The China Economic News Service reported today that Microsoft has assigned Taiwan Semiconductor Manufacturing (TSMC), Advanced Semiconductor Engineering (ASE) and Nanya PCB to manufacture, test and package the latest version of Xbox 360, codenamed "Jasper". TSMC will build ATI Xenos graphics and memory controller hub (GMCH) for the new Jasper console, using 65nm process. ASE was contracted to package and test the two chips, while Nanya has won orders to supply flip-chip packaging substrates, reports CENS.com. Current Xbox 360 consoles named Falcon utilize GMCH and eDRAM cores manufactured using 90nm process technology at TSMC as well as CPU built at IBM using 65nm fabrication process. The new Jasper Xbox 360s are projected to consume less electricity, use less complex cooling systems and logically produce less noise. In addition the revised consoles will fix the so-called "red ring of death" issue that plagued many Falcon systems. Microsoft will reportedly make available the Jasper version of XBox 360 game console in August this year.