Thursday, June 25th 2020

Intel's Raja Koduri Brandishes a Large Chip Package, Calls it BFP (Big Fabulous Package)
Raja Koduri likes to show off his work in GPU engineering, way back from his days at AMD. His latest bragging rights is what he calls the "BFP" (big fabulous package), a large GPU package that's larger than even an AMD SP3 package, roughly 75 mm x 80 mm in size, looking at its "family" photo where a AA battery is used for scale. This could very well be the largest version of Xe "Ponte Vecchio." Koduri's caption reads "And..they let me hold peta ops in my palm (almost)," likely referring to the chip's tensor ops performance. He also posted pictures of Xe's various test platforms, from Intel's labs in Folsom, California.
30 Comments on Intel's Raja Koduri Brandishes a Large Chip Package, Calls it BFP (Big Fabulous Package)
Is it going to be like that? I wonder.
hmmmm -_*
When HBM first came to the market nad R9Nano hit the shelves, I've said: finally! No more VGAs long as the computer itself weighting 5-6kg and covering 3 slots.
Unfortunately it's getting only worse as time goes on. Latest 20xx series was just ludicrous with size. Now this (I know it's just in-house ES) ginormous graphic processor.
I know HBM is expensive, but give users a choice. It would be so nice to have card of the current Titax RTX or 2080TiRTX in a envelope of R9Nano for consumers. I would pay just for that.