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NVIDIA GT200B
GT200B
Heat Spreader
G200-105-B3
G200-350-B3
G200-400-B3
Fritzchens Fritz
Die Shot
Die TPC
Block Diagram
TPC Diagram
NVIDIA's GT200B GPU uses the Tesla 2.0 architecture and is made using a 55 nm production process at TSMC. With a die size of 470 mm² and a transistor count of 1,400 million it is a very big chip. GT200B supports DirectX 11.1 (Feature Level 10_0). For GPU compute applications, OpenCL version 1.1 and CUDA 1.3 can be used. It features 240 shading units, 80 texture mapping units and 32 ROPs.
Graphics Processor
Released
Jun 1st, 2008
GPU Name
GT200B
Codename NVA0
Architecture
Tesla 2.0
Foundry
TSMC
Process Size
55 nm
Transistors
1,400 million
Density
3.0M / mm²
Die Size
470 mm²
Package
BGA-1981
Graphics Features
DirectX
11.1 (10_0)
OpenGL
3.3
OpenCL
1.1
Vulkan
N/A
CUDA
1.3
Shader Model
4.0
WDDM 1.2
PureVideo HD VP2
VDPAU Feature Set A
Render Config
Shading Units
240
TMUs
80
ROPs
32
SM Count
30
SFUs 60
TPCs 10
Tex L1 Cache 24 KB per TPC
L2 Cache
256 KB
Max. TDP
800 W
NVIDIA GPU Architecture History
Graphics cards using the NVIDIA GT200B GPU
Name
Chip
Memory
Shaders
TMUs
ROPs
GPU Clock
Memory Clock
G200-350-B3
1024 MB
240
80
32
648 MHz
1242 MHz
G200-400-B3
896 MB
240
80
28
576 MHz
999 MHz
G200-103-B2
896 MB
216
72
28
576 MHz
999 MHz
G200-105-B3
896 MB
240
80
28
633 MHz
1134 MHz
G200-350-B3
1024 MB
240
80
32
648 MHz
1242 MHz
4 GB
240
80
32
648 MHz
800 MHz
4 GB
240
80
32
648 MHz
800 MHz
4 GB
240
80
32
610 MHz
800 MHz
1536 MB
192
64
24
602 MHz
800 MHz
G200-835-B2
1024 MB
192
64
16
600 MHz
800 MHz
1536 MB
192
64
24
602 MHz
800 MHz
1536 MB
192
64
24
602 MHz
800 MHz
1024 MB
240
80
32
610 MHz
800 MHz
4 GB
240
80
32
610 MHz
800 MHz
4 GB
240
80
32
610 MHz
800 MHz
2 GB
240
80
32
610 MHz
800 MHz
G200-105-B3
896 MB
240
80
28
633 MHz
1134 MHz
4 GB
240
80
32
610 MHz
800 MHz
G200-103-B3
896 MB
192
64
28
576 MHz
999 MHz
G200-350-B3
2 GB
240
80
32
648 MHz
1152 MHz
G200-400-B3
896 MB
240
80
28
576 MHz
1008 MHz
GT200B GPU Notes
PureVideo HD: VP2
VDPAU: Feature Set A
GT200B, commonly printed on the chip package as G200-xxx-Bx is an optical shrink of the G200 core to the newer 55 manufacturing process of TSMC. It helped shrink the core's energy and thermal footprints to a level that even facilitated building a dual-GPU accelerator
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