Thursday, December 14th 2006
ATI to use NanoFoil on R600
Probably all of us are eagerly awaiting the R600 from ATI. The news floating on the internet is mixed - some report that the chip runs cool and doesn't draw a lot of power, while others tell us the contrary.
Hexus.net managed to find out some information about how ATI plans to cool the chip. Apparently, NanoFoil technology will be used. The technology works by having ultra-thin nanolayers of aluminium and nickel that can be controlled by heat, electricity or mechanical or optical stimulation, causing a reaction that gives off heat in a controlled fashion. The technology has been around since 2003, but hasn't yet been used to cool computer components.
Source:
Hexus
Hexus.net managed to find out some information about how ATI plans to cool the chip. Apparently, NanoFoil technology will be used. The technology works by having ultra-thin nanolayers of aluminium and nickel that can be controlled by heat, electricity or mechanical or optical stimulation, causing a reaction that gives off heat in a controlled fashion. The technology has been around since 2003, but hasn't yet been used to cool computer components.
15 Comments on ATI to use NanoFoil on R600
I hope Zalman gets news of this and starts to manufactur some DX10 card coolers..
The only way it will help with cooling is to form a better bond with the heat sink. Most likely they will use it on the heatspreader or this article is a little of and there using it to solder. I really hope ATI isn't dumb enough to fuse there stock heatsink to the chip:eek:
-The Eagle
would make it tough for aftermarket cooling.......especially for us H2O guys...that would suck...unless of course they release cards without cooling on them for cheaper prices...that could be nice...
looking forward to the first reviews and "REAL" specs on that...:rockout:
How great is this stuff? Even the best TIM would give like a few deg drop and if it's that great I want some. Nano stuffs f#$# cool:rockout:
It would be great if someone released waterblocks or TECs perfused to chips as it appears not to be DIY yet.
-The Eagle
me-->:slap:<--ati cooling dev dept...