AMD has released new AGESA PI1007 to support 48 GB and 24 GB DDR5 memory module for AM5 motherboards including X670E/B650E/B650/A620 platform, boosting the maximum memory capacity from 128 GB to 192 GB on 4 DIMMs, providing performance and compatibility to enthusiasts.

Apart from the wider memory capacity support, the latest AMD AGESA PI1007 also implements the CPU voltage protection updates, please flash your ASRock AM5 motherboard to BIOS version 1.24 for the most up to date technical revision.

Colorful Technology Company Limited, a professional manufacturer of graphics cards, motherboards, all-in-one gaming and multimedia solutions, and high-performance storage, proudly introduces the CVN ICICLE DDR5 high-performance memory for enthusiasts and overclockers. With a high-speed configuration of DDR5-6600 MHz frequency, this memory is built for speed.

The CVN ICICLE DDR5 memory supports Intel XMP 3.0 technology that allows users to boost performance with ease via the BIOS by activating the predefined and tested Intel XMP profile. Furthermore, its advanced heatsink design provides excellent heat dissipation to achieve higher overclocks.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced today that its AMD AM5 platform with X670, B650 and A620 motherboards now support 24 GB and 48 GB DDR5 memory modules after a BIOS update. This update increases the maximum RAM support up to 192 GB across four DIMMs, and up to 96 GB across two DIMMs from the previous maximums of 128 GB and 64 GB, respectively.

By enabling support for non-binary memory on both AMD EXPO and Intel XMP platforms, GIGABYTE motherboards now offer an effortless boost in memory capacity and system performance. This translates to improved multitasking and productivity for gamers and other users with demanding RAM needs. If you want to experience the benefits of this upgrade, get your GIGABYTE motherboard today.

MSI has been in close contact with the AMD and has referred to their official technical guidance to provide users with a safer and more optimized hardware environment. To achieve this goal, MSI will release a new list of BIOS updates specifically for the AMD Ryzen 7000 series CPU.

According to AMD's design specifications, the Ryzen 7000X3D series CPU does not fully support overclocking or overvoltage adjustments, including CPU ratio and CPU Vcore voltage. However, AMD EXPO technology can be used to optimize memory performance by appropriately increasing the CPU SoC voltage to ensure system stability when operating at higher memory frequencies.

AMD has today released another statement to the press, following on from controversy surrounding faulty Ryzen 7000X3D series processors - unlucky users are reporting hardware burnouts resulting from voltage-assisted overclocking. TPU has provided coverage of this matter this week, and made light of AMD's first statement yesterday. AMD ensures customers that it has fully informed ODM partners (motherboard manufacturers) about up-to-date and correct voltages for the Ryzen processor family - yet user feedback (via online hardware discussions) suggests that standard Ryzen 7000 models are also being affected by the burnout issue - this side topic has not been addressed by AMD (at the time of writing). This second statement repeats the previous one's recommendation that affected users should absolutely make contact with AMD Support personnel:

AMD Statement"We have root caused the issue and have already distributed a new AGESA that puts measures in place on certain power rails on AM5 motherboards to prevent the CPU from operating beyond its specification limits, including a cap on SOC voltage at 1.3 V. None of these changes affect the ability of our Ryzen 7000 Series processors to overclock memory using EXPO or XMP kits or boost performance using PBO technology. We expect all of our ODM partners to release new BIOS for their AM5 boards over the next few days. We recommend all users to check their motherboard manufacturers website and update their BIOS to ensure their system has the most up to date software for their processor.

Anyone whose CPU may have been impacted by this issue should contact AMD customer support. Our customer service team is aware of the situation and prioritizing these cases."

The recent escalating AMD Ryzen 7000X3D Series CPU issue has come to our attention, ASRock treats this type of incident seriously and would like to offer the most updated BIOS across our entire range of AM5 motherboards. ASRock has released new BIOS as well as A-Tuning utility for following AM5 chipset motherboards which limit CPU voltage on certain power rails. We encourage users to update to the new BIOS with the appropriate voltage settings urgently to ensure system stability and durability.

Apart from bringing rock-solid hardware products to PC users, ASRock is also keen on working with AMD and integrating the most up to date technologies into its products. If you're unsure about the risk of using old BIOS version, please seek professional support from ASRock customer service.

Since the highly-expected AMD Ryzen 7000X3D-series CPUs launched by AMD, GIGABYTE has provided the best quality AM5 motherboards to unleash the performance of these best gaming processors. GIGABYTE always work closely with AMD to ensure our motherboard design within AMD's guidelines and provide supreme performance with reliability from all aspect. To consistently deliver the most remarkable and solid platform, GIGABYTE release the new beta BIOS regarding to the recent concerns of potential motherboard damaged issues with Ryzen 7000X3D-series CPUs.

The latest beta BIOS provides a more secure range of SOC voltage settings to reduce the risk of CPU damage due to over-voltage settings. Meanwhile, through the GIGABYTE exclusive Performance Bung in the BIOS option, users can easily optimize the tuning process of CPU voltage setting, while obtain the optimal CPU voltage by AMD PBO2 option, which both help to unleash the foremost performance of Ryzen 7000 X3D CPUs.

Gigabyte is also apparently testing the new BIOS update that should bring non-binary memory support to AMD's 600-series chipset motherboards. With the official AGESA update for AMD X670 and B650 apparently just around the corner, it does not come as a surprise that all motherboard makers are implementing it and testing it on their motherboards.

The latest comes from Gigabyte over at Coolaler forums, showing the AORUS X670E Master motherboard running 192 GB of DDR5 memory. This time around, the memory was running at 6000 MT/s, so the official support is certainly around the corner, even for overclocked kits. Both Corsair and G.SKILL have already announced their own 24 GB and 48 GB modules running at up to DDR5-8000. The official AGESA update is rumored to come in April, but there is no official word from either AMD or various motherboard makers.

ASUS today announced BIOS updates for its Intel 700 and 600 series motherboards in partnership with Corsair, adding support for up to 192 GB of DDR5 memory and support for the new Corsair Vengeance DDR5 48 GB (2 x 24 GB) 7000 MT/s modules.

When builders acquire a 700 or 600 series Intel motherboard from the ROG Maximus, ROG Strix, ProArt, TUF Gaming or Prime lineups, they often have a choice to make: grab an option with support for budget-friendly last-gen DDR4 memory, or future-proof their purchase with a DDR5 model. As the market for DDR5 RAM has matured, it has become difficult for enthusiasts to ignore the performance potential of next-generation memory. With this latest BIOS update, ASUS motherboards with DDR5 support are formidable options. The entire selection of ASUS 700 and 600 series motherboards now supports the latest 24 and 48 GB DDR5 memory modules.

Over the past month, memory manufacturers started releasing DDR5 memory modules of 24 GB and 48 GB densities, which make up 48 GB (2x 24 GB), 96 GB (2x 48 GB or 4x 24 GB) and even 192 GB (4x 48 GB) capacities. There's only one catch—these modules only work with 12th Gen Core "Alder Lake" and 13th Gen Core "Raptor Lake" processors, as their memory controllers support a maximum of 192 GB of memory, and 24/48/96 GB DIMM densities. MEGAsizeGPU decided to find out what happens when one of these kits is installed on an AMD Ryzen 7000 "Zen 4" platform.

A Corsair Vengeance DDR5-5600 48 GB (2x 24 GB) memory kit was installed on a machine consisting of an AMD Ryzen 5 7600X processor, and an ASUS ROG Strix B650E-E Gaming motherboard (BIOS version 1222). It turns out that the machine POSTs, and is able to start the UEFI setup program. Here, the program is able to display the correct 48 GB memory amount, and the memory density of each of the two modules. The trouble is, Windows would not boot, and does not go past the Boot Manager. It halts with an error message that indicates a hardware problem.

Phoenix Technologies, a leading independent firmware supplier for PCs and computing devices, has launched FirmGuard, a cyber security product to address firmware vulnerability. Firmware is the software that connects a device's microchips to the operating system.

Phoenix Technologies is the first UEFI (Unified Extensible Firmware Interface) vendor to offer an enterprise cyber security product. FirmGuard is a cloud-based service, which has been initially targeted at managed service providers (MSPs). It will also be offered to large enterprise and government organizations.

ASUS today announced availability of a BIOS update for its X670 and X670E motherboards that enables full compatibility with the latest AMD Ryzen 7000 Series X3D CPUs featuring AMD 3D V-Cache technology.

The proven gaming performance of the AMD Ryzen 7 5800X3D CPU made it a long-standing favorite for PC builders. ASUS motherboards gave those builders high-performance, feature-rich options for assembling a potent gaming machine built around one of these chips. Now, AMD is upping its game with two new Ryzen 7000 Series CPUs with AMD 3D V-Cache technology: the Ryzen 9 7950X3D and the Ryzen 9 7900X3D. Combining a 3D vertical cache and all the advantages of the cutting-edge X670 platform, these chips are poised to seize the gaming performance crown.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced today that GIGABYTE X670, B650 motherboard lineup with advanced configuration provides a perfect match for the latest AMD Raphael X3D processors with 3D V-Cache technology. This match delivers remarkable improvements on gaming performance for building ultimate gaming systems.

AMD first launched 3D V-Cache technology on Ryzen 7 5800X3D processors in 2022 and made it one of the best gaming CPUs. Now AMD brings 3D V-Cache technology to Zen 4 and introduces AMD Ryzen 9 7950X3D, Ryzen 9 7900X3D, and upcoming Ryzen 7 7800X3D processors with superior gaming performance. This new generation 3D V-Cache CPUs with more cores also raise L3 cache up to 128 MB, and boost gaming performance thanks to the extra 64 MB cache of 3D V-Cache.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced today that GIGABYTE X670, B650 motherboard lineup with advanced configuration provides a perfect match for the latest AMD Raphael X3D processors with 3D V-Cache technology. This match delivers remarkable improvements on gaming performance for building ultimate gaming systems.

AMD first launched 3D V-Cache technology on Ryzen 7 5800X3D processors in 2022 and made it one of the best gaming CPUs. Now AMD brings 3D V-Cache technology to Zen4 and introduces AMD Ryzen 9 7950X3D, Ryzen 9 7900X3D, and upcoming Ryzen 7 7800X3D processors with superior gaming performance. This new generation 3D V-Cache CPUs with more cores also raise L3 cache up to 128 MB, and boost gaming performance up to 50% thanks to the extra 64 MB cache of 3D V-Cache.

PowerColor on Wednesday formally launched its flagship graphics card, the Radeon RX 7900 XTX Liquid Devil. Designed for enthusiasts with DIY liquid-cooling setups, the Liquid Devil is essentially an RX 7900 XTX Red Devil, but with a factory-fitted full-coverage water block instead of the massive air cooler. The block has been made by EK Water Blocks, and consists of a nickel-plated copper main material, with a clear-acrylic top, and some vinyl decals. The top is studded with ARGB LEDs. The block lacks fittings, but has G 1/4" threading, and PowerColor has included goodies such as an EK-Loop Leak Tester Flex kit (lets you check for coolant leaks).

The PowerColor RX 7900 XTX has an ace up its sleeves that positions it above the Red Devil OC—the "Unleash" BIOS. The card has a dual-BIOS setup, with the default BIOS being labeled "OC" and the other one being "Unleash." OC enables speeds comparable to the Red Devil OC—2395 MHz game and 2565 MHz boost (vs. 2269 MHz game and 2499 MHz boost AMD reference speeds). PowerColor is yet to spell out the clock speeds of the "Unleash" BIOS, but we're hearing that it will be even higher (possibly the highest factory OC for the RX 7900 XTX), along with increased power-limits. The PowerColor RX 7900 XTX Liquid Devil should be available from mid-February, 2023.

A few days ago, PowerColor teased its upcoming flagship Radeon RX 7900 XTX Liquid Devil graphics card. Today, we have the first images coming from CornerJack of Overclocking.com. According to his unboxing, we can see the new collaboration of EK and PowerColor to create the latest Radeon RX 7900 XTX Liquid Devil graphics card with nickel-plated copper block based on Quantum Vector technology, addressable RGB illumination through the acrylic top, and a black backplate that is also presumably RGB illuminated to match the block as well. Powered by triple 8-pin connectors, the card features a BIOS switch that allows users to switch between OC BIOS and unleash BIOS modes, with the latter presumably having higher power limits.

In the box, besides the card, there is a provided EK loop pressure test that tests if any leaks are occurring. You can see the card's pictures below and look at the complete unboxing by CornerJack here.

GIGABYTE displayed their latest motherboards and graphics cards at the 2023 International CES, covering their Socket LGA1700 Intel 700-series chipset; and Socket AM5 AMD 600-series chipset. The Z790 AORUS Tachyon is the company's top-grade LGA1700 motherboard targeting the professional overclocking crowd. The board is designed to chase down CPU and memory overclocking world records, featuring the company's most powerful CPU VRM solution, and a 1 DIMM-per-channel DDR5 memory setup that preferred by overclockers for supporting the highest memory overclocks with the tightest timings. There are several overclocker-friendly features besides the onboard buttons—dual-BIOS ROMs, angled connectors for bench cases, consolidated voltage measurement points, and a feature-packed BIOS setup program.

Over in the AMD side, GIGABYTE's top Socket AM5 motherboard is the X670E AORUS Xtreme, which is a feature-packed motherboard with possibly the strongest CPU VRM solutions in the market for Ryzen 7000 processors, and with the best VRM cooling. In addition to the PCIe Gen 5 M.2 slot wired to the AM5 SoC, you get additional Gen 5 slots that subtract from the x16 PEG slot. The AORUS Xtreme also has the most feature-rich BIOS available among GIGABYTE's AM5 lineup. The B650I AORUS Ultra is a premium Mini-ITX Socket AM5 motherboard based on the AMD B650 chipset. Despite its compact size, it gives you a PCI-Express 4.0 x16 PEG slot, a Gen 5 M.2 slot, and two additional Gen 4 M.2 slots, besides the latest wired- and wireless connectivity. We also snapped the B650 AERO G motherboard targeting creators, and the mainstream B650 AORUS Elite AX.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions today revealed the new PerfDrive technology on the Intel 700 series platform, which Integrates multiple GIGABYTE exclusive BIOS settings to allow users easily balance between different levels of performance, power consumption, and temperature according to their needs when using 13th gen Intel Core processors including i9-13900K CPU. In addition to the former released Instant 6 GHz, GIGABYTE PerfDrive technology also integrates newly developed BIOS settings of Optimization and Spec Enhance. Collaborating with the existing GCC software platform and GIGABYTE Ultra Durable design, GIGABYTE brings the most powerful 700 series platform with perfectly tuned motherboards in hardware, software, and firmware.

Enhanced by the supreme hardware design of power management, thermal, and stability, GIGABYTE Z790 motherboards not only smash the all-core overclocking world record on Cinebench R23 but also creates remarkable DDR overclocking performance of DDR5 9300. Now GIGABYTE PerfDrive technology makes it easy and attainable for users to enjoy the optimal performance of the Z790 platform, and benefit from the easy-tuning for 13th gen K-SKU Core CPUs on the B760 platform. Based on optimized HW design with multiple GIGABYTE unique BIOS setting, PerfDrive technology satisfy various users' needs with its intuitive graphical interface in the GIGABYTE UEFI BIOS.

AMD's next-generation Radeon RX 7900 high-end graphics cards are set to arrive next week and bring the new RDNA3 GPU architecture to the masses. However, it seems like the customers will have to fight for their purchase as the availability could be scarce at launch, leading to potentially increased prices with low stocks. According to Igor's Lab report, Germany will receive only 3,000 reference MBA (Made By AMD) units of Radeon RX 7900 series cards. In contrast, the rest of the EMEA region will receive only 7,000 MBA units. These numbers are lower than expected, so AIB partners may improve the supply once their designs hit shelves.

On the other hand, mainland China will not receive any MBA units of the new cards as a sign of increasing tension with Taiwan. Of course, AMD's board partners will supply their designs to China, and they are allowed to; however, it seems that only AMD is making a statement here. In addition to supply issues, the launch is rumored to be covered in BIOS issues such as memory leaks and the COVID-19 outbreak affecting production in closed factories. Of course, all of this information should be taken with a grain of salt, and we must wait for the official launch before making any further assumptions.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced the Instant 6 GHz technology which is exclusively designed for performance enhancement of Intel Core i9-13900K processor. By simply updating the latest BIOS on GIGABYTE's Z790 motherboards and activating related settings, users can boost the performance of Intel Core i9-13900K to 6 GHz in a snap. Other than the Turbo Boost mode, GIGABYTE Instant 6 GHz technology can unleash the potential power of the processor to boost the single-core performance up to 3% higher, which leading up to experiencing the unparalleled performance of future processors.

The lately launched Intel Core i9-13900K processor enables users to enjoy O.C. performance in an easier way. Using GIGABYTE's latest Instant 6 GHz technology, the system can automatically tweak CPU voltage and Vcore Load Line Calibration to detect the most two optimized cores running at 6 GHz frequency. Instead of suffering from complex O.C settings, users can enjoy effortless Overclocking by simply updating the latest BIOS on GIGABYTE's Z790 motherboards and activating the Instant 6 GHz option in the BIOS. This further delivers a 3% performance boost on one single core, and provides an O.C. edition-like experience on i9-13900K processor. The latest GIGABYTE Z790 motherboards ascend to a new level with their exclusive VRM design, thermal design, and convenience. The BIOS support Instant 6 GHz technology of Z790 motherboards has been updated on the GIGABYTE official website, users can upgrade BIOS with Q-Flash or Q-Flash Plus.

Intel Arc A770 "Alchemist" graphics card has an idle power-draw problem. It pulls 44 W (card-only) power when idling. This used to be acceptable some 15 years ago, but GPU idle power-draw has come a long way since. The reigning Goliath GeForce RTX 4090 pulls just 21 W when idling, and the RTX 3070, the card the A770 was extensively compared against, only pulls 9 W—that's 7 LED downlights worth power-difference between the A770 and RTX 3070. Intel has a workaround to this problem: enable the PCI-Express active state power management (ASPM) setting to L1 mode in your motherboard's UEFI BIOS setup program.

The Intel Xe-HPG "Alchemist" graphics architecture reportedly uses PCIe Gen 2-era L0 and L1 ASPM, which needs to be forced via software settings. To do this, find the PCIe ASPM settings in your BIOS setup, and enable them with the "L1" setting. You then make your way to Power Options in the Windows Control Panel, edit your active power scheme, and manually set the PCI-Express "Link state power-management" to "Maximum." This affects the power-management behavior and performance of all PCIe devices in your system, including NVMe SSDs, not just the graphics card. Intel did not put out its power-draw numbers for this workaround, but we intend to test it as soon as we can.

ASUS today announced the new Precision Boost Overdrive (PBO) enhancement, an exclusive temperature control feature for its range of X670 and B650 motherboards designed for AMD Ryzen 7000 series processors.

These latest CPUs push the limits of performance farther than ever before. They dynamically take advantage of available thermal headroom to give users higher clock speeds. This means that users might see higher CPU temperatures than they are used to in a new AMD Ryzen-powered machine. To put users in control, ASUS is rolling out a BIOS update for its X670 and B650 motherboards with new options for its PBO enhancement feature that makes it easy to balance thermals and performance. With just a few clicks, users will be able to dramatically reduce CPU temperatures—and maybe even increase performance and reduce fan noise in the process.

Intel Alder Lake source code for BIOS/UEFI building and optimization has been leaked in a massive 6 GB leak that appeared on 4chan and GitHub. While this number may seem small, it is a colossal codebase, given that the regular code files take up small space. We assume that the documentation is bundled there as well, however, we can not check ourselves as the repository has been taken down. Tom's Hardware has contacted an Intel representative to talk about the code leak and the rep issued a statement for the website.

Intel SpokespersonOur proprietary UEFI code appears to have been leaked by a third party. We do not believe this exposes any new security vulnerabilities as we do not rely on obfuscation of information as a security measure. This code is covered under our bug bounty program within the Project Circuit Breaker campaign, and we encourage any researchers who may identify potential vulnerabilities to bring them our attention through this program. We are reaching out to both customers and the security research community to keep them informed of this situation.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today revealed the breakthrough DDR5 performance of XMP DDR5-7600 and O.C. performance to DDR5-7950 under fan cooling on Z790 AORUS XTREME and MASTER motherboards with Team Group gaming modules T-FORCE DELTA RGB DDR5 7200 memory. Featuring Shielded Memory Routing of SMD memory DIMM, exclusive DDR5 overclocking BIOS setting, top-quality components, and enhanced design from hardware to firmware on motherboards, this performance proves GIGABYTE's strong leading role in product quality and performance.

To unleash the ultimate DDR5 performance, GIGABYTE Z790 AORUS XTREME and MASTER implement new generation Shielded Memory Routing design. By optimizing memory trace width, length, and style from HPC simulation to actual implementation, overall impedance is lowered between CPU memory controller and memory modules. Further with low signal-loss PCB, signal loss inside PCB and external interference are greatly reduced which can maintain high-speed DDR5 signal transmission to achieve higher DDR5 speed. In addition, the abundant BIOS setting of DDR5 Memory Upgrade and XMP 3.0 User Profile lead to the breakthrough performance of XMP DDR5-7600 and DDR5-7950 O.C. under fan cooling with T-FORCE DELTA RGB DDR5 7200 memory. The detailed memory information is listed in the memory support list of the motherboard.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, today announces a list of 600 series motherboards ready to support the latest Intel 13th Gen processors. Codenamed 'Raptor Lake,' the latest 13th generation Intel processors are designed to be far superior to their predecessors. With Intel announcing 15% better single-threaded performance and 41% better multi-threaded performance over the 12th generation processors, user expectations are high for the latest Intel variants with extra emphasis on supported motherboards.

BIOSTAR is proud to announce their list of the previous generation 600 series motherboards ready to support the new Intel processors. This is great news for consumers currently using this platform with an Alder Lake CPU because the latest 13th gen processors support both DDR5 and DDR4 with extremely impressive performance improvements.