Micron Technology, Inc.,, today announced it is shipping the Micron 2550 NVMe SSD to global PC OEM customers for use in mainstream laptops and desktops. The 2550 is the world's first client SSD to ship using NAND over 200 layers. Delivering performance that eclipses the competition through its density and power advantages, the 2550 provides users with responsiveness and the low power consumption needed to extend battery life for work and home PCs.

"We focused on delivering a superior user experience for PC users with this SSD," said Praveen Vaidyanathan, vice president and general manager of the Client Storage Group at Micron. "The new 2550 SSD builds on our established and broadly adopted PCIe Gen4 architecture. It also incorporates Micron's industry-leading 232-layer NAND and focuses on thermal architecture and power design. These capabilities deliver impressive application performance and phenomenal power savings."

The next-generation GDDR7 memory standard is shaping up nicely, to double bandwidth and density over the current GDDR6. In a company presentation detailing upcoming memory technologies, Samsung revealed that GDDR7 uses PAM3 signalling. While ones and zeroes are stored in DRAM memory cells, it is transmitted between devices (such as the DRAM chip and the GPU) in electrical waveforms known as "signals." Ones and zeroes are interpreted by patterns in the signal waveform.

Conventional GDDR6 memory uses NRZ (non-return to zero) or PAM2 signalling to achieve data-rates starting from 14 Gbps, with 24 Gbps expected to be the fastest production GDDR6 memory speed on offer, however some of the faster GDDR6 speeds such as 18 Gbps, 20 Gbps, and 22 Gbps couldn't hit production soon enough for the development phase of the GeForce RTX 30-series "Ampere" GPU, and so NVIDIA and Micron Technology co-developed the GDDR6X standard leveraging PAM4 signalling, to offer speeds ranging between 18 Gbps to 23 Gbps (or higher) several quarters ahead of this faster JEDEC-standard GDDR6.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, at the 2022 Super Computing Conference is unveiling the most extensive portfolio of servers and storage systems in the industry based on the upcoming 4th Gen Intel Xeon Scalable processor, formerly codenamed Sapphire Rapids. Supermicro continues to use its Building Block Solutions approach to deliver state-of-the-art and secure systems for the most demanding AI, Cloud, and 5G Edge requirements. The systems support high-performance CPUs and DDR5 memory with up to 2X the performance and capacities up to 512 GB DIMMs and PCIe 5.0, which doubles I/O bandwidth. Intel Xeon CPU Max Series CPUs (formerly codenamed Sapphire Rapids HBM High Bandwidth Memory (HBM)) is also available on a range of Supermicro X13 systems. In addition, support for high ambient temperature environments at up to 40° C (104° F), with servers designed for air and liquid cooling for optimal efficiency, are rack-scale optimized with open industry standard designs and improved security and manageability.

"Supermicro is once again at the forefront of delivering the broadest portfolio of systems based on the latest technology from Intel," stated Charles Liang, president and CEO of Supermicro. "Our Total IT Solutions strategy enables us to deliver a complete solution to our customers, which includes hardware, software, rack-scale testing, and liquid cooling. Our innovative platform design and architecture bring the best from the 4th Gen Intel Xeon Scalable processors, delivering maximum performance, configurability, and power savings to tackle the growing demand for performance and energy efficiency. The systems are rack-scale optimized with Supermicro's significant growth of rack-scale manufacturing of up to 3X rack capacity."

Eliyan Corporation, credited for the invention of the semiconductor industry's highest-performance and most efficient chiplet interconnect, today announced two major milestones in the commercialization of its technology for multi-die chiplet integration: the close of its Series A $40M funding round, and the successful tapeout of its technology on an industry standard 5-nanometer (nm) process.

Eliyan's NuLink PHY and NuGear technologies address the critical need for a commercially viable approach to enabling high performance and cost-effectiveness in the connection of homogeneous and heterogenous architectures on a standard, organic chip substrate. It has proven to achieve similar bandwidth, power efficiency, and latency as die-to-die implementations using advanced packaging technologies, but without the other drawbacks of specialized approaches.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today revealed the supreme performance of XMP DDR5-8000 on Z790 AORUS XTREME and Z790 AORUS MASTER motherboards with Team Group gaming modules T-FORCE DELTA RGB DDR5 memory. Enhanced with the exclusive Low Latency and High Bandwidth technology, this achievement proves again that GIGABYTE motherboard is the ultimate choice to unleash memory performance, as well as the leading role of memory performance by the teamwork of GIGABYTE vs. Team Group.

It's always been challenging to constantly exceed the high-frequency record of memory, and stable motherboards and high-performance memories make a perfect team to accomplish this difficult task. To provide superior performance and user experience, GIGABYTE has been working closely with Team Group on the record-breaking performance from DDR5-7600, DDR-7800, to XMP DDR5 8000. The detailed memory information is listed in the memory support list of the motherboard, users can check on the site for the best performance matrix on the Z790 platform.

KLEVV, an emerging memory brand introduced by Essencore, unveils its latest DDR5 standard U-DIMM and SO-DIMM memory running at 5600MT/s. Designed to support both AMD's latest Ryzen 7000 series processors and AM5 platform as well as Intel's 13th Gen Raptor Lake processors and Z790 motherboards, featuring blisteringly fast speed with a highly efficient power to performance ratio.

To cater the growing demand for high-speed computing with a highly versatile product selection, KLEVV introduces a brand-new 5600 MT/s version to its DDR5 standard desktop and laptop memory lineup. Fully compliant with JEDEC standards, the new 5600MT/s DDR5 memory is the latest addition to KLEVV's DDR5 U-DIMM and SO-DIMM lineup with the pre-existing 4800 MT/s memory.

SMART Modular Technologies, Inc. ("SMART"), a division of SGH and a global leader in memory solutions, solid-state drives and hybrid storage products today announced the addition of new DDR5 16 GB and 32 GB Very Low Profile Error-Correction Code Unbuffered Dual In-Line Memory Modules (VLP ECC UDIMM) to its lineup of blade memory VLP module products.

SMART's new DuraMemory DDR5 VLP ECC UDIMMs are designed for 1U blade servers and blade enclosure systems used in networking, telecom, compute and storage applications that are optimized to minimize space and power. DDR5 VLP ECC UDIMMs are designed to meet height, density, power, and performance specifications needed to enable the next generation of memory applications.

Kioxia Corporation, the world leader in memory solutions, has developed an image classification system based on Memory-Centric AI, an AI technology that utilizes high-capacity storage. The system classifies images using a neural network that refers to knowledge stored in external high-capacity storage; this avoids "catastrophic forgetting," one of the major challenges of neural networks, and allows knowledge to be added or updated without the loss of current knowledge. This technology was presented on October 25 at the oral session of European Conference on Computer Vision 2022 (ECCV 2022) in Tel Aviv, one of the top conferences in the field of computer vision.

In conventional AI techniques, neural networks are trained to acquire knowledge by updating parameters called "weights." Once fully trained, in order to acquire new knowledge a neural network must be either re-trained from the beginning or fine-tuned with new data. The former requires huge amounts of time and consumes significant energy costs, while the latter requires parameters to be updated and faces the catastrophic forgetting problem of losing the knowledge acquired in the past which leads to deterioration of classification accuracy.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced that Z790 AORUS TACHYON pushes the envelope of memory performance to XMP DDR5-8333 and DDR5-9300 O.C. with air cooling. On top of that, the phenomenal performance of XMP DDR5-8000 on Z790 AORUS XTREME and Z790 AORUS MASTER motherboards proves the enhancements from hardware to firmware including top-quality components, new generation Shielded Memory Routing design, and High Bandwidth of BIOS setting greatly improve memory stability and performance.

Enhanced by the new generation Shielded Memory Routing and low signal-loss PCB design, GIGABYTE Z790 AORUS TACHYON, Z790 AORUS XTREME, and Z790 AORUS MASTER can effectively reduce the internal and external signal loss or interference, which ensures blasting-fast DDR5 memory speed. In addition, the abundant BIOS setting of DDR5 Memory Upgrade and XMP 3.0 User Profile lead to the breakthrough performance of memories.

Colorful Technology Company Limited, a professional manufacturer of graphics cards, motherboards, all-in-one gaming and multimedia solutions, and high-performance storage, announces the new Battle-AX memory kits with support for the latest Intel platform, available in DDR4 and DDR5 memory modules. COLORFUL also launches two new CN Series NVMe SSDs in PCIe Gen4 and PCIe Gen3 interfaces. The new memory and storage products aim to provide builders upgrading to the newer mainstream system platforms as well as older generation systems with DDR4 memory and PCIe Gen 3 M.2 SSD slots.

The COLORFUL Battle-AX DDR5 and DDR4 memory is perfect for mainstream users that plan to upgrade to the latest Intel platforms. The Battle-AX DDR5 memory sports a black heatspreader while the Battle-AX DDR4 sports a white heatspreader. The Battle-AX DDR5 memory is available in 8 GB and 16 GB modules and frequencies of DDR5-4800 and DDR5-5200. The Battle-AX DDR4 memory is also available in 8 GB and 16 GB modules and frequencies of DDR4-3200 and DDR4-3600. The Battle-AX DDR5 memory supports Intel XMP 3.0 for quick and easy memory overclocking via the BIOS. The COLORFUL Battle-AX Series memory is covered with 3-year warranty.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today revealed the phenomenal performance of XMP DDR5-7800 on Z790 AORUS XTREME and Z790 AORUS MASTER motherboards with Team Group gaming modules T-FORCE DELTA RGB DDR5 memory. Enhanced with the new generation Shielded Memory Routing design, exclusive BIOS setting, top-quality components, and advanced design from hardware to firmware on motherboards, this achievement of memory stability and performance proves again GIGABYTE's strong leading role in high-performance motherboards in the market.

When it comes to pushing the memory frequency to the limits, a stable platform with top-quality materials always plays a key role in addition to high-performance memories. Enhanced by the new generation Shielded Memory Routing and low signal-loss PCB design, Z790 AORUS XTREME and Z790 AORUS MASTER can effectively reduce the internal and external signal loss or interference, which ensures blasting-fast DDR5 memory speed. In addition, the abundant BIOS setting of DDR5 Memory Upgrade and XMP 3.0 User Profile lead to the breakthrough performance of XMP DDR5-7800 with T-FORCE DELTA RGB DDR5. The detailed memory information is listed in the memory support list of the motherboard, users can check on the site for the best performance matrix on the Z790 platform.

Leading memory brand Team Group has continued to develop its industrial products in line with the demands of industrial customers. By integrating key technologies with its excellent R&D capabilities and focusing research on the diverse needs of industrial customers, Team Group has been able to develop a storage IC sorting technology and a durable storage device technology with anti-sulfuration and high voltage protections. These innovations have obtained Taiwan Invention Patents No. I751093 and I771910 as well as a U.S. Invention Patent, targeting emerging markets such as 5G, edge computing, and electric vehicles, meeting the requirements of industrial clients in a wide variety of environments.

As emerging 5G industrial applications becoming more diverse, memory stability and reliability have become increasingly difficult to maintain. Since, on one hand, memory retains data in a shorter period of time as in harsh environments and, on the other hand, industrial-grade memory that strives for stability requires longer data retention, the new IC sorting technology was designed to test whether the data retention of a memory device is within a safe range by means of an interrupting charge method. It is also used to ensure each of the sorted ICs is able to operate in the wide range of temperature and analyze whether the memory can be used stably under certain environments. Team Group's another innovation, the durable storage device technology, uses anti-sulfurated and high voltage resistant passive components placed on a specially designed multi-layer printed circuit board to protect against high voltages, surges, and sulfurization.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, today excited to announce the partnership with leading memory brand Team Group to release the all new T-FORCE DELTA RGB DDR5 VALKYRIE Edition desktop memory. The new T-FORCE DELTA RGB DDR5 VALKYRIE Edition desktop RAMs are the collaborative effort of two leading tech brands, Team Group and BIOSTAR. Carrying the legendary DNA of BIOSTAR's flagship VALKYRIE design language and T-FORCE DELTA RGB DDR5 desktop memory technology, the all new T-FORCE DELTA RGB DDR5 VALKYRIE Edition RAMs bring superior design, technology, and next-level engineering with jaw-dropping performance unparalleled in its class.

Its stealth fighter-influenced look features the signature wide-angled heatspreader with mesmerizing RGB lightning, unlike any other RAM on the market. Powered by a next-generation intelligent RGB control chip, it allows users full reign over limitless lighting customization using BIOSTAR's Advanced VIVID LED DJ software to create a highly personalized ambiance inside the system. Furthermore, the signature golden wings logo of BIOSTAR's VALKYRIE, together with T-FORCE's iconic wings logo, signify the Norse warriors' majestic wings and stands as a symbol of power and authority with its sleek streamlined design elements.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce new extreme overclocked performance DDR5 DRAM specifications up to DDR5-7800 under the Trident Z5 family. Designed for use with the latest 13th Gen Intel Core desktop processor and Intel Z790 chipset platform, these new flagship specifications mark a new era of DDR5 performance.

Pushing the memory performance to the limits of the latest 13th Gen Intel Core desktop processor and Intel Z790 chipset platform, G.SKILL is announcing new DDR5 memory specifications up to a blazing speed of DDR5-7800 at CL38 with 32 GB (2x 16 GB) kit capacity, under the flagship Trident Z5 family. Refer to the screenshot below to see the DDR5-7800 memory kit validated on the Intel Core i9-13900K desktop processor and ASUS ROG Maximus Z790 Apex motherboard.

According to the latest TrendForce research, pandemic-induced materials shortages abated in the second half of this year and the supply and delivery of short-term materials has recovered significantly. However, assuming materials supply is secure and demand can be met, the annual growth rate of server shipments in 2023 is estimated to be only 3.7%, which is lower than 5.1% in 2022.

TrendForce indicates that this growth slowdown is due to three factors. First, once material mismatch issues had eased, buyers began adjusting previously placed purchase order overruns. Thus, ODM orders also decreased but this will not affect the 2022 shipment volume of whole servers for the time being. Second, due to the impact of rising inflation and weakness in the overall economy, corporate capital investment may trend more conservative and IT-related investment will emphasize flexibility, such as the replacement of certain server terminals with cloud services. Third, geopolitical changes will drive the continuing emergence of demand for small-scale data centers and previous construction of hyperscale data centers will slow. The recent ban on military/HPC servers issued by the U.S. Department of Commerce on October 7 has a very low market share in terms of its application category, so the impact on the overall server market is limited at present. However, if the scope of the ban is expanded further in the future, it will herald a more significant slowdown risk for China's server shipment momentum in 2023.

Just two months after introducing the first CXL memory sample in August, SK hynix has successfully developed a computational memory solution, becoming the industry's first to integrate computational functions into CXL memory. The solution, a result of a close collaboration with SK Telecom from early on for optimization of the next-generation, high-performance computing infra system, marks a meaningful case where SK Group's ICT companies converged their technologies for a joint development.

Unveiling both the CMS and its software platform at the Open Compute Project (OCP) Global Summit 2022 taking place from Oct. 18 in San Jose, USA, SK hynix showed a next-generation high-performance computing infrastructure solution as well as the value of the solution from the customer's perspective. The solution is expected to be installed on next-generation server platforms to improve system performance as well as energy efficiency.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that its latest LPDDR5X DRAM with the industry's fastest speed of 8.5 gigabits per second (Gbps) was validated for use on Snapdragon mobile platforms. By optimizing a high-speed signal environment between application processor and memory, Samsung has surpassed the previous maximum speed of 7.5 Gbps achieved in March, reaffirming its leadership in the memory market.

As a global leader in the mobile DRAM market for more than a decade, Samsung has been driving mainstream adoption of high-end smartphones, enabling many more consumers to experience powerful computing performance on their mobile devices. Thanks to its low-power and high-performance characteristics, LPDDR DRAM is quickly becoming pervasive in modern computing systems, expanding beyond smartphones and into PCs, high-performance computing (HPC), servers and automobiles, where it has enjoyed robust growth in the last few years.

Thermaltake, the leading PC DIY premium brand for Case, Power, Cooling, Gaming peripherals, and enthusiast Memory solutions, introduces the ARGENT P900 Smart Gaming Desk, a smart, individual, and unique gaming desk designed with STUDIO F. A. PORSCHE. The ARGENT P900 Smart Gaming Desk is vastly different from what's currently on the market. Not only has it got a wide array of smart features you can utilize to dramatically boost your efficiency in everyday tasks, but it has sophisticated and ergonomic design aesthetics you can behold and appreciate every time you lay your eyes on it. Let's have a closer look at why this will be a perfect desk for your setup.

Designed with STUDIO F. A. PORSCHE, the ARGENT P900 Smart Gaming Desk is feature-packed, ultra high-quality, and will change the way you game and work for the better. To kick off, the ARGENT P900 features a built-in control unit and RGB Desk Mobile App, the exclusive app developed for the ARGENT P900, allowing desk heights and RGB lighting effects to be easily tweaked to your satisfaction. As you get to have control over the desk on your phone or PC via WiFi without unpleasant connection issues, it opens the door for you to redefine what a smart desk can be.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today revealed the breakthrough DDR5 performance of XMP DDR5-7600 and O.C. performance to DDR5-7950 under fan cooling on Z790 AORUS XTREME and MASTER motherboards with Team Group gaming modules T-FORCE DELTA RGB DDR5 7200 memory. Featuring Shielded Memory Routing of SMD memory DIMM, exclusive DDR5 overclocking BIOS setting, top-quality components, and enhanced design from hardware to firmware on motherboards, this performance proves GIGABYTE's strong leading role in product quality and performance.

To unleash the ultimate DDR5 performance, GIGABYTE Z790 AORUS XTREME and MASTER implement new generation Shielded Memory Routing design. By optimizing memory trace width, length, and style from HPC simulation to actual implementation, overall impedance is lowered between CPU memory controller and memory modules. Further with low signal-loss PCB, signal loss inside PCB and external interference are greatly reduced which can maintain high-speed DDR5 signal transmission to achieve higher DDR5 speed. In addition, the abundant BIOS setting of DDR5 Memory Upgrade and XMP 3.0 User Profile lead to the breakthrough performance of XMP DDR5-7600 and DDR5-7950 O.C. under fan cooling with T-FORCE DELTA RGB DDR5 7200 memory. The detailed memory information is listed in the memory support list of the motherboard.

Kioxia Corporation, a world leader in memory solutions, today announced the industry's first 2 terabyte (TB) microSDXC memory card working prototypes. Using its innovative BiCS FLASH 3D flash memory and an in-house designed controller, basic functions of the KIOXIA 2 TB microSDXC UHS-I memory card working prototypes were confirmed in the microSDXC standard's maximum density.

As the data recording capacity of smartphones, action cameras, and portable game consoles continues to increase, the need for ultra-high capacity SD memory cards to store all of this data has never been higher. The SD Association's SDXC specification has supported memory cards up to 2 TB for more than a decade—but 2 TB cards have not been successfully manufactured until now.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced its comprehensive product readiness for the newly available AMD Ryzen 7000 series of processors and the accompanying X670 and B650 chipset motherboards. From a new dedicated range of CORSAIR DDR5 memory for AMD platforms, to a huge lineup of award-winning CPU coolers, PC power supplies, cases and accessories, CORSAIR has the complete lineup of products to help enthusiasts build their new AMD-powered PC.

New AMD Ryzen 7000 processors and their supporting X670 and B650 chipset motherboards bring with them a huge change from past generations in the adoption of DDR5 memory, substantially increasing memory frequency versus DDR4. CORSAIR has a complete range of performance DDR5 created especially for AMD platforms, including the illustrious DOMINATOR PLATINUM RGB DDR5, the panoramically lit VENGEANCE RGB DDR5, or minimalist VENGEANCE DDR5. Available in a range of frequencies up to 6,000 MHz and capacities up to 64 GB, all CORSAIR DDR5 memory for AMD supports the new AMD EXPO (Extended Profiles for Overclocking) standard, offering single-setting-setup to ensure owners can easily run their memory at the speed it was created to run at.

Leading memory provider Team Group has reached a new level of DDR5 performance with its newest memory kit under the T-FORCE gaming sub-brand. Today, it has launched the DELTA RGB DDR5 DESKTOP MEMORY with an updated clock rate of up to 7,200 MHz to go along with Intel's recently released 13th generation CPUs and the new generation of 700 series motherboards from various motherboard manufacturers. Gamers around the world can reach new heights of DDR5 performance and experience the thrill of gaming with blazing fast clock speeds.

With T-FORCE LAB's stellar R&D capabilities and the use of carefully selected high-quality ICs, Team Group has taken the lead in introducing high-speed DDR5 16 GB dual-channel memory kits with clock rates of 6,800 MHz, 7,000 MHz, and 7,200 MHz for its DELTA RGB DDR5 DESKTOP MEMORY. It uses a special thermal module that combines cooling silicone and an aluminium alloy heatsink, allowing it to dissipate heat extremely effectively while overlocked and performing under high loads. Furthermore, it is certified by motherboard manufacturers ASRock, ASUS, Biostar, GIGABYTE, and MSI to be compatible with their respective lighting software. The desktop memory not only provides outstanding stability and performance but also the ability to freely customize RGB effects, allowing gamers to create truly unique and striking PC builds.

KLEVV, an emerging memory brand introduced by Essencore, is thrilled to unveil its latest extreme performance DDR5 overclocking/gaming memory, the CRAS XR5 RGB DDR5 memory kit. Tailor-made to synergize well with the latest 12th Gen Intel Core desktop processors and Intel Z690 chipset motherboards, the CRAS XR5 RGB DDR5 memory brings leading-edge DDR5 technology with jaw-dropping performance like never before.

Pushing the envelope of technology while focusing on craftsmanship, KLEVV showcases superior product design language and engineering prowess with the new flagship CRAS XR5 RGB DDR5 memory, designed to empower overclockers, PC enthusiasts, gamers, and professional content creators with mind blowing performance.

NVIDIA's high-performance computing hardware stack is now equipped with the top-of-the-line Hopper H100 GPU. It features 16896 or 14592 CUDA cores, developing if it comes in SXM5 of PCIe variant, with the former being more powerful. Both variants come with a 5120-bit interface, with the SXM5 version using HBM3 memory running at 3.0 Gbps speed and the PCIe version using HBM2E memory running at 2.0 Gbps. Both versions use the same capacity capped at 80 GBs. However, that could soon change with the latest rumor suggesting that NVIDIA could be preparing a PCIe version of Hopper H100 GPU with 120 GBs of an unknown type of memory installed.

According to the Chinese website "s-ss.cc" the 120 GB variant of the H100 PCIe card will feature an entire GH100 chip with everything unlocked. As the site suggests, this version will improve memory capacity and performance over the regular H100 PCIe SKU. With HPC workloads increasing in size and complexity, more significant memory allocation is needed for better performance. With the recent advances in Large Language Models (LLMs), AI workloads use trillions of parameters for tranining, most of which is done on GPUs like NVIDIA H100.

ZOTAC launched the ZBOX edge CI342, a compact fanless mini-PC powered by an Intel Pentium N6415 "Elkhart Lake" quad-core processor clocked at speeds of up to 3.00 GHz. The ZBOX measures just 147.2 mm x 147.2 mm x 32.1 mm (WxDxH), with a passive cooling solution for the SoC that has a TDP of just 6.5 W. It offers an impressive set of connectivity options, which include DisplayPort 1.2 and HDMI 2.0b making up the display outputs; three 5 Gbps USB 3.1 ports that include a type-C, a microSD card reader, two 1 GbE wired LAN interfaces, and Wi-Fi 6E + Bluetooth 5.2 WLAN. It's still being sold as a "barebones," meaning that you add your own RAM and storage. Memory options include two DDR4 SODIMM slots (dual-channel), and the only storage interface is an M.2-2280 slot with PCI-Express 3.0 x2 wiring. ZOTAC is also offering a non-barebones complete prebuilt with Windows 11, which includes one 4 GB DDR4-3200 SODIMM stick, and a 128 GB NVMe SSD.