Friday, November 6th 2015
GLOBALFOUNDRIES Achieves 14nm FinFET Technology Success for Next-Gen AMD Product
GLOBALFOUNDRIES today announced it has demonstrated silicon success on the first AMD (NASDAQ: AMD) products using GLOBALFOUNDRIES' most advanced 14nm FinFET process technology. As a result of this milestone, GLOBALFOUNDRIES' silicon-proven technology is planned to be integrated into multiple AMD products that address the growing need for high-performance, power-efficient compute and graphics technologies across a broad set of applications, from personal computers to data centers to immersive computing devices.
AMD has taped out multiple products using GLOBALFOUNDRIES' 14nm Low Power Plus (14LPP) process technology and is currently conducting validation work on 14LPP production samples. Today's announcement represents another significant milestone towards reaching full production readiness of GLOBALFOUNDRIES' 14LPP process technology, which will reach high-volume production in 2016. The 14LPP platform taps the benefits of three-dimensional, fully-depleted FinFET transistors to enable customers like AMD to deliver more processing power in a smaller footprint for applications that demand the ultimate in performance.
"FinFET technology is expected to play a critical foundational role across multiple AMD product lines, starting in 2016," said Mark Papermaster, senior vice president and chief technology officer at AMD. "GLOBALFOUNDRIES has worked tirelessly to reach this key milestone on its 14LPP process. We look forward to GLOBALFOUNDRIES' continued progress towards full production readiness and expect to leverage the advanced 14LPP process technology across a broad set of our CPU, APU, and GPU products."
"Our 14nm FinFET technology is among the most advanced in the industry, offering an ideal solution for demanding high-volume, high-performance, and power-efficient designs with the best die size," said Mike Cadigan, senior vice president of product management at GLOBALFOUNDRIES. "Through our close design-technology partnership with AMD, we can help them deliver products with a performance boost over 28nm technology, while maintaining a superior power footprint and providing a true cost advantage due to significant area scaling."
GLOBALFOUNDRIES' 14LPP FinFET is ramping with production-ready yields and excellent model-to-hardware correlation at its Fab 8 facility in New York. In January, the early-access version of the technology (14LPE) was successfully qualified for volume production, while achieving yield targets on lead customer products. The performance-enhanced version of the technology (14LPP) was qualified in the third quarter of 2015, with the early ramp occurring in the fourth quarter of 2015 and full-scale production set for 2016.
AMD has taped out multiple products using GLOBALFOUNDRIES' 14nm Low Power Plus (14LPP) process technology and is currently conducting validation work on 14LPP production samples. Today's announcement represents another significant milestone towards reaching full production readiness of GLOBALFOUNDRIES' 14LPP process technology, which will reach high-volume production in 2016. The 14LPP platform taps the benefits of three-dimensional, fully-depleted FinFET transistors to enable customers like AMD to deliver more processing power in a smaller footprint for applications that demand the ultimate in performance.
"FinFET technology is expected to play a critical foundational role across multiple AMD product lines, starting in 2016," said Mark Papermaster, senior vice president and chief technology officer at AMD. "GLOBALFOUNDRIES has worked tirelessly to reach this key milestone on its 14LPP process. We look forward to GLOBALFOUNDRIES' continued progress towards full production readiness and expect to leverage the advanced 14LPP process technology across a broad set of our CPU, APU, and GPU products."
"Our 14nm FinFET technology is among the most advanced in the industry, offering an ideal solution for demanding high-volume, high-performance, and power-efficient designs with the best die size," said Mike Cadigan, senior vice president of product management at GLOBALFOUNDRIES. "Through our close design-technology partnership with AMD, we can help them deliver products with a performance boost over 28nm technology, while maintaining a superior power footprint and providing a true cost advantage due to significant area scaling."
GLOBALFOUNDRIES' 14LPP FinFET is ramping with production-ready yields and excellent model-to-hardware correlation at its Fab 8 facility in New York. In January, the early-access version of the technology (14LPE) was successfully qualified for volume production, while achieving yield targets on lead customer products. The performance-enhanced version of the technology (14LPP) was qualified in the third quarter of 2015, with the early ramp occurring in the fourth quarter of 2015 and full-scale production set for 2016.
28 Comments on GLOBALFOUNDRIES Achieves 14nm FinFET Technology Success for Next-Gen AMD Product
I'm sure Kaby Lake (Skylake refresh) is Intel's response to Zen. It might be a huge step up from Skylake in terms of transistor count.
I'm still a little skeptical on the CPU side of things. Intel outspends AMD 10 to 1 on R&D.
"DIFFUSED IN USA"
"MADE IN MALAYSIA"
:)
But servers are the bread and butter of CPU makers like Intel and AMD (and apparently even Qualcomm), so what AMD really needs to boost money flow is some nice design sins in server space.Reminds me of RV770, Cypress, Tahiti (new node process as well as massively overhauled architecture), K6, etc, etc. It's been a while though...
Kaby is too close (relatively speaking) to be used as a response if necessary but I imagine Cannonlake would receive the adjustment if Zen is worthy of response (and I HOPE it is as that is good for everyone).
-AMD was having difficulty financing the construction in 2008.
-GloFo was created in 2009 acquiring the contract to build it from AMD.
-GloFo broke ground 2009.
-GloFo added another $2 billion investment to the New York fab in 2013.
From what I understand the plants acquired from IBM throughout NY state and in Burlington, VT all needed retooling and renovation and no way would have been ready.