Friday, May 31st 2019
AMD Confirms Ryzen 3000 "Matisse" Features Soldered IHS
AMD senior technical marketing manager Robert Hallock, responding to a specific question on Twitter, confirmed that the 3rd generation Ryzen processors do feature soldered integrated heatspreaders (IHS). Soldering as an interface material is preferred as it offers better heat transfer between the processor die and the IHS, as opposed to using a fluid TIM such as pastes. "Matisse" will be one of the rare few examples of a multi-chip module with a soldered IHS. The package has two kinds of dies, one or two 7 nm "Zen 2" 8-core CPU chiplets, and one 14 nm I/O Controller die.
The most similar example of such a processor would be Intel's "Clarkdale" (pictured below), which has its CPU cores sitting on a 32 nm die, while the I/O, including memory controller and iGPU, are on a separate 45 nm die. On-package QPI connects the two. Interestingly, Intel used two different sub-IHS interface materials for "Clarkdale." While the CPU die was soldered, a fluid TIM was used for the I/O controller die. It would hence be very interesting to see if AMD solders both kinds of dies under the "Matisse" IHS, or just the CPU chiplets. Going by Hallock's strong affirmative "Like a boss," we lean toward the possibility of all dies being soldered.
Image Credit: TheLAWNOOB (OCN Forums)
Source:
Robert Hallock (Twitter)
The most similar example of such a processor would be Intel's "Clarkdale" (pictured below), which has its CPU cores sitting on a 32 nm die, while the I/O, including memory controller and iGPU, are on a separate 45 nm die. On-package QPI connects the two. Interestingly, Intel used two different sub-IHS interface materials for "Clarkdale." While the CPU die was soldered, a fluid TIM was used for the I/O controller die. It would hence be very interesting to see if AMD solders both kinds of dies under the "Matisse" IHS, or just the CPU chiplets. Going by Hallock's strong affirmative "Like a boss," we lean toward the possibility of all dies being soldered.
51 Comments on AMD Confirms Ryzen 3000 "Matisse" Features Soldered IHS
apparently all intel laptops still overheat like 90ish celsius is considered normal even for the i7-9750h laptops... so im done with gaming laptops once and for all. might even buy a 360mm water cooler for the 3900x, overkill. but i want good temps
could not help it
I've put the above in quotes because I heard it so many times from people who know bollocks about hardware, and others who, even if they know their CPU from the GPU, insist on making predictions as if that was possible. As if you could formulate the present in an equation and thus extrapolate to the next 10 or 15 years: yeah, sure, just like Economists and Sociologists do with such success (I'm being sarcastic folks :rolleyes: )
Just buy your f***ing processor, 6 or 8 core and get on with it. Oh, and spend more time using it for gaming instead of benchmarks.
So I guess the history was different so, resident evil 2 remake needs 4 cores to work properly minimum, core count doubled from 4 to 8 and now 12 and next year 16 cores, cost wise in line with the market, $499 for 12 cores, instead of $2000, tables have turned and the future seems to be bright.
Now you ask me, what is "future proofing" and I say, it's the development of business services within the ecosystem.
8 cores cpus might last for the next 5 years or so, don't expect more than that, developers will make sure to use all possible resources.
www.overclock3d.net/news/cpu_mainboard/intel_roadmaps_show_a_6-core_coffee_lake_cpu_for_mainstream_desktops_in_2018/1
Not about which company makes more cores.
So... let's see.
If the IHS for 3900X is soldered and one slaps a 200W high-perf water cooler on it... I wonder what that 105W TDP cpu can do with (near) double the headroom?
Suddenly I feel so very old.
:)
With apologies to The Monkeys.