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Processor | 7800X3D |
---|---|
Motherboard | MSI MAG Mortar b650m wifi |
Cooling | Thermalright Peerless Assassin |
Memory | 32GB Corsair Vengeance 30CL6000 |
Video Card(s) | ASRock RX7900XT Phantom Gaming |
Storage | Lexar NM790 4TB + Samsung 850 EVO 1TB + Samsung 980 1TB + Crucial BX100 250GB |
Display(s) | Gigabyte G34QWC (3440x1440) |
Case | Lian Li A3 mATX White |
Audio Device(s) | Harman Kardon AVR137 + 2.1 |
Power Supply | EVGA Supernova G2 750W |
Mouse | Steelseries Aerox 5 |
Keyboard | Lenovo Thinkpad Trackpoint II |
Software | W11 IoT Enterprise LTSC |
Benchmark Scores | Over 9000 |
Dear Intel, the unit is Å, not A, as his name was Ångström. I guess your marketing department couldn't figure out how to type it, so now your new nodes are in Ampere...
They're just predicting the amount of amps required for idling on those cpus by then. Remember, everything's a roadmap these days.
Intel 7. So its an i7 on Intel 7. You can really tell and see Pat's engineering influence is working out just fine. So glad they have real brains up there now. Even my 8700K feels a bit faster being on Intel 14 now. Fat Fins instead of Super, but still. Thanks, Pat!
How about thinking about it a bit more?
Transistor density of the node is not everything, architecture has a great impact. (e.g. AMD used to cram lots more transistors in Polaris than NV did with Pascal)
That is why L1 cache vs L1 cache was compared.
And, it was 22 by 22 for "7nm TSMC" and 24 by 24 for "14nm Intel". (yes, FOURTEEN, not ten)
Intel's 10nm might be closer to actual 7nm, than TSMC's.
And yet it doesn't perform as such, strange how that works then. It underlines that architecture indeed has impact. The choice of what you place on a die, for example, also determines the density. Regardless, TSMC is producing 7nm on an EUV process and ever since DUV was left behind, the node performs as it should compared to its predecessors.
So forget density, start thinking lithography and how to get there. Its the chip quality that determines the frequency options for example, and the binning.