Tuesday, January 13th 2015

Next AMD Flagship Single-GPU Card to Feature HBM
AMD's next flagship single-GPU graphics card, codenamed "Fiji," could feature High-Bandwidth Memory (HBM). The technology allows for increased memory bandwidth using stacked DRAM, while reducing the pin-count of the GPU, needed to achieve that bandwidth, possibly reducing die-size and TDP. Despite this, "Fiji" could feature TDP hovering the 300W mark, because AMD will cram in all the pixel-crunching muscle it can, at the expense of efficiency from other components, such as memory. AMD is expected to launch new GPUs in 2015, despite slow progress from foundry partner TSMC to introduce newer silicon fabs; as the company's lineup is fast losing competitiveness to NVIDIA's GeForce "Maxwell" family.
Source:
The TechReport
119 Comments on Next AMD Flagship Single-GPU Card to Feature HBM
I think focusing on performance is better in many ways as long as you do not hit a point that is beyond crazy otherwise you do nullify part of your market with having to invest in more expensive parts to run already expensive parts. Power draw to me is important but more for the mobile class than anything as the higher class of cards are more for the extreme ranges of setups (higher resolution, surround/eyefinity, 3D, etc). Bingo, though to be fair some places do have very high electricity costs compared to you or I so I can see it somewhat but even with that unless your stressing your computer 24/7 it will not amount to much.
So, high temps means more heat means less OC for my CPU. All on air btw.
80 is the maximum acceptable imo.
samsung go to freakin 14nm...,intel shrink as well,nvidia...,but not amd...,there is something realy wierd in that picture!!
but dont judge me...,its just a teory...,something that crosed my mind :)
The problem with products that run hot isn't that they were designed to run hot, but more accurately that they were designed to run so close to thermal limits. If those nVidia cards could run at 150c, they'd just turn down the fan speed and most everyone would be happy. Exact same situation for me. I've been considering a 970, but only because it does really well in the one game I want to play and it plays nicely with some backlighting hardware I have. I'd prefer AMD, but even if the new card performs below expectations, at the very least, it should bump the GTX 970's price down.
By your reasoning, Intel's latest 2-3 platform offerings shouldn't have reviews including AMD FX and 990X chipsets for comparison, since the AMD platform is over 2 (Vishera) and 3 ( 900 series chipset) years old. Bandwidth is only half the equation. HBM is limited to 4GB of DRAM in it's first generational phase. Are you confident that 4GB is fully capable for holding the textures in all scenario's for 4K gaming? That is likely a fairly low estimation IMO. If the quoted numbers are right, Fiji has 4096 cores which are a 45% increase over Hawaii. The wide memory I/O afforded by HBM in addition to colour compression should also add further, as would any refinement in the caching structure - as was the case between Kepler and Maxwell-assuming it was being accorded the priority that Nvidia's architects imbued their project with.
If leaked information is to believed, it has double the stream processors as the 280X, a 17% higher clockspeed, and more than double the memory bandwidth.
First how does btarunr come up with, "Despite this, "Fiji" could feature TDP hovering the 300W mark..."? the article said "the world’s first 300W 2.5D discrete GPU SOC using stacked die High Bandwidth Memory and silicon interposer." Honestly that doesn't sound like anything more than an internal engineering project rather than any inferance to "Fiji". It appears to be pure speculation/assumption, not grounded in any evidence it is a imminent consumer product release.
I also would like btarunr to expound on "despite slow progress from foundry partner TSMC to introduce newer silicon fabs" as that doesn't seem to come from the linked article. It seems a slam on AMD for not having something for what now 4mo's since 970/980?
We know that TSCM "as normal" effected both companies abilities; Nvidia basically had to hold to 28nm on mainstream, and possible so will AMD for "Bermuda". Is saying as he does a hint there's some use of 16nm FinFET for "Flagship graphics" cards from both or either? (I don’t think that going out on a limb). With a 16nm FinFET would be strange for either side to really need push the 300W envelope? I believed AMD learned that approaching 300W is just too much for the thermal effectiveness of most reference rear exhaust coolers (Hawaii).
Despite many rumors of that mocked up housing, I don’t see AMD releasing a single card "reference water" type cooler for their initial "Fiji" release, reference air cooling will maintain. I don't discount they could provide a "Gaming Special" to find the market reaction as things progress for a "reference water" cooler, but not primarily.
Why would you release graphics cards with little of no inherent downsides from a performance perspective, with cheap-ass blowers that previously invited ridicule? Nvidia proved that the blower design doesn't have to be some Wal-Mart looking, Pratt & Whitney sounding abomination as far back as the GTX 690, yet AMD hamstrung their own otherwise excellent product with a cooler guaranteed to cause a negative impression. That reference design AIO contract Asetek recently signed was for $2-4m. That's a lot of AIO's for a run of "gaming special" boards don't you think?
Now, are you going to tell me that the largest negative gleaned from reviews, users, and tech site/forum feedback WASN'T due to the reference blower shroud?
Do you not think that if AMD had put more resources into putting together a better reference cooling solution that the overall impression of the reference board - THE ONLY OPTION AT LAUNCH - might have been better from a marketing and PR standpoint ? How many people stated that they would only consider the HD 7970 once the card was available with non-reference cooling - whether air or water?
EDIT: Sorry about the double post. Thought I was editing the one above.
EDIT:
The release of this card also lines up with the Asetek announcement. Not saying AMD wont have a AIO cooler but at least with EVGA we have proof in a product.
If Asetek's cooling becomes will become the de facto standard for AMD's reference cards, it stands to reason that others will follow suit. To my eyes it certainly looks cleaner than Arctic's hybrid solution- but then, I'm not a big fan of Transformer movies either. Well, the Asetek announcement for the $2-4m contract specifies an OEM (Nvidia or AMD), not an AIB/AIC, so chances are the EVGA contract isn't directly related any more than Sycom or any of the other outfits adding Asetek units to their range. The fact that card pictured is Nvidia OEM reference GTX 980 rather than an EVGA designed product would also tend to work against the possibility.
Having said that, I'm sure EVGA would love to have sales that warrant committing to a seven-figure contract for cooling units for a single SKU.
hpcuserforum.com/presentations/seattle2014/IDC_AMD_EmergingTech_Panel.pdf
819.2 Mb/s to 1,228.8 Mb/s
The fourth slide shows 30w for HBM vs 85w for GDDR5.
Edit: From what I gather, the power savings come from the logic board being on the chip rather than off chip. Everything doesn't have to go as far to get what it needs and that substantially cuts power requirements in addition to improving performance by way of reducing latency.
The large power savings are also data rate related (as Hynix themselves highlight). It is no coincidence that vRAM started to take a significant portion of total board power budget (~30%) with the advent of faster GDDR5 running in excess of 5Gbps, or the corresponding rise of LPDDR3 and 4 for system RAM as data rates increased and the need to reduce voltage became more acute. I think you'll find that SK Hynix's own presentation (PDF) is somewhat more comprehensive.