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x570s Chipset Cooling. Any Ideas?

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Whats wrong?
 

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Whats wrong?
I'm nearly certain that AMD has design faults all the way down . Their CPU's requires high voltage, their chipset cannot work fanless etc etc.. I damn wish I built an Intel rig last year. at the moment chipset is 63C.

If Intel is USA, AMD is Russia. that's it.
 

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I'm nearly certain that AMD has design faults all the way down . Their CPU's requires high voltage, their chipset cannot work fanless etc etc.. I damn wish I built an Intel rig last year. at the moment chipset is 63C.

If Intel is USA, AMD is Russia. that's it.
Nah, their cpus sip power, their fanless chipset runs half as warm as yours.. it’s the chosen parts as a whole that is giving you a hard time.
 
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I'm nearly certain that AMD has design faults all the way down . Their CPU's requires high voltage, their chipset cannot work fanless etc etc.. I damn wish I built an Intel rig last year. at the moment chipset is 63C.

If Intel is USA, AMD is Russia. that's it.
Why you troll so much?
 
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Ok, I'm getting a new pad from Thermal grizzly since it has the highest thermal conductivity. But what does the thickness should be? The default thickness is 1mm. Should I buy 1,5mm or 0,5mm. Which one is better?
1mm. More than that could put too much pressure on the die, too little won't make enough contact.

Replaced the thermal pad with Thermal Grizzly, but there is little change. I thought MSI wouldn't bother to put a good thermal pad, but I was wrong.
Temps are normal.
 

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I'm nearly certain that AMD has design faults all the way down . Their CPU's requires high voltage, their chipset cannot work fanless etc etc.. I damn wish I built an Intel rig last year. at the moment chipset is 63C.

If Intel is USA, AMD is Russia. that's it.

Odd geopolitical comparisons aside, 65C is flipping cool for a passive X570 PCH. 65 is where I'm at under load, and mine is actively cooled. 80C is probably where I'd start to be a little concerned, but still not alarmed.

B550 is way too different to compare to X570 on many different levels.

Of course, that's what I'd say, but you seem to have this weird unfounded obsession with "reliability", so I'm guessing you'll go ahead with it anyway like the whole no turbo thing.

It's a standard form-over-function chipset heatsink. Don't expect your PCH to get any cooler even with top of the line (Fujipoly?) pads. It is still designed to draw like 11W. B450/B550 Promontory draws like what, 4W? Different design for different functions.
 
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Odd geopolitical comparisons aside, 65C is flipping cool for a passive X570 PCH. 65 is where I'm at under load, and mine is actively cooled. 80C is probably where I'd start to be a little concerned, but still not alarmed.

B550 is way too different to compare to X570 on many different levels.

Of course, that's what I'd say, but you seem to have this weird unfounded obsession with "reliability", so I'm guessing you'll go ahead with it anyway like the whole no turbo thing.

It's a standard form-over-function chipset heatsink. Don't expect your PCH to get any cooler even with top of the line (Fujipoly?) pads. It is still designed to draw like 11W. B450/B550 Promontory draws like what, 4W? Different design for different functions.
The thing about this board is the PCH is responsible for a ton of IO as you can have the 3rd PCie 16 slot to run at x8 or use 2 NVME drives and the extra 4 SATA ports all share bandwidth with the USB and an extra M2 equipped. With proper airflow the board should be in the 60s but can easily run in the 70s if you are running a Game from one of those slots.
 

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I'm nearly certain that AMD has design faults all the way down . Their CPU's requires high voltage, their chipset cannot work fanless etc etc.. I damn wish I built an Intel rig last year. at the moment chipset is 63C.
lol, keep dreaming..

Either stick to the subject or show us that the Z690 runs cooler than that.

From what I've seen, lots of Z690 users have temps around 60 - 65 degrees, while some have higher. In the end it's not AMD or Intel that makes the board. Poor heatsink = poor cooling.

Anyway, no one ever said 63 degrees was bad.
 
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I'm nearly certain that AMD has design faults all the way down . Their CPU's requires high voltage, their chipset cannot work fanless etc etc.. I damn wish I built an Intel rig last year. at the moment chipset is 63C.

If Intel is USA, AMD is Russia. that's it.

Over the top "reliability" obsession is over the top man...
Heck, the chipset on my asus rog X570-E is running 10°c hotter, on a 35°c day of summer and guess what... it is FAR from the critical 95°c...
I don't see the benefits in literally screwing up your warranty just to gain 5°C-10°c on a non-critical situation.

But hey, if you wanna go even deeper in Russian mud, then you can try putting a noctua 80mm fan on that chipset or change your thermal pad for K5-PRO (or even the 2...)
 
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lol, keep dreaming..

Either stick to the subject or show us that the Z690 runs cooler than that.

From what I've seen, lots of Z690 users have temps around 60 - 65 degrees, while some have higher. In the end it's not AMD or Intel that makes the board. Poor heatsink = poor cooling.

Anyway, no one ever said 63 degrees was bad.
What people don't appreciate about X570S (especially this board) is the only reason there is no fan is the propaganda that made fans on the PCH seem foolish. For me I prefer my temps running lower. Like the Asus X570 Strix E where if you remove the shroud you can drop temps by 12 to 15 degrees. Your sentiment is correct though as there is no way they would have done it if it wasn't feasible to have no fan and no danger to temps. With my Side panel off it get temps in the 70s but when I put on the side panel I see temps in the 60s. By far the most important thing is to have proper airflow in your case.
 
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Odd geopolitical comparisons aside, 65C is flipping cool for a passive X570 PCH. 65 is where I'm at under load, and mine is actively cooled. 80C is probably where I'd start to be a little concerned, but still not alarmed.

B550 is way too different to compare to X570 on many different levels.

Of course, that's what I'd say, but you seem to have this weird unfounded obsession with "reliability", so I'm guessing you'll go ahead with it anyway like the whole no turbo thing.

It's a standard form-over-function chipset heatsink. Don't expect your PCH to get any cooler even with top of the line (Fujipoly?) pads. It is still designed to draw like 11W. B450/B550 Promontory draws like what, 4W? Different design for different functions.
Yep - there's just no reason to give Thermal Grizzly pads to what is basically a recycled 12nm Zen IMC.

In this case, having better thermal transfer is like getting a bigger hose to fill up the same sized bucket. Doesn't make any sense, 65⁰C is also completely fine since like Phenom original lol.

The Russia / USA "analogy" just confuses me on so many levels. Has nothing to do with anything - only exposes lack of knowledge of both silicon and geopolitics
 
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z690s pch doesen't fare much better if you populate all m.2 slots.

I've burned the original pch 2mm pad dry within months. 92c at the end.

I switched to a 1 mm pad and a blob NT-H1 paste from the one side.

From the other i've included a ssd heatpipe glued to the pch cooler. Half of a 40mm aluminium cooler as well.

20220529_221336.jpg


And no, it was not fun since i also had to cut into my noctua card to fit everything :shadedshu:
20220529_125239.jpg


Just to run 4x m.2 ssd (and 4x sata ones) whilst never seeing over 70c z690 pch temps again -.-
 
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The OP just turned into a Karen thinking anything that doesn't satisfy me is a failure
 
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I'm nearly certain that AMD has design faults all the way down . Their CPU's requires high voltage, their chipset cannot work fanless etc etc.. I damn wish I built an Intel rig last year. at the moment chipset is 63C.

If Intel is USA, AMD is Russia. that's it.
How many threads must you make for you to understand that you're not smarter than an AMD engineer about their hardware?

Like, quit the trolling and go Intel already. Nothing has ever been wrong with your 3900x or chipset.
 
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Latest news..
I've changed the thermal pad with 1,5mm Thermal grizzly, and it seems the temperature is under control for now unless overheats later on.
1656364687681.png

Ps. System is up for about 5 hours
 

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Ps. This was never needed.
To be honest it didn't worth the effort.. The temperature change is only fractional. I thought MSI had used a cheap thermal pad and so I should replace it with better one.
 
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I thought MSI had used a cheap thermal pad
This really makes no sense and [speaking to the crowd] I don't understand why some feel that a board maker, CPU maker, computer maker, cooler maker, etc., would use poor quality thermal pastes or pads on their products. They know doing so would only make their products look bad and perform badly. They all know TIM (thermal interface materials) must be used on these devices. Electrical engineers, designers and maintainers have known this for many many decades.

So if they have to use TIM, why would one think they would use such inferior TIM that their customers would need to replace it? I find this particularly true (and puzzling) on products that are marketed for overclocking and capabilities and cooling features - such as with that MSI board. Surely, MSI knows if their products were to overheat and become unstable due to such a poor manufacturing decision, the bad publicity from upset buyers (and the IT media) would be devastating for their bottom line.

This is NOT a cost issue. TIM is cheap - even the best TIM when you buy at those quantities.

IMO, you are just lucky you did not cause collateral damage in the process.

To be honest it didn't worth the effort..
I appreciate your honesty admitting this. :) I hope potential future readers see this, get the message, and leave their TIM alone.
 
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I don't understand this logic.
And rightfully so. That's because it is not true so the logic does not make sense. See the comments and the Engineering Stack Exchange link in post #16 above.

There are exceptions - thicker pads are used only to compensate for uneven thicknesses of multiple devices using a single cooler, or with excessive spacing issues caused by the heatsink mounting mechanism preventing, for some reason, direct contact.
 
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I don't understand this logic.
I had a Gigabyte Vega 64 that I decided one day to use 2mm thermal pads on (the same as the one on the back). I replaced all the pads on the card and even on the back. It is to the point where the pads can be clearly seen. That card is in a Silverstone RL07 case with no airflow and a 240 rad's air being pulled through fans with the only exit point being the 120mm exhaust fan at the back. The card mines 24/7 and does not go above 68 C. I do agree though that you must make sure that contact remains optimal though. My example may only be specific for Vega though as there are no memory chips to worry about. I don't think a 3mm pad would have worked.

 
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What you did there is completely unnecessary, it was well within specs. Next time before you do such a thing ask a expert, don’t do rash decisions based on your feelings that 65°C are “high”.
 

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Mar 26, 2014
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9,670 (2.46/day)
Location
Washington, USA
System Name Veral
Processor 7800x3D
Motherboard x670e Asus Crosshair Hero
Cooling Corsair H150i RGB Elite
Memory 2x24 Klevv Cras V RGB
Video Card(s) Powercolor 7900XTX Red Devil
Storage Crucial P5 Plus 1TB, Samsung 980 1TB, Teamgroup MP34 4TB
Display(s) Acer Nitro XZ342CK Pbmiiphx, 2x AOC 2425W, AOC I1601FWUX
Case Fractal Design Meshify Lite 2
Audio Device(s) Blue Yeti + SteelSeries Arctis 5 / Samsung HW-T550
Power Supply Corsair HX850
Mouse Corsair Nightsword
Keyboard Corsair K55
VR HMD HP Reverb G2
Software Windows 11 Professional
Benchmark Scores PEBCAK
What you did there is completely unnecessary, it was well within specs. Next time before you do such a thing ask a expert, don’t do rash decisions based on your feelings that 65°C are “high”.
OP asks questions yet ignores the mass advice. Sadly your post is falling on deaf ears.
 
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