am i the only one bothered that he rips his chipset heatsink off because it runs nice and cool but for some odd reason not enough?
I did find it "puzzling". IMO, this is one of those scenarios where it is best to follow one of the basic tenets of electronics operation and maintenance - "
If it ain't broke, don't fix it!"
But since we are already past that, I will say this - it is much more important to "properly" apply new TIM (thermal interface material) than deciding which TIM to apply. Proper application includes thoroughly cleaning the mating surfaces of old TIM and other contaminants before applying new TIM. Also, it is critical to ensure proper ESD precautions are observed. Then applying as thin a layer as possible while still providing complete coverage. If using a pad, I would use the same thickness. The motherboard engineers/designers chose that specific thickness for specific technical reasons. It was not some arbitrary decision based on a roll of the dice.
The principle is the thicker the pad the better the heat transfer to a certain degree.
Sorry, but actually, that is not true - the opposite is.
The most efficient transfer of heat occurs with direct metal-to-metal contact. It is important to remember the primary purpose for using any thermal interface material is to compensate for any irregularities in the flatness of the mating surfaces - that is, to fill unevenness and any microscopic pits and valleys that may trap unwanted "insulating" air between those surfaces. Any excess TIM is actually in the way and counterproductive to the most efficient transfer of heat.
So why use thicker pads? They are used to compensate for mechanical constraints - to act like a "shim" or spacer so proper
and even mounting pressures for the heatsink are applied. In some cases, a single heatsink may be used to cool more than one device that are not exactly the same height. For example, a thick pad may be used on a RAM stick where a single heat sink is used to cool 8 memory chips. A thicker pad will compensate for any height differences.
For additional information, see
heat - Thermal pad thickness - Electrical Engineering Stack Exchange and
temperature - Thermal pads, their thickness and conductivity - Electrical Engineering Stack Exchange
In order to increase the life expectancy of my motherboard
Sadly, there is a lot of misinformation being spewed out there by some "influencers" and wannabe experts who have had no formal education in electronics and should not even be talking about electronics. The idea that "cooler is always better" is one of those.
While keeping our electronics properly cooled is absolutely essential and critically important, cooler does NOT automatically mean better. As long as the electronics are being operated comfortably within their normal operating temperatures, there is no reason to expect cooler temps will make it perform better, be more stable, or have a longer life expectancy. In those scenarios, all you really get is bragging rights.
Your specs do not say which Asus Tuf case you have (assuming the computer in your specs is the one we are discussing here). Nevertheless, it must be noted it is the case's responsibility to provide a sufficient supply of cool air flowing through the case. The various component heatsinks must extract the heat from the device, but it is the air flow provided by the case cooling that must exhaust that heat out of the case.
While some may consider 65°C quite warm, it is not "hot!" So if me, and if I wanted to lower those temps, I would have looked at my case cooling first and to increasing the air flowing through my case. I might have added another case fan, or upgraded the existing case fans with fans that move more air. My point is, I would have done this before second guessing the MSI engineers and risk collateral damage through ESD or accidental mishandling during disassembling and assembling of that cooler - especially since replacing the TIM may have no significant impact on the chipset cooling at all!