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VIA 1.1GigaPro (C3 800)

1
Cores
1
Threads
11 W
TDP
800 MHz
Frequency
N/A
Boost
Samuel 2
Codename
VIA BGA 368
Socket
Front
Front
VIA BGA 368
VIA BGA 368
The VIA 1.1GigaPro (C3 800) was a desktop processor with 1 core, launched in September 2001. It is part of the C3 lineup, using the Samuel 2 (C5B) architecture with VIA BGA 368. 1.1GigaPro (C3 800) has 64 KB of L2 cache and operates at 800 MHz. VIA is building the 1.1GigaPro (C3 800) on a 150 nm production process using 16 million transistors. The silicon die of the chip is not fabricated at VIA, but at the foundry of TSMC. The multiplier is locked on 1.1GigaPro (C3 800), which limits its overclocking capabilities.
With a TDP of 11 W, the 1.1GigaPro (C3 800) consumes very little energy. For communication with other components in the machine, 1.1GigaPro (C3 800) uses a PCI-Express N/A connection. Although the processor doesn't come with integrated graphics, certain motherboards with compatible chipsets can provide this capability. Inside the box you will not only find the processor, but also a Yes cooler.
A lot of games will not work on this processor, because they require the SSE instruction set, which is not supported.

Physical

Socket: VIA BGA 368
Foundry: TSMC
Process Size: 150 nm
Transistors: 16 million
Die Size: 52 mm²
Package: BGA
tJMax: 85°C

Processor

Market: Desktop
Production Status: End-of-life
Release Date: Sep 11th, 2001
Part#: AG40VT1
Bundled Cooler: Yes

Performance

Frequency: 800 MHz
Turbo Clock: N/A
Base Clock: 133 MHz
Multiplier: 6.0x
Multiplier Unlocked: No
Voltage: 1.65 V
TDP: 11 W
Average Power:6 W

Architecture

Codename: Samuel 2
Generation: C3
(Samuel 2 (C5B))
Memory Support: unknown
ECC Memory: No
PCI-Express: N/A
Chipsets: VIA Apollo 133, SiS 630E

Core Config

# of Cores: 1
# of Threads: 1
SMP # CPUs: 1
Core Pipeline:12 Stages
Integrated Graphics: On certain motherboards (Chipset feature)

Cache

Cache L1: 128 KB
Cache L2: 64 KB

Features

  • MMX
  • 3DNow!
  • x86
Jul 21st, 2024 06:28 EDT change timezone

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