AMD's next-generation Ryzen 8000 "Granite Ridge" desktop processor based on the "Zen 5" microarchitecture, will continue to top out at 16-core/32-thread as the maximum CPU core-count possible, says a report by PC Games Hardware. The processor will retain the chiplet design of the current Ryzen 7000 "Raphael" processor, with two 8-core "Zen 5" CCDs, and one I/O die. It's very likely that AMD will reuse the same 6 nm client I/O die (cIOD) as "Raphael," just the way it used the same 12 nm cIOD between Ryzen 3000 "Matisse" and Ryzen 5000 "Vermeer;" but with updates that could enable higher DDR5 memory speeds. Each of the up to two "Eldora" Zen 5 CCDs has 8 CPU cores, with 1 MB of dedicated L2 cache per core, and 32 MB of shared L3 cache. The CCDs are very likely to be built on the TSMC 3 nm EUV silicon fabrication process.

Perhaps the most interesting aspect of the PCGH leak would have to be the TDP numbers being mentioned, which continue to show higher-performance SKUs with 170 W TDP, and lower tiers with 65 W TDP. With its CPU core-counts not seeing increases, AMD would bank on not just the generational IPC increase of its "Zen 5" cores, but also max out performance within the power envelope of the new node, by dialing up clock speeds. AMD could ride out 2023 with its Ryzen 7000 "Zen 4" processors on the desktop platform, with "Granite Ridge" slated to enter production only by Q1-2024. The company could update its product stack in the meantime, perhaps even bring the 4 nm "Phoenix" monolithic APU silicon to the Socket AM5 desktop platform. Ryzen 8000 is expected to retain full compatibility with existing Socket AM5, and AMD 600-series chipset motherboards.

AMD today announced its new Ryzen 7000X3D high-end desktop processors to much fanfare, with availability slated for February 2023, you can read all about them in our older article. In our coverage, we noticed something odd about the cache sizes of the 12-core 7900X3D and 16-core 7950X3D. Whereas the 8-core, single-CCD 7800X3D comes with 104 MB of total cache (L2+L3), which works out to 1 MB L2 cache per core and 96 MB of L3 cache (32 MB on-die + 64 MB stacked 3DV cache); the dual-CCD 7900X3D and 7950X3D was shown with total caches of 140 MB and 144 MB, while they should have been 204 MB or 208 MB, respectively.

In our older article, we explored two possibilities—one that the 3DV cache is available on both CCDs but halved in size for whatever reason; and the second more outlandish possibility that only one of the two CCDs has stacked 3DV cache, while the other is a normal planar CCD with just the on-die 32 MB L3 cache. As it turns out, the latter theory is right! AMD put out high-resolution renders of the dual-CCD 7000X3D processors, where only one of the two CCDs is shown having the L3D (L3 cache die) stacked on top. Even real-world pictures of the older "Zen 3" 3DV cache CCDs from the 5800X3D or EPYC "Milan-X" processors show CCDs with 3DV caches having a distinct appearance with dividing lines between the L3D and the structural substrates over the regions of the CCD that have the CPU cores. In these renders, we see these lines drawn on only one of the two CCDs.

AMD might fall behind Intel on PCI-Express Gen 5 support, say sources familiar with the recent GIGABYTE ransomware attack and ensuing leak of confidential documents. If you recall, AMD had extensively marketed the fact that it was first-to-market with PCI-Express Gen 4, over a year ahead of Intel's "Rocket Lake" processor. The platform block-diagram for Socket AM5 states that the AM5 SoC puts out a total of 28 PCI-Express Gen 4 lanes. 16 of these are allocated toward PCI-Express discrete graphics, 4 toward a CPU-attached M.2 NVMe slot, another 4 lanes toward a discrete USB4 controller, and the remaining 4 lanes as chipset-bus.

Socket AM5 SoCs appear to have an additional 4 lanes to spare than the outgoing "Matisse" and "Vermeer" SoCs, which on higher-end platforms are used up by the USB4 controller, but can be left unused for the purpose, and instead wired to an additional M.2 NVMe slot on lower-end motherboards. Thankfully, memory is one area where AMD will maintain parity with Intel, as Socket AM5 is being designed for dual-channel DDR5. The other SoC-integrated I/O, as well as I/O from the chipset, appear to be identical to "Vermeer," with minor exceptions such as support for 20 Gbps USB 3.2x2. The Socket has preparation for display I/O for APUs from the generation. Intel's upcoming "Alder Lake-S" processor implements PCI-Express Gen 5, but only for the 16-lane PEG port. The CPU-attached NVMe slot, as well as downstream PCIe connectivity, are limited to PCIe Gen 4.

Western Digital is reportedly preparing a firmware update for its WD Black SN850 M.2 NVMe SSD that restores the drive's write performance levels on PCs based on the AMD X570 platform. This problem is localized to X570, specifically to when the drive is installed on an M.2 NVMe slot that is wired to the X570 chipset. Drives that are installed on the slot that's directly wired to the Ryzen processor perform as expected (Ryzen 3000 "Matisse" and Ryzen 5000 "Vermeer").

The drive performs as intended on AMD B550, as well as Intel platforms that support PCIe Gen 4, as the only Gen 4-capable M.2 slots are the ones directly wired to the processor. Western Digital localized the problem to certain X570 motherboards that have their PCIe maximum payload size (MPS) value set at 128 bytes. This dictates the maximum transaction layer packet (TLP) that goes through the PCIe controller, and a low MPS value cripples performance. The firmware update by Western Digital possibly works around this limitation. The company is expected to release the firmware update by 12 July, 2021.

AMD in its "Where Gaming Begins Episode 3" online event, announced that it is introducing Smart Access Memory (resizable base address register) support to Ryzen 3000 series "Matisse" processors, based on the "Zen 2" microarchitecture. These exclude the Ryzen 3 3200G and Ryzen 5 3400G. The PCI-SIG innovated feature was, until now, restricted to the Ryzen 5000 series on the AMD platform, although is heavily proliferated across the Intel platform. Resizable BAR enables the CPU to see the graphics card's entire dedicated memory as one addressable block, rather than through 256-megabyte apertures. For game engines that are able to take advantage of the feature, this could translate to a performance boost of up to 16 percent. Be on the lookout for BIOS updates from your motherboard manufacturer.

A leaked presentation slide by AMD for its Ryzen 5000 series "Zen 3" processors reveals details of the processor's memory interface. Much like the Ryzen 3000 series "Matisse," the Ryzen 5000 series "Vermeer" is a multi-chip module of up to 16 CPU cores spread across two 8-core CPU dies, and a unified I/O die that handles the processor's memory-, PCIe, and SoC interfaces. There are three configurable clock domains that ensure the CPU cores are fed with data at the right speed, and to ensure that the MCM design doesn't pose bottlenecks to the memory performance.

The first domain is fclk or Infinity Fabric clock. Each of the two CCDs (8-core CPU dies) has just one CCX (CPU core complex) with 8 cores, and hence the CCD's internal Infinity Fabric cedes relevance to the IFOP (Infinity Fabric over Package) interconnect that binds the two CCDs and the cIOD (client I/O controller die) together. The next frequency is uclk, or the internal frequency of the dual-channel DDR4 memory controller contained in the cIOD. And lastly, the mclk, or memory clock is the industry-standard DRAM frequency.

BIOSTAR, a leading brand of motherboards, graphics cards, and storage devices, today announces that their motherboards are ready to support future Ryzen with AGESA Combo V2 PI 1.0.8.1 BIOS update.

With a wide list of supporting models, BIOSTAR consumers can rest assured that their dreams of upgrading to the future Ryzen are fully achievable. With a few easy steps to update the BIOS version, users can enjoy the full benefits of the future Ryzen from their existing BIOSTAR 500 series AM4 motherboards. Gaming and content creation will get extended benefits like improving memory compatibility and memory overclocking capabilities after AGESA Combo V2 PI 1.0.8.1 BIOS updating.

AMD today announced its entry-level A520 desktop chipset for 3rd Gen Ryzen "Matisse" processors, and possible readiness for Athlon and Ryzen 4000G processors based on the "Renoir" silicon. Much like the B550, it lacks support for Ryzen 3 3200G and Ryzen 5 3400G processors based on the "Picasso" silicon, as well as older 2nd- and 1st Gen Ryzen processors. The A520 succeeds the A320 chipset, and enables motherboards priced deep under the $100-mark, close to the $50 magic figure. The ASMedia-sourced chipset has quite a few similarities with the B550, but one big segmentation - complete lack of PCIe Gen 4.

Motherboards based on the AMD A520 completely lack PCIe Gen 4 support, even with a Ryzen 3000 "Matisse" processor. Even the PCI-Express x16 and M.2 NVMe slots wired to the AM4 SoC are limited to PCIe Gen 3. On the B550, these two slots run at Gen 4 speeds when paired with a capable processor. Much like the B550, the downstream (general purpose) PCIe lanes from the chipset run at PCIe Gen 3 speeds, although unlike the B550, the chipset only puts out 6 lanes. Other platform I/O includes up to five 10 Gbps USB 3.2 ports (includes two from the AM4 SoC), two 5 Gbps USB 3.1 ports, four SATA 6 Gb/s (AHCI-only) ports, and six USB 2.0 ports. At launch, A520 motherboards only support Ryzen 3000 "Matisse" processors, with support planned for 4000G "Renoir" processors when they launch in the retail channel, and future "Zen 3" processors, through firmware updates.

AMD's 7 nm "Renoir" APU silicon, which features eight "Zen 2" CPU cores, has only a quarter of the L3 cache of the 8-core "Zen 2" CCD used in "Matisse," "Rome," and "Castle Peak" processors, with each of its two quad-core compute complexes (CCXs) featuring just 4 MB of it (compared to 16 MB per CCX on the 8-core "Zen 2" CCD). Chinese-language tech publication TecLab pubished a quick review of an alleged Ryzen 7 4700GE socket AM4 processor based on the "Renoir" silicon, and discovered that the chip offers significantly lower memory latencies than "Matisse," posting just 47.6 ns latency when paired with DDR4-4233 dual-channel memory.

In comparison, a Ryzen 9 3900X with these kinds of memory clocks typically posts 60-70 ns latencies, owing to the MCM design of "Matisse," where the CPU cores and memory controllers sit on separate dies, which is one of the key reasons AMD is believed to have doubled the L3 cache amount per CCX compared to previous-generation "Zeppelin" dies. TecLab tested the alleged 4700GE engineering sample on a ROG Crosshair VIII Impact X570 motherboard that has 1 DIMM per channel (the best possible memory topology).

VLSI engineer Fritzchens Fritz, famous for high-detail EM photography of silicon dies and annotations of them, recently published his work on AMD's 7 nm "Renoir" APU silicon. His die-shots were annotated by Nemez aka GPUsAreMagic. The floor-plan of the silicon shows that the CPU component finally dwarfs the iGPU component, thanks to double the CPU cores over the previous-gen "Picasso" silicon, spread over two CCXs (compute complexes). The CCX on "Renoir" is visibly smaller than the one on the "Zen 2" CCDs found in "Matisse" and "Rome" MCMs, as the L3 cache is smaller, at 4 MB compared to 16 MB. Being MCMs with disintegrated memory controllers, it makes more sense for CCDs to have more last-level cache per CCX.

We also see that the iGPU features no more than 8 "Vega" NGCUs, so there's no scope for "Renoir" based desktop APUs to feature >512 stream processors. AMD attempted to compensate for the NGCU deficit by dialing up engine clocks of the iGPU by over 40% compared to those on "Picasso." What caught our eye in the annotation is the PCI-Express physical layer. Apparently the die indeed has 20 PCI-Express lanes besides an additional 4 lanes that can be configured as two SATA 6 Gbps ports thanks to SerDes flexibility.

AMD formally launched its B550 socket AM4 desktop chipset, with the promise of bring PCI-Express gen 4 connectivity to the masses. Motherboards based on the B550 support 3rd gen Ryzen desktop processors based on the "Matisse" silicon, and "Zen 2" microarchitecture. The chipset will, in the future, support Ryzen 4000G "Renoir" and "Zen 3" based "Vermeer" desktop processors. Based on an ASMedia-made design, the chipset lets you have PCI-Express gen 4.0 on the main x16 slot from the processor, and at least one M.2 NVMe slots (which is CPU-attached). The chipset itself puts out up to 8 general purpose PCI-Express gen 3.0 lanes, besides up to six SATA 6 Gbps ports, and USB 3.2 connectivity. Motherboards based on the B550 start at $99 MSRP (although $114 on Newegg), and some of the pricier models go all the way up to $300.Do read the TechPowerUp reviews for GIGABYTE B550 AORUS Pro | GIGABYTE B550I AORUS Pro AX | ASUS ROG Strix B550-F Gaming

GIGABYTE today introduced the B550 VISION D socket AM4 motherboard targeted at creators. Built in the ATX form-factor, the board supports socket AM4 Ryzen 3000 "Matisse" processors, and is based on the new AMD B550 chipset. Within GIGABYTE's product stack, the B550 VISION D is positioned above its B550 AORUS Master flagship board based on this chipset. The board draws power from a combination of 24-pin ATX and 8-pin EPS power connectors (concealed under a plastic bit near the VRM heatsinks). A 14-phase VRM conditions power for the CPU. The socket is wired to four DDR4 DIMM slots supporting up to 128 GB of dual-channel DDR4 memory; and two PCI-Express 4.0 x16 slots (x8/x8 with both populated). This is something the AORUS Master lacks, on the other hand, the VISION D lacks SLI certification.

The third PCIe x16 slot is gen 3.0 x4, and wired to the B550 chipset. The board offers two M.2 NVMe slots, one of the two has PCIe 4.0 x4 wiring from the AM4 SoC, the other has PCIe 3.0 x4 wiring from the chipset. There are only four SATA 6 Gbps on offer with this board, as GIGABYTE is freeing up PCIe lanes on the chipset. Unless we're mistaken, GIGABYTE is offering "unofficial" Thunderbolt 3 support. The board features an Intel "Titan Ridge" Thunderbolt 3 controller that puts out two "USB-C 3.2 Gen 2 40 Gbps" ports with DisplayPort passthrough. GIGABYTE is careful not to call these Thunderbolt 3 ports. Networking connectivity includes 802.11ax + Bluetooth 5 WLAN, and two 1 GbE interfaces driven by Intel controllers. The onboard audio solution uses premium ALC1220-VB codec, WIMA capacitors, and AMPs on the front channels. The company didn't reveal pricing.

ASUS released a beta BIOS updates for its top AMD 400-series chipset motherboard that includes the AGESA ComboAM4 1.0.0.6 microcode. A HardwareLuxx.de community member tracking AGESA updates posted screenshot of a Crosshair VII Hero (X470) motherboard with a AGESA ComboAM4 1.0.0.6 version (not to be confused with AGESA PinnaclePI 1.0.0.6). The beta BIOS version for the motherboard bears version number 3101. The BIOS file was originally released to web by Shamino on the OCN forums, earlier today.

While not much is known about ComboAM4 1.0.0.6, the Beta BIOS 3101 for Crosshair VII Hero enables per-CCX overclocking, meaning that you can set different manual OC multiplier values per CCX on your processor. We're not sure if both "Pinnacle Ridge" and "Matisse" support it, or just the latter. We also don't know at this point if per-CCX overclocking is an ASUS innovation or a feature of ComboAM4 1.0.0.6. Find the BIOS ROM file here.

Several future AMD processor codenames across various computing segments surfaced courtesy of an Expreview leak that's largely aligned with information from Komachi Ensaka. It does not account for "Matisse Refresh" that's allegedly coming out in June-July as three gaming-focused Ryzen socket AM4 desktop processors; but roadmap from 2H-2020 going up to 2022 sees many codenames surface. To begin with, the second half of 2020 promises to be as action packed as last year's 7/7 mega launch. Over in the graphics business, the company is expected to debut its DirectX 12 Ultimate-compliant RDNA2 client graphics, and its first CDNA architecture-based compute accelerators. Much of the processor launch cycle is based around the new "Zen 3" microarchitecture.

The server platform debuting in the second half of 2020 is codenamed "Genesis SP3." This will be the final processor architecture for the SP3-class enterprise sockets, as it has DDR4 and PCI-Express gen 4.0 I/O. The EPYC server processor is codenamed "Milan," and combines "Zen 3" chiplets along with an sIOD. EPYC Embedded (FP6 package) processors are codenamed "Grey Hawk."

Last week, we brought you reports of AMD inching closer to launch its 3rd generation Ryzen "Matisse Refresh" processor lineup to ward off the 10th gen Intel Core "Comet Lake" threat, by giving the "Zen 2" chips possible clock speed-bumps to shore up performance. The lineup included the Ryzen 9 3900XT, the Ryzen 7 3800XT, and the Ryzen 5 3600XT. We now have a first-look at their alleged clock speeds courtesy of an anonymous tipster on ChipHell forums, seconded by HXL @9550pro.

The XT SKUs indeed revolve around 200-300 MHz increments in base- and boost clock speeds as many of our readers predicted in the "Matisse Refresh" article's comments section. The 3900XT comes with 4.10 GHz base clock, and 4.80 GHz max boost clocks, compared to 3.80 GHz base and 4.60 GHz boost clocks of the 3900X. Likewise, the 3800XT notches up to 4.20 GHz base clock (highest in the lineup), and 4.70 GHz max boost, compared to 3.90-4.50 GHz of the 3800X. The 3600XT offers the same 4.70 GHz max boost, a step up from the 4.40 GHz of the 3600X, but has its base clock set at 4.00 GHz, compared to 3.80 GHz on the 3600X. It appears like AMD's design focus is to reduce, if not beat, Intel's gaming performance lead. The 10th generation Core "Comet Lake" tops gaming performance by a mid-high single-digit percentages over AMD's offerings, and AMD could bring them down to low single-digit percentages with the XT family.

Rumors of AMD refreshing its 3rd generation Ryzen desktop processor family are growing louder. On Friday (22/05), reports of the "Matisse Refresh" processor family surfaced, with talk of "Ryzen 7 3850X" and "Ryzen 7 3750X" processors headed for a June 2020 announcement followed by July availability. Turns out AMD has a different naming scheme in mind, targeted at wooing gamers. The company is reportedly bringing its "XT" brand extension over from its Radeon graphics card family over to the Ryzen line.

There are three SKUs AMD is developing, the Ryzen 9 3900XT, the Ryzen 7 3800XT, and the Ryzen 5 3600 XT. All three are likely to retain core counts of the SKUs they are displacing from current price points - with the 3900XT likely being a 12-core/24-thread part; the 3800XT an 8-core/16-thread part, and the 3600XT a 6-core/12-thread part. AMD is likely to give the three a major clock speed increase to shore up gaming performance. It won't surprise us if AMD tinkers with boost algorithms, either. GIGABYTE has already referenced "Matisse Refresh" in its motherboard product roadmaps, which adds plenty of credibilty to this rumor. With "Zen 3" based 4th gen Ryzen processors unlikely to relieve the embattled 3900X, 3800X, and 3600X in the wake of Intel's 10th gen Core "Comet Lake" launch until Q4-2020, it makes sense for AMD to plan a product stack refresh to bolster its competitiveness. AMD is reportedly planning a June 16 product announcement, followed by July 7 availability.

AMD is planning to immediately update its product stack to counter the Intel 10th gen Core "Comet Lake-S" desktop processor family. Codenamed "Matisse Refresh," the processor will use existing IP, based on the 7 nm "Zen 2" microarchitecture, but could improve in areas such as clock-speeds. As it now stands, the Ryzen 9 3900X appears unfazed by the i9-10900K and i7-10700K at its new $410 price, however, competitiveness of the 3800X and 3700X could buckle under pressure from the i7-10700 series (K, KF, non-K, and F), as well as the Core i5-10600 series. To this effect, we're hearing rumors of a "Ryzen 7 3750X" and "Ryzen 7 3850X" seeing the light of the day soon, with an early-June announcement, and early-July market availability. References to the 3750X date back to October 2019.

Rumors of "Matisse Refresh" gained traction when WCCFTech editor Hassan Mujtaba tweeted a slide from a GIGABYTE AMD B550 motherboard series pre-launch presentation, which references GIGABYTE's own interpretation of AMD's roadmap. It lists out every CPU microarchitecture for the AM4 platform, and right next to "Matisse" is "& Refresh," confirming that "Matisse Refresh" is real. A microarchitecture "refresh" needn't even involve any physical changes to the processor design, core-counts, or architecture, and can sometimes even indicate something as simple as a second major wave of SKUs that replace existing SKUs in the market, leading to their phase-out (eg: Intel "Haswell Refresh" retaining the 4th gen Core model numbering). The slide also adds weight to the theory that desktop "Renoir," like its mobile counterpart, lacks PCIe gen 4.0. The slide also talks about AMD introducing the entry-level A520 desktop chipset in August, which will support PCIe gen 4 when paired with a capable processor.

In their briefing leading up to today's Ryzen 3 3100 and 3300X review embargo, AMD disclosed that its upcoming "Zen 3" 4th generation Ryzen desktop processors will only support AMD 500-series (or later) chipsets. The next-gen processors will not work with older 400-series or 300-series chipsets. This comes as a blow to those who bought premium X470 motherboards hoping for latest CPU compatibility running into 2020. At this time only B550 is available, but we expect more news on enthusiast chipsets as the Zen 3 launch date comes closer. AMD B550 is a fascinating new mid-range chipset by AMD. Launching today as a successor to the popular B450 chipset, B550 is a low-power silicon with roughly the same 5-7 W TDP as the older 400-series chipset. Although AMD won't confirm it, it's likely that the chipset is sourced from ASMedia. It brings a lot to the table that could draw buyers away from B450, but it also takes some away.

The AMD B550 currently only supports 3rd generation Ryzen "Matisse" processors. Ryzen 3000 "Picasso" APU are not supported. What's more, older Ryzen 2000 "Pinnacle Ridge," "Raven Ridge," and first gen Ryzen 1000 "Summit Ridge" aren't supported, either. The Athlon 200 and 3000 "Zen" based chips miss out, too. AMD argues that it ran into ROM size limitations when trying to cram AGESA microcode for all the older processors. We find that hard to believe because B450 motherboards with the latest ComboAM4 AGESA support 2nd gen and 3rd gen processors, including APUs and Athlon SKUs based on the two. On the bright side, AMD assured us (within its marketing slides for the B550), that the chipset will support upcoming processors based on the "Zen 3" microarchitecture. The company also came up with a new motherboard packaging label that clarifies that the processors won't work with the 3400G and 3200G.

AMD's timely announcement of the Ryzen 3 "Matisse" processor series could stir things up in the entry-level as Intel kitted its 10th generation Core i3 processors as 4-core/8-thread. Last week, a head-to-head Cinebench comparison between the i3-10300 and 3300X ensued, and today we have a 3DMark Firestrike and Time Spy comparison between their smaller siblings, the i3-10100 and the 3100, courtesy of Thai PC enthusiast TUM_APISAK. The two were benchmarked on Time Spy and Fire Strike on otherwise constant hardware: an RTX 2060 graphics card, 16 GB of memory, and a 1 TB Samsung 970 EVO SSD.

With Fire Strike, the 3100-powered machine leads in overall 3DMark score (by 0.31%), CPU-dependent Physics score (by 13.7%), and the Physics test. The i3-10100 is ahead by 1.4% in the Graphics score thanks to a 1.6% lead in graphics test 1, and 1.4% lead in graphics test 2. Over to the more advanced Time Spy test, which uses the DirectX 12 API that better leverages multi-core CPUs, we see the Ryzen 3 3100 post a 0.63% higher overall score, 1.5% higher CPU score; while the i3-10100 powered machines post within 1% higher graphics score. These numbers may suggest that the i3-10100 and the 3100 are within striking distance of each other and that either is a good pick for gamers, until you look at pricing. Intel's official pricing for the i3-10100 is $122 (per chip in 1,000-unit tray), whereas AMD lists the SEP price of the Ryzen 3 3100 at $99 (the Intel chip is at least 22% pricier), giving AMD a vast price-performance advantage that's hard to ignore, more so when you take into account value additions such as an unlocked multiplier and PCIe gen 4.0.

Intel is giving finishing touches to its 10th generation Core i3 desktop processors based on the "Comet Lake" microarchitecture. These upcoming socket LGA1200 processors are 4-core/8-thread, and see the debut of HyperThreading and Turbo Boost technologies to the Core i3 desktop processor brand extension. The i3-10100 is an entry-level part clocked at 3.60 GHz with 4.30 GHz boost; while the i3-10300 is clocked higher with 3.70 GHz nominal and 4.40 GHz boost frequency. The TDP of both parts is rated at 65 W. Besides clock speeds, the two parts are differentiated with L3 cache amount, with the i3-10100 featuring 6 MB, and the i3-10300 featuring 8 MB. Cinebench R20 scores of the two chips were leaked to the web by CPU-Monkey.

The i3-10100 reportedly scores 448 points in the single-thread, and 2284 points in the multi-threaded test. The i3-10300, on the other hand, scores 457 points in the single-threaded test, and 2330 points in the multi-threaded test. The same source also claims to have tested the upcoming 3rd generation AMD Ryzen 3 "Matisse" 4-core/8-thread processor series, with the Ryzen 3 3100 scoring 444 points single-thread and 2154 points multi-threaded; and the Ryzen 3 3300X scoring 491 points single-thread, and 2341 points multi-threaded. If these scores hold true, it's game on between the two companies' entry-level chips.

AMD has announced its Ryzen 3 "Matisse" quad-core desktop processors, with two SKUs in the pipe, the $99 Ryzen 3 3100 and the $120 Ryzen 3 3300X. Both are 4-core/8-thread parts spaced apart by clock-speeds, or so we thought. According to an alleged AMD presentation slide leaked to the web, the differentiation between the two runs deeper than that. Both chips are based on the "Matisse" multi-chip module, with a single 8-core "Zen 2" chiplet that has four disabled cores. How AMD goes about disabling these cores appears to be the secret sauce behind the "X" on the 3300X.

Inside each "Zen 2" chiplet, the 8 cores are spread between two 4-core CCX (compute complexes). On the 3100, AMD disabled two cores per CCX, and halved the 16 MB L3 cache per CCX. So it ends up with a 2+2 core CCX configuration, 8+8 MB of L3 cache adding up to 16 MB. The 3300X takes the more scenic route. An entire CCX is disabled, all four cores are part of the same CCX. This design lowers inter-core latency among the cores, and more importantly. gives each of the four cores access to 16 MB of shared L3 cache. And then there's the speed-bump. This goes a long way in explaining how the 3300X is shown within striking distance of the Core i7-7700K in leaked Cinebench scores, and could provide a formidable gaming processor in the lower end.

Intel's Core i7-7700K "Kaby Lake" quad-core processor may fall significantly behind its 9th generation successor and today's Ryzen 7 chips, but it remains a formidable piece of silicon for strictly-gaming builds. Can it be bested by a $120 AMD Ryzen 3 3300X? A leaked, alleged Cinebench R15 score suggests that something very fascinating is brewing at AMD. The score points to the i7-7700K having a single-thread score just 0.5 percent higher than the 3300X, which means the multi-threaded score of the 4-core/8-thread AMD chip could end up within striking distance of the i7-7700K.

If this holds up, then AMD has a shot at bringing i7-7700K levels of gaming performance down to $120 (SEP). That would have the potential to seriously disrupt the sub-$200 processor market for gamers, enabling them to build fairly powerful 1440p (or higher) gaming builds. The low price will also let builders allocate more money to the graphics card. Adding to its gaming credentials could be the fact that the "Matisse" MCM features PCI-Express gen 4.0 x16 when paired with an X570 or upcoming B550 chipset motherboard, as detailed in AMD's announcement of the processor. The Ryzen 3 3300 is a 4-core/8-thread processor based on the "Zen 2" microarchitecture, clocked at 3.80 GHz, with 4.30 GHz boost frequency, and featuring 18 MB of total cache. It is expected to be available from May 2020.

Today, AMD announced the newest additions to the 3rd Gen AMD Ryzen desktop processor family, the AMD Ryzen 3 3100 and AMD Ryzen 3 3300X processors and AMD B550 Chipset for Socket AM4 designed for 3rd Gen AMD Ryzen desktop processors with over 60 designs in development. Taking advantage of the AMD world-class portfolio of technologies, these new Ryzen 3 desktop processors bring the groundbreaking "Zen 2" core architecture to business users, gamers, and creators worldwide, leveraging Simultaneous Multi-Threading (SMT) technology for increased productivity. With double the threads, twice the bandwidth, and a wide selection of motherboards in development the AMD B550 chipset and Ryzen 3 desktop processors deliver the ideal processing solution from top to bottom.

"Games and applications are becoming more and more demanding, and with this, users are demanding more from their PCs," said Saeid Moshkelani, senior vice president and general manager, client business unit. "AMD is committed to providing solutions that meet and exceed those demands for all levels of computing. With the addition of these new Ryzen 3 desktop processors we are continuing this commitment with our mainstream gaming customers. We've taken performance up a level, doubling the processing threads of our Ryzen 3 processors to propel gaming and multitasking experiences to new heights."

AMD could spring a major suprise with pricing of its 3rd generation Ryzen 3 "Matisse" quad-core desktop processors we detailed recently. According to pricing put out by Komachi Ensaka, the Ryzen 3 3300X could start at a price of USD $120, and the Ryzen 3 3100 at $104. Even if these are 1,000-unit tray prices, or pre-tax cost prices to retailers, which you mark up by 20 percent, you're still looking at no more than $144 for the 3300X, and no more than $125 for the 3100. This would allow AMD to engage in a price-war against Intel's 10th generation Core i3 line of 4-core/8-thread processors. AMD also appears to be careful not to cannibalize the 3200G and 3400G APUs, which command sub-$150 price points. There's still no word on when AMD plans to launch these chips.

AMD is readying a new line of Ryzen 3 socket AM4 desktop processors to bolster its competitiveness against the upcoming 10th generation Core i3 processor family, according to OPN details unearthed by @momomo_us. The new line of processors are expected to be based on the "Matisse" MCM, configured with one "Zen 2" chiplet that has a quad-core CPU configuration. Within the chiplet, AMD appears to be achieving 4 cores by disabling one of the two CCXs completely, instead of taking the 2+2 core CCX configuration route. A single CCX with its 16 MB L3 cache, and 2 MB of L2 cache (4x 512 KB) add up to the processor's 18 MB "total cache."

Among the two SKUs existing are the Ryzen 3 3100 (OPN: 100-000000284) and the Ryzen 3 3300X (OPN: 100-000000159). Both are 4-core/8-thread parts with 18 MB total cache, and 65 W TDP. The 3100 is clocked up to 3.90 GHz, and the 3300X up to 4.30 GHz. It remains to be seen if AMD enables features like PCI-Express gen 4.0, and whether the 3100 has an unlocked multiplier. AMD's move to introduce Ryzen 3 "Matisse" parts appears to be necessitated by Intel's 10th gen Core i3. Intel is configuring its next value-segment chips to be 4-core/8-thread at price-points under $160. AMD has older generation Ryzen 5 and Ryzen 3 series parts at these prices, but is lacking on any current-gen product. One area where the 10th gen Core i3 one-ups Ryzen 3 "Matisse" is integrated graphics. Then again, Intel is likely to have "F" SKUs of Core i3 parts with disabled iGPUs, meant for gaming PCs. That's what AMD appears to be going after, to establish the next low-cost gaming PC king.