Samsung stands as a technology giant in the industry, with tendrils stretching out towards almost every conceivable area of consumer, prosumer, and professional markets. It is also one of the companies which can actually bring up the fight to Intel when it comes to semiconductor manufacturing, with some analysts predicting the South Korean will dethrone Intel as the top chipmaker in Q2 of this year. Samsung scales from hyper-scale data centers to the internet-of-things, and is set to lead the industry with 8nm, 7nm, 6nm, 5nm, 4nm and 18nm FD-SOI in its newest process technology roadmap. The new Samsung roadmap shows how committed the company is (and the industry with it) towards enabling the highest performance possible from the depleting potential of the silicon medium. The 4 nm "post FinFET" structure process is set to be in risk production by 2020.

This announcement also marks Samsung's reiteration on the usage of EUV (Extreme Ultra Violet) tech towards wafer manufacturing, a technology that has long been hailed as the savior of denser processes, but has been ultimately pushed out of market adoption due to its complexity. Kelvin Low, senior director of foundry marketing at Samsung, said that the "magic number" for productivity (as in, with a sustainable investment/return ratio) with EUV is 1,500 wafers per day. Samsung has already exceeded 1,000 wafers per day and has a high degree of confidence that 1,500 wafers per day is achievable.

AMD finalized the GPU architecture roadmap running between 2016 and 2018. The company first detailed this at its Capsaicin Event in mid-March 2016. It sees the company's upcoming "Polaris" architecture, while making major architectural leaps over the current-generation, such as a 2.5-times performance/Watt uplift and driving the company's first 14 nanometer GPUs; being limited in its high-end graphics space presence. Polaris is rumored to drive graphics for Sony's upcoming 4K Ultra HD PlayStation, and as discrete GPUs, it will feature in only two chips - Polaris 10 "Ellesmere" and Polaris 11 "Baffin."

"Polaris" introduces several new features, such as HVEC (h.265) decode and encode hardware-acceleration, new display output standards such as DisplayPort 1.3 and HDMI 2.0; however, since neither Polaris 10 nor Polaris 11 are really "big" enthusiast chips that succeed the current "Fiji" silicon, will likely make do with current GDDR5/GDDR5X memory standards. That's not to say that Polaris 10 won't disrupt current performance-thru-enthusiast lineups, or even have the chops to take on NVIDIA's GP104. First-generation HBM limits the total memory amount to 4 GB over a 4096-bit path. Enthusiasts will have to wait until early-2017 for the introduction of the big-chip that succeeds "Fiji," which will not only leverage HBM2 to serve up vast amounts of super-fast memory; but also feature a slight architectural uplift. 2018 will see the introduction of its successor, codenamed "Navi," which features an even faster memory interface.

Alongside an updated desktop CPU roadmap, Intel posted an updated consumer SSD roadmap at its 3D Revolution 2014 presentation in Rome. It reveals the company's next-generation consumer SSD series, codenamed "August Ridge," and branded SSD 750 series. Targeting both the "consumer" and "professional" (≠ enterprise) market segments, the SSD 750 series comes in three form-factors, 2.5-inch SATA 6 Gb/s, mSATA 6 Gb/s, and M.2 (likely PCIe 2.0 x2 link layer). The series will sell in most popular sub-terabyte capacities, and will be based on the company's 20 nm MLC NAND flash. We have no reason to believe Intel will discontinue using SandForce-made processors in its consumer SSDs. Intel's SSD 750 series "August Ridge" is slated for Q4-2014.

Intel's presentation for Italian technology conference 3D Revolution 2014 was leaked to the web, revealing the company's most up-to-date desktop CPU roadmap, which looks deep into 2015. It reveals a wealth of new information. To begin with the HEDT (high-end desktop) segment, Intel plans to drag Core i7 "Ivy Bridge-E" through Q3-2014, and launch its succeeding Core i7 "Haswell-E" processor close to Q4-2014, or late into Q3, which would pin its launch some time in September 2014. "Haswell-E" is built in the new socket LGA2011-3 package, and is supported exclusively by Intel X99 Express chipset. It also heralds DDR4 memory to the consumer space. "Haswell-E" will have its reign till late-Q3 2015, when Intel plans to launch Core i7 "Broadwell-E," which is built in the same package, and supported by the same X99 platform, but based on a swanky new 14 nm silicon.

Things get interesting with the company's mainline desktop processors. Intel recently launched its "Haswell" Refresh silicon, and is bound to launch their unlocked variants, codenamed "Devil's Canyon," on the 25th of June. Built in the LGA1150 package, "Haswell" Refresh runs on both 8-series and 9-series chipset. Intel's 9-series chipset was originally designed to launch alongside the company's first processors built on the 14 nm silicon fab process, codenamed "Broadwell," which is an optical shrink of "Haswell," with a few minor tweaks and speed bumps, just as "Ivy Bridge" was to "Sandy Bridge." Intel's "Broadwell" chips are now expected to debut in Q1-2015, probably along the sidelines of the 2015 International CES. These chips will be supported by existing LGA1150 motherboards, some with BIOS updates.

AMD today announced a roadmap of near- and mid-term computing solutions that harness the best characteristics of both the x86 and ARM ecosystems, called "ambidextrous computing." The cornerstone of this roadmap is the announcement of AMD's 64-bit ARM architecture license for the development of custom high-performance cores for high-growth markets. Today's announcement also provides a forward-looking glimpse into AMD's development plans to deliver truly unmatched ambidextrous computing and graphics performance using a shared, flexible infrastructure to enable its customers to blaze new paths of innovation for the embedded, server and client markets as well as semi-custom solutions.

"Before today, AMD was the only company in the world to deliver high performance and low-power x86 with leadership graphics. AMD now takes a bold step forward and has become the only company that can provide high-performance 64-bit ARM and x86 CPU cores paired with world-class graphics," said Rory Read, AMD president and CEO. "Our innovative ambidextrous design capability, combined with our portfolio of IP and expertise with high-performance SoCs, means that AMD is set to deliver ambidextrous solutions that enable our customers to change the world in more efficient and powerful ways."

AMD (NYSE: AMD) today disclosed its roadmap for the fast-growing embedded computing market, as it becomes the first company to offer both ARM and x86 processor solutions for low-power and high-performance embedded compute designs. The new lineup includes two best-in-class x86 accelerated processing units (APUs) and central processing units (CPUs), a first look at a high-performance ARM system-on-chip (SoC) and a new family of discrete AMD Embedded Radeon graphics processing units (GPUs) expected to launch in 2014. These additions provide the embedded industry's engineering community with more choices to match their exact design needs, and are designed to offer improvements in performance-per-watt and performance-per-dollar. Together with the recent launch of the award-winning AMD Embedded G-Series SoC family that set a superior bar for performance-per-watt low-power multicore APUs, these latest additions to the embedded product roadmap further signify a strategic push by AMD to focus on the high-growth embedded market.

AMD reportedly updated its consumer products roadmap for 2014 thru 2015 to account for changes in the industry. The company is expected to unveil its next-generation "Volcanic Islands" GPU family by late-September, 2013. In the first quarter of 2014, the company is expected to unveil its 4th generation entry-level APUs, codenamed "Kabini." Built in ST3 socket for notebooks, and FS1B for desktops, this product family will include dual- and quad-core parts, with TDPs under 25W. Among the quad-core parts are the A4-5350 and A4-5150, and among the dual-core ones is the E1-2650.

"Kabini" will enter mass-production in February 2014, and will be formally announced in the following month. Kabini's early-2014 launch, delayed from late-2013, will have a cascading effect on its successor's launch. "Beema," its successor, will now launch in either late-2014, or early-2015. "Beema" will be based on the same socket types as "Kabini," but will incorporate more HSA technologies.

As the massive growth of information technology services places increasing demand on the datacenter, Intel Corporation today outlined its strategy to re-architect the underlying infrastructure, allowing companies and end-users to benefit from an increasingly services-oriented, mobile world. The company also announced additional details about its next-generation Intel Atom processor C2000 product family (codenamed "Avoton" and "Rangeley"), as well as outlined its roadmap of next-generation 14nm products for 2014 and beyond. This robust pipeline of current and future products and technologies will allow Intel to expand into new segments of the datacenter that look to transition from proprietary designs to more open, standards-based compute models.

"Datacenters are entering a new era of rapid service delivery," said Diane Bryant, senior vice president and general manager of the Datacenter and Connected Systems Group at Intel. "Across network, storage and servers we continue to see significant opportunities for growth. In many cases, it requires a new approach to deliver the scale and efficiency required, and today we are unveiling the near and long-term actions to enable this transformation."

Intel's first processors in the BGA (ball-grid array) package, arrive by the end of 2013, according to a leaked roadmap slide. Some of the first of these processors will span across entry-level market segments, covering the Celeron and Pentium brands. The term system-on-chip (SoC) better defines these chips than processors, as they completely integrate the processor as we know it, with the motherboard chipset. Motherboards with BGA processors come with the processors non-replaceable, and hard-wired to the board, with a stock fan-heatsink.

Intel's first SoCs for the desktop are based on the "BayTrail-D" silicon. These include the Celeron J1750, Celeron J1850, and Pentium J2850. Celeron J1750 is a dual-core part, with the CPU cores clocked at 2.41 GHz, GPU at 792 MHz, and a TDP rated at just 10W. Celeron J1850, on the other hand, is a quad-core part, with its CPU cores clocked at 2.00 GHz, and the same 792 MHz GPU. Pentium J2850 tops the series, being a quad-core part with CPU cores running at 2.41 GHz, and GPU at 792 MHz. Both these quad-core parts stick to 10W TDP. Being SoCs, these chips integrate connectivity otherwise handled by a PCH, into the processor package. According to an Intel roadmap slide, the three parts will spearhead Intel's BGA CPU lineup deep into 2014, at least as far as late-June.

According to CPU World staff, who, by appealing to an unnamed secondary source, managed to confirm the validity of an earlier leak, we are now looking at Intel's desktop roadmap for the following twelve months. The slides reveal the Q3 launch of Intel's Ivy Bridge-E chips, the Core i7-4820K, i7-4930K and i7-4960X comprising the lineup. The new Extreme chips will make use of the existing X79 platform. Also in Q3 the Premium line will receive a new product, the Core i7-4771, which we do not know in what way differs from the currently available Core i7-4770, but a judicious appeal to wild speculation could point out an upgraded IGP.

The mid segments will get a platform upgrade in the form of a new H81 chipset, and six new processors, the Core i3-4130, i3-4330, i3-4340, as well as three new Ivy Bridge based Pentium chips, the G3220, G3420 and G3430. Celeron processors are in the pipelines for Q1 2014, while Q2 will follow with the Haswell refresh and the accompanying new platform based on the Z97 and H97 chipsets.

Keeping up with an updated launch roadmap for Q1 2013 posted last November, Intel rolled out entry-level Celeron and Pentium dual-core processors based on its 22 nm "Ivy Bridge" silicon. All of the seven desktop and four mobile chips announced occupy price-points under $100. The desktop lineup begins with the Celeron G1610 (2.60 GHz, dual-core, 55W TDP), priced at US $42; Celeron G1610T (2.30 GHz, dual-core, 35W TDP) at $42; followed by Celeron G1620 (2.70 GHz), priced significantly higher at $52; Pentium G2010 (2.80 GHz, dual-core, 55W TDP) and G2020 (2.90 GHz), and G2020T (2.50 GHz, 35W TDP) at $64; and Pentium G2130 (3.20 GHz, dual-core, 55W TDP) at $86.

Intel has two kinds of Celeron mobile processors, targeting the mainstream and Ultrabook-like notebook form-factors. Among the mainstream notebook processors are the Celeron 1000M (1.80 GHz, dual-core, 35W TDP) and Celeron 1020M (2.10 GHz, dual-core, 35W TDP). Among the Ultrabook-like form-factor models are the Celeron 1007U (1.50 GHz, dual-core, 17W TDP), and Celeron 1037U (1.80 GHz, dual-core, 17W TDP). Interestingly, all four mobile Celeron "Ivy Bridge" CPU models are priced at $86, in 1000-unit tray quantities.

The Ethernet Alliance, a global consortium dedicated to the continued success and advancement of Ethernet technologies, today announced Chairman, John D'Ambrosia of Dell, and Marketing Committee Chair, Chauncey Schwartz of QLogic, will be featured speakers at the upcoming Large Installation System Administration Conference (LISA '12). A technical educational conference and networking event for system administrators of all levels of expertise, LISA '12 is scheduled for December 9 - 14, 2012 at San Diego, CA's Sheraton San Diego Hotel & Marina.

Ethernet is at the next critical junction in its lifecycle, particularly with the emergence of new applications like cloud computing and server virtualization, that could profoundly impact this essential technology," said John D'Ambrosia, chairman, Ethernet Alliance, and chief Ethernet evangelist, CTO office, Dell. "Therefore, it's important to understand the current conditions within the Ethernet ecosystem, as well as taking a forward-facing view of where we'll be six months, a year, or even five years down the road."

With the dawn of 2013, and no catastrophes in sight, Intel is going ahead with its usual business of phasing out old processor models, and making way for new ones. By the end of 2012, Intel will stop taking orders for several processor models mostly based on the older 32 nm "Sandy Bridge" silicon. These include chips such as the Core i7-2700K, Core i5-2310, Core i3-2105, Pentium G440, and surprisingly, an early demise of the 22 nm Core i5-3450, which is cannibalized by the Core i5-3470 at the same price point. Pentium G870, G645 and G645T as well as Celeron G555, G550 and G550T are the other chips on the chopping block.

Come 2013, Intel will release Pentium and Celeron series processors based on its 22 nm "Ivy Bridge" micro-architecture. These include the Pentium G2130, G2020 and G2020T and Celeron G1620, G1610 and G1610T. In the mobile (notebook) CPU sphere, Intel will launch dual-core "Ivy Bridge" chips to layer out its Ultrabook product segment. These include the Core i7-3687, Core i5-3437U, Celeron 1037U, 1007U, 1020M and 1000M. In March, the company is expected to launch its 4th generation Core "Haswell" line of processors.

Production of AMD's next-generation FX processor family, which are based on its "Piledriver" microarchitecture, will commence in Q3 2012, according to industry sources. Some of the first client processor models based on the "Vishera" silicon, will be the eight-core FX-8350, six-core FX-6300, and quad-core FX-4320. The three model names were earlier misinterpreted with an "x" prefix from a roadmap slide.

A few more details are known about these chips. For starters, the chips will be built on the existing AM3+ package, retaining compatibility with current AM3+ platforms. The chips will also retain dual-channel DDR3-1866 MHz integrated memory controllers, and Turbo Core 2.0. The main differences here, are increases in IPC (performance to clock-speed ratio), and the implementation of resonant clock mesh technology, which increases energy efficiency.

Details of desktop Core i7 and Core i5 "Ivy Bridge" processors in the LGA1155 package have been detailed at lengths, in the past. Core i3 parts based on the same 22 nm Ivy Bridge silicon, however, were relatively known. Tables listing out updated information about the lineup points out that Intel has as many as five Core i3 "Ivy Bridge" desktop processors in the works, all dual-core, and among which two are low-power parts.

The table also suggests that these Core i3 chips will have reduced features, importantly, the lack of PCI-Express 3.0 bus. When connected to these chips, PCI-E 3.0 add-on cards (such as graphics cards) will function in PCI-Express 2.0 mode. Further, these chips will lack support for AES-NI (accelerates encryption), VT-d (enhanced virtualization), and TXT (security). Certain models in the lineup have faster integrated graphics, denoted by a "5" in the end of the model number. These chips also lack Turbo Boost for the x86 cores, but feature HyperThreading.

In the second quarter of this year, AMD will launch its next-generation accelerated processing unit, codenamed "Trinity", starting with quad-core A10 and A8 parts in the quarter, followed by dual-core A6 and A4 parts in the third-quarter of 2012 (more here). DonanimHaber scored a specifications-sheet that details all the models AMD has in store for this year, also giving us an insight to what constitute each of these model numbers.

An interesting revelation here is that AMD does not have triple-core APUs anywhere in its lineup. The A10 lineup consists of quad-core APUs that come with Radeon HD 7660D graphics, while the A8 lineup also consists of quad-core APUs, but with slower Radeon HD 7560D graphics. The A6 lineup consists of dual-core APUs with Radeon HD 7540D graphics, while the A4 lineup has dual-core APUs with Radeon HD 7480D graphics.

AMD is pushing on with a desktop product lineup that's leveraging its Piledriver CPU and Graphics CoreNext GPU architectures in 2012. Apparently, the company will have a faster product development cycle to catch up with Intel's "Tick-Tock", as revealed in a roadmap slide scored by DonanimHaber. The current product lineup will remain unchanged in the first quarter of 2012. Then in the second quarter, AMD will launch a few more socket AM3+ FX-8000, FX-6000, and FX-4000 series eight, six, and four-core processors; along with the much talked about "Trinity" accelerated processing unit.

The fastest "Trinity" APUs will get a new brand identifier, the A10-5000 series. These APUs will pack next-generation "Piledriver" modular cores and Radeon HD 7600D series graphics. Around this time, AMD will also launch the Brazos 2.0 low-power APU for netbooks, nettops, and embedded computing devices. Brazos 2.0 will get the E2-1000 series branding. The big change is reserved for the third quarter of 2012, when AMD launches the successor of its less-than-lucky AMD FX "Bulldozer" processor family.

At its annual Financial Analyst Day, AMD (NYSE: AMD) detailed a new "ambidextrous" strategy that builds on the company's long history of x86 and graphics innovation while embracing other technologies and intellectual property to deliver differentiated products.

AMD is adopting an SoC-centric roadmap designed to speed time-to-market, drive sustained execution, and enable the development of more tailored customer solutions. SoC design methodology is advantageous because it is a modular approach to processor design, leveraging best practice tools and microprocessor design flows with the ability to easily re-use IP and design blocks across a range of products.

Today at its annual Financial Analyst Day, AMD has presented an updated roadmap detailing the hardware it plans to bring to the table during 2012 and 2013. For this year, the Sunnyvale-based company is preparing a processor quarter which includes the Trinity, Brazos 2.0 and Hondo APUs (accelerated processing units) and the Vishera CPU.

Set to be the main weapon in AMD's x86 arsenal, the Trinity APU (aka the 2nd gen A Series) is made on 32 nm process technology, and features DirectX 11 graphics, two/four Piledriver cores (Piledrive is said to deliver 25% better performance than the Stars cores found in Llano APUs), and a TDP that can go as low as 17 W on mobile parts. Trinity is expected to debut in Q2 and already has close to 100 design wins (more than Llano had before its release).

In 2012, Intel will update its processor lineup up to performance 2 tiers with new models based on the spanking new 22 nm "Ivy Bridge" silicon, which will increase performance over the current generation, and bring some new features to the table. In late November, a list of desktop Core i5/i7 models could be compiled, which were later confirmed on roadmap slides. CPU World compiled retail channel pricing of several of those Core i5/i7 "Ivy Bridge" chips. The prices look to be more or less consistent with current "Sandy Bridge" Core processors, which those chips are bound to replace. The Core i7-3770K, for example, which will replace the Core i7-2600K, will be similarly priced to it.

Earlier this week, a report tabled the model numbers of Intel's 2012 Core processor family based on the "Ivy Bridge" silicon. Its processor model number scheme consisted of Core i5/i7 3000 series, targeting various market price points. Many of these model numbers are confirmed on the latest roadmap slide detailing the Core processor family for 2012. We are also getting to see what the nomenclature of next-generation Core i3 processors could look like.

The slide shows that Ivy Bridge processors will start selling in Q2 2012, which is consistent with reports of an April 2012 launch. Intel will begin with Core i3-32xx (xx = TBD), i5-3450, i5-3550, i5-3570K, i7-3770, and i7-3770K. Around this time, there will be a market transition among cheaper Core i3 parts. In Q3 2012, i5-3470 and i5-3570 will displace i5-3450 and i5-3550; while a faster Core i7-37x0K processor will displace the i7-3770K. The market transition among some Core i3 parts will continue in Q3. Q4 2012 will largely resemble Q3, except that the lower-end Core i3 lineup will have fully transitioned to Ivy Bridge. There will be no changes in the LGA2011 Sandy Bridge-E HEDT lineup, except that an affordable quad-core part will be added in Q1 2012. For quick reference, we re-posted the table from the older report.

2012-13 promises to be a period of big graphics product launches, centric to a new DirectX version, DirectX 11.1, which will ship with Microsoft's next major Windows version (currently referred to as Windows 8). Information compiled by ExpertsPC.com and 4Gamer.net tables what NVIDIA's next-generation graphics family could look like, and around what time it could be released to market. With its next-generation GeForce Kepler family of GPUs, NVIDIA will follow a sensible bottom-up product release model, to ensure that it isn't met with any technical hurdles with TSMC's new 28 nm manufacturing process, and so it could launch GPUs with increasingly higher transistor counts, till its top-of-the-line GPU is outed.

The first GPU in NVIDIA's pipeline is the GeForce Kepler 107 (GK107), on which will be based entry thru lower-mainstream SKUs. The data doesn't reveal things like core counts, but points out that GK107 will have a 128-bit wide GDDR5 memory interface, will use the current-generation PCI-Express 2.0 bus, will be built on the 28 nm process, and will support DirectX 11.1. This will be followed by the GK106, on which "sweet-spot" SKUs could be based. This will be NVIDIA's first PCI-Express 3.0 compliant GPU, it will have a 256-bit wide GDDR5 memory interface.

Here are details of the first three models of Intel's "Sandy Bridge-E" Core i7 processors in the LGA2011 package. Some of these details were made public as early as mid-April. It was then analyzed that Intel was driving two distinct lines of LGA2011 client processors: Enthusiast and Performance, and within Performance, there were BClk multiplier-unlocked six-core, and locked quad-core chips. With the new series, Intel will move to the 3000 series of processor model numbering, indicating that the new processors will be part of Intel's 3rd generation Core processors, even though they're based on the Sandy Bridge architecture.

Before we move to the model numbers, here's a quick run up of the brand extenders. "X" denotes Extreme Edition, "K" denotes "Unlocked" (BClk multipler unlocked). Leading the pack will be Core i7-3960X Extreme Edition. This six-core (6 cores, 12 threads with HTT) chip has a nominal clock speed of 3.30 GHz, Turbo Boost speed of up to 3.90 GHz, and features the full 15 MB of L3 cache present on the Sandy Bridge-E silicon. Expect this chip to have a four figure price-tag.

Originally slated for Q4 2011, the launch of Intel's Sandy Bridge-E desktop/workstation platform has been pushed back to Q1 2012, sources told VR-Zone. The high-end platform was expected by industry observers to be a December launch, targeting the shopping season, but it seems like January 2012 is found to be more fitting. Perhaps the International CES, where the latest and greatest from the tech industry is unveiled, serves as the ideal launch-pad for Sandy Bridge-E.

Sandy Bridge-E is an upscale of the architecture that makes up Intel's 2011 Core processor family. Consisting of 4 or 6 cores, Sandy Bridge makes up two distinct product lines for the client desktop market. The chips pack massive quad-channel DDR3 integrated memory controllers and PCI-Express 3.0 hubs that can drive up to four graphics cards. The processor is made of a new 2011-pin LGA package, with the new Intel X79 chipset handling the rest of the platform.

Here is the first picture of GA-X79A-UD3, the first Gigabyte-branded socket LGA2011 motherboard. Based on the Intel X79 Express chipset, the board supports upcoming Sandy Bridge-E enthusiast processors in the LGA2011 package. Mind you, this is just the cheapest LGA2011 board from Gigabyte, there is a higher-end line of X79 motherboards, so don't let the unspectacular looks of the UD3 get you.

The GA-X79A-UD3 is a standard ATX sized motherboard. Its main VRM is spread all around the large CPU socket, in what appears to be a 6-phase design, with an unknown number of memory and uncore phases. LGA2011 processors feature a large quad-channel DDR3 memory controller, along with a northbridge uncore component with a 40-lane PCI-Express 3.0 controller. Those amount to the socket's insane pin-count of 2,011 pins. Memory slots are located in pairs of two on either sides of the socket. Each slot is its own 64-bit wide memory channel.