Phison Electronics, a leading innovator in NAND Flash technologies, today announced the newest addition and highest available capacity of the Pascari D-Series data center-optimized SSDs to be showcased at SC24. The Pascari D205V drive is the first PCIe Gen 5 128 TB data center class SSD available for preorder to address shifting storage demands across use cases including AI, media and entertainment (M&E), research and beyond. In a single drive the Pascari D205V offers 122.88 TB of storage, creating a four-to-one capacity advantage over traditional cold storage hard drives while shrinking both physical footprint and OPEX costs.

While the exponential data-deluge continues to strain data center infrastructure, organizations face a tipping point to maximize investment while remaining conscious of footprint, cost efficiency and power consumption. The Pascari D205V read-intensive SSD combines Phison's industry-leading X2 controller and the latest 2 Tb 3D QLC technology engineered to enable unequaled 14,600 MB/s sequential read and 3,000K IOPS random read performance. By doubling both the read speeds against Gen 4 as well as the capacity against the 61.44 TB enterprise SSDs currently available on the market today, the Pascari D205V allows customers to upgrade to larger datasets per server, top-tier capacity-per-watt utilization and unparalleled read performance.

Renowned global memory brand Team Group Inc. is committed to providing consumers with diverse and optimal storage solutions. Today, it proudly unveils the Team Group MP44Q M.2 PCIe 4.0 Solid State Drive, featuring the latest 3D QLC NAND technology, combining cutting-edge technology with the trend of demanding high storage capacity to meet daily system and file storage needs.

Team Group MP44Q M.2 PCIe 4.0 SSD utilizes the latest 3D QLC NAND, offering capacities of up to 4 TB. With the PCIe Gen 4 x4 interface and SLC Caching technology, it achieves maximum sequential read and write speeds of up to 7,400 MB/s and 6,500 MB/s, respectively. The MP44Q SSD operates with low power consumption, catering to all document processing and storage applications, significantly enhancing work efficiency. Paired with Team Group's exclusively patented graphene heat dissipation sticker, whose thickness is less than 1 mm, eliminating the potential for mechanical interference in any assembly, coupled with the native heat sink of the motherboard, such an arrangement effectively addresses the heat generated by high performance, extending the SSD's lifespan.

YMTC X3-6070 3D QLC NAND flash chips are claimed by the company to offer endurance comparable to 3D TLC NAND flash chips from its competitors, ITHome reports. The company launched the new NAND flash chip at an event earlier this week. The X3-6070 is based on YMTC's 3rd Generation Xtracking architecture, and is 128-layer, which may not sound very competitive, given that other brands have moved up to 176-layer, or 232-layer; but YMTC says that the 128-layer design-choice is one of the four key ingredients to achieving high endurance for this chip.

The other three ingredients are innovations in the materials making up the NAND flash physical layer, new error-correction algorithms, and optimizations at the level of the SSD controller. The X3-6070 can sustain 4,000 P/E cycles per cell, YMTC claims, which is in league of contemporary 3D TLC NAND flash chips. It is able to do so, at lower costs from the QLC architecture. Besides the X3-6070, YMTC also launched a few first-party reference design SSDs that fully implement the controller-level optimizations needed for the chip to perform and endure as advertised.