GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, announced the launch of the newest B550 AORUS motherboards primed to unleash the potential of 3rd Gen AMD Ryzen desktop processors. The all new B550 AORUS motherboards kick off the PCIe 4.0 era with extensive feature sets, and equip up to Direct 16 phases of digital power design with advanced thermal solutions that provide the processors and chipset more stable power supplement. Select GIGABYTE B550 AORUS motherboards feature a native USB 3.2 Gen2 interface, feature-rich I/O with a pre-installed I/O shield, the latest wireless connection, and Ultra Durable technology, set to deliver an unmatched user experience. "

We are seeing increasing user demands for flexible systems that perform well in a multitude of tasks from gaming to content creation more than ever before," said Chris Kilburn, corporate vice president and general manager, client component business unit, AMD. "AMD is excited to bring the power of 3rd Gen AMD Ryzen desktop processors and cutting edge PCIe 4.0 support to the mainstream users with our latest AMD B550 chipsets. With overwhelming platform support from our partners at Gigabyte, AMD is confident these new B550 platforms will provide flexibility and power never seen before on a mainstream platform."

Leading global motherboard manufacturer, ASRock, proudly announces its latest range of motherboards featuring the new AMD B550 chipset, supporting AMD Ryzen desktop processors. "ASRock AMD B550 motherboard series brings exciting and innovating features such as PCIe 4.0 to the mainstream, ASRock offers a comprehensive range of motherboards from entry to premium, including the Taichi, PG Velocita, Extreme, Steel Legend and Pro4 series, leading features and excitement into the market." says Chris Lee, general manager of ASRock motherboard business unit.

"We are seeing increasing user demands for flexible systems that perform well in a multitude of tasks from gaming to content creation more than ever before," said Chris Kilburn, corporate vice president and general manager, client component business unit, AMD. "AMD is excited to bring the power of 3rd Gen AMD Ryzen desktop processors and cutting edge PCIe 4.0 support to the mainstream users with our latest AMD B550 chipset. With a wide range of form factors, power delivery options, and designs from our partners at ASRock, AMD is confident these new B550 platforms will provide flexibility and power never seen before on a mainstream platform."

Slightly ahead of its launch, ASUS flashed a banner of its AMD B550 chipset motherboard lineup, revealing two other boards than the premium ROG Strix B550-E Gaming AMD unveiled in its platform unveil. These include an unnamed micro-ATX board slotted in the TUF Gaming series, and a entry-level Prime B550M-A micro-ATX board. The Prime board has our attention as its spartan layout could indicate that there will indeed be socket AM4 boards based on the B550 starting at $100, as AMD promised. The B550 has a distinct advantage over the B450 in the form of PCI-Express gen 4.0 for the main PEG and at least one M.2 NVMe slots; and an easier upgrade path toward 4th gen Ryzen "Vermeer" and "Renoir," than AMD's 400-series chipsets have.

AMD's 4th generation Ryzen "Renoir" desktop APUs, based on the "Zen 2" microarchitecture, could lack PCI-Express gen 4.0, hints the product page of an upcoming AMD B550 chipset motherboard by BIOSTAR. AMD already declared that the B550 lacks support for "Picasso," which means the "Ryzen with Radeon Vega Graphics" processors referenced in the BIOSTAR product page have to be "Renoir." On the mobile platform, Ryzen 4000H and 4000U series processors do lack PCIe gen 4.0, but it was expected that AMD will enable gen 4.0 for the desktop socket AM4 platform.

The lack of gen 4.0 support has implications for "Renoir." For starters, the APU, like its predecessors, spares only 8 PCIe lanes toward PEG (PCI-Express discrete graphics, or the main x16 slot you typically use for graphics cards). If these lanes are gen 3.0, then even the newer graphics cards, such as AMD's "Navi" RX 5700 XT, or next-gen GeForce "Ampere," would have to make do with a PCI-Express 3.0 x8 interface, despite being gen 4.0 x16-capable. We will test just how much of a bottleneck this poses, when the next-gen graphics cards come out.

The bulk of AMD's 4th generation Ryzen desktop processors will comprise of "Vermeer," a high core-count socket AM4 processor and successor to the current-generation "Matisse." These chips combine up to two "Zen 3" CCDs with a cIOD (client I/O controller die). While the maximum core count of each chiplet isn't known, they will implement the "Zen 3" microarchitecture, which reportedly does away with CCX to get all cores on the CCD to share a single large L3 cache, this is expected to bring about improved inter-core latencies. AMD's generational IPC uplifting efforts could also include improving bandwidth between the various on-die components (something we saw signs of in the "Zen 2" based "Renoir"). The company is also expected to leverage a newer 7 nm-class silicon fabrication node at TSMC (either N7P or N7+), to increase clock speeds - or so we thought.

An Igor's Lab report points to the possibility of AMD gunning for efficiency, by letting the IPC gains handle the bulk of Vermeer's competitiveness against Intel's offerings, not clock-speeds. The report decodes OPNs (ordering part numbers) of two upcoming Vermeer parts, one 8-core and the other 16-core. While the 8-core part has some generational clock speed increases (by around 200 MHz on the base clock), the 16-core part has lower max boost clock speeds than the 3950X. Then again, the OPNs reference A0 revision, which could mean that these are engineering samples that will help AMD's ecosystem partners to build their products around these processors (think motherboard- or memory vendors), and that the retail product could come with higher clock speeds after all. We'll find out in September, when AMD is expected to debut its 4th generation Ryzen desktop processor family, around the same time NVIDIA launches GeForce "Ampere."

AMD backpedaled on dropping support for its future "Zen 3" processors on AMD 400-series chipset motherboards. The company will work with its motherboard partners in integrating "Zen 3" processor support on certain beta versions of motherboard BIOSes. AMD also detailed how it plans to go about it. The said BIOS will be a one-way ticket to using "Zen 3" processors while losing support for all older microarchitectures.

The way it works is the motherboard manufacturer will integrate the Zen 3-only AGESA with a firmware that can squeeze into a 16 MB ROM. They may also choose to conserve ROM space in areas such as the UEFI setup program, which may not correspond with the motherboard's original feature-set. This is essentially similar to how MSI integrated "Zen 2" support on some of its older motherboards with 16 MB ROMs, by slimming down its UEFI setup program.

GIGABYTE B550 AORUS Master is the company's most premium socket AM4 motherboard based on the upcoming AMD B550 chipset. We described this board in some detail in our older article covering an assortment of top B550 motherboards from manufacturers, but missed a key bit. At the time we assumed that the PCI-Express lane switches located below the board's main PCI-Express slot merely split its x16 connection from the AM4 SoC down to two x8 connections to share between two slots, given that AMD allows multi-GPU (including SLI) with the B550. Apparently, the lane switches are there for a different, more fascinating reason.

A BenchLife.info report points to the possibility of all three M.2 slots on this motherboard having PCI-Express gen 4.0 wiring - something that shouldn't normally be possible, since all downstream PCIe lanes put out by the B550 are gen 3.0. The way we see it, the topmost M.2 slot has a direct PCI-Express 4.0 x4 connection from the AM4 socket (as it normally should). The second- and third slots, however, pull their wiring from a series of lane switches that split the main x16 PEG slot to gen 4.0 x8/x4/x4. It's possible that one of the two x16 (electrical x4) slots has a further lane sharing arrangement with one of the two M.2 slots.

Here is the first picture of the AMD Ryzen 7 4700G, the company's upcoming socket AM4 APU based on the 7 nm "Renoir" silicon, courtesy of VideoCardz. The picture reveals a standard-looking socket AM4 chip with commercial name and OPN markings (100-000000146), matching the Igor's Lab OPN code leak from earlier this week. The Ryzen 7 4700G offers an 8-core/16-thread CPU based on the "Zen 2" microarchitecture, and an integrated graphics solution that combines the SIMD machinery of the "Vega" graphics architecture, with the updated display- and media engines of "Navi." The iGPU is configured with 8 CUs (512 stream processors), which on the 4700G has an impressive maximum engine boost clock of 2.10 GHz, according to the Igor's Lab story.

The 8-core/16-thread CPU of the Ryzen 7 4700G has a nominal clock speed of 3.60 GHz, and a maximum boost frequency of 4.45 GHz, with several Precision Boost power-states in both directions of the nominal clock. The CPU features 512 KB of L2 cache per core, and 8 MB of shared L3 cache (4 MB per CCX). The iGPU engine clock goes all the way up to 2.10 GHz, which could help it overcome some of the CU deficit vs. "Picasso," which has 11 CUs (704 stream processors), but clocked only up to 1.40 GHz. Since the Ryzen 5 3400G has an unlocked multiplier, it stands to reason that even the 4700G could. If the platform I/O of "Renoir" in its mobile avatar is anything to go by, then the 4700G could feature a limited PCI-Express x8 lane setup for its PEG port. AMD is rating the TDP of the 4700G at 65 W.

SilentiumPC today released an update to its Grandis line of dual fin-stack (type-D) CPU coolers, with the new Grandis 3 EVO ARGB. The cooler was last updated in 2016 with the Grandis 2 XE1436. The Grandis 3 sees the fins in both stacks do away with the perforations, increasing surface area, and now feature jagged edges. It also has a revised CPU base design with a slightly thicker mirror-finish nickel-plated copper base. The nickel plating now extends to the six 6 mm copper heat pipes (the Grandis 2 uses exposed copper).

The other, more noticeable design change, is the ventilation. The cooler now includes a pair of Pulsar HP ARGB fans. The "push" fan outside the first fin-stack is 120 mm, while the "pull" fan between the two fin-stacks is 140 mm. Both fans feature hydraulic bearings rated for 50,000 hours. The 120 mm "push" fan spins between 250 to 1,600 RPM, while the 140 mm "pull" fan does 250 to 1,400 RPM. The company didn't put out air-flow or noise output figures. The cooler has a thermal capacity of 250 W TDP, and supports several modern CPU socket types including LGA1151, LGA1200, LGA2066, and AM4. Both fans feature standard 3-pin ARGB connections for the lighting. The fan impellers and frames are made of a translucent white material that acts as diffusers for light from the diodes located in the fan hub. Measuring 159 mm x 140 mm x 131 mm (HxWxD) with its fan installed, the Grandis 3 EVO ARGB weighs 961 g, and is in fact lighter than its predecessor.Update 14:14 UTC: SilentiumPC announced pricing for the Grandis 3 EVO ARGB to be 55€ (including VAT). The company also announced the 49€ Grandis 3 with non-illuminated fans, which otherwise has identical specs to the Grandis 3 EVO ARGB.

It was only a matter of time before AMD brought its 7 nm "Renoir" APU silicon onto the desktop platform. The first such chip just hit the radar as the Ryzen 7 4700G. This would be the first desktop Ryzen APU graded as Ryzen 7, thanks to its CPU core count. The 4700G features an 8-core/16-thread CPU based on the "Zen 2" microarchitecture. The iGPU is a hybrid between "Vega" and "Navi."

The "Renoir" iGPU features the SIMD components of "Vega," but with the display- and multimedia-engines of "Navi." The iGPU apparently maxes out on 8 NGCUs on "Renoir," amounting to 512 stream processors. Increased iGPU engine clocks attempt to make up the CU deficit compared to the previous-generation "Picasso" (8 vs. 11). The CPU features 512 KB of L2 cache per core, and 8 MB of shared L3 cache (4 MB per CCX). An AoTS run in which the processor is paired with a Radeon RX 5700 XT graphics card surfaced on social media. Bringing "Renoir" to the desktop platform at prices competitive with Intel's 10th generation Core i3 thru Core i7 will be critical for AMD, as it nullifies a key advantage Intel has - integrated graphics, so the processors could make it to the vast majority of non-gaming builds with high CPU performance demand.Update May 10th: A possible UserBenchmark submission of this processor, where it carries the engineering sample number "100-000000149-40_40/30_Y" surfaced. It's shown having clock speeds of 3.00 GHz base and 4.00 GHz boost. We know this is a desktop platform looking at its ASRock B550 Taichi motherboard and Micron-supplied standard DIMM.

In their briefing leading up to today's Ryzen 3 3100 and 3300X review embargo, AMD disclosed that its upcoming "Zen 3" 4th generation Ryzen desktop processors will only support AMD 500-series (or later) chipsets. The next-gen processors will not work with older 400-series or 300-series chipsets. This comes as a blow to those who bought premium X470 motherboards hoping for latest CPU compatibility running into 2020. At this time only B550 is available, but we expect more news on enthusiast chipsets as the Zen 3 launch date comes closer. AMD B550 is a fascinating new mid-range chipset by AMD. Launching today as a successor to the popular B450 chipset, B550 is a low-power silicon with roughly the same 5-7 W TDP as the older 400-series chipset. Although AMD won't confirm it, it's likely that the chipset is sourced from ASMedia. It brings a lot to the table that could draw buyers away from B450, but it also takes some away.

The AMD B550 currently only supports 3rd generation Ryzen "Matisse" processors. Ryzen 3000 "Picasso" APU are not supported. What's more, older Ryzen 2000 "Pinnacle Ridge," "Raven Ridge," and first gen Ryzen 1000 "Summit Ridge" aren't supported, either. The Athlon 200 and 3000 "Zen" based chips miss out, too. AMD argues that it ran into ROM size limitations when trying to cram AGESA microcode for all the older processors. We find that hard to believe because B450 motherboards with the latest ComboAM4 AGESA support 2nd gen and 3rd gen processors, including APUs and Athlon SKUs based on the two. On the bright side, AMD assured us (within its marketing slides for the B550), that the chipset will support upcoming processors based on the "Zen 3" microarchitecture. The company also came up with a new motherboard packaging label that clarifies that the processors won't work with the 3400G and 3200G.

AMD's upcoming B550 desktop chipset, which plays second-fiddle to the premium X570, could bring relief to gaming PC builders wanting to put together 3rd gen Ryzen desktops with PCI-Express gen 4.0 graphics and M.2 SSD connectivity on the cheap. Pricing of a handful ASUS B550 motherboards was leaked to the web by Australian retailer ICIT.net.au, who listed the somewhat premium ASUS ROG Strix B550-F Gaming for AUD $262.90, including GST (converts to USD $167 including all taxes). The retailer also lists TUF B550-Plus Gaming and Prime B550M-A at the same exact price, which could be pre-launch inflation (so we're going by the price of what could be the best-endowed SKUs among the three).

If this pricing holds up, B550 based boards could launch at prices close to those of B450 boards at launch. The B550 is AMD's mid-range desktop chipset that is expected to enable PCI-Express gen 4.0, at least where it matters the most (the main x16 slot and the M.2 slot that's wired to the AM4 SoC). Much like its predecessors, the B450 and B350, it could enable CPU- and memory overclocking. Reports dating back to Q3-2019 point to the B550 being ASMedia-sourced, and having a far lower chipset TDP than the X570 (making do with passive heatsinks like the AMD 400-series).

AMD formally announced its AGESA ComboAM4 1.0.0.5 microcode. The new microcode is intended to be encapsulated into motherboard UEFI firmware updates and distributed by motherboard- and OEM desktop manufacturers, at their discretion. AGESA 1.0.0.5 improves POST (time) with select Micron Technology DDR4-3200 memory chips. An intermittent virtual memory error with certain Realtek onboard Ethernet PHY chips has been fixed. The microcode also improves PCI-Express bus stability and interoperability, in general. A PCIe lane configuration issue with Ryzen 3 Pro 2100GE has been fixed. Besides these, all other performance- and stability-improvements part of older 1.0.0.4 a/ab/abb/abba microcodes are incorporated into 1.0.0.5. Keep an eye on the BIOS updates section of your socket AM4 motherboard's product page on its company website.

Jonsbo introduced the TW2 PRO all-in-one, closed-loop liquid CPU Cooler, with a 360 mm x 120 mm radiator-size model. The company is preparing variants with 240 mm x 120 mm and 120 mm x 120 mm radiator sizes. These coolers are characterized by ambient air-pressure stabilized radiators, and high flow-rate pump-blocks. The included fans and the pump-block feature bright acrylic RGB LED embellishments. The included fans feature glossy-black impellers with the RGB diffusers located along the bore of the frames, with 18 diodes per fan. These fans spin between 800 to 1,600 RPM, pushing up to 42.8 CFM of air, with noise output of 26 dBA. Among the CPU socket types supported are LGA115x and AM4. The 360 mm variant is expected to be priced under 499 RMB ($71 USD).

While AMD's 7 nm "Renoir" APU silicon is off busy disrupting the mobile processor market, AMD needs a socket AM4 desktop APU to challenge Intel's Core i5 and Core i7 chips that have iGPUs, and it's only natural for "Renoir" to reach the desktop platform at some point. PC enthusiast _rogame unearthed details of a 35-Watt TDP AMD APU codenamed "Artic," with a rather high 3.00 GHz nominal clock speed, which could hint at the possibility of this being a desktop part. The part in question also features an iGPU ticking at 1200 MHz, and DDR4-3200 memory.

AMD has released Renoir on the mobile platform at 15 W and 45 W power-envelopes. It has, in the past, similarly segmented its desktop APUs into 65 W and energy-efficient 35 W TDP parts, with the latter using lower clock speeds and aggressive power-management to hold on to its TDP. This chip could be the latter, a possible "Ryzen 3 4200GE" of sorts. _rogame mentions that the iGPU performance is a notch lower than the 6 CU "Renoir" parts such as the 4600H, while the CPU performance is higher than the 8-core/8-thread 4700U. Here's hoping we find out more soon.

AMD is readying a new line of Ryzen 3 socket AM4 desktop processors to bolster its competitiveness against the upcoming 10th generation Core i3 processor family, according to OPN details unearthed by @momomo_us. The new line of processors are expected to be based on the "Matisse" MCM, configured with one "Zen 2" chiplet that has a quad-core CPU configuration. Within the chiplet, AMD appears to be achieving 4 cores by disabling one of the two CCXs completely, instead of taking the 2+2 core CCX configuration route. A single CCX with its 16 MB L3 cache, and 2 MB of L2 cache (4x 512 KB) add up to the processor's 18 MB "total cache."

Among the two SKUs existing are the Ryzen 3 3100 (OPN: 100-000000284) and the Ryzen 3 3300X (OPN: 100-000000159). Both are 4-core/8-thread parts with 18 MB total cache, and 65 W TDP. The 3100 is clocked up to 3.90 GHz, and the 3300X up to 4.30 GHz. It remains to be seen if AMD enables features like PCI-Express gen 4.0, and whether the 3100 has an unlocked multiplier. AMD's move to introduce Ryzen 3 "Matisse" parts appears to be necessitated by Intel's 10th gen Core i3. Intel is configuring its next value-segment chips to be 4-core/8-thread at price-points under $160. AMD has older generation Ryzen 5 and Ryzen 3 series parts at these prices, but is lacking on any current-gen product. One area where the 10th gen Core i3 one-ups Ryzen 3 "Matisse" is integrated graphics. Then again, Intel is likely to have "F" SKUs of Core i3 parts with disabled iGPUs, meant for gaming PCs. That's what AMD appears to be going after, to establish the next low-cost gaming PC king.

Corsair started selling the White edition variant of its XC7 RGB CPU water-block. The XC7 launched with its standard black variant, which we reviewed recently. The white variant (model: CX-9010005-WW) is now available from Corsair's website in the US, for USD $74.99. The block sees nickel-plated copper with a mirror-finish, as its primary material. It features a clear acrylic top that has an outer pearl-white accent. The top is studded with addressable RGB LEDs that take in a standard 3-pin input, and compatible with Corsair's iCue software. The block features standard G1/4" fittings, and supports mainstream desktop CPU sockets, namely the LGA115x, upcoming LGA1200, and AMD socket AM4.

Thermaltake today rolled out the TH240 ARGB Sync and TH120 ARGB Sync all-in-one, closed-loop, liquid CPU coolers. As their names suggest, the two are differentiated by radiator size, with the TH240 (CL-W286-PL12SW-A) packing a 240 mm x 120 mm radiator; and the TH120 (CL-W285-PL12SW-A) a 120 mm x 120 mm one. What's different with these coolers is the inclusion of high static-pressure fans, an included fan+LED controller, and a cubical new pump-block design with an ARGB LED illuminated ornament on top. The pump turns at a fixed 3,300 RPM speed, while each of the included fans takes in 4-pin PWM + 3-pin ARGB connectors, spinning up to 1,500 RPM, pushing 59.28 CFM of air, with a maximum noise output of 28.2 dBA. Among the CPU socket types supported are LGA115x and AM4. The company didn't reveal pricing.

Bitspower today unveiled its Mono Block for the ASUS ROG Crosshair VIII Impact X570 motherboard. It is designed to cool the socket AM4 processor and CPU VRM of the Crosshair VIII Impact, with precisely-laid base-plate contact points for the board's 8+2 phase VRM and the processor. The block's primary material is nickel-plated copper, with mirror-finish at its base-plate contact points. It features a clear acrylic top with provision for an ARGB LED light strip. A micro-fin lattice is located over the CPU for heat-dissipation. The block measures 115 mm x 98 mm x 28 mm, and features standard G1/4" fittings. Available now, it is priced at USD $140.

AMD's 4th generation Ryzen desktop processors are expected to launch around September 2020, sources in the motherboard industry tell DigiTimes. Codenamed "Vermeer," successor to "Matisse," these processors will be socket AM4 multi-chip modules of up to two CPU complex dies based on the "Zen 3" microarchitecture, combined with an I/O controller die. The "Zen 3" chiplets are expected to be fabricated on a newer 7 nm-class process by TSMC, either N7P or N7+. The biggest design change with "Zen 3" is the doing away of CCX arrangement of CPU cores, with each chiplet holding a common block of cores sharing a last-level cache. This, along with clock speed headroom gains from the new node are expected to yield generational price-performance increases.

The "Zen 2" based 8-core "Renoir" die is also expected to make its socket AM4 debut within 2020, succeeding the "Picasso" based quad-core Ryzen 3000-series APUs. This is a particularly important product for AMD, as it is expected to compete with Intel's 10th generation Core i5 6-core/12-thread processors in terms of pricing, while offering more cores (8-core/16-thread) and a faster iGPU. The 4th gen Ryzen socket AM4 processor lineup will launch alongside AMD's 600-series motherboard chipset, with forwards- and backwards-compatibility (i.e., "Vermeer" and "Renoir" working with older chipsets, and older AM4 processors working on 600-series chipset motherboards). AMD was originally expected to unveil these processors at the 2020 Computex trade-show in June, but Computex itself is rescheduled to late-September.

Have you ever wondered how a laptop with a desktop CPU that has 16 cores and 32 threads would look like on a laptop? Well, today is your lucky day as XMG, a German laptop maker, has decided to launch a laptop that has AMD's latest and greatest desktop CPU - the Ryzen 3950X 16C/32T monster. The 3950X CPU, while featuring a regular TDP of 105 W, has been configured to 65 W in Eco Mode, and it runs anywhere from 2.6 to 4.2 GHz. The CPU also isn't soldered to the motherboard and there is a full AM4 socket, that is capable of housing any 3000 series desktop CPU.

Besides a powerful CPU, there are options for NVIDIA GeForce RTX 2060 or RTX 2070 graphics cards, which drive a 15.6-inch Full HD 144 Hz IPS panel equipped with anti-glare technology. The GPUs are a "Max-P incarnation" as XMG calls it, which presumably means that they are designed for maximum performance i.e. possibly higher boost speeds. Additionally, you can configure the laptop with up to 64 GB of DDR4 2666 MHz RAM. This configuration, containing Ryzen 9 3950X, RTX 2070, 32 GB of RAM and 1 TB NVM, costs around 2631 EUR. For more configuration options, you can check out this website. Availability is supposed to be in 6-8 weeks.

SilentiumPC rolled out several variants of its best-selling Fortis 3 tower-type CPU cooler since its 2015 debut, including a design refresh as the Fortis 3 v2, and its RGB variant late last year, which came with older standard RGB. Its latest iteration is the Fortis 3 EVO ARGB. The business end of the cooler, its large tower-type heatsink, is unchanged from the older variants. All that's really changed with the EVO ARGB is the fan.

The included Pulsar HP ARGB 140 mm fan features translucent white plastic making up not just the impeller, but also the frame. This allows bright addressable RGB LEDs embedded in the hub to project light not just through the fan blades, but also the frame. SilentiumPC has also re-tuned the motor to feature a speed range of 200 to 1,400 RPM (compared to 500 to 1,400 RPM on older models of Fortis 3). It also comes with a newer hydraulic bearing that enables a 50,000-hour service life. The fan takes in 4-pin PWM for its primary function, and 3-pin ARGB for the lighting. A "Nano Reset" ARGB LED controller comes included with the cooler, as does a 5 W/mK thermal compound. CPU socket compatibility hasn't changed: LGA2066, LGA115x, and AM4. Its price in Europe is 42.90€ (including VAT).

In Win today rolled out the SR24, an all-in-one liquid CPU cooler featuring a patented "twin turbine pump" feature. These are basically two pump turbines attached on both ends of the DC motor's shaft, which in turn are located on either ends of the CPU block. One of the turbine pushes coolant into the block, while the other pulls heated coolant from it. In Win claims that even if one of the two fails over time, the other will provide sufficient coolant pressure to cool your CPU, while a warning LED lights up. With both turbines operational, the SR24 offers double the coolant pressure, and a markedly superior P-Q curve. The pump block is capped off with an RGB illuminated In Win logo.

The innovative pump-block of the In Win SR24 is tubed to a 240 mm x 120 mm aluminium radiator. Ventilating it are a pair of included In Win Jupiter 120 mm fans that each spin at speeds of 500 to 2,500 RPM, with up to 101.5 CFM of air-flow, and as low as 23 dBA of noise output. The fans feature double ball bearings and feature addressable RGB LEDs in their hubs. A single 3-pin ARGB connection handles lighting for the two fans and the pump-block. The company didn't mention thermal load numbers, but among the CPU socket types supported are TR4, sTRX4, LGA2066, AM4, and LGA115x. The company didn't reveal pricing.

ID-Cooling today updated its Zoomflow line of all-in-one liquid CPU cooler series with the new Zoomflow 360X Snow. As with most PC hardware names that use the term "snow," the 360X Snow is a white trim of the Zoomflow 360. White dominates the pump-block's body, the nylon sleeve around the tubing, the radiator (including its fins), and the three included fans. ID-Cooling claims the cooler is capable of handling thermal loads of up to 350 W thanks to its high coolant pressure and large 360 mm x 120 mm radiator.

The three included 120 mm hydraulic-bearing fans each spin at speeds ranging between 700 to 1,500 RPM, pushing up to 62 CFM of air, with noise output ranging between 18 to 26.4 dBA. A single 3-pin ARGB connection from the motherboard lights up the three fans and the RGB ornament on the pump-block. Among the CPU socket types supported are AMD TR4, sTRX4, and AM4; and Intel LGA2066 and LGA115x. The company didn't reveal pricing, although we expect it to be priced around the $130-mark.

At its 2020 IEEE ISSCC keynote, AMD presented two slides that detail the extent of cost savings yielded by its bold decision to embrace the MCM (multi-chip module) approach to not just its enterprise and HEDT processors, but also its mainstream desktop ones. By confining only those components that tangibly benefit from cutting-edge silicon fabrication processes, namely the CPU cores, while letting other components sit on relatively inexpensive 12 nm, AMD is able to maximize its 7 nm foundry allocation, by making it produce small 8-core CCDs (CPU complex dies), which add up to AMD's target core-counts. With this approach, AMD is able to cram up to 16 cores onto its AM4 desktop socket using two chiplets, and up to 64 cores using eight chiplets on its SP3r3 and sTRX4 sockets.

In the slides below, AMD compares the cost of its current 7 nm + 12 nm MCM approach to a hypothetical monolithic die it would have had to build on 7 nm (including the I/O components). The slides suggest that the cost of a single-chiplet "Matisse" MCM (eg: Ryzen 7 3700X) is about 40% less than that of the double-chiplet "Matisse" (eg: Ryzen 9 3950X). Had AMD opted to build a monolithic 7 nm die that had 8 cores and all the I/O components of the I/O die, such a die would cost roughly 50% more than the current 1x CCD + IOD solution. On the other hand, a monolithic 7 nm die with 16 cores and I/O components would cost 125% more. AMD hence enjoys a massive headroom for cost-cutting. Prices of the flagship 3950X can be close to halved (from its current $749 MSRP), and AMD can turn up the heat on Intel's upcoming Core i9-10900K by significantly lowering price of its 12-core 3900X from its current $499 MSRP. The company will also enjoy more price-cutting headroom for its 6-core Ryzen 5 SKUs than it did with previous-generation Ryzen 5 parts based on monolithic dies.