Multiple users have recently reported that the August 13 Windows 11 update causes issues with dual-boot Linux/Windows configurations. However, the issues are actually related to changes in UEFI Secure Boot Advanced Targeting (SBAT) policies. The issue stems from Microsoft enforcing SBAT and revoking old, exploitable certificates. Many Linux distributions use self-signed UEFI shims, which are no longer allowed due to known exploits. The new update revokes the SBAT certificates on affected, known exploitable versions of GRUB shipped with some Linux distributions. This can result in error messages like "Verifying shim SBAT data failed: Security Policy Violation" or "Something has gone seriously wrong: SBAT self-check failed: Security Policy Violation." To resolve this issue, Linux users need to update GRUB or disable the SBAT policy on the Linux side.

It's important to note that this is not primarily a Microsoft problem, but rather a necessary security update that affects some Linux distributions using outdated or vulnerable bootloaders. For more information on SBAT revocations and the boot process, users can refer to the Ubuntu Discourse here. This problem particularly impacts software developers and gaming enthusiasts who rely on dual-boot setups. As always, it's good practice for users to back up their data before performing any system updates. Considering alternatives like using virtual machines is also a good choice for users relying on older Linux distributions.

Intel's Sales and Marketing Group (SMG) has announced a 35% reduction in costs as the company looks to streamline operations and adapt to challenging market conditions. The cuts, revealed during an all-hands meeting on August 5th, will impact both jobs and marketing expenses within the SMG. Intel has directed the group to "simplify programs end-to-end" by the end of the year, a directive that comes on the heels of the company's announcement that it would lay off 15% of its global workforce to save $10 billion in operating expenses. "We are becoming a simpler, leaner, and more agile company that's easier for partners and customers to work with while ensuring we focus our investments on areas where we see the greatest opportunities for innovation and growth," Intel said in a statement to CRN. The company emphasized that this restructuring is about "building a stronger Intel for the future," with partners integral to its plans.

The job cuts within the SMG are expected to target overlapping responsibilities, such as account managers and industry-focused teams, which can confuse customers navigating Intel's complex organization. Additionally, the company plans to significantly reduce its marketing budget and simplify programs, aiming to save at least $100 million in the latter half of 2024 and an additional $300 million in the first half of 2025. The impact will also be felt in Intel's market development fund (MDF), a crucial tool for supporting OEMs and other partners through events, training, and more. An ex-Intel executive warned that the MDF had become vital as the company's product leadership waned, allowing it to maintain valuable relationships with partners. As Intel navigates these changes, its partners are bracing for the impact, with one CEO describing the situation as everyone "hunkering down and just waiting to hear something." Another partner executive expressed concerns about Intel's ability to maintain the level of service and support its customers have come to expect.

Intel has officially started shipping the "0x129" microcode update for its 13th and 14th generation "Raptor Lake" and "Raptor Lake Refresh" processors. This critical update is currently being pushed to all OEM/ODM partners to address the stability issues that Intel's processors have been facing. According to Intel, this microcode update fixes "incorrect voltage requests to the processor that are causing elevated operating voltage." Intel's analysis shows that the root cause of stability problems is caused by too high voltage during operation of the processor. These increases to voltage cause degradation that increases the minimum voltage required for stable operation. Intel calls this "Vmin"—it's a theoretical construct, not an actual voltage, think "speed for an airplane required to fly". The latest 0x129 microcode patch will limit the processor's voltage to no higher than 1.55 V, which should avoid further degradation. Overclocking is still supported, enthusiasts will have to disable the eTVB setting in their BIOS to push the processor beyond the 1.55 V threshold. The company's internal testing shows that the new default settings with limited voltages with standard run-to-run variations show minimal performance impact, with only a single game (Hitman 3: Dartmoor) showing degradation. For a full statement from Intel, see the quote below.

Regarding the instability of the Intel Core 14th /13th Gen desktop processors, MSI will release the latest BIOS of Intel 700 and 600 series motherboards and 14th /13th Generation Desktop PC with 0x129 microcode to mitigate the instability.

The 1st batch of BIOS releasing models are MEG Z790 GODLIKE MAX, MEG Z790 ACE MAX, MPG Z790 CARBON MAX WIFI II, MPG Z790 CARBON WIFI, MAG Z790 TOMAHAWK MAX WIFI and Z790MPOWER. All BIOS of Intel 700 and 600 series motherboards and 14th /13th Generation Desktop PC will be released soon in coming weeks by the end of August. MSI will continue to update our users on the latest news. Please follow MSI's official channels and check the product pages for the latest BIOS updates.

In a statement for Tom's Hardware, Intel has announced a two-year warranty extension for its 13th and 14th Generation Core processors. This decision comes in response to widespread reports of crashes and instability affecting a broad range of models, from high-end flagship chips to mid-range offerings. The extension effectively increases the standard warranty period from three to five years for most boxed processors, with even the limited-edition models seeing an increase from one to three years. This move aims to reassure customers and mitigate concerns about potential long-term damage to affected chips. Intel has identified excessive voltage as the root cause of the problem, which has led to unexpected system crashes and blue screens of death (BSODs), particularly during gaming and other demanding tasks.

The company plans to release a microcode update by mid-August to prevent further degradation in unaffected processors. However, this update will not resolve issues in chips that have already experienced problems, and users with malfunctioning processors will need to seek replacements. The tech giant has faced criticism for its delayed response to the issue, which has plagued users for months. In its statement, Intel also addressed concerns about Via Oxidation, clarifying that while this separate issue was discovered in 2022, it is not the cause of the current instability problems. The company claims to have implemented fixes and enhanced screening procedures for Via Oxidation by early 2023, with affected chips reportedly removed from the supply chain by early 2024.

After many back and forths, it now appears that TSMC is finally getting ready to start construction of its fab in Dresden, Germany. Multiple news outlets are reporting that TSMC is getting ready to start production on its new fab within the next few weeks, which is ahead of the expected Q4 groundbreaking. That said, TSMC has yet to announce an official date for a groundbreaking ceremony or a date when construction will start, but according to media reports TSMC's Chairman and CEO C.C. Wei will be in Germany at the end of August to sign documents with the German government and during this trip, the groundbreaking ceremony is expected to take place.

Assuming everything goes according to plan, the Dresden fab is expected to start production sometime in late 2027, but it's far from a cutting edge fab, as it'll mainly be supplying the European automotive industry with components. The new fab should start its life with two different process technologies, namely a 28 or 22 nm planar CMOS node as well as a 16 or 12 nm FinFET node. The Dresden fab is said to have a production capacity of around 40,000 12-inch wafers monthly. The new fab is expected to be an investment in excess of €10 billion for TSMC, with the city of Dresden spending an additional €250 million for a special water supply system and enhancements to the power grid. Unlike similar projects, TSMC will not be the sole owner of the new fab, as Infineon, Robert Bosch and NXP are each taking a 10 percent stake in the fab.

Thanks for the detailed information obtained by The Verge, today we confirm previously leaked details as Sony gears up to unveil the highly anticipated PlayStation 5 Pro, codenamed "Trinity." According to insider reports, Sony is urging developers to optimize their games for the PS5 Pro, with a primary focus on enhancing ray tracing capabilities. The console is expected to feature an RDNA 3 GPU with 30 WGP running BVH8, capable of 33.5 TeraFLOPS of FP32 single-precision computing power, and a slightly quicker CPU running at 3.85 GHz, enabling it to render games with ray tracing enabled or achieve higher resolutions and frame rates in select titles. Sony anticipates GPU rendering on the PS5 Pro to be approximately 45 percent faster than the standard PlayStation 5. The PS5 Pro GPU will be larger and utilize faster system memory to bolster ray tracing performance, boasting up to three times the speed of the regular PS5.

Additionally, the console will employ a more powerful ray tracing architecture, backed by PlayStation Spectral Super Resolution (PSSR), allowing developers to leverage graphics features like ray tracing more extensively. To support this endeavor, Sony is providing developers with test kits, and all games submitted for certification from August onward must be compatible with the PS5 Pro. Insider Gaming, the first to report the full PS5 Pro specs, suggests a potential release during the 2024 holiday period. The PS5 Pro will also feature modifications for developers regarding system memory, with Sony increasing the memory bandwidth from 448 GB/s to 576 GB/s, enhancing efficiency for an even more immersive gaming experience. To do AI processing, there is an custom AI accelerator capable of 300 8-bit INT8 TOPS and 67 16-bit FP16 TeraFLOPS, in addition to ACV audio codec running up to 35% faster.

AYANEO, an Asian manufacturer known for its mobile handhelds, has introduced a new device, the AYANEO Kun. The Kun is powered by the latest AMD Ryzen 7 7840U mobile processor from the Ryzen 7040 series. This SoC includes eight Zen 4 cores and an integrated graphics unit based on the RDNA 3 architecture with 12 compute units. The console's dimensions stand at 312 x 133 x 21.9 mm, making it slightly wider but slimmer than ASUS's ROG Ally, with the exact weight yet to be disclosed. Kun's battery capacity is rated for 75Wh, as compared to other handhelds' 40 Wh, potentially indicating a longer battery life.

The AYANEO Kun's other notable features include its 8.4-inch display with an IPS panel and resolution of 1,920 x 1,200 pixels. For controls, the device utilizes a D-Pad and two Hall sensor-equipped joysticks for gaming. The shoulder buttons also employ Hall sensor technology. There are touchpads on either side of the display, along with other function keys and the A/B/X/Y keys. For the first time, AYANEO has integrated buttons at the back of the device, offering customizable functions. The device provides two Type-C (likely USB4), one USB Type-A, and one 3.5 mm jack connection. More comprehensive technical details, model variants, and pricing information are to be released during the official unveiling of the AYANEO Kun scheduled for August.

Hello and welcome back to the world of marbles - it's been a while! Straight to the news of the day—Marble It Up! Ultra releases on August 17th! It will be available on Nintendo Switch, Xbox Series X|S, Xbox One, PlayStation 5, PlayStation 4, Steam (including Steam Deck) and the Epic Store. We'll be rolling out more info over the coming weeks in anticipation of the launch!

Be sure to check out our updated FAQ and drop by the Discord Community. A very special thank you to our community. Whether you've been here from the start or are about to roll with us for the first time - this game couldn't exist without the attention and dedication of those who play it.

According to the Verge, Microsoft is getting ready to hike up the price of its Xbox Series X console come August, but apparently only in some parts of the world. However, the company is also readying a small price increase in its Game Pass pricing as well, that will take effect globally. The Game Pass pricing increase in the US will be a mere US$1 from US$9.99 to US$10.99 a month, whereas the Game Pass Ultimate will see an increase of US$2, from US$14.99 to US$16.99 a month, with European countries seeing the same kind of increase in cost, but in Euro instead of Dollars. The Verge has a list of other regional price increases for the Game Pass for those interested.

As for the Xbox Series X, Europe, Canada and Australia are said to see a hike in pricing, whereas the US, Japan and some South American nations are apparently avoiding a price hike for now. The new pricing will be £479.99 in the UK, €549.99 in most EU countries, C$649.99 in Canada and AU$799.99 in Australia. The new pricing is said to take effect on the first of August. The Xbox Series S will apparently avoid a price hike for now.

QuakeCon 2023 Returns to its Roots, Reuniting Fans with a Modern Upgrade to the Classic BYOC - It's official! After three years of digital-only events, QuakeCon 2023 will mark the return of the beloved BYOC, in-person at the Gaylord Texan Resort & Convention Center in Grapevine, Texas from Thursday, August 10 through Sunday, August 13.

"QuakeCon is our favorite event of the year, and we can't wait to finally see our incredible QuakeCon community in-person again, celebrate games, and frag all weekend with thousands of friends." said Marty Stratton, Studio Head, id Software. "For our first year back, QuakeCon 2023 is focusing on the fan favorite BYOC and the players that made QuakeCon the best gaming gathering for more than 25 years."