Noctua has, as of this month, refreshed its product roadmap for the rest of 2023, and even provides a couple of scant details about far-off hardware scheduled for launch in early 2024 and beyond. The Austrian computer cooling hardware specialist is probably updating their release forecast in preparation for Computex 2023 - set to start at the end of the month - where brand new goodies could be debuted to industry-types and public attendees.

Noctua's 8-way fan hub seems to be delayed - the previous version of the roadmap had it down for a Q1 2023 launch, but the update now indicates a second quarter window. A bunch of next-gen AMD Threadripper coolers are marked down for an estimated third-quarter release, and Noctua has a slim 60 mm fan
as well as a 24 V 40 mm fan lined up for the final quarter. All-black versions of existing NH-D12L, NH-D9L and NH-L9x65 CPU coolers are due by the end of this year - a number of coolers are already available in the company's "chromax.black" finish - for those who do not enjoy the signature beige and brown aesthetic. A single next-generation 140 mm fan is teased for a Q1 2024 launch, with a chromax.black version coming later in the year. Finally, a re-designed NH-D15 CPU cooler gets a loose 2024 window.

Today, Ubisoft hosted Division Day, a special event where the creative team behind The Division franchise gave a sneak peek at everything that's coming soon. The Division 2 team revealed their Year 5 roadmap and Season One: Broken Wings; The Division Heartland made its cinematic debut; The Division Resurgence announced a new testing phase; and several other projects including an upcoming Webtoon and first look at unique action figures were revealed. Here's a roundup of everything covered during Ubisoft's Division Day showcase:

The Division Heartland, the upcoming free-to-play PvEvP, survival-action shooter, made its cinematic debut during the Division Day showcase, showing off the town of Silver Creek, teasing the enemy factions and mysterious virus players will face. The Division Heartland will go into Closed Beta later this year; if you want to be part of it, head over to thedivisionheartland.com to register for a chance to participate, as well as receive five friend invites.

What's next for Northgard? A sneak peek into what the future holds for our favorite vikings...Ohoi! We're working hard on Northgard and you can expect a ton of new changes this year. Keep in mind this roadmap is mostly tentative, hence why no dates will be revealed as of today. But enough talk, here is what you came for...

The near future
Our next update is the annual major balancing patch. It is coming in the next month or so but it is not exclusively balancing that it will be bringing to the game. Before expanding the game further, it was important for us to focus on some of the more pressing matters that have been brought to our attention over the last few months.

Free Update coming April 18th + 2023 Roadmap and Physical Release for PowerWash Simulator - The first few months of this year have been crazy. You've cleaned Croft Manor and de-mucked Midgar… wherever next?! Well, we'll take a look at what else is coming this year in a minute, but not before we've said a huge and heartfelt THANK YOU to you all for the community support so far this year. It has been incredible seeing your reaction to the new content on socials and our Discord.

What's coming this year? 2023 Roadmap - Hop in the van, we're going on a road trip! Throughout 2023, we'll be taking you to places near and far in a range of Special Packs and updates that traverse Muckingham and beyond. Behold, our 2023 roadmap! With each free expansion, we'll be revealing more of Muckingham and its stories, whereas the paid Special Packs will transport you outside of the Muckingham universe to all sorts of new and exciting places.

All eyes - especially investors' eyes - are on Intel's data center business today. Intel's Sandra Rivera, Greg Lavender and Lisa Spelman hosted a webinar focused on the company's Data Center and Artificial Intelligence business unit. They offered a big update on Intel's latest market forecasts, hardware plans and the way Intel is empowering developers with software.

Executives dished out updates on Intel's data center business for investors. This included disclosures about future generations of Intel Xeon chips, progress updates on 4th Gen Intel Xeon Scalable processors (code-named Sapphire Rapids) and demos of Intel hardware tackling the competition, heavy AI workloads and more.

Xeon Roadmap Roll Call
Among Sapphire Rapids, Emerald Rapids, Sierra Forest and Granite Rapids, there is a lot going on in the server CPU business. Here's your Xeon roadmap updates in order of appearance:

An alleged AMD client product roadmap slide leaked to the web confirms the Ryzen 7000X3D series. This also builds on a confirmation by Robert Hallock that 3DV Cache technology remains a continued part of the company's client processor roadmap. The 3DV Cache tech played in instrumental role in shoring up gaming performance of AMD's previous-generation "Zen 3" microarchitecture to levels matching or exceeding those of the Intel "Alder Lake," with a performance uplift in the range of 10 to 25 percent. The expectations for 3DV Cache to work a similar miracle with "Zen 4" are set rather high.

While "Zen 4" has achieved gaming performance parity with "Alder Lake," Intel's next-generation "Raptor Lake" is right around the corner, with the company claiming 10-15% single-threaded performance uplifts that should restore the its gaming performance leadership over AMD. The alleged AMD roadmap does not specify when exactly the Ryzen 7000X3D comes out, but is part of the block that spans Q3-2022, deep into 2023. Rumors are abuzz that the company could unveil the 7000X3D in the first half of 2023.

At Intel's 2022 Investor Meeting, Chief Executive Officer Pat Gelsinger and Intel's business leaders outlined key elements of the company's strategy and path for long-term growth. Intel's long-term plans will capitalize on transformative growth during an era of unprecedented demand for semiconductors. Among the presentations, Intel announced product roadmaps across its major business units and key execution milestones, including: Accelerated Computing Systems and Graphics, Intel Foundry Services, Software and Advanced Technology, Network and Edge, Technology Development, More: For more from Intel's Investor Meeting 2022, including the presentations and news, please visit the Intel Newsroom and Intel.com's Investor Meeting site.

Digital computing continues to enrich our lives in more ways than we can imagine. We acquire, consume, and create content and services with a few clicks or taps of our fingertips. Exponential increases in compute performance, enabled by Moore's Law, play a significant role in making these experiences seamless. Moore's Law is also enabling us to democratize access to this enormous pool of processing power. Amazing things happen when a lot of compute is available to a lot of people without much friction.

Blockchain is a technology that has the potential to enable everyone to own much of the digital content and services they create. Some even call it an inflection point in computing, fundamentally disrupting the way we store, process and transact our digital assets as we usher in the era of metaverse and Web 3.0. No matter how the future evolves, it is certain the availability of a lot more compute to everyone will play a central role.

Intel is expected to announce their desktop Alder Lake processors later this month on October 28th and it would appear that laptop processors could enter production as early as November. These revelations come from a leaked roadmap published by Wccftech that lists the Alder Lake-P and Alder Lake-M processor families for launch in Q4 2021 and Q1 2022 respectively. The production window for Alder Lake-P opens November 8th and closes March 13th while for Alder Lake-M that period is from January 17th to April 17th.

The roadmap lists Alder Lake-P processors as featuring a TDP between 12 W to 45 W and Alder Lake-M covering 7 W to 15 W. The two platforms will both feature up to 96 Xe graphics Execution units along with Thunderbolt 4 and WiFi 6E connectivity. Alder Lake-P will include PCIe 5.0 and DDR5 support with no mention of DDR4 compatibility while Alder Lake-M will get PCIe 4.0 and LPDDR4X/LPDDR5. The mobile lineup is divided into 3 groups of which the flagship H55 was not mentioned in the roadmap indicating a post Q1 2022 release.

The AMD embedded roadmap for 2020 - 2023 was recently leaked and reveals some interesting information about AMD's upcoming Zen 4 based EPYC server processes. The current generation 7003 series of Zen 3 EPYC processors offer up to 64 cores and 128 threads with a TDP range of 120 W - 280 W. The next-generation EPYC 7004 "Genoa" Zen 4 processors will push the maximum core count to 96 cores and 192 threads with a maximum TDP of 320 W. The Zen 4 based EPYC processors will move to a 12 chiplet design up from the current 8 chiplet design which allows for the core increase that will increase the physical size of the processors and require a new SP5 socket. The new EPYC 7004 series processors will also support the latest features such as 12 channel DDR5-5200 ECC memory and PCIe Gen5.

As it stands, Cyberpunk 2077 is the game many either love or love to hate. The game launched last December 10th after three delays to a great reception of the PC platform - and a good one on current-gen PS5 and Xbox Series X|S - but was a fiasco on last-gen consoles and their mid-life refreshes to such an extent that Sony removed the game from their digital store. A great deal of digital ink has already been written on CD Projekt Red's handling of the situation, and it could - really could - have been handled better.

Now, CD Projekt Red co-founder Marcin Iwiński has released a 5-minute video where he approaches Cyberpunk 2077's release state; assumes, alongside the direction, full responsibility for the state of the game; and doubles-down on CD Projekt Red's commitment to improve the Cyberpunk 2077 experience. he doesn't go into too much detail as to how and why things went awry, but says that a smattering of management decisions led to today's situation. And considering the current situation, plans for post-launch DLC (akin to those that happened with The Witcher 3, which featured new armor, weapons, haircuts, missions, and a New Game + mode) will be arriving slightly later than predicted, so as to allow the team to fully focus on straightening out the games' rough patches.

Noctua has recently updated their 2021 product roadmap pushing a number of products back one quarter including their passive CPU cooler. The passive CPU cooler, black NF-A12x25 fans, black NH-U12A, and NH-U12A heatsinks have all been delayed from Q1 2021 to Q2 2021 the only product which remains on track for a Q1 2021 release is the redux line CPU cooler. The release of white Noctua fans has also been pushed from Q2 2021 until Q3 2021, products expected to release in Q3 and Q4 2021 remain on track. These new delays are likely due to the return of COVID-19 lockdowns and are only estimates which are subject to change.

Intel is planning to introduce its first NUC (next unit of computing) device based on the 11th generation Core "Tiger Lake" processor by the end of 2020, according to leaked company roadmaps covering NUCs. These point to Intel refreshing its "Hades Canyon" performance-segment NUC mini-PC with a "Tiger Lake-U" processor, a 3rd party discrete GPU, and slightly bigger device size (1.35 L vs. 1.2 L of the original "Hades Canyon"). At the very top, the "Ghost Canyon" NUC 9 Extreme with "Coffee Lake-HR" processors will continue to hold the fort into 2021.

The mainstream NUC mini-PC lineup will continue to be "Frost Canyon," powered by "Comet Lake-U" 10th generation Core processors. Q2-Q3 2020 will see Intel launch significant updates to its NUC Compute Element lineup, with "West Cove," "Ghost Canyon," and "Quartz Canyon" holding the mainstream, performance-segment, and professional segment, respectively; while are likely based on "Comet Lake-H" processors; and "Austin Beach" low-power compute element based on "Comet Lake-U."

Several future AMD processor codenames across various computing segments surfaced courtesy of an Expreview leak that's largely aligned with information from Komachi Ensaka. It does not account for "Matisse Refresh" that's allegedly coming out in June-July as three gaming-focused Ryzen socket AM4 desktop processors; but roadmap from 2H-2020 going up to 2022 sees many codenames surface. To begin with, the second half of 2020 promises to be as action packed as last year's 7/7 mega launch. Over in the graphics business, the company is expected to debut its DirectX 12 Ultimate-compliant RDNA2 client graphics, and its first CDNA architecture-based compute accelerators. Much of the processor launch cycle is based around the new "Zen 3" microarchitecture.

The server platform debuting in the second half of 2020 is codenamed "Genesis SP3." This will be the final processor architecture for the SP3-class enterprise sockets, as it has DDR4 and PCI-Express gen 4.0 I/O. The EPYC server processor is codenamed "Milan," and combines "Zen 3" chiplets along with an sIOD. EPYC Embedded (FP6 package) processors are codenamed "Grey Hawk."

AMD Financial Analyst Day presents an opportunity for AMD to talk straight with the finance industry about the company's current financial health, and a taste of what's to come. Guidance and product teasers made during this time are usually very accurate due to the nature of the audience. In this live blog, we will post information from the Financial Analyst Day 2020 as it unfolds.20:59 UTC: The event has started as of 1 PM PST. CEO Dr Lisa Su takes stage.

During the IEDM event hosted by the IEEE organization, ASML's CEO, Martin van den Brink, took the stage to elaborate more on ASML's vision of the future of semiconductors. When talking about the future of semiconductors, Mr. Brink started talking about Intel and their vision for the future. Intel's slides were showing many things including backporting of IP to older processes and plan to go back to "tick-tock" two-year cadence to restore the previous confidence in Intel's manufacturing capabilities.

Perhaps one of the most interesting notes about the presentation is the fact that Intel is working hard to realize its plans of bringing back a two-year cadence of "tick-tock" process realization. That means that in the future, presumably after 10 nm debut problems are solved, Intel wants to do the old process and optimization tactics. A slide (shown below) titled "In Moore We Trust" is speaking a lot about Intel's future plans, showing few things in particular: Intel's upcoming 10 nm++ and 10 nm+++ nodes, and the possibility of backporting.

AMD updated its technology roadmaps to reflect a 2020 launch window for its upcoming CPU and graphics architectures, "Zen 3" and RDNA2. The two will be based on 7 nm+ , which is AMD-speak for the 7 nanometer EUV silicon fabrication process at TSMC, that promises a significant 20 percent increase in transistor-densities, giving AMD high transistor budgets and more clock-speed headroom. The roadmap slides however hint that unlike the "Zen 2" and RDNA simultaneous launch on 7th July 2019, the next-generation launches may not be simultaneous.

The slide for CPU microarchitecture states that the design phase of "Zen 3" is complete, and that the microarchitecture team has already moved on to develop "Zen 4." This means AMD is now developing products that implement "Zen 3." On the other hand, RDNA2 is still in design phase. The crude x-axis on both slides that denotes year of expected shipping, too appears to suggest that "Zen 3" based products will precede RDNA2 based ones. "Zen 3" will be AMD's first response to Intel's "Comet Lake-S" or even "Ice Lake-S," if the latter comes to fruition before Computex 2020. In the run up to RDNA2, AMD will scale up RDNA a notch larger with the "Navi 12" silicon to compete with graphics cards based on NVIDIA's "TU104" silicon. "Zen 2" will receive product stack additions in the form of a new 16-core Ryzen 9-series chip later this month, and the 3rd generation Ryzen Threadripper family.

We've all taken a look at AMD's March 2019 product roadmap, which showed us the upcoming 2019 tech the company would be bringing to the table in its "non-stop product momentum". However, it seems that this non-stop product momentum might be coming to an unexpected twist of fate that might delay it from entering the last station - the Zen 2-based Threadripper. In the company's latest May earnings call roadmap, the company silently removed the Zen 2 Threadripper from its product roadmap - where it used to sit right after the launch of Zen 2-based Ryzen products for consumers, is now just a big crop of the space it occupied.

This might mean many things, and a mistake on someone's part while cropping the PowerPoint slide could be the only thing going on here. However, the best and most plausible speculation that can be entertained when one considers this is simple - a supply problem. With the 7 nm node being the newest, most dense fabrication process possible, and with AMD having to share TSMC's 7 nm wafer production with a number of high profile companies - such as Qualcomm, for instance - may mean that supply is simply too tight to support Zen 2-based products across so many product stacks - Ryzen and Epyc - at the same time.

While Fallout 76 may have (read: has) come out of the gates to generally poor rception, Bethesda Softworks has been hard at work trying to bring the game up to speed to the potential of the Fallout series - at least, as much potential as there is to scrounge for in this shared/world rendition of it. This has worked, according to Bethesda, through a dedication to "(...) improve performance, detect new exploits, and make the experience smoother for everyone. There's still work to do, but we're happy to report that game and server stability has increased over 300% since launch." To celebrate a perceived new state of the nation, Bethesda has just revealed their plans for the game thorugh a roadmap that spans the entirety of 2019.

It seems the game will be following a Seasonal content delivery, as there is a Spring, Summer, Fall, and Winter separation for content - free content, that is. The first content update, dubbed "Wild Appalachia", will be coming out throughout Spring 2019, featuring a series of new quests, features, events, crafting systems and more starting on March 12 and appearing over several weeks. Summer will see the arrival of of the "Nuclear Winter" content update, which seems like a tongue-in-cheek proposition. "Wastelanders", dropping this Fall, will be the single most comprehensive amount of content, according to Bethesda, with "a new main questline, new factions, new events, new features and even more surprises." Check out after the break for the full announced features for the Spring Update, "Wild Appalachia".

Intel's Next Unit of Computing (NUC) systems have always offered a great deal of performance in a tiny form factor. Their current lineup which consists of Hades Canyon features Intel's 8th generation of processors and depending on model can also feature an AMD Radeon RX VEGA M graphics processor, that said, the vast majority of units utilize Intel's integrated graphics. The most potent these configuration is Intel's 100W 4c/8t i7-8809G with Radeon RX Vega M GH graphics. It delivers exceptional performance for the size, allowing users to play AAA games at high settings with stable frame rates.

Thanks to a member of the PC EVA forums we now have access to what appears to be a leaked Intel roadmap showcasing their Ghost Canyon X NUC systems. Set to debut in 2019/2020 Intel will be pushing multiple new CPUs for these systems including a 45W 8c/16t i9-9xxxH, 45W 6c/12t i7-9xxxH, and 45W 4c/8t i5-9xxxH. All three feature UHD graphics by Intel, however, what is most interesting there provisions for a single PCIe X16 slot. Now, in reality, the inclusion of a proper PCIe slot is unlikely, I would speculate due to the size that it is, in fact, an MXM slot which limits options to discrete mobile graphics processors which tend to be far more expensive for consumers. Still, more information is required before making any serious judgments one way or the other at this time.

At the XFastest Network event in Japan, ASRock shared some slides detailing its overall graphics card strategy up to February 2019. There are some interesting bits of information that can be gleaned/extrapolated from it. One bit of information that seems to be set in stone is the introduction, come August, of revised versions of some graphics cards (namely, the RX 570 and RX 580 models) under the MK2 marketing - likely revised in their cooling apparatus. That the RX Vega versions of ASRock graphics cards won't be receiving such a revision seems clear as well: there's no reason for the company to withhold information on that. The others, however, are more prone to speculation.

First of, the fact that ASRock still only lists AMD graphics cards likely means the company will remain an exclusively AMD-aligned AIB. Secondly, the absence of any new AMD graphics cards in the ASRock lineup, while noteworthy and prone to speculation, doesn't really say much. AMD certainly wouldn't look lovingly towards ASRock should they out information on a new RX600 series or other AMD products ahead of time. Likewise, ASRock wouldn't want publicity on a new deal with NVIDIA to hit the roads ahead of time. As such, let's just stay with the MK2 graphics cards and ASRock's lineup - and codification for its products, which they kindly shared during the event.

Bluechip computer, a German IT distribution company, has inadvertently spilled the beans on AMD and Intel's plans for the remainder of this year, shedding some more light on a number of products whose existence was still somewhat marred in fog. The information comes straight from a webinar Bluechip presented to its industry partners - a 30-minute presentation which made its way to YouTube.

The information gleaned is a confirmation, of sorts, of AMD's planned launch of their Z490 platform in June; the B450 chipset coming a little bit later, in July (an expected product, in every sense); and AMD's second-gen Threadripper, a known-quantity already, which should accompany a X399 platform refresh.

Continuing with its trend of leaking AMD slides, Spanish website Informatica Cero has now published some purported company slides leading up to AMD's 2020 strategy. New information concerns the appearance of a new, value-oriented mobile APU in the form of "Dali" - let's hope performance on that is slightly more predictable than the particular style of the artist whose name it follows. Dali therefore joins AMD's "Renoir" APU and "Vermeer" CPUs (both expected in the 7 nm process) for AMD's 2020 roadmap. This is an interesting product, which AMD is likely positioning for tablets and ultraportables.

Another interesting tidbit is AMD's outlook for their Threadripper line of HEDT CPUs. The company is looking towards its 7 nm rendition of these powerhouse chips, codenamed "Castle Peak", to bring them, in a literal way, to that figurative peak. AMD compares Threadripper to a Monster Truck of computing, and is apparently hoping to introduce Castle Peak as early as 2019. AMD then plans to further refine these "process inflection point" products in a new generation to come right after, in 2020 (much like the company has done now with Zen and Zen+).

AMD at CES shed some light on its 2018 roadmap, while taking the opportunity to further shed some light on its graphics and CPU projects up to 2020. Part of their 2018 roadmap was the company's already announced, across the board price-cuts for their first generation Ryzen processors. This move aims to increase competitiveness of its CPU offerings against rival Intel - thus taking advantage of the blue giant's currently weakened position due to the exploit saga we've been covering. This move should also enable inventory clearings of first-gen Ryzen processors - soon to be supplanted by the new Zen+ 12 nm offerings, which are expected to receive a 10% boost to power efficiency from the process shrink alone, while also including some specific improvements in optimizing their performance per watt profile. These are further bound to see their market introduction in March, and are already in the process of sampling.

On the CPU side, AMD's 2018 roadmap further points towards a Threadripper and Ryzen Pro refresh in the 2H 2018, likely in the same vein as their consumer CPUs that we just talked about. On the graphics side of their 2018 roadmap, AMD focused user's attention in the introduction of premium Vega offerings in the mobile space (with HBM2 memory integration on interposer, as well), which should enable the company to compete against NVIDIA in the discrete graphics space for mobile computers. Another very interesting tidbit announced by AMD is that they would be skipping the 12 nm process for their graphics products entirely; the company announced that it will begin sampling of 7 nm Vega products to its partners, but only on the Instinct product line of machine learning accelerators. We consumers will likely have to wait a little while longer until we see some 7 nm graphics cards from AMD.

The latest version of Intel's desktop client-platform roadmap has been leaked to the web, which reveals timelines and names of the company's upcoming product lines. To begin with, it states that Intel will upgrade its Core X high-end desktop (HEDT) product line only in Q4-2018. The new Core X HEDT processors will be based on the "Cascade Lake-X" silicon. This is the first appearance of the "Cascade Lake" micro-architecture. Intel is probably looking to differentiate its Ringbus-based multi-core processors (eg: "Coffee Lake," "Kaby Lake") from ones that use Mesh Interconnect (eg: "Skylake-X"), so people don't compare the single-threaded / less-parallized application performance between the two blindly.

Next up, Intel is poised to launch its second wave of 6-core, 4-core, and 2-core "Coffee Lake" processors in Q1-2018, with no mentions of an 8-core mainstream-desktop processor joining the lineup any time in 2018. These processors will be accompanied by more 300-series chipsets, namely the H370 Express, B360 Express, and H310 Express. Q1-2018 also sees Intel update its low-power processor lineup, with the introduction of the new "Gemini Lake" silicon, with 4-core and 2-core SoCs under the Pentium Silver and Celeron brands.