AMD's interim RDNA 3.5 architecture will power the Radeon RX 8000 series integrated graphics in "Strix Halo" mobile processors, while the more advanced RDNA 4 architecture is reserved for the higher-tier Radeon RX 9000 series of discrete graphics, according to @9550pro on X. We previously believed that AMD's Ryzen AI MAX 300 Strix Halo processors would carry an iGPU with Radeon 8000S branding. However, at the same time, we expected the Radeon RX 8000 series of desktop GPUs to have a similar branding while being powered by RDNA 4. The new Radeon naming scheme is now transparent, thanks to the latest leaks of the naming schemes and early glimpses of reference design.

The RDNA 4-based RX 9000 series will be powered by the Radeon RX 9070 XT, built on the Navi 48 silicon. This GPU represents AMD's new focus on the high-volume midrange performance segment rather than competing in the ultra-enthusiast high-end space. The architecture promises enhanced SIMD IPC performance and a specialized ray tracing solution that significantly reduces performance overhead compared to current offerings. According to All The Watts, the RX 9000 lineup is expected to include various SKUs across different performance tiers, including the RX 9060, 9050, and 9040 series. Meanwhile, the RDNA 3.5-powered RX 8000 series will serve as a refined iteration of the current RDNA 3 generation. Still, they will be exclusive to AMD's mobile segment in the form of iGPU, integrated inside Strix Halo APU. Both RDNA 4 GPUs and RDNA 3.5-based APUs are scheduled for the CES 2025 event unveiling in January.

GEEKOM, a Taiwanese tech company famous for making high quality mini PCs, is heading to CES for the second consecutive year in 2025 with an exciting lineup of new products. Known as the Green Mini PC Global Leader, GEEKOM always focuses on improving the quality and reliability of its products, and it also spares no effort in cutting down carbon emissions and making the world a greener place.

Among the many mini PCs that GEEKOM plans to put on show at CES 2025, there are many industry firsts. The GEEKOM QS1, for instance, is the world's first mini PC powered by a Qualcomm chipset. The tiny computer sports an Arm-based Qualcomm Snapdragon X1E-80-100 processor with twelve 4.0 GHz Oryon CPU cores, a 3.8 TFLOPS Adreno X1-85 GPU and a 45 TOPS Hexagon NPU. It is smart and fast enough to breeze through all of your daily home and office computing chores, yet energy-efficient enough to significantly cut down your electric bill.

AMD's upcoming Ryzen AI Kraken Point APUs appear to be affordable APUs for next-generation thin-and-light laptops and potentially even some gaming handhelds. Murmurings of these new APUs have been going around for quite some time, but a PassMark benchmark was just posted, giving us a pretty comprehensive look at the hardware configuration for the upcoming Ryzen AI 7 350. While the CPU configuration in the PassMark result confirms the 4+4 configuration we reported on previously, it seems as though the iGPU portion of the new Ryzen AI 7 is getting something of a downgrade compared to previous generations.

While all previous mobile Ryzen 7 and Ryzen 9 APUs have featured the Radeon -80M or -90M series iGPUs, the Ryzen AI 7 350 steps down to the AMD Radeon 860M. Although not much is known about the new iGPU, it uses the same nomenclature as the Radeon iGPUs found in previous Ryzen 5 APUs, suggesting it is the less performant of the new 800 series iGPUs. This would be the first time, at least since the introduction of the Ryzen branding, that a Ryzen 7 CPU will use a cut-down iGPU. This, along with the 4+4 (Zen 5 and Zen 5c) heterogenous architecture, suggests that this Ryzen 7 APU will prioritize battery life and thermal performance, likely in response to Qualcomm's recent offerings. Comparing the 760M to the single 860M benchmark on PassMark reveals similar performance, with the 860M actually falling behind the average 760M by an average of 9.1%. Take this with a grain of salt, though, since there is only one benchmark result on PassMark for the 860M.

YEYIAN Gaming, a trailblazing leader in high-performance gaming desktop PCs, computer hardware, and accessories, is thrilled to announce its participation at CES 2025, which will take place from January 7 to 10, 2025, at The Venetian Resort in Las Vegas. YEYIAN GAMING will present an impressive lineup of cutting-edge gaming products, including next-generation gaming PCs, high-performance 40-inch curved monitors, advanced mechanical keyboards, and innovative gaming accessories crafted to inspire gamers and creators alike. Visitors, media, influencers, and content creators are invited to experience YEYIAN GAMING's latest innovations firsthand. The showcase, open from 9:00 AM to 5:00 PM, provides an exclusive opportunity to explore next-level hardware engineered for exceptional performance, bold designs, and unmatched versatility.

At CES 2025, YEYIAN Gaming will unveil an exciting array of new products tailored for professional gamers, streamers, and PC enthusiasts. Here's a detailed preview of the lineup:

Ever since AMD introduced Strix Point, enthusiasts like ourselves have been eagerly awaiting details regarding the high-end Strix Halo APUs with integrated graphics that are rumored to be powerful enough for the system to not require discrete graphics at all. Leaks regarding the upcoming performance mobile APU lineup have been trickling out steadily, and a fresh new Geekbench leak reveals the CPU performance of the Ryzen AI+ Max 395 APU, which boasts a 16-core configuration consisting entirely of Zen 5 cores, unlike Strix Point which features a mix of Zen 5 and the smaller Zen 5c cores. And oh dear, are the numbers ever so lucrative.The APU managed to rake in 2,849 points in the single-core department, and a whopping 20,708 points in multicore. As Videocardz correctly notes, this result is far ahead of AMD's current top-end mobile offering, the Ryzen 9 7945HX3D, which manages around 16,900 points in the multicore test. In single-core, however, the Ryzen 9 7945HX3D does edge ahead, with around 2,900 points. That said, the ROG Flow Z13 laptop that the APU was housed in is most likely still in the testing phase, so it is entirely possible that the final product will sport even better performance. That being said, the Apple M4 Max SoC, however, remains in a league of its own with 3,800 points in single-core and a shocking 25,000 points in multicore. With CES 2025 just around the corner, it's only a matter of weeks before the Ryzen AI Max+ lineup finally sees the light of day and reaches our hands.

At this point, it's basically taken for granted that Lenovo will be launching its cut-down Legion Go S gaming handheld at CES 2025, and a fresh leak from Evan Blass via The Verge points to another Legion Go handheld—a direct replacement for the current-generation Go—launching alongside the Go S. While the Go S will supposedly be powered by the less powerful AMD Ryzen Z2G and its Radeon 680M iGPU, the full-fat Legion Go 2 will likely use a more powerful processor and iGPU, suggesting that a Ryzen Z2 Extreme SoC is on the way.

Perhaps the most compelling thing about the new Legion Go handheld, though is that it will reportedly feature an OLED display. Despite the new display tech, though, the Legion Go 2 will supposedly have the same display size, detachable controllers, and FPS mode, although the images shared by Blass show significantly rounder controller edges, which should make the chunky handheld less cumbersome to hold. The leaks make no mention of SteamOS or a Steam button for the Legion Go 2, suggesting that it will still be a Windows-first gaming handheld, and the Legion Space button is still present on the face of the Legion Go 2 featured in the leaks.

Minisforum is an easily recognizable brand that is well-regarded for its lineup of mini PCs. The MS-A1 is one such mid-range offering that boasts an AM5 socket, and the product is now available to configure with the 16-core Ryzen 9 9950X with a 100 W TDP, which happens to be an absolute monstrosity of a desktop CPU with hefty cooling requirements.

The system was already available with a Ryzen 7 8700G, which was most likely performant enough for most people. The MS-A1 does not feature dedicated graphics, which is why the Ryzen 7 8700G was a great choice thanks to its relatively potent iGPU. However, it is no surprise that there are many workloads that demand raw CPU power over anything else, and the MS-A1 with the Ryzen 9 9950X will be an excellent option for such demanding scenarios. That said, since the system does not feature discrete graphics, the Radeon 610M iGPU found in the 9950X will simply not be able to keep up with any GPU-intensive workloads.

AMD's recently launched Strix Point lineup of high-end APUs boast truly impressive performance, even when configured with lower TDPs. As time goes on, more and more hardware brands are hitting the market with Strix Point-powered devices, and unsurprisingly, Aoostar does not wish to sit on the sidelines either.

The company has teased a yet-to-be announced mini PC, with Strix Point at its heart. Powered by the powerful Ryzen AI 9 HX 370 APU, the system will likely offer excellent performance, considering that Aoostar refuses to skimp on its cooling system. Thankfully, that does seem to be case, since Aoostar claims the upcoming mini PC will boast a vapor chamber cooling setup allowing the HX 370 to run at its maximum of 54 watts. For those out of the loop, here is a rundown of the HX 370's specifications: 12-core setup with 8 Zen 5c cores and 4 Zen 5 cores, Radeon 890M iGPU based on RDNA 3+, and a 50 TOPS XDNA 2 NPU to justify the "AI" branding.

Fanless mini PCs are far from hard to find on the internet, although such systems seldom sport impressive hardware. That is to be expected, considering that powerful components require admirable cooling setups that are difficult to achieve in a passively cooled mini PC. However, Onlogic appears to be poised to tackle that trend by introducing the ML1000G-42 mini PC.

The system, boasting a rather compact 14.2 x 6.1 x 10.7 mm chassis, sports an 8-core Ryzen 7 8840U "Hawk Point" APU paired with up to 96 GB of DDR5-5600 memory. The product is mostly targeted at industrial use, which can be easily deduced from its external design. However, there is nothing specific about this system that outright prevents office users from using this as their daily driver. After all, there is hardly a scarcity of mini PC enthusiasts who prefer fanless systems.

It's been public knowledge for a while now that Lenovo is planning an imminent successor to its Legion Go handheld that has proven rather popular among handheld gamers. Previous leaks and rumors indicated that the Legion Go S 8ARP1, as it will apparently be named, will be a more affordable version of the current Legion Go. Now, thanks to Roland Quandt, Windows Central, and WinFuture, more details about the upcoming Legion Go S have leaked, including images of the device, supposed specifications, and a potential price.

According to the leaks, the new affordable handheld gaming PC will feature some substantial hardware changes, including a slightly smaller eight-inch display, this time with a much lower 1920 × 1200p resolution and a slightly lower 120 Hz refresh rate. Gone, too, are the Nintendo Switch-style detachable controllers, with the Legion Go S instead featuring a white unibody design. What's more interesting than the leaked images of the Legion Go S or the hardware changes—detachable controllers or not, the Legion Go is still intended to be used as a handheld—is the new AMD APU that will seemingly power the Go S. The as-yet unannounced AMD Ryzen Z2G looks like it will be an odd core configuration featuring an AMD Radeon 680M iGPU and Zen 3+ cores. Ultimately, the APU seems like it will put the Legion Go S somewhere between the current-generation Legion Go and devices featuring the AMD Ryzen Z1 (non-extreme), which is a good place to be if Lenovo hopes to compete with the likes of the Steam Deck OLED, which will seemingly cost around the same as the Legion Go S, depending on which region you are in.

With the Senza Under Desk PC, ARCTIC is launching a remarkable new product on the market. The innovative Senza Under Desk PC, available in three versions, impresses with its discreet under-desk mounting, high performance, and completely passive cooling. A complete PC that integrates perfectly into any working environment and ensures a tidy, efficient setup.

The ideal solution for modern offices and home office
"The Senza was developed to optimize the workplace. With our Under Desk PC, we have created a computer that is inaudible and invisible and offers maximum comfort and performance."—Magnus Huber, CEO

Chinese OEM brand Erying presented its first AMD-based motherboard, the Alkiad B650 ITX D5. The overall design of the Erying Alkiad B650 ITX D5 sports a white PCB with black components and is equipped with an EPS 8-pin power connector alongside a 24-pin ATX connector. 5 V ARGB connectors are included for those who cannot live without a colorful build. The VRM is based on an 8+2+1 phase power delivery design and covered by a decent heatsink, more than enough for a budget AM5 65 W platform in a standard ITX 170 x 170 mm format.

The Alkiad B650 ITX D5 motherboard has 2 DDR5 DIMM memory slots, supports 6400+ (OC) MT/s, and Intel XMP 3.0 / AMD EXPO profiles. The Erying motherboard offers 1x PCIe 4.0 ×16 and 1x PCIe 4.0 ×4 M.2 slots, and 4x SATA III ports while the Realtek RTL8125BG provides 1x 2.5GbE RJ45 connectivity. The rear I/O panel offers 4x USB 2.0, 3x USB-A 5 Gbps and 1x USB-C 10 Gbps ports, 1x DP and 1x HDMI connectors and the usual audio combo (one S/PDIF and a pair of 3.5 mm). The motherboard comes before AMD's expected expansion of its Ryzen 9000 series "Granite Ridge" desktop processor family in Q1 2025 with new 65 W CPU models and the introduction of the AMD B850 chipset. There is no exact information yet regarding pricing and availability.

A significant fix has been submitted to the Linux kernel 6.13-rc1 that addresses prolonged boot times affecting older AMD processors, specifically targeting "Zen 1" and "Zen 2" architectures. The issue, which has been present for approximately 18 months, could cause boot delays ranging from several seconds to multiple minutes in extreme cases. The problem was discovered by a Nokia engineer who reported inconsistent boot delays across multiple AMD EPYC servers. The most severe instances showed the initial unpacking process taking several minutes longer than expected, though not all boots were affected. Investigation revealed that the root cause stemmed from a kernel modification implemented in June 2023, specifically related to CPU microcode update handling.

The technical issue was identified as a missing step in the boot process: Zen 1 and Zen 2 processors require the patch buffer mapping to be flushed from the Translation Lookaside Buffer (TLB) after applying CPU microcode updates during startup. The fix, submitted as part of the "x86/urgent" material ahead of the Linux 6.13-rc1 release, implements the necessary TLB flush for affected AMD Ryzen and EPYC systems. This addition eliminates what developers described as "unnecessary and unnatural delays" in the boot process. While the solution will be included in the upcoming Linux 6.13 kernel release, plans are in place to back-port the fix to stable kernel versions to help cover most Linux users on older Zen architectures.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced a groundbreaking update to its X3D Turbo Mode feature, providing users with an intuitive new method to activate advanced gaming performance optimization directly through the AORUS AI SNATCH software.

Users can now easily enable the X3D Turbo Mode with a streamlined process:

• Run live update on GCC to get the latest AORUS AI SNATCH version B24.11.19.01
• Navigate to the flag icon in the lower-left corner
• Click the flag icon to activate X3D Turbo Mode
• Confirm the pop-up window by clicking "OK"
• System will automatically restart to activate the feature

For users who wish to cancel the action, a "Discard" button is available to immediately halt the process.

AMD has recently filed a patent revealing plans to implement "multi-chip stacking" in future Ryzen SoCs, as Wccftech reports, quoting a post on X from @coreteks: "New patent from AMD shows how future Zen SoCs could look. Basically a novel packaging design that enables compact chip stacking and interconnection by having them partially overlap, as in this figure. The dotted line is a larger die stacked on top of those smaller ones". The patent details a new approach where smaller chiplets partially overlap with a larger die, creating space for additional components and functions on the same die. This strategy aims to improve the efficiency of the contact area, thus making room for higher core counts, larger caches, and increased memory bandwidth within the same die size. The proposed stacking will reduce the physical distance between components through overlapping chiplets, thus minimizing interconnect latency and achieving faster communication between different chip parts. The design will also improve power management, as the segregated chiplets allow for better control of each unit through power gating.

Even if long-time rival Intel has lost some of its momentum (and market share) this year, AMD's chance to push ahead with its intention to become number one in the market is to continue to innovate. In the same way that its 3D V-Cache technology made the X3D processor lineup so successful, this chip stacking approach could play a major role in future AMD Ryzen SoCs. It seems that AMD is committed to moving away from the monolithic design era and taking the road of multi-chiplet; however, it can be a long wait until (and if) this chip stacking will complete the journey from patents to design, production, and final product.

MSI has released a brief statement regarding the recent issue of a burned AMD Ryzen 7 9800X3D on the MSI Tomahawk X870 motherboard. The issue was reported over at Reddit, showing both burned CPU and socket, and currently it seems to be an isolated incident. MSI is stepping in to investigate the issue and has released a brief statement.

"Recently, we received a user report indicating damage to an AMD Ryzen 7 9800X3D processor on an MSI MAG X870 TOMAHAWK WIFI motherboard. At MSI, we are fully committed to the quality of our products and have begun investigating this incident. Additionally, we are working closely with AMD and are in contact with GamersNexus, which is independently investigating this incident. We will continue to provide updates as the investigation progresses," said MSI in its official statement.

According to CRN, AMD is looking to make some cuts to its workforce of approximately 26,000 employees. The company hasn't announced a specific number, but in a comment to the publication AMD said that "as a part of aligning our resources with our largest growth opportunities, we are taking a number of targeted steps that will unfortunately result in reducing our global workforce by approximately 4 percent". In actual headcount numbers that should be just north of a thousand people that the company will let go. It's not clear which departments or divisions at AMD will be affected the most, but the cutback appears to be a response to AMD's mixed quarterly report.

AMD's statement also doesn't make it clear on exactly what the company will be putting its focus on moving forward, but CRN seems to suggest that the embedded and gaming business is where AMD is struggling. That said, it's not likely that AMD will put an increased focus on those businesses, but instead the company is more likely to invest more into its server products, least not to try and catch up with NVIDIA in the AI server market. According to CRN, AMD has also seen a strong demand in AI PCs, such as the Ryzen AI 300-series of mobile SoCs, so it's possible AMD will put an extra effort into is mobile product range. The Ryzen 9000-series is thankfully also doing well, so it's unlikely there will be any big cutbacks here. We already know that AMD is not going after NVIDIA with a new flagship GPU to compete with NVIDIA's GeForce RTX 5000-series flagship SKU, so it's possible that the company will cut back on some people in its consumer GPU team for the time being, but this should become clear come CES in January.

According to the market research firm Mercury Research, the desktop CPU market has witnessed a remarkable transformation, with AMD seizing a substantial 28.7% market share in Q3 of 2024—a giant leap since the launch of the original Zen architecture in 2017. This 5.7 percentage point surge from the previous quarter is a testament to the company's continuous innovation against the long-standing industry leader, Intel. Their year-over-year growth of nearly ten percentage points, fueled by the success of their Ryzen 7000 and 9000 series processors, starkly contrasts Intel's Raptor Lake processors, which encountered technical hurdles like stability issues. AMD's revenue share soared by 8.5 percentage points, indicating robust performance in premium processor segments. Intel, witnessing a decline in its desktop market share to 71.3%, attributes this shift to inventory adjustments rather than competitive pressure and still holds the majority.

AMD's success story extends beyond desktops, with the company claiming 22.3% of the laptop processor market and 24.2% of the server segment. A significant milestone was reached as AMD's data center division generated $3.549 billion in quarterly revenue, a new record for a company not even present in the data center in any considerable quantity just a decade ago. Stemming from strong EPYC processor sales to hyperscalers and cloud providers, along with Instinct MI300X for AI applications, AMD's acceleration of data center deployments is massive. Despite these shifts, Intel continues to hold its dominant position in client computing, with 76.1% of the overall PC market, held by its strong corporate relationships and extensive manufacturing infrastructure. OEM partners like Dell, HP, Lenovo, and others rely heavily on Intel for their CPU choice, equipping institutions like schools, universities, and government agencies.

The leading system integrator iBUYPOWER, a company focusing on building high-performance gaming computers, announced today that new PCs equipped with the AMD Ryzen 7 9800X3D Series CPU, AMD's fastest gaming desktop processor, can now be purchased on its official website. By integrating the new processor into an iBUYPOWER system that is backed by an extensive warranty of three-years labor and two-years parts, customers can look forward to top-of-the-line gaming performance powered by AMD "Zen 5" architecture and built on 4 nm technology.

The AMD Ryzen 7 9800X3D Series processor is built with exclusive 2nd gen AMD 3D V-Cache technology, which enables up to 104 MB of on-chip memory and provides increased frequencies for higher and smoother frame rates when paired with AMD EXPO technology. The new CPU is designed for the AMD AM5 platform, which allows for breakneck DDR5 memory speeds, PCIe 5.0 integration for high-speed bandwidth, and is built for long-lasting performance against the latest gaming releases.

Thanks to a recent report from VideoCardz, we learned that AMD has introduced a series of prebuilt desktop computers in China featuring their new Ryzen 7 9800X3D processor. The systems are being sold through AMD's store on JD.com rather than through traditional computer manufacturers. The Ryzen 7 9800X3D processor, which launches November 7 at $479, will be the centerpiece of these systems. For the components, AMD partnered with several manufacturers: ASUS supplies motherboards and graphics cards, Thermalright provides the 360 mm 360 Frozen Infinity AIO liquid cooling system, and LOONGTR makes the computer cases, which include Ryzen branding. The company is offering seven different configurations. Each system includes 32 GB of DDR5-6000 memory and uses an ASUS TUF Gaming B650M-Plus motherboard with 1 TB storage, except for one model with a Prime X670E-Pro motherboard with 2 TB storage.

Prices range from $1,000 for the base model without a graphics card to $2,100 for the version with AMD's RX 7900 XTX graphics card. Some models include NVIDIA graphics cards instead of AMD's own, specifically the RTX 4070 Super and RTX 4070 Ti Super. The computers will be available starting November 7, just before Singles' Day on November 11, a major shopping event in China. It overlaps with the Ryzen 7 9800X3D launch, given that it is the heart of the system. AMD already sells other prebuilt systems in the Chinese market, including models with various Ryzen processors and graphics cards, such as the China-only RX 6750 GRE.

We are days away from the official November 7 launch of AMD's Ryzen 7 9800X3D CPU with 3D V-Cache, and we are already seeing some estimates of the speedup compared to the last-generation Ryzen 7 7800X3D CPU. According to a Geekbench submission discovered by Everest (Olrak29_) on X, the upcoming AMD Ryzen 7 9800X3D has been spotted running at a clock speed of 5.46 GHz. This is a 260 MHz increase from the official boost frequency of 5.2 GHz, which indicates overclocking has been applied. If readers recall, the last generations of X3D processors had overclocking disabled, and this time, things are looking different thanks to the compute die being placed on top of SRAM. AMD attributes this to CCD being closer to the heat spreader instead of memory and allowing it to spread heat more effectively, ensuring a stable overclock.

Regarding performance, the Ryzen 7 9800X3D outperforms its predecessor, the Ryzen 7 7800X3D, by an impressive 27.4% in the single-core Geekbench v6 test and 26.8% in the multicore test. The last generation CPU scored 2,726 points in single-core and 15,157 points in multicore tests, while the new Zen 5 design has managed to produce 3,473 points in single-core and 19,216 in multicore tests. These results are approximately 27% improvement over the Zen 4, suggesting that the Zen 5 architecture benefits greatly from better SRAM bandwidth and capacity. While these results only come from synthetic benchmarks, they give us a picture of what to expect from this CPU. We have to wait for more real-world test cases to fully conclude the improvement factor.

Just last week, AMD announced the arrival of its upcoming Ryzen 9000 series of CPUs with 3D V-Cache for November 7. However, we might be in for a treat, as AMD could be preparing Threadripper 9000WX/X series of CPUs with 3D V-Cache. According to VideoCardz, the ASUS Pro WS WRX90E-SAGE SE board appears to include an intriguing feature in its settings—there's a configuration option related to 3D V-Cache control, though this setting currently doesn't have any practical application with the available Threadripper 7000WX and 7000X processors. The presence of this setting hasn't been officially documented by ASUS, showing that this feature could indeed end up in future iterations of Threadripper processors, namely the 9000WX/X series.

AMD currently offers 3D V-Cache treatment in its high-end Genoa-X CPUs, with up to 96 cores and 192 threads, and 1,152 MB of L3 cache. These CPUs were praised for their capabilities in the high-performance computing sector, performing calculations at unprecedented rates thanks to the massive cache size and bandwidth. If AMD decides to opt-in for the HEDT market with 3D V-Cache, we might see an appearance with the upcoming Threadripper generation. However, right now, it is only speculation based on undocumented features in ASUS's high-end board. Even if these CPUs are planned, we are not near their launch as the priority is launching and shipping the consumer-oriented Ryzen 7 9800X3D CPU on November 7.

MSI is thrilled to introduce the upcoming AMD Ryzen 7 9800X3D, an innovation built on the Zen 5 architecture and featuring AMD's groundbreaking 3D V-Cache technology. The Ryzen 7 9800X3D is designed for peak performance with improved IPC and superior power efficiency compared to the previous generation, promising an exhilarating leap in computing power.

The Ryzen 7 9800X3D integrates seamlessly with the AM5 socket ecosystem, providing users access to PCIe Gen 5 bandwidth and high-speed DDR5 memory support. Built on a 4 nm process, this processor establishes a new performance, power efficiency, and responsiveness benchmark, ideal for intensive gaming and content creation. MSI's X870(E) motherboards are fully compatible with the Ryzen 7 9800X3D, featuring a robust lineup from MEG X870E GODLIKE to MAG X870 TOMAHAWK WIFI. MSI's X870(E) motherboards and AMD's latest processors unlock peak gaming performance for users.

Today, AMD unveiled new desktop computing products, delivering enhanced performance for gamers. The lineup features the new AMD Ryzen 7 9800X3D Desktop processor, based on the "Zen 5" architecture and utilizing 2nd Gen AMD 3D V-Cache technology.

With the AMD Ryzen 7 9800X3D processor, AMD has re-engineered its cutting-edge on-chip memory solution with 2nd Gen AMD 3D V-Cache technology. The 64 MB cache memory has been relocated below the processor, which puts the core complex die (CCD) closer to the cooling solution to help keep the "Zen 5" cores cooler, delivering high clock rates and providing up to an average 8% gaming performance improvement compared to our last-gen generation and up to an average 20% faster than the competition. This revolutionary change in placement allows for extreme overclocking of the processor. It's the first X3D processor to be fully unlocked, empowering enthusiasts and gamers to push its performance to new limits.

ASRock, the global leading manufacturer of motherboards, graphics cards, mini PCs, and gaming monitors, announced today that its AM5 series motherboards are fully compatible with the AMD Ryzen 7 9800X3D processor, maximizing its impressive gaming performance. This allows PC enthusiasts worldwide to be among the first to experience the exceptional capabilities brought by the AMD Ryzen 7 9800X3D processor. The AMD Ryzen 7 9800X3D is the first model released in the 9000X3D processor series. ASRock AM5 motherboards will continue to receive updates to ensure seamless compatibility with upcoming Ryzen 9000 Series X3D processors, delivering outstanding performance for gaming enthusiasts.

Users can download and install the latest AGESA 1.2.0.2a BIOS from the ASRock website or use the BIOS Flashback and Instant Flash features for an easy upgrade. ASRock recommends updating to the latest BIOS version promptly to ensure optimal system compatibility and performance.