NVIDIA is possibly launching a more cost-effective variant of its GeForce RTX 4070 graphics card featuring GDDR6 memory, replacing the GDDR6X that it originally launched with. The new SKU would be better differentiated from the RTX 4070 SUPER. When NVIDIA refreshed its RTX 40-series "Ada" product stack in January, it discontinued the RTX 4070 Ti and RTX 4080, which had been replaced in the lineup by the RTX 4070 Ti SUPER and RTX 4080 SUPER, but at the time it didn't tinker with the RTX 4070, which continued to sell at a roughly $50 lower price than the RTX 4070 SUPER. This new SKU could be an attempt by NVIDIA to get further down below the $500-mark in pricing.

The RTX 4070 originally launched with 21 Gbps GDDR6X memory. This new variant sees the memory replaced with 20 Gbps conventional GDDR6. The JEDEC standard GDDR6 chips could be cheaper than GDDR6X, and could very well be the same GDDR6 chip models AMD uses in some of its higher Radeon RX 7000 series SKUs. This, however, comes with a 4.75% drop in memory bandwidth, which NVIDIA probably overcomes with increasing the GPU clocks a touch. The ASIC code for this SKU is AD104-251, compared to the AD104-250 of the original RTX 4070. The core configuration is otherwise unchanged—you get 5,888 CUDA cores across 46 streaming multiprocessors. Galax has a card based on this SKU ready.

Cable Matters, a leader in developing cutting-edge connectivity solutions, introduces a USB4 20 Gbps Switch, meeting the diverse needs of today's dynamic remote workforce. This versatile, powerful device seamlessly blends performance, adaptability, and cost efficiency, offering users an unparalleled connectivity solution.

"The vision of this product grew from the needs of today's remote workforce," says Jeff Jiang, CEO of Cable Matters. "People are doing more than ever with multiple devices and require connectivity solutions that provide performance and flexibility at an affordable price." Unlike traditional switches, the USB4 20 Gbps Switch is engineered to handle two USB-C, USB4 or Thunderbolt enabled devices concurrently, effortlessly scaling to match the demands of gadget-intensive users. Users can instantly share a USB-C, USB4 or Thunderbolt monitor or docking station between two devices, and easily switch between them using either the unit's button or the included remote control.

Gigabyte's new Stealth series of motherboards has to date only had a single product, the Z690 Aorus Elite Stealth, but now, Gigabyte has added its first Stealth board for AMD CPUs. The B650E Aorus Stealth Ice not only has all of its connectors on the back of the board, but it also has a white/silver PCB with a similarly coloured front and back cover. Apart from the DIMM slots, all connectors are also in somewhat matching colours, although judging by the pictures, the colours don't quite match on all the connectors and slots. That aside, the B650E Aorus Stealth Ice is a pretty competent board, as long as you're not interested in adding anything more than a graphics card and some NVMe SSDs, as it has zero additional PCIe expansion slots. It's a rather bold move by Gigabyte, but at the same time, most gamers and consumers don't tend to add PCIe devices to their computers outside of additional storage these days.

Besides the PCIe 5.0 x16 slot, you get two M.2 sockets wired to the CPU, one PCIe 5.0—with its own, larger heatsink—and one PCIe 4.0, as well as a third PCIe 4.0 M.2 socket via the chipset. There's also support for four SATA 6 Gbps drives if more storage is needed. Gigabyte has also added an internal HDMI 1.4 port that's limited to 1080p30, which is intended to be used with Gigabyte's LCD Edge View display. Other connectivity on the back of the PCB includes a USB 3.2 Gen 2x2 (20 Gbps) port, a USB 3.2 (5 Gbps) pin-header as well as the usual USB 2.0, fan headers and LED headers that you'd expect from a modern motherboard. The VRM design is a 12+2+2 design with a 60 Amp DrMOS configuration for the 12+2 phases for the CPU and GPU.

What appears to be the full details of all of Intel's upcoming 800-series chipsets have leaked and although we've already seen what the Z890 chipset will offer, no details of the other SKUs have leaked to date. Maybe the biggest news is that there won't be an H870 chipset this time around, according to the leaker @jaykihn0 over at X/Twitter. The full range appears to be Z890, B860 and H810 for consumers, W880 for workstations and Q870 for corporate desktops. That said, the Z890 and W880 are identical in terms of slots and ports, but whereas the W880 gains full ECC support and Intel vPro and remote management, it loses the CPU and bus overclocking features of the Z890. The Q870 loses four chipset PCIe 4.0 lanes, one 20 Gbps or two 10 Gbps USB 3.2 ports, but is otherwise similar to the Z890, minus all the overclocking features, but with Intel vPro and remote management.

The B860 ends up on the chopping block as always and loses not only 10 chipset PCIe lanes compared to the Z890 chipset, but also four lanes from the CPU and four lanes on the DMI interface to the chipset. On top of that bifurcation goes out the window toigether with PCIe RAID and the chipset is only capable of having two 20 Gbps or four 10 Gbps USB 3.2 ports, but at least memory overclocking is still on the table. Finally, the H810 chipset is as basic as it gets, with no extra CPU PCIe lanes beyond the 16 lanes for a graphics card, but they are at least PCIe 5.0 this time around. The chipset itself is only equipped with a mere eight PCIe 4.0 lanes and it gets zero 20 Gbps and two 10 Gbps USB 3.2 ports. Note that all platforms support one or two Thunderbolt 4 / USB4 ports, but it's unclear if this is native support or via an add-on chip. Also note that the USB ports are shared and the maximum count is that for the 5 Gbps ports in the details below, so the Z890 for example, doesn't have 25 USB 3.2 ports in total, but rather only 10. All in all, we'll see a migration to PCIe 5.0 for the x16 slot across the entire 800-series chipset range and from the B860 and up, all chipsets will have a dedicated PCIe 5.0 x4 interface that will most likely be used for an M.2 slot. Also, the PCIe lane count is the maximum, but due to Intel's HSIO layout, some resources will be shared with SATA and Ethernet, which means not all PCIe lanes will be accessible.

Intel's upcoming Core Ultra "Arrow Lake-S" desktop processor introduces a new socket, the LGA1851, alongside the new Intel 800-series desktop chipset. We now have some idea what the 151 additional pins on the new socket are used for, thanks to a leaked platform map on the ChipHell forums, discovered by HXL. Intel is expanding the number of PCIe lanes from the processor. It now puts out a total of 32 PCIe lanes.

From the 32 PCIe lanes put out by the "Arrow Lake-S" processor's system agent, 16 are meant for the PCI-Express 5.0 x16 PEG slot to be used for discrete graphics. Eight are used as chipset bus, technically DMI 4.0 x8 (these are eight lanes that operate at Gen 4 speed for 128 Gbps per direction of bandwidth). There are now not one, but two CPU-attached M.2 NVMe slots possible, just like on the AMD "Raphael" and "Granite Ridge" processors. What's interesting, though, is that not both are Gen 5. One of these is Gen 5 x4, while the other is Gen 4 x4.

Cable Matters, a leader in providing top-tier connectivity solutions, today announced the launch of its groundbreaking Thunderbolt 5 cable manufactured by Lintes Technology Co., Ltd. The cable is available in 3 different lengths: 1 foot, 1.6 feet and 3.3 feet. This latest innovation delivers unparalleled performance, supporting up to 80 Gbps of bi-directional data transfer and up to 120 Gbps of video bandwidth, a substantial leap from the previous Thunderbolt 4 technology.

The new Thunderbolt 5 cable by Cable Matters represents a significant advancement in connectivity technology, offering increased bandwidth and power delivery capabilities. The Bandwidth Boost technology enables the cable to transmit up to 120 Gbps for the best display experience, providing up to 3 times increase over Thunderbolt 4's maximum bandwidth. This enhancement is particularly beneficial for demanding applications such as high-resolution video streaming, extensive data transfer, and high-speed gaming.

At Computex last week, we got a first look at Gigabyte's new TRX50 AI TOP motherboard—where TOP stands for trillions of operations per second—designed for AMD's Threadripper and Threadripper Pro CPUs. Now the company has released the full specifications of the TRX50 AI TOP and the board is packed to the brim with features. The E-ATX board is home to four PCIe x16 slots, all of which can operate in PCIe 5.0, but one can be limited to PCIe 4.0, depending on your choice of CPU. There's also four NVMe M.2 slots, with CPU dependent functionality. Other features include eight DIMM slots, but these are again CPU dependent, two 10 Gbps Ethernet interfaces via a pair of Marvell AQtion AQC113C controllers, WiFi 7 via a Qualcomm QCNCM865 module and dual audio chips, one for the rear ports and one for the front panel audio.

As this is a 2024 model, USB4 is of course also part of the package, but only one of the two USB4 supports DP Alt-mode, due to there only being one DP input. The board also has an internal USB 3.2 Gen 2x2 (20 Gbps) header for a case mounted USB-C port, a further six rear 5 Gbps USB Type-A ports, plus a pair of internal headers for a further four 5 Gbps USB Type-A ports. The board also has four SATA ports, a 16+8+4 power phase design, a 14-layer PCB, a debug display and the now common easy release features for the M.2 drive heatsinks and the graphics card. The TRX50 AI TOP also sports what Gigabyte calls "UC BIOS" which has a "User-Centred intuitive UX with Quick Access function", but there's currently no details of how this differs from previous UEFI releases from Gigabyte. There was no word on pricing.

Team Group showed off its latest portable SSDs at the 2024 Computex. We begin our tour of the Team Group booth with the T-Force M400, a portable SSD that takes advantage of the 40 Gbps USB4 interface to serve up phenomenal transfer speeds of up to 3700 MB/s reads, with up to 3400 MB/s writes. The M400 comes in capacities of 1 TB, 2 TB, and 4 TB. The T-Create P35 is a compact high-security portable SSD, which comes with native encryption, and the SSD Security Toolbox interface that protects data even against bruteforcing and BadUSB attacks. This drive packs TCG-Opal 2.0 with 256-bit AES hardware encryption. The drive takes advantage of the 10 Gbps USB 3.2 Gen 2 interface, and offers transfer speeds of up to 1000 MB/s reads/writes.

The T-Create CinemaPr P31 is a high performance portable SSD meant for lossless digital cinematography. It's designed to fit with popular cinema camera rigs, as well as video rigs made of DSLRs or even smartphones. The drive features a 20 Gbps USB 3.2 Gen 2x2 interface, and has up to 2000 MB/s of transfer speeds on tap, with enough speeds for 4K or 8K raw captures. There's also the T-Create CinemaPr R41 CFexpress 4.0 Type B, a related product with similar camera-mounting capabilities.

At Computex 2024, we went hands-on with the only custom-design AMD Radeon RX 7900 XTX graphics card to implement the 16-pin 12V-2x6 power connector. We've written quite a bit about this card, but weren't expecting it to be this long. This isn't just the only RX 7900 XTX with a 12V-2x6, but also the only air-cooled RX 7900 XTX that's strictly 2 slots-thick. ASRock made this card for graphics rendering farms, or AI development/inferencing builds, in which a GPU server would have 4-6 of these packed like sardines. The lateral blower helps ensure proper ventilation. The backplate is recessed to ensure better ventilation to the neighboring card.

The card sticks to AMD reference clock speeds of 2270 MHz Game clock, and 20 Gbps (GDDR6-effective) memory speed. ASRock also gave us a technical deep-dive into the card's design. For one, it's confirmed that the power connector is 12V-2x6 (H++) and not 12VHPWR. The cooling solution consists of a large copper vapor-chamber plate that makes contact with the GPU, memory, and VRM; conveying heat to an aluminium channel heatsink, which is ventilated by a high-speed lateral blower. The cooler shroud and backplate are both made of aluminium.

MSI also brought plenty of SSD products to the Computex 2024 show, including the new SPATIUM M560 PCIe 5.0 NVMe M.2 SSD based on the Phison E31T controller and Kioxia's 218-layer BiCS 3D TLC NAND, the new SPATIUM non-metal Vapor Chamber SSD Thermal Solution, and a couple of SSD accessories, including the DATAMAG Magnetic Portable SSD and the DATAVAULT SSD Enclosure.

As said, the new SPATIUM M560 PCIe 5.0 NVMe M.2 SSD will use the Phison 7 nm E31T controller paired up with Kioxia 8th generation 218-layer BiCS 3D TLC NAND and offer transfer rates of up to 10,000 MB/s. The controller, according to MSI, should bring up to a 15 percent reduction in power consumption as well as "maximize bandwidths and link efficiency". It will be available in 1 TB, and 2 TB capacities, and MSI will probably have a version that will include the new SPATIUM non-metal Vapor Chamber SSD Thermal Solution which has been also showcased at the Computex 2024 show. MSI says that this is yet another world's first, which uses "a two-phase flow transition of gas and liquid with minimal signal interference, ensuring rapid and silent heat exchange." According to MSI, the new SPATIUM non-metal Vapor Chamber SSD Thermal Solution should provide up to 11 degrees lower temperature compared to a standard aluminium heatsink.

Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid-state storage devices, today launched the SM2322, the industry's fastest single-chip high-performance, low-power, and cost-effective solution for external portable SSDs, supporting up to 8 TB of storage and achieves unparalleled data transfer rates of 20 Gbps for storing and accessing large amounts of content seamlessly from AI smartphones, high-performance multimedia devices, and game consoles.

With the increase of AI-capable devices, high density and high-performance storage solutions are becoming more critical to consumers. Portable SSDs powered by the new SM2322 controller are the only solution that offers low-cost, high-density and high-performance, making it the ideal solution for these applications. Equipped with a USB 3.2 Gen 2x2 interface with 20 Gb/s bandwidth and fully integrated hardware and software solution delivering peak sequential read and write transfer speeds of 2,100 MB/s and 2,000 MB/s, respectively, with up to 8 TB capacity, SM2322 powered high-performance portable SSDs enable an ultra-compact and lightweight form factor. The SM2322 supports the ProRes format and MFi specification for iPhone users while also being compatible with Windows, Android OS, and macOS, making it an ideal high-density, high-performance portable storage solution for AI smartphones, HD content creators, and gaming enthusiasts who require high-density, high-performance portable storage.

Today, we have the latest round of leaks that suggest that AMD's upcoming RDNA 4 graphics cards, codenamed the "RX 8000-series," might continue to rely on GDDR6 memory modules. According to Kepler on X, the next-generation GPUs from AMD are expected to feature 18 Gbps GDDR6 memory, marking the fourth consecutive RDNA architecture to employ this memory standard. While GDDR6 may not offer the same bandwidth capabilities as the newer GDDR7 standard, this decision does not necessarily imply that RDNA 4 GPUs will be slow performers. AMD's choice to stick with GDDR6 is likely driven by factors such as meeting specific memory bandwidth requirements and cost optimization for PCB designs. However, if the rumor of 18 Gbps GDDR6 memory proves accurate, it would represent a slight step back from the 18-20 Gbps GDDR6 memory used in AMD's current RDNA 3 offerings, such as the RX 7900 XT and RX 7900 XTX GPUs.

AMD's first generation RDNA used GDDR6 with 12-14 Gbps speeds, RDNA 2 came with GDDR6 at 14-18 Gbps, and the current RDNA 3 used 18-20 Gbps GDDR6. Without an increment in memory generation, speeds should stay the same at 18 Gbps. However, it is crucial to remember that leaks should be treated with skepticism, as AMD's final memory choices for RDNA 4 could change before the official launch. The decision to use GDDR6 versus GDDR7 could have significant implications in the upcoming battle between AMD, NVIDIA, and Intel's next-generation GPU architectures. If AMD indeed opts for GDDR6 while NVIDIA pivots to GDDR7 for its "Blackwell" GPUs, it could create a disparity in memory bandwidth performance between the competing products. All three major GPU manufacturers—AMD, NVIDIA, and Intel with its "Battlemage" architecture—are expected to unveil their next-generation offerings in the fall of this year. As we approach these highly anticipated releases, more concrete details on specifications and performance capabilities will emerge, providing a clearer picture of the competitive landscape.

ASUS today announced the TUF Gaming GT302 ARGB chassis, a case that makes it easy to build a high-performance PC with great cooling. Prepped and ready for great out-of-the-box cooling, equipped for wide compatibility with high-performance parts, and thoughtfully constructed inside and out for an easy PC DIY experience, the GT302 ARGB resets expectations for a mainstream case.

Great cooling - right out of the box
Most PC builders go big on cooling to ensure an excellent balance of performance and quiet operation. From the moment it is pulled out of the packaging, the TUF Gaming GT302 ARGB gives users a superb foundation for high-end cooling. This starts with a front panel designed first and foremost to maximize airflow efficiency. It is constructed of a wide-open, high-porosity square-type mesh that leaves ample room for fresh air to enter a PC. Four pre-installed 140 mm ARGB case fans move cool air through the chassis. These fans are exceptionally thick, measuring 28 mm in depth. These fans deliver up to 3 mmH2O static pressure and 115 CFM airflow for excellent cooling with quiet operation.

For those of you that have been waiting patiently for the first DisplayPort 2.1 monitors to start arriving, we have good news as Gigabyte has revealed details of its first display equipped with DP 2.1. The monitor in question is the AORUS FO32U2P which also sports a 4K QD-OLED panel with a 240 Hz refresh rate. The 31.5-inch QD-OLED panel does follow the standard feature set with a 10-bit panel, 250 cd/m² brightness, 1.5 million to one contrast ratio, 0.03 ms GTG response time and a DisplayHDR True Black 400 certification. Gigabyte has gone for an anti-reflective coating as well, which might not appeal to everyone.

As for the inputs, the DP2.1 ports support the full UHBR20 spec, which is 80 Gbps of total bandwidth over four 20 Gbps DisplayPort lanes, which means Gigabyte hasn't skimped on anything here. Yes, you read that correctly as well, the monitor has two DP 2.1 inputs, one full size and one mini DP input and there's also a USB Type-C input that supports DP-Alt mode, in addition to 65 W USB Power Delivery and USB data, although it's not clear if this port also supports DP 2.1. Furthermore, there are two HDMI 2.1 ports, one upstreams and two downstreams USB 3.2 ports, as well as a headphone and microphone jack. Gigabyte has also equipped the AORUS FO32U2P with a pair of 5 W speakers and a stand that offers tilt, swivel, pivot and height adjustments. The maximum power usage is said to be 78 W, but this shouldn't include the USB PD part. Other features include KVM support, daisy-chaining via a DP output, picture in picture and picture by picture support and various gaming features such as crosshairs, night vision, black equalizer etc. Gigabyte has as yet to announce official pricing on a release date.

Update Mar 5th: We've received additional details on the DisplayPorts of the AORUS FO32U2P from Gigabyte and only the DP inputs supports DP 2.1, whereas the USB Type-C input and the DP daisy-chain ports are limited to DP 1.4. The MSRP of the AORUS FO32U2P will be US$1399.99 with the AORUS FO32U2 which is a DP 1.4 version will have an MSRP of US$1199.99.

erial leaker @yuuki_ans on X/Twitter has released details on Intel's upcoming Barlow Rridge Thunderbolt 5 controller which will be known as the JHL9580 or JHL9540 depending on the SKU. The good news is that Intel has finally moved to PCIe 4.0 for the bus interface, which was expected due to the increased bandwidth on offer by Thunderbolt 5 over Thunderbolt 3 and 4. Barlow Ridge will use a PCIe 4.0 x4 interface to connect to the host and it appears that the earlier leak that suggested native Thunderbolt support in Arrow Lake-S might be incorrect, as there are diagrams showing Barlow Ridge connected to Arrow Lake-S CPUs.

Besides the faster bus, Thunderbolt 5 brings asymmetrical data transmission support which means that for display applications there will be a 120/40 Gbps mode, whereas for data only applications Thunderbolt 5 will deliver a symmetrical 80 Gbps mode. We should point out that this only appears to apply to the JHL9580 SKU, which also supports 40 Gbps USB4 speeds, whereas the JHL9540 for some reason remains a Thunderbolt 4 controller. That said, both of the Barlow Ridge SKUs get support for 20 Gbps USB 3.2 Gen 2x2, something that was lacking in previous Thunderbolt implementations. There will also be support for DisplayPort 2.1 via DP Alt Mode with full UHBR20 support when used with a DP80 certified cable. Actual data transfers are limited to the 64 Gbps PCIe 4.0 interface to the host system, just like USB4, but this does at least give Thunderbolt 5 extra head room for display data even in symmetrical mode. The Barlow Ridge controllers appear to be connected directly to the Arrow Lake-S CPUs via the PCIe 4.0 x4 interface, much in the same way USB4 host controllers connect to AMD's Ryzen 7000-series CPUS.

Thunderbolt 5 is almost upon us. The new specification offers 80 Gbps bi-directional transfers, with up to 120 Gbps per-direction through lane asymmetry. The new Thunderbolt 5 + 8K60 Display Docking Station from j5create (model: JTD5172) takes advantage of Thunderbolt 5 to wire out next-gen connectivity. It plugs into one Thunderbolt 5 upstream port, putting out three downstream Thunderbolt 5. Each of the three double up as USB. You also have four type-A USB 3.2 ports, two each of 10 Gbps and 5 Gbps. When connected to a 2-pin power brick, the dock puts out a high-powered USB-PD 3.1 port with 140 W delivery. An SD/microSD 4.0 card reader, stereo audio through 4-pole 3.5 mm jack, and a 2.5 GbE wired networking interface make for the rest of it.

VIA Labs, Inc. (VLI), a leading supplier of USB4, USB 3.2, and USB Power Delivery Controllers, today announced that the VL832 USB4 Endpoint Device Controller achieved USB4 certification from the USB Implementor's Forum (USB-IF). VIA Lab's VL832 supports USB 40 Gbps operation and is now listed on the USB-IF Integrator's List under TID: 10033.

VIA Lab VL832's USB-IF Certification represents a key milestone in the USB4 ecosystem. The certified USB4 device controller with an integrated USB 3.2 USB 10 Gbps Hub, USB 2.0 Hub, and DisplayPort output, provides essential connectivity for peripheral devices such as multi-function adapters and docking stations. In USB4 40 Gbps mode, VL832 supports full DisplayPort HBR3 bandwidth (32.4 Gbps), and the USB 20 Gbps hub can enable multiple USB 10 Gbps devices to operate at full performance on supported host platforms. Both metrics are double what was previously possible using DisplayPort Alternate Mode, which is limited to 2-lanes of DisplayPort when supporting USB 3.2 functionality.

ASRock, the leading global motherboard, graphics card, and mini PC manufacturer, today announced the ASRock Radeon RX 7900 XT Phantom Gaming White 20 GB OC. This graphics card is powered by the AMD Radeon RX 7900 XT GPU and built on 5 nm process. The new design pattern, featuring a white color scheme, is for enthusiasts seeking a white-themed PC. ASRock Radeon RX 7900 XT Phantom Gaming White 20 GB OC Graphics card has 84 compute units and boasts 5376 stream processors with a Boost Clock of up to 2450 MHz and a Game Clock of up to 2075 MHz. With 20 GB of GDDR6 high-speed memory clocked at 20 Gbps Effective and 80 MB of Infinity Cache, delivering 4K gaming at the highest settings.

ASRock Radeon RX 7900 XT Phantom Gaming White 20 GB OC graphics cards use the triple-fan Phantom Gaming 3X cooling system with the customized 100/100/100 mm Striped Ring Fans, Air Deflecting Fin, and Ultra-fit Heatpipe to provide superior cooling performance. ARGB LEDs that support Polychrome SYNC allow users to customize lighting effects, while the metal frame and backplate prevent the PCB from bending. The Super Alloy Graphics Card components provide stability for long-term operation. With its great performance and rich features, it can fully satisfy the needs of gamers.

QNAP Systems, Inc., a leading computing, networking and storage solution innovator, today launched the new QXG-10G2SF-X710 10GbE network expansion card. Equipped with the advanced Intel Ethernet Controller X710-BM2, this PCIe Gen 3 card (compatible with PCIe Gen 2) can be installed into a QNAP NAS or Windows /Linux PC, instantly augmenting connectivity with two high-speed 10GbE ports.

Featuring a low-noise fanless design, the QXG-10G2SF-X710 comes with two 10GbE SFP+ (10G/1G) network ports. Users can utilize SMB Multichannel or Port Trunking to combine bandwidth, providing up to 20 Gbps of data transfer potential, thereby accelerating large file sharing and intensive data transmission. The QXG-10G2SF-X710 also supports SR-IOV that enhances network resource allocation for VMware virtualization applications, reducing network bandwidth consumption and significantly lowering CPU usage for virtual machine servers (hypervisors).

QNAP Systems, Inc., a leading computing, networking, and storage solution innovator has launched the QXG-10G2T 10 GbE network expansion card. The QXG-10G2T is a cutting-edge, dual-port, 5-speed 10 GbE (RJ45) network expansion card, presenting an energy-efficient and cost-effective solution for various networking needs. This card is ideal for a professional photographers, videographers, or part of a collaborative team that requires simultaneous data access with lower latency.

Andy Chuang, QNAP Product Manager said, "We are excited to bring the QXG-10G2T to the market. This expansion card is a testament to QNAP's commitment to providing innovative and efficient solutions for modern networking challenges. With its versatile features and support for multiple speeds, the QXG-10G2T offers a seamless experience for both NAS and PC users, enhancing their workflow efficiency."

Simply NUC, Inc, a leading mini computer solutions company, today announced a new Simply NUC designed and branded mini PC product family called Moonstone. Equipped with the latest AMD Ryzen 7000 processors in a compact 4x4 design with an innovative cooling solution, Moonstone delivers top-tier computing performance for a wide range of usages. Supporting up to 64 GB of DDR5-4800 high-speed RAM and up to 16 TB of storage, Moonstone will increase your computing output while keeping a minimal footprint on both your desk and energy bill.

"Perfect for working or gaming, we saw an opportunity to set the new standard of innovation-driven mini PC performance," said Aaron Rowsell, Simply NUC co-CEO, "Moonstone is the highest performing 4x4 ever launched."

Back in October of last year, pictures from an ASUS event in China appeared online, showing off a pair of mATX motherboards that had most of its peripheral and power connectors on the reverse side of the motherboard. Now it appears that ASUS has decided to launch such a product, in the shape of the unforgettably named TUF Gaming B760M-BTF WiFi D4. The BTF part in the model name stands Back To (the) Future, although ASUS is most likely not allowed to use that term due to copyright restrictions, so it had to make do with BTF. Regardless of naming, the interesting part here is that all of the power connectors, the four SATA ports, the USB-C and USB 3.0 headers, as well as multiple other headers and one of three M.2 slots, are on the reverse side of the motherboard. This is all done to allow for cleaner cable management.

Other noteworthy features on the board include a single PCIe 5.0 x16 slot, one PCIe 4.0 x4 and one x1 slot, three USB-C ports, of which one is capable of 20 Gbps speeds and 2.5 Gbps Ethernet. As this is a mid-range board, we presume ASUS wants to test the waters so to speak, to make sure there's a market for such a product. However, one major hurdle is the small fact that there aren't any suitable chassis in the market and the product page even mentions that "This motherboard is compatible with specific case models", without going into any details. Presumably, ASUS will offer a suitable chassis, or have some partner(s) lined up that will provide a suitable chassis. Gigabyte announced something similar in May last year, but decided to team up with system integrators, something ASUS might be planning on as well.

Yes, you read that correctly, ASUS didn't launch just one, but two W790 based LGA-4677 motherboards today, namely the Pro WS W790-Sage SE and the Pro WS W790-Ace. The main difference here is that the Sage supports up to seven PCIe 5.0 x16 slots—one is a x8 slot electrically—and is designed for the Xeon W-3400 series, whereas the Ace supports five PCIe 5.0 x16 slots and is in turn designed for the Xeon W-2400 series. One downside of these boards is that they might not fit in a standard ATX case, as the Sage follows the SSI-EEB form factor and the Ace the SSI-CEB form factor, both of which are a fair bit wider than an ATX motherboard and with different mounting holes.

The Pro WS W790-ACE also sports eight DDR5 DIMM slots that operate in quad-channel and supports up to 2 TB of RAM if ECC R-DIMMs are used. Furthermore, ASUS has kitted out the Ace with a pair of PCIe 4.0 M.2 slots, one 2280 and one 22110 slot, four SATA ports, three slim SAS ports, a Marvell 10 Gbps and an Intel 2.5 Gbps Ethernet interface, a single USB 3.2 Gen 2x2 20 Gbps USB Type-C port around the back and an internal header for a second, case mounted port. Finally the board has four USB 3.2 Gen 2 10 Gbps Type-A ports around the back and a header for a further two., as well as eight USB 2.0 ports around the back and audio courtesy of a Realtek S1220A based solution with optical S/PDIF out.

MSI Radeon RX 7900 XTX Gaming Trio Classic, the company's first Radeon 7000 series RDNA3 graphics card, is finally listed online. American retailer Newegg put it up for sale at $1,100, a $100 premium over the $1000 AMD baseline price for the RX 7900 XTX. This is a "sold and shipped by Newegg" listing. MSI showed this card off last month, at the 2023 International CES. It pairs a custom-design PCB with a previous-generation Tri Frozr 2.0 cooling solution—the same one it used with its RX 6950 XT Gaming series. The PCB, however, is an MSI in-house design, with a meaty VRM that draws power from three 8-pin PCIe power connectors, and should hence feature a higher power-limit than the reference-design board, which has been known to scoop out a far greater overclocking headroom on other cards with a similar power setup (such as the ASUS TUF Gaming RX 7900 XTX).

The MSI RX 7900 XTX Gaming Trio Classic comes with clock speeds of 2.30 GHz game, and 2.50 GHz boost, which surprisingly are AMD's reference clocks. Perhaps MSI is saving factory-overclocks for the RX 7900 XTX Gaming X Trio Classic, which it will price even higher. Maxing out the 5 nm "Navi 31" GPU, the RX 7900 XTX offers 6,144 stream processors across 96 RDNA3 compute units, with 96 Ray Accelerators, 384 TMUs, 192 ROPs, and a 384-bit wide GDDR6 memory interface, running 24 GB of memory at 20 Gbps (960 GB/s memory bandwidth).

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions today unveiled the latest Intel B760 series motherboards. With enhanced XMP and hardware design of memory, the full B760 DDR5 lineup can achieve superb Z790-like memory performance of DDR5-7600. Featuring up to 16+1+1 phases of 60 amps digital power VRM design with full-coverage heatsink, GIGABYTE's B760 lineup provides premium power and thermal design for the high-frequency operation of Intel 13th gen processors. Meanwhile, the innovative PCIe and M.2 EZ-Latch technology are implemented to simplify the upgrade of graphics cards and M.2 SSDs, and to avoid accidental damage to the surrounding components. Moreover, the features of 2.5 GbE LAN, Wi-Fi 6E, USB 3.2 Gen 2x2 Type C with 20 Gbps, and up to 3 sets of PCIe 4.0 x4 M.2 slots with armor on select models offer superb connectivity. Further with the latest GIGABYTE PerfDrive technology and GCC software platform, GIGABYTE delivers the outstanding B760 platform with the optimal hardware, software, and firmware which covers from DDR4 to DDR5 with full form factor options of ATX, Micro ATX, and Mini ITX.

In the Intel product plan, the "Z" chipset is the only platform to support CPU and memory overclocking. However, the B chipset with limited DDR frequency tuning offers more budget friendly options, especially those only require memory overclocking. In order to provide solid power for high-performance operation of CPU and XMP overclocking, GIGABYTE B760 AORUS motherboards are geared up to 16+1+1 power phases with 60 amps DrMOS design, while the well-received B760 AORUS ELITE features 12+1+1 power phases, and the leading power design of 14+1+1 phases on B760M AORUS PRO. These power designs allow GIGABYTE B760 AORUS motherboards of all configuration to deliver the most stable power, as well as to provide sufficient power when the CPU runs full loading. Meanwhile, enhanced by full-coverage heatsink, 5 W/mK thermal pad, and 2x copper PCB, B760 AORUS MASTER/ PRO/ ELITE/ GAMING X lineup covers from ATX to micro ATX models boast superb thermal design to improve the stability and keep the power supply area which is most likely to generate heat staying cool.