Acer today announced new models of the Acer Swift Edge 16 and Acer Swift Go 14 laptops, blending AI power and innovative features in stylish thin and light devices. The latest additions to the Swift lineup feature AMD Ryzen 8040 Series processors with up to AMD Radeon 780M Graphics and equipped with Ryzen AI for versatile performance and support for Acer's AI-powered capabilities such as Acer PurifiedVoice, Acer PurfiedView, and the new Acer LiveArt photo-editing feature. Intuitive control and seamless navigation on the AI PCs are made possible thanks to the AcerSense application and Copilot in Windows with instant access through dedicated keys. Users can also appreciate clear images and rich colors when working or streaming through the OLED laptops' displays, as well as Microsoft Pluton technology, enabled by default, to help secure devices, personal data, and encryption keys.

Harnessing the Power of AI with AMD Ryzen 8040 Series Processors
Designed to deliver premium AI experiences and reliable performance for everyday productivity, the Swift Edge 16 and Swift Go 14 laptops are powered by AMD Ryzen 8040 Series processors with Ryzen AI technology built in. AMD's latest processors enable the efficient distribution of AI workloads between accelerators on the NPU, GPU, and CPU, to advance user experiences with AI technology on the devices. It leverages AMD's "Zen 4" processor architecture with up to eight cores and delivers up to 16 threads of processing power, so creative professionals and mainstream users can expect fast, power-efficient computing and longer battery life on the ultrathin Swift laptops.

Chinese processor designers need help creating a leading-edge design that satisfies their needs, with the imposed sanctions and restrictions of Western countries. However, designers are using creative ways to make a server processor to fulfill their needs. According to the latest Sina report, Chinese company Loongson has developed a 32-core processor using chiplet technology. Previously, the company announced its 16-core 3C5000 processor based on LA464 cores, which utilize LoongArch ISA. Loongson used chiplet technology to fuse two 3C5000 processors into a single-socket solution called 3D5000, which features 32 LA464 cores to create a higher-performing design. Based on the LGA-4129 package, the chip size is 75.4x58.5×6.5 mm.

The company claims that the typical power consumption is rated for 130 Watts at 2.0 GHz or 170 Watts at 2.2 GHz, with TDP power consumption not exceeding 300 Watts at 2.2 GHz even with peaks. The performance of the new 3D5000 processor, measured using SPEC2006, is 400 points and 800 points for single-socket and dual-socket servers, respectively. The four-socket server is expected to reach 1600 points in the same benchmark, so scaling is advertised as linear. Loongson hopes to provide samples to industry partners in the first half of 2023 with an unknown price tag.

ASUS today revealed the all-new Zenfone 9 smartphone at a virtual launch event. Zenfone 9 is a totally redesigned compact 5.9-inch device with high performance and exciting new features. Powered by the latest flagship Snapdragon 8+ Gen 1 Mobile Platform, it's the most powerful Zenfone ever released. This latest generation Zenfone 9 has been totally redesigned to give it a premium, sleek look and feel, with four eye-catching new colors, a tactile new high-grip texture, and IP68 certification. The modern design features a massively upgraded dual-camera system with a 50 MP Sony IMX 766 main camera featuring a new 6-Axis Hybrid Gimbal Stabilizer, electronic image stabilization (EIS) and ultrafast autofocus technology for sharp, shake-free photos and videos. There's also a 12 MP IMX 363 ultrawide camera, and a 12 MP IMX 663 punch-hole front camera for crystal clear selfies and video chats.

As Zenfone 9 fits perfectly in one hand, the ASUS ZenUI 9 (Android 12) interface has been optimized for one-handed use. There's also the unique ASUS ZenTouch, a multifunction side-mounted power button incorporating a fingerprint sensor for hassle-free unlocking and support for convenient gesture controls. The new Connex Case accessory allows users to attach the Connex Card Holder or Connex Smart Stand, and there's also a new Smart Backpack Mount for safely attaching Zenfone 9 to a backpack's strap.

Qualcomm Technologies, Inc. today announced the Snapdragon X60 5G Modem-RF System, its third-generation 5G modem-to-antenna solution (the Snapdragon X60). Snapdragon X60 features the world's first 5-nanometer 5G baseband and is the world's first 5G Modem-RF System to support spectrum aggregation across all key 5G bands and combinations, including mmWave and sub-6 using frequency division duplex (FDD) and time division duplex (TDD), providing ultimate operator flexibility to uplift 5G performance utilizing fragmented spectrum assets. This 5G modem-to-antenna solution is designed to enhance the performance and capacity for operators worldwide while increasing average 5G speeds in mobile devices. Snapdragon X60 is engineered to accelerate network transition to 5G standalone mode through support for any key spectrum band, mode or combination, along with 5G Voice-over-NR (VoNR) capabilities.

Cooler Master, a global leader in designing and manufacturing innovative gaming peripherals and PC components, has unveiled its latest lineup of headsets for gamers of all types: the MH600 Series.

The MH600 Series emphasizes high performance and premium sound quality with a core suite of features standard in every model:

• Swiveling ear cups and fabric mesh cushioning for superior, long-lasting comfort
• Hassle-free portability with detachable cords and foldable frames
• Adjustable omnidirectional boom mic for superior voice quality and minimal background noise
• Premium sound quality with 50 mm neodymium audio drivers

Razer, the leading global lifestyle brand for gamers, today announced their new Razer Blade Stealth 13 with NVIDIA GeForce GTX 1650 graphics - the World's First Gaming Ultrabook. Powered by Intel's new 10th generation processor, the new Razer Blade Stealth 13 delivers true gaming performance packed into an amazingly thin 15 mm chassis weighing only 1.3 kg.

"Razer is constantly pushing the boundaries of what's possible, by designing laptops that utilize the most powerful components in the smallest chassis" says Brad Wildes, Senior Vice President of Razer's Systems Division. "We did it with our original Razer Blade, which led the trend of slim gaming systems, and now we're doing it again with our Blade Stealth, pioneering a new market for powerful, small-footprint laptops."

Razer is launching an updated, TKL (Tenkeyless) version of the Chroma V2 keyboard, which we covered back in January. The keyboard's actual product name is "Razer BlackWidow Tournament Edition Chroma V2". Like the Chroma V2, it's available with Razer's three desktop switches (Yellow, Orange, or Green), and boasts a detachable USB cable and likewise detachable wrist rest.

Unchanged BlackWidow features on this Chroma V2 version include Razer's Chroma lighting (which boasts individually backlit keys at 16.8 million colors per key), with Chroma effects powered by Razer's Synapse software. 10 key roll-over anti-ghosting and fully programmable keys with on-the-fly macro recording options are present, with the keyboard featuring 1000 Hz polling, a braided USB cable, a USB pass-through and a 3.5 mm 4-pole audio pass-through jack.

That some M.2 SSDs throttle their speeds because of increased operating temperatures has already been demonstrated. Some companies, like Plextor, have even launched M.2 SSDs with specifically-developed heatsinks to reduce operating temperatures and thus reduce performance degradation. Other companies, Like MSI, have started incorporating M.2 heatsinks on their motherboard design, looking to attract more customers on the prospect of increased SSD performance - though some say the merits of MSI's approach are debatable.

Now, SilverStone has announced a more cost-effective - and compatible - way of improving thermals of your M.2 SSD of choice, by introducing its TP01-M2 thermal pads. These pads are colored blue (because blue means cool, see?), and the company claims their usage on a Samsung SM951 SSD brought about improvements of around 15ºC in the operating temperatures, down to 71ºC from the 86ºC sans thermal pads. These go for around 5€ a pack, which comes with two 20 mm (W) x 100 mm (D), one with 0.5 mm thickness, and another with improved cooling capabilities but a greater 1.5 mm thickness.

Thermaltake is consistently increasing its offers in the wall-mountable chassis portion of its business. Now, the company is introducing a mITX chassis that's supposed to appeal to wall-mounting users who prefer a lither system with a smaller footprint.

As is the hallmark of the P series, the P1 offers support for your choice of AIO or custom loop liquid coolers. It's open-frame design and 5 mm thick tempered glass will make sure to showcase all your components and bling properly. The Core P1 features three setup choices - vertical, horizontal, and wall-mounted. The chassis allows for three 2.5" drives and an extra 2.5" or 3.5". The case features five expansion slots, looking to offer more flexibility in the installation. The Core P1 allows 2x 120 mm fans to be installed, or 1x 240 mm radiator. The clearance for the CPU cooler is 170 mm, the graphics card can be up to 380 mm with a radiator thinner than 30 mm (without fans), and the PSU length sits at to 180 mm.

Slim and light, MSI's GP60 and GP70 presents better performance of the latest laptops for online gaming competitions. Under the hood, these NBs meet your need for machines that with good performance with better gaming experience. In addition, they sport envelope-pushing SteelSeries gaming keyboards, unique Audio Boost for headsets sound enhancement solution. Easy to Take and powerful, these NBs will give you the furious advantage in HD gaming competitions. MSI has received high marks for its high-end gaming laptops, the good performance but compact gaming design in new gaming notebooks. They featured Intel's 4th Generation Quad Core processor and new Generation NVIDIA GeForce GT 740M discrete graphics. Specially designed to meet the demands of online gamers around the world.

Seagate Technology plc, a world leader in storage solutions, today announced it's shipping its thinnest hard disk drive (HDD) ever to OEM partners - the Seagate Laptop Ultrathin HDD. Just 5mm thin, the Laptop Ultrathin HDD is designed to be integrated into ultra-thin, lightweight mobile computing devices and tablets all while delivering high capacity storage at an affordable price.

"When we originally demonstrated this solution last September, we knew we had a truly innovative product that would empower our partners to reimagine mobile applications," said Steve Luczo, president, CEO and chairman of Seagate. "The strong support from our OEM partners indicates we have delivered on our vision and look forward to a new wave of innovative solutions enabled by this revolutionary product."

Toshiba Electronics Europe (TEE) has announced that solid state drives (SSDs) built on the company's 19nm Multi-Level Cell (MLC) NAND flash technology are now readily available across Europe. Toshiba was the first company to develop 19nm NAND SSDs and the family includes the world's smallest and highest density NAND flash drives.

Toshiba's THNSNH family addresses the storage, performance and power efficiency demands of even the most data-intensive and energy-sensitive systems. The drives are ideal for high-end notebooks, tablets, PCs, all-in-one desktop computers and industrial PCs. Capacities of 512GB1, 256GB, 128GB and 60GB are all now available in 2.5-inch form factors with a choice of 7.0 mm and 9.5 mm profiles. mSATA modules with capacities of 256GB, 128GB and 60GB are also available.

Buffalo Japan introduced the BSKBB15SV foldable keyboard for those who find on-screen keyboards on their phablets less than ergonomic. Measuring 149 x 95.5 x 16 mm (WxDxH) when folded and 297 x 95.5 x 7.5 mm unfolded, the keyboard features Bluetooth 2.0 keyboard-class compliance, which lets it pair with almost any modern Bluetooth-enabled smartphone, tablet, or notebook. It features an English QWERTY layout, with a total of 83 keys. The keys feature 17 mm pitch and 2.2 mm travel (stroke). It includes a complementary stand that can hold most tablets. Available in black and silver color options, and slated for early December, it is priced around 7,035¥ (US $86).

The "A-Drive", one of the world's thinnest 5 mm hybrid hard drive in a 2.5" form factor, was officially launched by Mr. S. Iswaran, Minister in the Prime Minister's Office and Second Minister for Home Affairs and Trade & Industry, to commemorate the Data Storage Institute's (DSI) 20 years of R&D in the area of data storage capabilities.

The "A-Drive" represents the next generation of storage innovation providing capacities of up to 1 TB Hard Disk Drive (HDD) with 32 GB Solid State Drive (SSD). This potentially allows the "A-Drive" to store over 250,000 songs in its 5 mm body. The "A-Drive" also addresses limitations of the popular, yet expensive, flash-based SSD, as well as the conventional HDD for the consumer and business industry.

ADATA announced a new line of affordable client SSDs, the Premier Pro SP600 series. Built in the 9.5 mm-thick 2.5-inch form-factor, the drives take advantage of SATA 6 Gb/s interface. Available in 32 GB, 64 GB, and 128 GB capacities, the Premier Pro SP600 series is driven by JMicron JMF661 processor, and features 20 nm-class MLC NAND flash memory. The drives offer sequential read speeds of up to 360 MB/s, and up to 130 MB/s writes. Random access performance numbers provided to us include 40,000 IOPS 4K random reads, and 30,000 IOPS 4K random writes. The drives pack most common client SSD features, including TRIM, NCQ, and 40 b/KB ECC. The 32 GB, 64 GB, and 128 GB variants are priced at US $49.99, $69.99, and $99.99, respectively.

As hard drives stared at oblivion in the Ultrabook segment, with Intel planning to slim the specification down even further, leaving room for nothing but bare SSDs, WD pulled a rabbit out of its hat with the revolutionary 5 mm-thick hybrid HDD. Following its September 10 announcement, 5 mm-thick hybrid HDDs have reportedly sparked great interest in notebook vendors, which prompted WD to pull its mass-production schedule from Q1 2013 to end of 2012.

WD, a subsidiary of Western Digital Corp. today announced it is sampling a 5 mm-thin hard disk drive featuring hybrid technology. WD has developed hard drives slim enough for integration into today's thinnest notebook PCs, which provide high-capacity storage and robustness while featuring instant-on and application performance similar to today's client solid state drives (SSDs). The new technologies will be showcased during WD's Investor Day, Sept. 13, 2012.

"Mobile devices are becoming smaller, thinner, lighter and more responsive," said Matt Rutledge, vice president of client storage solutions at WD. "Working with our technology partners, WD has developed new 5 mm hard drives that enable high capacity storage along with excellent performance and superior economics to allow our customers to expand their thin offerings."