AMD's Bulldozer architecture is a well-known quantity by now, and seemingly straddles a line between loathing and love between tech enthusiasts. Slow and power hungry compared to Intel's options, it harkens back to a time where the roles were reversed, and AMD were looking to compensate for architectural deficiencies (and architectural design decisions that can either be claimed as erroneous or ahead of their time) via increased clockspeeds. However you look at these Bulldozer CPUs, the fact is that they remain some of the best overclockers of all time - at least when it comes to maximum operating frequencies, especially at absolutely scorching vCore values.

To achieve that operating frequency, Der8auer used an Elmor EVC2 controller and diagnostics chip, which, connected to a usually unpopulated pin area in the ASUS 970 PRO GAMING/AURA motherboard, allowed him to read-out everything that was running through the motherboard's VRM circuitry, and perform manual adjustments. Corsair Vengeance 2,666 MHz DDR3 memory was also used in the system. An accident happened along the way, though: when pulling AMD's stock cooler from the motherboard, the CPU remained attached to the cooler, which resulted in some bent pins (screams in horror). Luckily, things were fixed with a screwdriver - let that serve as a warning, alert, and tip, should this happen to you.

AMD senior technical marketing manager Robert Hallock, responding to a specific question on Twitter, confirmed that the 3rd generation Ryzen processors do feature soldered integrated heatspreaders (IHS). Soldering as an interface material is preferred as it offers better heat transfer between the processor die and the IHS, as opposed to using a fluid TIM such as pastes. "Matisse" will be one of the rare few examples of a multi-chip module with a soldered IHS. The package has two kinds of dies, one or two 7 nm "Zen 2" 8-core CPU chiplets, and one 14 nm I/O Controller die.

The most similar example of such a processor would be Intel's "Clarkdale" (pictured below), which has its CPU cores sitting on a 32 nm die, while the I/O, including memory controller and iGPU, are on a separate 45 nm die. On-package QPI connects the two. Interestingly, Intel used two different sub-IHS interface materials for "Clarkdale." While the CPU die was soldered, a fluid TIM was used for the I/O controller die. It would hence be very interesting to see if AMD solders both kinds of dies under the "Matisse" IHS, or just the CPU chiplets. Going by Hallock's strong affirmative "Like a boss," we lean toward the possibility of all dies being soldered.Image Credit: TheLAWNOOB (OCN Forums)

AMD is planning to launch its next performance-segment CPUs alongside its Radeon R9 285 graphics card; the FX-8370 and its energy-efficient variant, the FX-8370E. Based on the 32 nm "Vishera" silicon, the FX-8370 is an eight-core socket AM3+ processor, featuring out of the box clock speeds of 4.10 GHz, with TurboCore frequencies of 4.30 GHz. The standard variant features 125W TDP, while the FX-8370E features 95W. The two will sell at the same price-points as the FX-8350. The FX-8370E will sell at a slight premium.

AMD is preparing to expand its performance-segment socket AM3+ processor lineup, steering clear of the 220W TDP of its FX-9000 series. The two chips are the FX-8370, and the FX-8370E. The FX-8370 will likely replace the FX-8350 around the $180 mark; while the FX-8370E will be its energy-efficient variant. Both chips offer clock speeds of 4.10 GHz, with 4.30 GHz TurboCore frequencies. While the FX-8370 has a rated TDP of 125W, the FX-8370E features 95W, without a reduction in clock speeds. The FX-8370E could hence come at a slight premium.

Both the FX-8370 and FX-8370E are eight-core processors based on the 32 nm "Vishera" silicon, featuring four "Piledriver" CPU modules that have 2 MB of L2 cache each, and 8 MB of L3 cache shared between the four modules. The chips feature dual-channel DDR3 integrated memory controllers, with native support for DDR3-1866 MHz, and 5.2 GT/s HyperTransport 3.1 system bus. Instruction-sets include AVX, AES, SSE4.2, FMA3, and XOP. The chips will run on all existing socket AM3+ motherboards, with some needing BIOS updates.

In addition to its new A-series APUs, AMD announced two new CPUs, the Athlon 860K, and the FX-8300. Built in the FM2+ package, the Athlon 860K is a quad-core CPU based on the 28 nm "Kaveri" silicon, with its integrated graphics disabled. It features four "Steamroller" CPU cores clocked at 3.70 GHz, with an unlocked base-clock multiplier that enables overclocking. The two modules that make up the four cores feature half their normal L2 cache amounts, and so the total L2 cache is just 2 MB. The chip will run on socket FM2+ motherboards based on the A88X, A85, A75, and A55 chipsets. The FX-8300, on the other hand, is a budget eight-core processor in the AM3+ package. It's based on the 32 nm "Vishera" silicon, featuring eight CPU cores spread across four "Piledriver" modules; clocked at 3.20 GHz, with 3.50 GHz of Turbo Core frequencies. The chips feature 2 MB of L2 cache per module, and 8 MB of shared L3 cache. Its TDP is rated at 95W.

AMD introduced two additions to its FX line of socket AM3+ processors, the six-core FX-6350, and the quad-core FX-4350. The two were released as OEM-only parts, late last year, and are now being released to the retail channel, in PIB (processor-in-box) packages. Based on the 32 nm "Vishera" silicon and "Piledriver" micro-architecture, the two chips are designed to hold two extremely catchy sub-$150 price-points.

The FX-6350 features a nominal core clock speed of 3.90 GHz, a maximum Turbo Core frequency of 4.20 GHz, 6 MB of total L2 cache, and 8 MB L3 cache. The FX-4350, on the other hand, features 4.20 GHz clock speed, with 4.30 GHz Turbo Core, 4 MB of total L2 cache, and 8 MB of L3. Both parts feature unlocked base-clock multipliers, modern instruction-sets such as AVX, AES-NI, SSE4.2, SSE4.1, FMA2, and XOP. Both further have TDP rated at 125W. The FX-6350 retail PIB package will be priced as low as US $132, while the FX-4350 will go for as low as $122. The two will also ship with AMD's newest case-badge design, pictured below.

AMD's A-series "Trinity" line of APUs may have helped make the APU outsell CPUs in 2013, but it won't be long before they're replaced by the new "Richland" A-series APUs for desktops and mainstream notebooks. "Richland" is a tweaked version of "Trinity" which sees AMD stick to the 32 nm process, and retain the "Piledriver" CPU micro-architecture, but increase CPU clock speeds, add a faster DDR3-2133 MHz dual-channel IMC, and integrate a Radeon HD 8000 series Graphics CoreNext iGPU into the silicon. Desktop APU models will take up with A##-6000 series numbering scheme.

The series will be led by AMD A10-6800K, which features every component on the "Richland" silicon unlocked, which includes two "Piledriver" CPU modules amounting to four x86-64 cores, and all stream processors on the iGPU unlocked, with the highest CPU and iGPU clock speeds enabled in the lineup. The iGPU model for this chip is Radeon HD 8670D. The A10-6800K features unlocked multipliers, making overclocking a breeze. Trailing it is the A10-6700, which features all physical components unlocked, but with slightly lower clock speeds, and locked BClk multipler. It features the same iGPU as its bigger sibling, the HD 8670D.

MSI is working on a new micro-ATX motherboard with Celeron 847 BGA processor hard-wired onto it, the C847MS-E33. The Celero 847 is a dual-core processor based on the 32 nm "Sandy Bridge" architecture, clocked at 1.10 GHz, featuring 2 MB of L2 cache, and a dual-channel DDR3 IMC. Its 17-Watt TDP is low enough for MSI to use a passive heatsink to cool it with. Aiding the CPU is an Intel NM70 chipset, which provides one each of SATA 6 Gb/s and SATA 3 Gb/s ports.

The C847MS-E33 features two DDR3 DIMM slots, supporting up to 16 GB of dual-channel DDR3-1333 MHz memory. Its processor is wired to a PCI-Express 2.0 x16 slot, two legacy PCI and a PCIe 2.0 x1 make for the rest of its expansion. Connectivity includes 6-channel HD audio with optical and coaxial SPDIF outputs, gigabit Ethernet, a number of USB 2.0/1.1 ports on the rear panel and by headers, and display outputs that include HDMI and D-Sub. We expect the board to be priced around $70-80, providing a decent entry-level PC solution.

MSI expanded its entry-level socket LGA1155 motherboard lineup with the B75MA-G43, featuring Intel Small Business Advantage. The micro-ATX board is positioned to be a notch below the B75MA-G45. It features a simpler 5-phase CPU VRM. The CPU socket, which supports 32 nm "Sandy Bridge" and 22 nm "Ivy Bridge" processors, is wired to four DIMM slots, supporting up to 32 GB of dual-channel DDR3 memory, and a PCI-Express 3.0 x16. Other expansion slots include a PCI-Express 2.0 x16 (electrical x4, wired to PCH), and two legacy PCI.

Storage connectivity on the B75MA-G43 includes one SATA 6 Gb/s, and five SATA 3 Gb/s ports. The chipset gives out four USB 3.0 ports, two of which are given out by a standard header, and two at the rear panel. Display connectivity includes DVI, D-Sub, and HDMI. 8-channel HD audio, gigabit Ethernet, PS/2 combo, LPT and COM (by headers), and a number of USB 2.0/1.1 ports make for the rest of it. The B75MA-G43 is expected to be priced under $60.

With the dawn of 2013, and no catastrophes in sight, Intel is going ahead with its usual business of phasing out old processor models, and making way for new ones. By the end of 2012, Intel will stop taking orders for several processor models mostly based on the older 32 nm "Sandy Bridge" silicon. These include chips such as the Core i7-2700K, Core i5-2310, Core i3-2105, Pentium G440, and surprisingly, an early demise of the 22 nm Core i5-3450, which is cannibalized by the Core i5-3470 at the same price point. Pentium G870, G645 and G645T as well as Celeron G555, G550 and G550T are the other chips on the chopping block.

Come 2013, Intel will release Pentium and Celeron series processors based on its 22 nm "Ivy Bridge" micro-architecture. These include the Pentium G2130, G2020 and G2020T and Celeron G1620, G1610 and G1610T. In the mobile (notebook) CPU sphere, Intel will launch dual-core "Ivy Bridge" chips to layer out its Ultrabook product segment. These include the Core i7-3687, Core i5-3437U, Celeron 1037U, 1007U, 1020M and 1000M. In March, the company is expected to launch its 4th generation Core "Haswell" line of processors.

MSI unveiled a new all-integrated mini-ITX motherboard that steps above the Intel Atom and AMD E-Series crowd, being based on Intel Celeron 847 dual-core processor (1.10 GHz, 32 nm "Westmere" micro-architecture, 2 MB L3 cache, SSE4.2, EM64T). MSI used a small fan-heatsink to cool the chip, which has 17W TDP. The processor is backed by Intel NM70 chipset. It is based on the compact 1023-pin BGA package, and is hardwired to the motherboard. One of the features that give the processor its edge over Atom and E-Series is its dual-channel DDR3 integrated memory controller with maximum memory support of up to 16 GB. The chip is wired to two DDR3 DIMM slots.

The only expansion slot is a PCI-Express 2.0 x1. Storage connectivity includes one each of SATA 6 Gb/s and SATA 3 Gb/s. Display outputs include DVI and D-Sub. A missed opportunity here is the lack of HDMI. 6-channel HD audio, gigabit Ethernet, legacy PS/2, and a number of USB 2.0/1.1 connectors make for the rest of it. Surprisingly, MSI designed the board with modern UEFI BIOS, which lets you take advantage of Windows 8 Secure Boot feature. There is no word on availability and pricing of the C847IS-P33.

Intel's newest flagship desktop processor, the Core i7-3970X Extreme Edition, started selling. In Singapore, the chip is being sold at S$ 1,425 (US $1,167), including local taxes. Based on the 32 nm "Sandy Bridge-E" silicon, and built in the LGA2011 package, the i7-3970X is a six-core processor clocked at 3.50 GHz, with maximum Turbo Boost frequency of 4.00 GHz. The six-core chip is bolstered by HyperThreading, enabling 12 logical CPUs, 256 KB L2 cache per core, 15 MB shared L3 cache, and a quad-channel DDR3 integrated memory controller, supporting up to 128 GB of memory. Surprisingly, the chip's 200 MHz speed bump over the Core i7-3960X affected its TDP, which is rated at 150W, up from 130W of the i7-3960X.

Intel slipped in a new processor model to lead the Atom series of low-power processors, the D2560. Introduction of the new chip follows discontinuation of the D2700, it is positioned above the D2550. Based on the "Saltwell" micro-architecture and built on the 32 nm "Cedarview" silicon, the Atom D2560 is a dual-core x86 processor clocked at 2.00 GHz. It features HyperThreading, which enables four logical CPUs for the operating system to deal with. The dual-core x86 component is armed with 1 MB of L2 cache. Its instruction set includes SSE2/SSE3/SSSE3. Among its uncore components are a single-channel DDR3-1066 MHz IMC, which supports up to 4 GB of memory, and integrated HD graphics clocked at 640 MHz. Its TDP is rated at 10W. The new chip should cost OEMs $47 a piece in 1000-unit tray quantities.

AMD announced the 2012 FX "Vishera" line of eight-core, six-core, and quad-core desktop processors. Based on the new "Piledriver" CPU micro-architecture, the new processors feature increased performance and an updated instruction set, over the previous generation. To begin with, the processors are based around the "Vishera" silicon, built on the 32 nm HKMG process at Global Foundries. With a transistor count of 1.2 billion and a die area of 315 mm², Vishera packs four Piledriver modules, with two cores each, 2 MB L2 cache per module (8 MB total), and 8 MB of L3 cache. Eight-, six-, and four-core models are carved out by toggling the number of modules between four, three, and two.

The Vishera silicon also features an updated CPU instruction set, which includes SSE/2/3/S3/4.1/4.2/4A, AVX, AES-NI, FMA/FMA2/FMA3, XOP, and F16C. An x86 processor by design, Vishera features the AMD64 x86-64 instruction set. Its updated integrated memory controller supports up to 64 GB of dual-channel DDR3 memory, with a standard speed of DDR3-1866 MHz, and more possible with overclocking. The memory interface is single, monolithic 128-bit, unlike the dual 64-bit IMC approach of the "Stars" micro-architecture. Built in the same socket AM3+ package as the previous generation FX, the new chips are compatible with existing AM3+ motherboards with a BIOS update. The 2012 FX processor lineup includes a total of four models, the FX-8350 flagship eight-core, FX-8320 performance eight-core, FX-6300 mainstream six-core, and FX-4300 value quad-core. All models feature unlocked base-clock multipliers, making each of them fit for overclocking. Their specifications and target SEP pricing are tabled below. Market prices could be about 5~10% above the SEP prices.

Samsung Electronics, Co., Ltd., a world leader in advanced semiconductor technology solutions, announced foundry production of STMicroelectronics' leading products using 32/28nm High-K Metal Gate (HKMG) process technology. Samsung Electronics' foundry business has been selected by STMicroelectronics to provide it with products at the 32/28nm process node. The relationship has already resulted in taping-out of a dozen ST advanced system-on-chip (SoC) devices for mobile, consumer and network applications.

"We have successfully started production of STMicroelectronics' new-generation 32/28nm SoC products," said Kwang-Hyun Kim, executive vice president of Foundry business, Device Solutions, Samsung Electronics. "A foundry relationship with ST demonstrates our commitment to advanced process technology and our 32/28nm HKMG process-technology leadership. We have aggressively ramped 32/28nm capacity and will continue to deliver the most advanced process solutions to our customers."

Intel has this week revealed the discontinuance schedule for a lot of its older, 32 nm processors, including the Celeron G440 and the Core i5-2310, i5-2320, i5-2400, i5-2400S, i5-2405S, i5-2500, i5-2500K, i5-2500S, i5-2500T, i7-2600, i7-2600K, i7-2600S and i7-2700K. Interestingly enough, there's also a 22 nm chip on the black list, the 3.1 GHz Core i5-3450 which was released just last quarter.

All the CPUs listed are set to be available for orders until March 29, 2013, and will continue to ship while supplies last (for the boxed versions) or until September 27, 2013 (for the tray versions).

According to an OCWorkbench report, AMD will officially launch its second generation A-series desktop APUs on the very first day of Q4 2012, October 1. The launch will include a contingent of socket FM2 motherboards from various manufacturers, based on AMD A55, A75, and A85X chipsets. Among the A-series socket FM2 models launched on October 1, are A10-5800K, A10-5700, A8-5600K, A8-5500, Athlon X4 750K/740, A6-5400K and A4-5300. Built on the 32 nm HKMG process by Globalfoundries, AMD A-series "Trinity" APUs combine up to four x86-64 CPU cores based on the "Piledriver" micro-architecture, with a Radeon HD 7000 series GPU core, with up to 384 stream processors based on the VLIW4 architecture.

At IDF 2012, Intel showed off an experimental SoC codenamed "Rosepoint," targeted at low power mobile consumer devices. Built on the 32 nm process, the tiny chip combines a full-featured dual-core Atom processor with a WiFi transceiver. This could eliminate the need for external transceivers on Atom-powered devices, reducing the platform's board footprint, and of course, power draw.

The current chip comes with its share of limitations. It supports just 2.4 GHz radio band. According to Intel's Justin Rattner, the chip should scale with Moore's Law, and future versions could have greater capabilities, including cellular data, and built-in antennae. Production versions of the chip aren't due for another two years, so it's safe to assume that Rosepoint is just a development milestone.

Intel Corporation's chief product officer today described how its low-power processors, starting with the company's 4th generation Intel Core processor family available next year, will set a new standard for mobile computing experiences and innovative Ultrabook, convertible and tablet designs.

Speaking at the Intel Developer Forum in San Francisco, David (Dadi) Perlmutter said Intel reduced the platform idle power of its 4th generation Intel Core processor family based on the next-generation "Haswell" microarchitecture by more than 20 times over the 2nd generation while delivering outstanding performance and responsiveness. He also said Intel will add a new line of even lower-power processors based on the same microarchitecture to its roadmap starting in 2013.

Intel Corp. has yesterday expanded its CPU offer, adding to it both desktop and mobile models built on 22 nm and 32 nm technology. On the desktop side, the company launched several Core i5 and i3 chips, including the GPU-less Core i5-3350P, plus one Celeron and six Pentium CPUs based on the Sandy Bridge architecture (see the SB mention in the chart). These mid- to low-end desktop parts are priced between $177 and $37.

While Intel had nothing high-end for desktops, the company did introduce a new mobile flagship, the 22 nm Core i7-3940XM which costs a whopping $1,096 and packs four cores clocked at 3.0 GHz. Other releases include two more quad-core models - the 2.8 GHz i7-3840QM and the 2.7 GHz i7-3740QM, and a couple of low-end Celerons (B830 & 887).

Besides rolling out new chips Intel has also lower the price tag of three processors, the 3.40 GHz Core i3-2130 (from $138 to $117), the Pentium G2120 (from $86 to $75) and the Pentium G550 (from $52 to $42).

Intel's next high-end desktop (HEDT) platform, codenamed "Ivy Bridge-E," is slated for Q3-2013, according to the latest platform road-map slide sourced by VR-Zone. According to the leaked slide, launch of Ivy Bridge-E Core i7 processors follows that of Core "Haswell" socket LGA1150 processors (Q2-2013). What's more, the upcoming Ivy Bridge-E chips will be compatible with existing socket LGA2011 motherboards, based on Intel X79 Express chipset.

Intel's next-generation Ivy Bridge-E chips are up-scaled versions of today's Core "Ivy Bridge" chips, built on the same 22 nm process, with more processing cores, memory channels, cache, and PCI-Express 3.0 certified system interfaces. It remains to be seen if Intel launches a new chipset to go with the new processor, or retains the X79 chipset with a few minor updates in the form of steppings. The company retained its X58 Express chipset over the first two HEDT processor generations (45 nm Core i7 "Bloomfield" and 32 nm Core i7 "Westmere").

Intel's next high-end desktop processor, the Core i7-3970X Extreme, arrives in Q4, 2012, according to a DonanimHaber report. The i7-3970X is expected to ship with clock speeds of 3.50 GHz, with maximum Turbo Boost frequency of 4.00 GHz. The six-core chip is based on the 32 nm "Sandy Bridge-E" silicon, and built in the LGA2011 package. Its feature-set is consistent with that of the Core i7-3960X, with 15 MB shared L3 cache, HyperThreading, and unlocked base-clock multiplier. In all likelihood, the i7-3970X could displace the i7-3960X from its price-point.

Intel Corporation Senior Vice President Tom Kilroy officially introduced the next wave of Ultrabook systems during a keynote address at Computex Taipei 2012. Making a bold statement around the importance of touch technology, Kilroy also announced that Intel has signed agreements with several leading touch panel manufacturers to ensure adequate capacity to meet the expected demand for touch-enabled Ultrabook experiences over the next several years.

He also highlighted the company's efforts to deliver user-centric experiences across a range of mobile devices from the Ultrabook to smartphones and tablets, pointing to momentum across all three.

AMD revealed performance numbers of its key product for mainstream notebooks, the A10-4600M, in an infographic for the Korean market. Besides detailing the part, it reveals some performance numbers. To begin with, A10-4600M is based on the 32 nm "Trinity" silicon with all its components enabled. It has four x86-64 cores spread across two "Piledriver" architecture modules, 4 MB of total cache (2x 2 MB), CPU clock speeds of 2.30 GHz (3.00 GHz TurboCore), and integrated Radeon HD 7660G graphics that has 384 VLIW4 stream processors, and GPU core speed of 685 MHz. The chip integrates a PCI-Express 2.0 root complex, and dual-channel DDR3-1600 MHz integrated memory controller.

Moving on to performance numbers, and as expected, the infographic doesn't touch comparative CPU performance with a barge-pole. Instead the focus is on graphics performance, with an emphasis on Dual GPU feature, where the integrated graphics can work in tandem with a discrete GPU of the same class, resulting in up to 75% performance increase. Based on data from this infographic, and its own testing data of other notebooks, NordicHardware compiled relative performance of the IGP and Dual Graphics setup involving the A10-4600M and Radeon HD 7670M discrete GPU.

NextComputing, a leading manufacturer of portable and small footprint workstations and servers, announces the addition of the Intel Xeon E5-2600 processor product family to its line portable workstations, compact towers, and high-density rack-mount computers. Intel Xeon E5-2600 processors offer up to eight (8) processor cores per CPU, plus leading edge features like PCI Express 3.0. With support for up to two of these processors (16 cores), and multiple PCI Express slots, NextComputing has delivered the industry's highest performance computing platforms in the most compact form-factors available.