ATP Electronics, a leading manufacturer of high-performance cost-effective DRAM modules, announces the release of fast, low-power DDR4 solutions for the latest Intel Xeon Platinum, Gold, Silver and Bronze Scalable processors and 8th-generation Intel Core i7/i5/i3 processors. ATP's latest DDR4 solutions are ideal for high-performance computing (HPC) applications requiring high density, low power, great scalability and efficiency, such as telecommunication infrastructures, networking storage systems, network-attached storage (NAS) servers, micro/cloud servers, and embedded systems like industrial PCs.

Built-in enterprise-level density dramatically increases the capabilities of growing embedded and cloud computing environments to meet large-scale, memory-intensive workloads. The 1.2V low power design delivers optimal savings, keeping systems cool without escalating power bills. The latest Intel Xeon Scalable processors provide native support for six memory channels that can operate at the same speed even at full load, so ATP's DDR4-2666 modules ensure a big boost in performance and productivity with their fast 2666 MT/s data rate. The increased interface speed from 2400/MTs to 2666 MT/s amplifies theoretical peak performance by 15%.By implementing the 8 Gbit IC design, ATP DDR4 modules enable cost-effective scalability and expansion of memory footprints to keep pace with future requirements. Each module undergoes rigorous testing to ensure reliability and long-term endurance.

ATP unbuffered DDR4-2666 modules are available in SODIMM, UDIMM, ECC UDIMM, ECC SODIMM, and ECC mini-DIMM. Registered DIMMs (RDIMMs) are also available.