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AMD Ryzen 9 9955HX3D

16
Cores
32
Threads
55 W
TDP
2.5 GHz
Frequency
5.4 GHz
Boost
Fire Range
Codename
Socket FL1
Socket
Front
Front
Connectivity
Connectivity
AMD Socket FL1
AMD Socket FL1
The AMD Ryzen 9 9955HX3D is a mobile processor with 16 cores, launched in January 2025. It is part of the Ryzen 9 lineup, using the Zen 5 (Fire Range) architecture with Socket FL1. Thanks to AMD Simultaneous Multithreading (SMT) the core-count is effectively doubled, to 32 threads. Ryzen 9 9955HX3D has 128 MB of L3 cache and operates at 2.5 GHz by default, but can boost up to 5.4 GHz, depending on the workload. AMD is making the Ryzen 9 9955HX3D on a 4 nm production node using 16,630 million transistors. The silicon die of the chip is not fabricated at AMD, but at the foundry of TSMC. You may freely adjust the unlocked multiplier on Ryzen 9 9955HX3D, which simplifies overclocking greatly, as you can easily dial in any overclocking frequency.
With a TDP of 55 W, the Ryzen 9 9955HX3D consumes typical power levels for a modern PC. AMD's processor supports DDR5 memory with a dual-channel interface. The highest officially supported memory speed is 5600 MT/s. ECC memory is supported, too, which is an important capability for mission-critical systems, to avoid data corruption. For communication with other components in the system, Ryzen 9 9955HX3D uses a PCI-Express Gen 5 connection. This processor features the Radeon 610M integrated graphics solution.
Hardware virtualization is available on the Ryzen 9 9955HX3D, which greatly improves virtual machine performance. Programs using Advanced Vector Extensions (AVX) can run on this processor, boosting performance for calculation-heavy applications. Besides AVX, AMD has added support for the newer AVX2 and AVX-512 instructions, too.

Physical

Socket: AMD Socket FL1
Foundry: TSMC
Process Size: 4 nm
Transistors: 16,630 million
Die Size: 2x 70.6 mm²
I/O Process Size:6 nm
I/O Transistors:3,400 million
I/O Die Size:122 mm²
Package: µFC-BGAFL1
tJMax: 100°C

Processor

Market: Mobile
Production Status: Active
Release Date: Jan 6th, 2025
Part#: 100-000001030
Bundled Cooler: None

Performance

Frequency: 2.5 GHz
Turbo Clock: up to 5.4 GHz
Base Clock: 100 MHz
Multiplier: 25.0x
Multiplier Unlocked: Yes
TDP: 55 W
Configurable TDP:75 W
PPT:74-101 W

Architecture

Codename: Fire Range
Generation: Ryzen 9
(Zen 5 (Fire Range))
Memory Support: DDR5
Rated Speed: 5600 MT/s
Memory Bus: Dual-channel
ECC Memory: Yes
PCI-Express: Gen 5, 28 Lanes
(CPU only)

Core Config

# of Cores: 16
# of Threads: 32
SMP # CPUs: 1
Integrated Graphics: Radeon 610M

Cache

Cache L1: 80 KB (per core)
Cache L2: 1 MB (per core)
Cache L3: 128 MB (shared)

Features

  • MMX
  • SSE
  • SSE2
  • SSE3
  • SSSE3
  • SSE4A
  • SSE4.1
  • SSE4.2
  • AES
  • AVX
  • AVX2
  • AVX-512
  • BMI1
  • BMI2
  • SHA
  • F16C
  • FMA3
  • AMD64
  • EVP
  • AMD-V
  • SMAP
  • SMEP
  • SMT
  • Precision Boost OD
  • Precision Boost 2
  • AMD EXPO

Notes

Radeon graphics dynamic frequency: 400-2200 MHz

Level 3 cache arranged as 2x 32MB 2D cache plus 1x 64MB 3D V-Cache.

ECC modes require motherboard support.
Mar 21st, 2025 03:43 EDT change timezone

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