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AMD EPYC 7663P

56
Cores
112
Threads
240 W
TDP
2000 MHz
Frequency
3.5 GHz
Boost
Milan
Codename
Socket SP3
Socket
Front
Front
Delidded
Delidded
Connectivity
Connectivity
AMD Socket SP3
AMD Socket SP3
The AMD EPYC 7663P is a server/workstation processor with 56 cores, launched in September 2023, at an MSRP of $3139. It is part of the EPYC lineup, using the Zen 3 (Milan) architecture with Socket SP3. Thanks to AMD Simultaneous Multithreading (SMT) the core-count is effectively doubled, to 112 threads. EPYC 7663P has 256 MB of L3 cache and operates at 2000 MHz by default, but can boost up to 3.5 GHz, depending on the workload. AMD is making the EPYC 7663P on a 7 nm production node using 33,200 million transistors. The silicon die of the chip is not fabricated at AMD, but at the foundry of TSMC. The multiplier is locked on EPYC 7663P, which limits its overclocking potential.
With a TDP of 240 W, the EPYC 7663P is extremely power hungry, which means you need top-notch cooling. AMD's processor supports DDR4 memory with an eight-channel interface. The highest officially supported memory speed is 3200 MT/s, but with overclocking (and the right memory modules) you can go even higher. ECC memory is supported, too, which is an important capability for mission-critical systems, to avoid data corruption. For communication with other components in the machine, EPYC 7663P uses a PCI-Express Gen 4 connection. This processor lacks integrated graphics, you might need a graphics card.
Hardware virtualization is available on the EPYC 7663P, which greatly improves virtual machine performance. Additionally, IOMMU virtualization (PCI passthrough) is supported, so that guest virtual machines may directly use host hardware. Programs using Advanced Vector Extensions (AVX) can run on this processor, boosting performance for calculation-heavy applications. Besides AVX, AMD is including the newer AVX2 standard, too, but not AVX-512.

Physical

Socket: AMD Socket SP3
Foundry: TSMC
Process Size: 7 nm
Transistors: 33,200 million
Die Size: 8x 81 mm²
I/O Process Size:12 nm
I/O Die Size:416 mm²
Package: FCLGA-4094

Processor

Market: Server/Workstation
Production Status: Active
Release Date: Sep 5th, 2023
Launch Price: $3139
Part#: 100-000001284

Performance

Frequency: 2000 MHz
Turbo Clock: up to 3.5 GHz
Base Clock: 100 MHz
Multiplier: 20.0x
Multiplier Unlocked: No
TDP: 240 W
Configurable TDP:225-280 W

Architecture

Codename: Milan
Generation: EPYC
(Zen 3 (Milan))
Memory Support: DDR4
Rated Speed: 3200 MT/s
Memory Bus: Eight-channel
ECC Memory: Yes
PCI-Express: Gen 4, 128 Lanes
(CPU only)

Core Config

# of Cores: 56
# of Threads: 112
# of CCDs:8
Cores per CCD:8
SMP # CPUs: 1
Integrated Graphics: N/A

Cache

Cache L1: 64 KB (per core)
Cache L2: 512 KB (per core)
Cache L3: 256 MB (shared)

Features

  • MMX
  • EMMX
  • SSE
  • SSE2
  • SSE3
  • SSSE3
  • SSE4.1
  • SSE4.2
  • SSE4A
  • AVX
  • AVX2
  • ABM
  • BMI1
  • BMI2
  • FMA3
  • AES
  • RdRand
  • SHA
  • ADX
  • CLMUL
  • F16C
  • Real
  • Protected
  • SMM
  • FPU
  • NX bit
  • SMT
  • AMD-Vi
  • AMD-V
  • SME
  • TSME
  • SEV
  • SenseMi
  • Boost 2
Oct 18th, 2024 11:56 EDT change timezone

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