sub-system, however, could see NVIDIA use the same 21 Gbps-rated GDDR6X memory chips, which across the 192-bit memory interface, produce 504 GB/s of memory bandwidth. Confirmation of the memory size came from regulatory filings of several upcoming custom-design RTX 4070 board models by MSI and GIGABYTE, with the Eurasian Economic Commission (EEC), and Korean NRRA.

Gigabyte is also apparently testing the new BIOS update that should bring non-binary memory support to AMD's 600-series chipset motherboards. With the official AGESA update for AMD X670 and B650 apparently just around the corner, it does not come as a surprise that all motherboard makers are implementing it and testing it on their motherboards.

The latest comes from Gigabyte over at Coolaler forums, showing the AORUS X670E Master motherboard running 192 GB of DDR5 memory. This time around, the memory was running at 6000 MT/s, so the official support is certainly around the corner, even for overclocked kits. Both Corsair and G.SKILL have already announced their own 24 GB and 48 GB modules running at up to DDR5-8000. The official AGESA update is rumored to come in April, but there is no official word from either AMD or various motherboard makers.

T-FORCE, the gaming sub-brand of Team Group, has launched the blazing-fast VULCAN SO-DIMM DDR5 Memory for laptop gamers looking to upgrade to next-generation DDR5 memory. The VULCAN Memory delivers incredible performance with a simple installation and comes in a range of large capacities, making it the perfect choice for boosting one's gaming experience as well as productivity. Thanks to its ultra-thin graphene heatspreader that enhances cooling; it keeps laptops stable during intensive gaming and allows players to seize victory at the most critical moments.

Following the release of DDR5 desktop memory, the new generation of extremely-fast RAM from T-FORCE has swept the PC hardware world. Today, T-FORCE is launching its first VULCAN SO-DIMM DDR5 Memory designed specifically for gaming laptops. Offering a max clock rate of DDR5-5200 and featuring an ultra-thin graphene heatspreader, gamers will experience shorter load times and faster boot-up speeds while still maintaining low laptop temperatures. With up to 64 GB of capacity, players will enjoy unimpeded gaming and use work applications simultaneously. The new release of VULCAN SO-DIMM brings a whole new level of performance and user experience.

Colorful Technology Company Limited, a professional manufacturer of graphics cards, motherboards, all-in-one gaming and multimedia solutions, and high-performance storage, announces the Battle-Ax Redline Series gaming memory. Available in DDR4 and DDR5 memory kits, the Battle-Ax Redline Series are designed for the latest generation Intel and AMD platforms.

The Battle-Ax Redline Series sports a new look - a low-profile heatspreader with an aggressive styling that fits its beastly performance specifications. The Battle-Ax Redline DDR5 sports a white/red heatspreader while the Battle-Ax Redline DDR4 comes in black/red color.

Kingston today unveiled the FURY Renegade Pro DDR5 RDIMM memory for workstations based on the Intel W790 platform (Xeon W-3400 and W-2400 series "Sapphire Rapids" processors). The company is marking these as "overclockable" registered ECC DIMMs, as they come with Intel XMP 3.0 profiles that enable their advertised speeds on Intel platforms. The FURY Renegade Pro series comes in DDR5-6000 (32-38-38 1.35 V), DDR5-5600 (36-38-38 1.25 V), and DDR5-4800 (36-38-38 1.1 V) speed; with module densities of 16 GB and 32 GB (per DIMM); making up single-module kits, 4-module kits (for W-2400 platforms), and 8-module kits (for W-3400 platforms). The modules themselves are bare—lacking in heatspreaders, with a thin decal covering the DRAM chips. These are standard-height DIMMs.

In response to the increasing demand for powerful computing that can be relied on in a wide range of even the most challenging installation environments, leading industrial computing manufacturer and solution provider, OnLogic (www.onlogic.com), has unveiled their Helix 401 fanless industrial computer. The compact device is designed for use in edge computing, industry 4.0, Internet of Things (IoT), and many other emerging applications and will make its public debut at Embedded World 2023.

"You may never see them, but industrial computers are everywhere, working diligently to power technology solutions of every shape and size. These systems need to be small and reliable while still being just as powerful as high-end desktop machines," says Mike Walsh, Senior Product Manager at OnLogic. "The Helix 401 balances size and performance while providing a wide range of configuration possibilities to help users tailor it to their specific application. It's small enough to fit in your hand, similar in size to Intel's popular NUC, but capable enough to drive advanced automation solutions and power the next great smart agriculture, building automation or energy management innovation."

It has been reported by multiple users across several online communities that their Wii U consoles are no longer functioning properly. The error codes 160-0103 and 160-2155 are the dreaded indicators of memory corruption. It has been discovered that the NAND Flash within the Wii U's internal eMMC is prone to failure. According to details gleaned from teardowns of the console's hardware, Nintendo has implemented either Toshiba or Samsung flash storage boards for the various revisions of the console. There has been an uptick in the rate of bricked Wii U consoles across recent months, but the problems seem to have occurred as far back as 2015, according to archived posts on the GBA Temp forum. It is speculated that leaving the Wii U inactive for long periods of time can lead to the memory corruption issues.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is announcing an extreme performance DDR5 memory kit based on the latest 24 GB module capacity, with a specification of DDR5-8000 CL38-48-48 at 48 GB (24 GB x2) under the flagship Trident Z5 RGB series, and setting a new bar for extreme overclocked memory with 24 GB capacity modules.

With Samsung Electronics announcing that the next-generation GDDR7 memory standard is in development, and Cadence, a vital IP provider for DRAM PHY, EDA software, and validation tools announcing its latest validation solution, the decks are clear for the new memory standard to debut with the next-generation of GPUs. GDDR7 would succeed GDDR6, which had debuted in 2018, and has been around for nearly 5 years now. GDDR6 launched with speeds of 14 Gbps, and its derivatives are now in production with speeds as high as 24 Gbps. It provided a generational doubling in speeds from the preceding GDDR5.

The new GDDR7 promises the same, with its starting speeds said to be as high as 36 Gbps, going beyond the 50 Gbps mark in its lifecycle. A MyDrivers report says that NVIDIA's next-generation GeForce RTX 50-series, probably slated for a late-2024 debut, as well as AMD's competing RDNA4 graphics architecture, could introduce GDDR7 at its starting speeds of 36 Gbps. A GPU with a 256-bit wide GDDR7 interface would enjoy 1.15 TB/s of bandwidth, and one with 384-bit would have a cool 1.7 TB/s to play with. We still don't know what is the codename of NVIDIA's next graphics architecture, it could be any of the ones NVIDIA hasn't used from the image below.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced new high-speed 7000MT/s 48 GB (2x 24 GB) VENGEANCE RGB DDR5 and VENGEANCE DDR5 memory kits, as well as the general availability of its massive 192 GB (4x 48 GB) DDR5-5200 kits. CORSAIR has worked closely with motherboard manufacturer ASUS to ensure that these new kits work flawlessly across its full range of 700 series motherboards, making them an ideal high-speed companion for the latest 13th Gen Intel Core processors.

These new memory kits are compatible with all Intel 700 series motherboards, but the close working relationship between ASUS and CORSAIR demonstrates both company's commitment to delivering optimal performance and compatibility for customers. Rigorous testing of these new VENGEANCE DDR5 memory kits ensures they work across the full range of ASUS motherboards, including at the new higher DDR5-7000 speeds.

Netac on Wednesday launched the Hurricane Z RGB line of premium DDR5 memory kits. These are characterized by their chunky aluminium heatspreaders that have a clear chrome finish (claimed to be silver-plated), and crowned by silicone addressable-RGB LED diffusers. The company released dual-channel (two module) kits with densities of 32 GB (2x 16 GB), across six speed-based variants.

At the very top is a DDR5-8000 variant with 38-48-48-128 timings and 1.5 V module voltage; followed by a DDR5-7600 variant that offers 36-46-46-122 timings at 1.4 V. A notch below is the DDR5-7200 variant with 34-45-45-115 timings and 1.4 V; followed by a DDR5-6600 variant with slightly tighter 34-40-40-105 timings at the same 1.4 V. The DDR5-6200 variant offers a tighter 32-38-38-96 timings at 1.35 V, while the series begins with a DDR5-6000 variant with 36-36-36-96 timings at 1.35 V. All six variants rely on XMP 3.0 profiles to enable their advertised speeds and timings. Under the hood, these modules are using SK hynix-sourced DRAM chips. Netac released the Hurricane Z RGB series in China first, where its prices range between the equivalent of $203 and $335, depending on the model.

Lexar, a leading global brand of flash memory solutions, is excited to announce Lexar ARES RGB DDR5 Desktop Memory. Specifically designed for gaming, this next-gen DDR5 memory delivers superior performance with speeds starting at DDR5-5600 and up to DDR5-6000, and with quick CL32-36-36-68 / CL34-38-38-76 timings (XMP 3.0 & EXPO). A premium aluminium heatspreader keeps the gaming system cool for ultra-fast performance.

Lexar ARES RGB DDR5 Desktop Memory features on-board Power Management IC (PMIC) to provide better power control and power delivery and it also includes Lexar RGB Sync which lets gamers customize the RGB LED to their own style. "Lexar ARES RGB DDR5 Desktop Memory provides the performance that gamers need to master the latest games—and the upcoming titles that will require the speed and capacity of DDR5," said Joey Lopez, Director Brand Marketing. "And in addition to the performance, this memory also features Lexar RGB Sync so gamers can play in style."

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce the return of the 7th Annual OC World Cup 2023, after a 3-year hiatus. The G.SKILL OC World Cup extreme overclocking competition will begin with the Online Qualifier stage, held from March 1, 2023 until April 5, 2023 on hwbot.org. Then the top 9 overclockers of the online qualifier will become finalists, who are qualified to join the live competition at the G.SKILL booth during Computex 2023 week from May 30, 2023 to June 2, 2023 and compete for a portion of the $40,000 USD total cash prize pool, with the OC Champion title taking home $10,000 USD!

With the participation of top extreme overclockers from around the world and carefully crafted rules designed to test the ability of each overclocker, the G.SKILL OC World Cup is considered to be one of the most challenging overclocking competition by professional overclockers. The G.SKILL OC World Cup consists of three rounds: Online Qualifier, Live Qualifier, and Grand Final. The top 9 overclockers of the Online Qualifier will be eligible to enter the Live Qualifier stage during the week of Computex 2023 at the G.SKILL booth, and the top 3 overclockers from the Live Qualifier stage will compete for the title of OC Champion in the Grand Final.

ASRock is announcing the support of 48 GB and 24 GB DDR5 memory module across Intel 700 and 600 Series motherboards, boosting the maximum memory capacity from 128 GB to 192 GB on 4 DIMMs, providing performance and compatibility to enthusiasts.

For maximum performance, BIOS update is recommended to achieve a boost of system performance as well as memory capacity, increasing productivity for memory demanding multitasking applications.

According to SkatterBench, a website known for incredible overclocking attempts, we get to see AMD's Ryzen 7000 series integrated GPU get up to 42% performance improvement from overclocking. Specifically, the SKU used in the attempt was the Ryzen 9 7900 non-X model with 12 cores and 24 threads, clocked at 3.7 GHz base frequency and 5.4 GHz boost speed. The SKU contains a basic AMD GPU integrated into the package; however, not meant for any serious gaming tasks. Nonetheless, it is interesting to see what a two-core RDNA2 GPU clocked at 2.2 GHz managed to achieve once overclocked. The memory clock of the GPU is set to 2.4 GHz at stock.

Running at the base voltage of 0.997 volts under Furmark workload, the iGPU consumes around 38.5 Watts. However, the overclocking attempt pushed the voltage to 1.395 Volts, resulting in a 3.1 GHz iGPU frequency. The GPU Memory clock is now set to 3200 MHz, and the GPU+SOC power is 60.689 Watts, almost double compared to the stock settings. The overclocker used a GFX curve optimizer with various system tweaks to achieve these numbers. While the OC attempt was successful, the most significant performance improvement was a 42% increase, with some game titles averaging less. Below, the blue bar indicates stock, while the green bar indicates OC'd performance. You can check out the YouTube video as well to see more details.