G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce a new white colored edition of its flagship Trident Z5 RGB series DDR5 memory, featuring extreme overclocked speeds of up to DDR5-8200 at 24 GB x 2 kit capacity.

The White Choice of Overclocked Performance DDR5 Memory
The new white version of the Trident Z5 RGB series boasts a sleek white aluminium heat spreader and features a black brushed-aluminium strip inset across the center, providing PC enthusiasts an ideal high-performance overclocked memory kit in a white themed PC build.

NVIDIA's compute and AI-oriented H100 GPU is supposedly getting an upgrade. The H100 GPU is NVIDIA's most powerful offering and comes in a few different flavors: H100 PCIe, H100 SXM, and H100 NVL (a duo of two GPUs). Currently, the H100 GPU comes with 80 GB of HBM2E, both in the PCIe and SXM5 version of the card. A notable exception if the H100 NVL, which comes with 188 GB of HBM3, but that is for two cards, making it 94 GB per each. However, we could see NVIDIA enable 94 and 64 GB options for the H100 accelerator soon, as the latest PCI ID Repository shows.

According to the PCI ID Repository listing, two messages are posted: "Kindly help to add H100 SXM5 64 GB into 2337." and "Kindly help to add H100 SXM5 94 GB into 2339." These two messages indicate that NVIDIA could prepare its H100 in more variations. In September 2022, we saw NVIDIA prepare an H100 variation with 120 GB of memory, but that still isn't official. These PCIe IDs could just come from engineering samples that NVIDIA is testing in the labs, and these cards could never appear on any market. So, we have to wait and see how it plays out.

Lam Research Corp. (Nasdaq: LRCX) today introduced Coronus DX, the industry's first bevel deposition solution optimized to address key manufacturing challenges in next-generation logic, 3D NAND and advanced packaging applications. As semiconductors continue to scale, manufacturing becomes increasingly complex with hundreds of process steps needed to build nanometer-sized devices on a silicon wafer. In a single step, Coronus DX deposits a proprietary layer of protective film on both sides of the wafer edge that helps prevent defects and damage that can often occur during advanced semiconductor manufacturing. This powerful protection increases yield and enables chipmakers to implement new leading-edge processes for the production of next-generation chips. Coronus DX is the newest addition to the Coronus product family and extends Lam's leadership in bevel technology.

"In the era of 3D chipmaking, production is complex and costly," said Sesha Varadarajan, senior vice present of the Global Products Group at Lam Research. "Building on Lam's expertise in bevel innovation, Coronus DX helps drive more predictable manufacturing and significantly higher yield, paving the way for adoption of advanced logic, packaging and 3D NAND production processes that weren't previously feasible."

Neo Forza, a Taiwanese brand entity under Goldkey Technology Corporation, had a booth at Computex 2023, where the company showed its next-generation memory and storage products. Starting off, the company presented its DDR5 memory kits running at 8000 MHz speeds, indicating the maturity of DDR5 and that we are way past the initial 4800 MHz speeds at launch. The demonstrated kit was a part of the company's TRINITY lineup, which was displayed in white. For demo purposes, the kit was configured as two 16 GB DIMMs.

Next up, Neo Forza has showcased its next-generation PCIe Gen 5 NVMe SSD. Running at x4 lanes of the new PCIe 5.0 protocol, the 2 TB SSD was spotted running at 10 GB/s speeds in both read and write tasks set by CrystalDiskMark benchmark. Interestingly, the SSD also boasted a massive heatsink, as shown below.

Transcend brought its latest flash storage and PC memory products to Computex 2023. The company, much like Kingston and Micron, appears to be focusing on the high-volume mid-range of the market that it can sell both in the retail channel and to OEMs, without too much invested on niche high-end ones. To begin with, the company showed us its DDR5 UDIMMs and RDIMMs. Nothing flashy—these stick with JEDEC-standard speeds, such as DDR5-5600 (13th Gen native speed), and DDR5-4800.

The company doesn't have PCIe Gen 5 SSDs yet, but we were shown a handful Gen 4 ones meant for the DIY retail channel, including the PCIe SSD 250H (MTE250H), with its sporty heatsink, and extensive testing for PlayStation 5 compatibility; and its alter-ego without the heatsink, the PCIe SSD 250S (MTE250S). These drives come in capacities ranging between 1 TB to 4 TB, with sequential transfer speeds of up to 7.5 GB/s reads, and up to 6.7 GB/s writes. Also shown were a set of smaller NVMe Gen 3 SSDs in the M.2-2230 and M.2-2260 form-factors, the MTE300S and MTE400S, respectively. With capacities of just 256 GB and 512 GB for the MTE300S, and 256 GB thru 1 TB for the MTE400S, these drives are probably meant for hand-held game consoles, or low-cost desktop PCs, where OEMs or SIs buy them in large quantities.

Anacomda, a Taiwanese memory, storage, and accessories maker, had a booth at Computex 2023, where the company presented the new DDR5 memory kits with speeds ranging up to 7000 MHz. Starting off, we have the model called "Standard," which is just a standard DDR5 UDIMM memory kit available as 8 and 16 GB DIMM, in 2x 8 GB and 2x 16 GB capacities. Running at 4800 MHz, the standard kit has a CAS latency of 40, with a running voltage set to 1.1 Volts. Next is the KingSnake Overclocking UDIMM, which is, as the name suggests, a kit optimized for overclocking. Available in frequencies of 5600/6000/6200/7000 MHz, these memory modules run at 1.25 or 1.45 Volts at CAS latencies of 40 and 36. They also come in 16 GB and 32 GB capacities.

Last but not least, there is an ET (EryxTataricus) unbuffered UDIMM kit that is basically an RGB version of KingSnake, with all the same features except the inclusion of RGB lighting capable of syncing with all modern motherboard RGB software.

Essencore KLEVV brought in a formidable lineup of new PCIe Gen 5 NVMe SSDs and DDR5 memory for gamers and overclockers, at the 2023 Computex. The lineup is led by the KLEVV CRAS V RGB series of DDR5 memory that comes in high-end speeds of DDR5-6000 (30-36-36-76 @ 1.35 V), DDR5-6400 (32-38-38-78 @ 1.35 V), DDR5-7200 (34-44-44-84 @ 1.40 V), DDR5-7600 (36-46-46-86 @ 1.40 V), and DDR5-8000 (38-48-48-128 @ 1.55 V). These modules feature both Intel XMP 3.0 and AMD EXPO SPD profiles. The KLEVV BOLT V series form the company's mid-range, offering speeds of DDR5-6000 (30-36-36-76 @ 1.35 V), DDR5-6400 (32-38-38-78 @ 1.35 V), and DDR5-6800 (34-40-40-80 @ 1.35 V). Both XMP 3.0 and EXPO are to be found even with these modules. The company interestingly also has standard modules for DDR5-4800 and DDR5-5600, which make do with just 1.1 V. We also spied KLEVV's odd-capacity 24 GB and 48 GB CRAS V RGB modules.

The storage lineup for Essencore is led by the KLEVV CRAS C950 PCIe Gen 5 NVMe SSD, and the CRAS C910 Gen 4 SSD. The CRAS C950 comes in 1 TB, 2 TB, and 4 TB capacities, and uses a Phison E26-series controller paired with 3D TLC NAND flash. The 1 TB variant offers up to 11.5 GB/s sequential reads, with up to 8.5 GB/s sequential writes, while the 2 TB and 4 TB models do up to 12 GB/s sequential reads, with up to 11 GB/s sequential writes. The drive uses a chunky passive aluminium heatsink to keep cool. The CRAS C910, on the other hand, comes both as a bare drive (without heatsink), and as the CRAS C910 RGB, where it features a heatsink with an RGB diffuser. The drive uses an InnoGrit IG5220 controller, comes in capacities of up to 1 TB, and offers speeds of up to 5 GB/s sequential reads, with up to 4.8 GB/s sequential writes.

Continuing to move Universal Flash Storage (UFS) technology forward, KIOXIA America, Inc. today announced sampling of new, higher performing UFS Ver. 4.0 embedded flash memory devices. These devices deliver fast embedded storage transfer speeds in a small package size and are targeted to a variety of next-generation mobile applications, including leading-edge smartphones. The improved performance of UFS products from KIOXIA enables these applications to take advantage of 5G's connectivity benefits, leading to faster downloads, reduced lag time and an improved user experience.

UFS Ver. 4.0 devices from KIOXIA integrate the company's innovative BiCS FLASH 3D flash memory and a controller in a JEDEC-standard package. UFS 4.0 incorporates MIPI M-PHY 5.0 and UniPro 2.0 and supports theoretical interface speeds of up to 23.2 gigabits per second (Gbps) per lane or 46.4 Gbps per device. UFS 4.0 is backward compatible with UFS 3.1.

Team Group unveiled its mighty Team Xtreem DDR5 memory for overclocking, at the 2023 Computex. These modules are designed such that their PCBs are shorter than their height, and instead of cramming RGB LEDs on top, the 2 mm-thick aluminium heat spreader turns into an extruded heatsink. Some of the higher speed versions of these run at DRAM voltages as high as 1.45 V, so the heatsink design should come in handy. The T-Force Xtreem comes in speeds ranging between DDR5-6400 and DDR5-8266, and in capacities ranging from 16 GB (2x 8 GB), going all the way up to 96 GB (2x 48 GB). The T-Force Xtreem RGB has an additional design element in the form of an acrylic RGB LED diffuser, although from the looks of it, this acrylic bit seems to be covering the fins of the heat spreader. It comes in the same speed-based and capacity based variants, as the regular Xtreem DDR5.

At the 2023 Computex, we caught CORSAIR's flagship PC memory line, the DOMINATOR Titanium DDR5 series. These are built to, well, dominate the overclocking and benchmark records scene, and come in several high-speed models, such as DDR5-8000 and DDR5-8266, and capacities as high as 192 GB (4x 48 GB kits). The company also has a limited batch of 500 "First Edition" kits, which feature a gold-on-white color scheme, and the company's highest grade of manual binning.

A defining feature about the DOMINATOR Titanium DDR5 series is their heat spreader design, which consists of 2 mm-thick aluminium making contact with the DRAM chips, which connect to an upper copper heatsink with RGB LEDs studded. The edges of the top have mount-holes, so a set of 2 or 4 of these DIMMs can be bolted onto the company's latest DHX cooling module. This is essentially a chunky slab of anodized aluminium that soaks up and dissipates heat from the DIMMs, and has slats that let the RGB lighting through. CORSAIR is backing these with lifetime warranties, and plans to launch them in July 2023.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced the latest addition to its award-winning memory line-up, DOMINATOR TITANIUM DDR5 memory. Built using some of the fastest DDR5 ICs alongside patented CORSAIR DHX cooling technology for improved overclocking potential, DOMINATOR TITANIUM continues the DOMINATOR legacy with stunning design and blazing performance.

Sporting an elegant, fresh new design and built using premium materials and components, DOMINATOR TITANIUM DDR5 memory will be available for both Intel and AMD platforms, supporting Intel XMP 3.0 when paired with 12th and 13th-Gen Core processors or AMD EXPO for Ryzen 7000 CPUs. These technologies enable easy overclocking in just a couple of clicks on compatible platforms.

Leading memory brand, Team Group, returns to COMPUTEX 2023 with the theme "DAZZLE．CHILL．INTEGRATE" to introduce six new products in the memory, cooling solution, and storage device categories. They will be unveiled for the first time at COMPUTEX (5/30-6/2), showcasing Team Group's latest cooling solutions and "aurora" RGB lighting tech as the highlights of the grand exhibition. This year's exhibition is split into two display areas for T-FORCE and T-CREATE's new products. In addition to a large gradient LED screen that will demonstrate T-FORCE's industry-leading RGB technology, there will be physical display areas for the new products, each of which will create an immersive interactive experience that displays the cooling and aurora theme of the exhibition. Attendees will be met with a visual feast of colorful lighting and cool tech.

T-FORCE XTREEM ARGB DDR5 Gaming Overclocking Memory is equipped with innovative dual light pipes which utilize black translucent acrylic and multi-optical designs to display a soft aurora-like flow of light. The matte heat spreader of the XTREEM ARGB DDR5 is made of high-quality 2 mm black aluminium alloy, which has undergone aluminium extrusion, CNC processing, sandblasting, and black anodizing, creating a unique material that combines the hardness and durability of basalt and the soft texture of black beach sand. It comes in a variety of frequencies starting from DDR5-7000 to DDR5-8266 and is specially designed for gamers after an extreme performance and dazzling RGB lighting.

As COMPUTEX once again opens its door, MSI, the world leader in gaming, content creation, business & productivity, and AIoT solutions, is all geared up to dominate the show floor with a full slate of new lineup and its Best Choice Award honorees. "We are thrilled to be back at COMPUTEX," said Sam Chern, MSI Vice President of Marketing. "We expect to see users' tech experiences reinvented and MSI is at the forefront. Our COMPUTEX 2023 lineup showcases the ultimate fusion of breakthrough technology and everlasting aesthetics that surpasses all limits and indulges global users with the best possible experience like never before."

This year, MSI themes its booth around The Leap to Singularity, envisioning a future in which the technological singularity brings forth superintelligence to improve human lives. Among the highlights on display will be the Raider GE78 HX Smart Touchpad, Stealth 16 and Creator Z17 laptops powered by up to 13th Gen Intel Core i9 processors and NVIDIA GeForce RTX 40 Series graphics, making them powerhouses for gamers and creators alike.

ORIGIN PC, a leader in custom high-performance systems, today announced the launch of its new 14-inch, 40-Series powered laptops. The powerful EON14-S gaming laptop and NS-14 workstation laptop are available now. Gamers can rejoice as 40-Series gaming is now lightweight and portable. Enjoy the sights and buttery smooth frame-rates provided by next-gen hardware anywhere with the EON14-S. Streamers, content creators, and professionals now have access to an incredibly portable, yet powerful system to fuel their creative engine with an NS-14 laptop.

The EON14-S is a modern and reliable gaming machine that pushes a portable experience further than before without sacrificing performance. It can be equipped with up to an Intel Core i9-13900H 14-core processor, up to an NVIDIA GeForce RTX 4070 GPU, to 64 GB of DDR5 DRAM, and even 8 TB of storage. All while only 0.84 inches thin and 3.85 pounds light, it provides incredible speeds, frame rates, and connectivity to offer an immersive and full-fledged gaming experience on the go.

GeIL, one of the world's leading PC components & peripheral manufacturers today announced the latest Pristine R5 series as well as Spear R5 series server memory products, providing solutions not only for the needs of standard Registered DIMMs which fully complies with the JEDEC specifications but also the market of high-end applications which requires high-performance server memory.

GeIL stated that the popularity of online games and the metaverse brings not simply the growth momentum of the server market, related requirements such as the gaming service, the big data analysis, and AI applications also create the massive needs of cloud computing which customers are now asking for great performance rather than just focusing on stability, reliability and security when it comes to the server products. GeIL further pointed out that the demand for high-bandwidth and large-capacity server memory is therefore continuously and rapidly growing.

The Korea Intellectual Property Rights Information Service (KIPRIS) has been processing a bunch of trademark applications in recent weeks, submitted by Samsung Electronics Corporation. News outlets pointed out, earlier on this month, that the South Korean multinational manufacturing conglomerate was attempting to secure the term "Snowbolt" as a moniker for an unreleased HBM3P DRAM-based product. Industry insiders and Samsung representatives have indicated that high bandwidth memory (5 TB/s bandwidth speeds per stack) will be featured in upcoming cloud servers, high-performance and AI computing - slated for release later on in 2023.

A Samsung-focused news outlet, SamMobile, has reported (on May 15) of further trademark applications for next generation DRAM (Dynamic Random Access Memory) products. Samsung has filed for two additional monikers - "Shinebolt" and "Flamebolt" - details published online show that these products share the same "designated goods" descriptors with the preceding "Snowbolt" registration: "DRAM modules with high bandwidth for use in high-performance computing equipment, artificial intelligence, and supercomputing equipment" and "DRAM with high bandwidth for use in graphic cards." Kye Hyun Kyung, CEO of Samsung Semiconductor, has been talking up his company's ambitions of competing with rival TSMC in providing cutting edge component technology, especially in the field of AI computing. It is too early to determine whether these "-bolt" DRAM products will be part of that competitive move, but it is good to know that speedier memory is on the way - future generation GPUs are set to benefit.

Ampere Computing today announced a new AmpereOne Family of processors with up to 192 single threaded Ampere cores - the highest core count in the industry. This is the first product from Ampere based on the company's new custom core, built from the ground up and leveraging the company's internal IP. CEO Renée James, who founded Ampere Computing to offer a modern alternative to the industry with processors designed specifically for both efficiency and performance in the Cloud, said there was a fundamental shift happening that required a new approach.

"Every few decades of compute there has emerged a driving application or use of performance that sets a new bar of what is required of performance," James said. "The current driving uses are AI and connected everything combined with our continued use and desire for streaming media. We cannot continue to use power as a proxy for performance in the data center. At Ampere, we design our products to maximize performance at a sustainable power, so we can continue to drive the future of the industry."

Last year, Crucial canned its Ballistix brand of gaming focused memory, but it seems like the company still wants to offer its customers a more premium product, as Crucial has just introduced its new Pro series of memory products. Crucial will offer its new Pro series in both DDR5 and DDR4 flavours at either DDR5-5600 or DDR4-3200 speeds. It should be noted that the DDR4 modules still rely on a green PCB, while the DDR5 modules get the same black PCB as Crucial's regular DDR5 modules. Beyond the heatsink, there isn't much that differs between the Pro series and Crucial's regular modules, but there is one thing that might matter to potential buyers.

Crucial has added support for AMD EXPO and Intel XMP 3.0 to its Pro series of modules. In the case of AMD EXPO this only applies to DDR5 modules, whereas the DDR4 modules support Intel XMP 2.0, in this case a feature its standard DDR4 modules lack. This should make it easier for end users to take advantage of the extra performance offered by some of these modules. That said, as Crucial has stuck to JEDEC timings, taking the Pro DDR5-5600 UDIMM kit as an example, you end up with timings of 46-46-45-45 at 1.1 Volts, where competing products have timings in the range of 36-36-36-36, although usually at 1.25 Volts or higher. Even as far as JEDEC timing goes, Crucial has chosen the middle ground for DDR5 5600, as there is a timing option from JEDEC that supports 40-40-40-40, which would make more sense for a more premium product. Price wise, a 32 GB kit with two 16 GB modules of DD5-5600 modules carries an $11 price premium over Crucials standard modules, with a retail price of US$114.99 versus US$103.99, but there are better options out there at this price point.

The NAND memory industry is not in great shape at the moment, with the big three (Micron, Samsung, SK Hynix) having reported significant financial losses in this area recently. If you include Kioxia and Western Digital as part of this collective picture, a grand total of over $10 billion has been lost in the flash memory segment. According to DigiTimes Asia this week, Pua Khein-Seng - the chief executive officer of Phison Electronics Corporation - has warned that parts of the industry could collapse due to potential company bankruptcies.

Khein-Seng informed attendees at a press conference that forced NAND price cuts are not feasible in the current market environment, and that supply chains could be affected if related companies start to shutdown - due to operational losses. He expects 3D NAND manufacturers to cutback on output in order to soften the market, and unit price increases are also a possibility. Phison has experienced a drop in revenues for the first quarter of 2023, but the CEO insists that his company is not willing to cutback on research and development costs - 80% of its annual expense budget will be invested in future projects. Khein-Seng states that rival companies have reduced spending on R&D by 20%, yet Phison remains committed to its clients by providing cutting edge technology (for example the E26 SSD memory controller).

The latest AMD AGESA 1.0.0.7 AM5 platform microcode that the company recently released to improve stability of machines powered by Ryzen 7000X3D processors, more importantly, prevent them from physical damage due to increased voltage in voltage-assisted overclocking scenarios; reportedly impacts memory overclocking capabilities, too, reports g01d3nm4ng0. The "PROCHOT Control" and "PROCHOT Deassertation Ramp" toggles that were available in the oldest versions of AGESA for AM5, are not available in the latest production AGESA.

The memory compatibility is also affected. AMD recently added support for odd-density DDR5 memory modules, such as 24 GB and 48 GB, which make up 48 GB and 96 GB 2-module (dual-channel, four sub-channel) kits. It is possible to max out 192 GB, but while the older AGESA 1.0.0.6 allowed memory frequencies of up to DDR5-6000 with SoC voltage of 1.3 V, the newer AGESA is only stable up to DDR5-4400 at this density. To be fair, most motherboards advertise maximum memory frequencies of under DDR5-4800 for memory configurations where there are two DIMMs per channel, and both DIMMs are dual-rank (so four dual-rank DIMMs in all, which is the least optimal memory configuration from a memory frequency and latency perspective).

The new Sabrent Rocket CFX Type B (CF-XXIT) memory cards are here to give you the performance, endurance, and capacity you deserve. These cards come in at up to 2 TB with read/write speeds of up to 1,800/1,700 MB/s and sustained writes of up to 1,300 MB/s so that you are never slowed down. Massive IOPs let you quickly access any and all of your files rapidly. Capture and work with your HD content - videos, photographs, audio, and more - at high speeds, all in a convenient form factor. Don't settle for inferior storage media for your professional videography and photography needs.

Match your artistic vision. Revel in your element. Sabrent hardware is selected for performance, power efficiency, and reliability. These memory cards contain SSD-quality hardware with a powerful controller and fast flash memory for the smoothest takes. Features such as TRIM, LDPC, ECC, SmartRefresh, and wear-leveling keep your storage fast and enduring. Lose yourself in the moment and capture your vision. Who has time to deal with undependable, slow storage? Get the quality you deserve. Get Sabrent.

NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash and DRAM memory, today announced the launch of its ground-breaking technology, 3D X-DRAM. This development is the world's first 3D NAND-like DRAM cell array that is targeted to solve DRAM's capacity bottleneck and replace the entire 2D DRAM market. Relevant patent applications were published with the United States Patent Application Publication on April 6, 2023.

"3D X-DRAM will be the absolute future growth driver for the Semiconductor industry," said Andy Hsu, Founder and CEO of NEO Semiconductor and an accomplished technology inventor with more than 120 U.S. patents. "Today I can say with confidence that Neo is becoming a clear leader in the 3D DRAM market. Our invention, compared to the other solutions in the market today, is very simple and less expensive to manufacture and scale. The industry can expect to achieve 8X density and capacity improvements per decade with our 3D X-DRAM."

The 43rd edition of the Symposium on VLSI Technology & Circuits, held annually in Kyoto Japan, is charting the way forward for the devices of the future. Held between June 11-16, 2023, this year's symposium will see structured presentations, Q&A, and discussions on some of the biggest technological developments in the logic chip world. The lead (plenary) sessions drop a major hint on the way the wind is blowing. Leadning from the front is an address by Suraya Bhattacharya, Director, System-in-Package, A*STAR, IME, on "Multi-Chiplet Heterogeneous Integration Packaging for Semiconductor System Scaling."

Companies such as AMD and Intel read the tea-leaves, that Moore's Law is buckling, and it's no longer economically feasible to build large monolithic processors at the kind of prices they commanded a decade ago. This has caused companies to ration their allocation of the latest foundry node to only the specific components of their chip design that benefit the most from the latest node, and identify components that don't benefit as much, and disintegrate them into separate dies build on older foundry nodes, which are then connected through innovative packaging technologies.

v-color Technology Inc., an industry leader in cutting-edge memory solutions, proudly unveils the game-changing 48 GB (24 GB x2) DDR5-8200 38-52-52-130 Manta XPrism RGB Extreme OC Memory in a range of 7200 to 8200 MHz kits. This state-of-the-art memory module is meticulously designed to cater to the evolving needs of gamers, overclockers, and enthusiasts who demand top-notch performance, reliability, and aesthetics.

The Manta XPrism RGB 48 GB (24 GB x2) DDR5-8200 CL38 Extreme OC Memory is crafted with the latest technological advancements, delivering unbeatable speed and efficiency. Featuring a 48 GB memory capacity and a staggering 8200 MHz frequency, this DDR5 memory module is poised to transform the performance of any high-end gaming or workstation system.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is proud to announce the release of its latest DDR4 DRAM, the Heatsink Storming-V series. The DDR4 DRAM, Storming-V series, is a highly versatile memory module that caters to a wide range of users, from casual content consumption such as watching TV shows, movies and listening to music, to avid gamers who demand engaging stories, stunning graphics, and solid gameplay. Moreover, pro gamers who prioritize speed and performance will find the Heatsink Storming-V series highly appealing.

With its optimized memory speed, timing, voltage settings, and unique design that offers overclocking capabilities, ultra-fast data access, and optimal cooling, the Heatsink Storming-V series delivers unmatched performance and reliability. Therefore, whether you are a casual user or a pro gamer, the Storming-V series is the perfect memory module that caters to your specific needs.