Thermaltake seems to have finished development of its new high-end CPU cooler, the Thermaltake Frio. Designs of this cooler surfaced as early as in June this year, originally slating it for Computex 2009. After some development delay, it has finally taken shape with the disctinct black+red color scheme the company's Level 10 case comes with. The design consists of a CPU contact block from which five seemingly 8 mm heatpipes arise, conveying heat to a dense aluminum fin array which has largely rectangular fins. The array is cooled a 120 mm fan. There is provision to install one on either sides, that rotates at speeds between 1200 - 2500 rpm. The cooler supports all current CPU sockets, including LGA-1366, LGA-1156, LGA-775, AM3/AM2+. The cooler is now slated for CES 2010.