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AMD Ryzen 3 PRO 8300GE

4
Cores
8
Threads
35 W
TDP
3.4 GHz
Frequency
4.9 GHz
Boost
Phoenix2
Codename
Socket AM5
Socket
Front
Front
Connectivity
Connectivity
AMD Socket AM5
AMD Socket AM5
The AMD Ryzen 3 PRO 8300GE is a desktop processor with 4 cores, launched in April 2024. It is part of the Ryzen 3 lineup, using the Zen 4 (Phoenix) architecture with Socket AM5. Thanks to AMD Simultaneous Multithreading (SMT) the core-count is effectively doubled, to 8 threads. Ryzen 3 PRO 8300GE has 8 MB of L3 cache and operates at 3.4 GHz by default, but can boost up to 4.9 GHz, depending on the workload. AMD is building the Ryzen 3 PRO 8300GE on a 4 nm production process using 20,900 million transistors. The silicon die of the chip is not fabricated at AMD, but at the foundry of TSMC. The multiplier is locked on Ryzen 3 PRO 8300GE, which limits its overclocking capabilities.
With a TDP of 35 W, the Ryzen 3 PRO 8300GE consumes only little energy. AMD's processor supports DDR5 memory with a dual-channel interface. The highest officially supported memory speed is 5200 MT/s, but with overclocking (and the right memory modules) you can go even higher. ECC memory is supported, too, which is an important capability for mission-critical systems, to avoid data corruption. For communication with other components in the machine, Ryzen 3 PRO 8300GE uses a PCI-Express Gen 4 connection. This processor features the Radeon 740M integrated graphics solution. Inside the box you will not only find the processor, but also a Wraith Stealth cooler.
Hardware virtualization is available on the Ryzen 3 PRO 8300GE, which greatly improves virtual machine performance. Additionally, IOMMU virtualization (PCI passthrough) is supported, so that guest virtual machines may directly use host hardware. Programs using Advanced Vector Extensions (AVX) will run on this processor, boosting performance for calculation-heavy applications. Besides AVX, AMD has added support for the newer AVX2 and AVX-512 instructions, too.

Physical

Socket: AMD Socket AM5
Foundry: TSMC
Process Size: 4 nm
Transistors: 20,900 million
Die Size: 137 mm²
Package: FC-LGA1718
tJMax: 95°C

Processor

Market: Desktop
Production Status: Active
Release Date: Apr 16th, 2024
Part#: 100-000001189
Bundled Cooler: Wraith Stealth

Performance

Frequency: 3.4 GHz
P-Core Base:4.0 GHz
Turbo Clock: up to 4.9 GHz
E-Core Frequency: 3.2 GHz
up to 3.6 GHz
Base Clock: 100 MHz
Multiplier: 40.0x
Multiplier Unlocked: No
TDP: 35 W
PPT:47 W

Architecture

Codename: Phoenix2
Generation: Ryzen 3
(Zen 4 (Phoenix))
Memory Support: DDR5
Rated Speed: 5200 MT/s
Memory Bus: Dual-channel
ECC Memory: Yes
PCI-Express: Gen 4, 14 Lanes
(CPU only)
Chipsets: X870E, X870, B850, B840, X670E, X670, B650E, B650, A620

Core Config

# of Cores: 4
# of Threads: 8
Hybrid Cores: 1 + 3
SMP # CPUs: 1
Integrated Graphics: Radeon 740M

Cache

Cache L1: 64 KB (per core)
Cache L2: 1 MB (per core)
Cache L3: 8 MB (shared)

Features

  • MMX
  • SSE
  • SSE2
  • SSE3
  • SSSE3
  • SSE4A
  • SSE4.1
  • SSE4.2
  • AES-NI
  • AVX
  • AVX2
  • AVX-512
  • BMI1
  • BMI2
  • SHA
  • F16C
  • FMA3
  • NX-Bit
  • AMD64
  • EVP
  • AMD-V
  • AMD-V SVM
  • AMD-V RVI
  • AMD AVIC
  • AMD-Vi
  • SLAT
  • SMAP
  • SMEP
  • SMT
  • GMET
  • Windows Secured-Core
  • AMD Secure Processor
  • Precision Boost 2

Notes

Graphics engine boost clock: 2600MHz

ECC mode requires motherboard support.
Feb 5th, 2025 09:49 EST change timezone

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